CN208331812U - A kind of COB mould group based on high-voltage linear constant current technology - Google Patents

Abstract

The COB mould group based on high-voltage linear constant current technology that the utility model discloses a kind of, including pedestal and fender bracket, the fender bracket is fixedly installed on base upper surface, thermal conductive insulation glue is fixedly installed on the inside of the fender bracket of the pedestal upper surface, the thermal conductive insulation glue is fixedly installed ceramic substrate far from the side of pedestal, the ceramic substrate is fixedly installed several high voltage LED chips far from the side of thermal conductive insulation glue, the ceramic substrate upper surface covering is equipped with convex lens, the LED chip surface is fixedly installed transparent silicon glue-line, coolant liquid is injected on the inside of transparent silicon glue-line upper surface and convex lens, matcoveredn is fixedly installed in the lens and ceramic substrate junction, the fender bracket is equipped with protective cover far from one end of pedestal, the first screw thread is offered on the inside of the protective cover.The utility model structure is simple, easy to use, can effectively extend the service life of COB mould group by radiating.

Description

A kind of COB mould group based on high-voltage linear constant current technology

Technical field

The utility model relates to COB mould technical group field, specially a kind of COB mould based on high-voltage linear constant current technology Group.

Background technique

COB light source is that the high photosynthetic efficiency on the mirror metal substrate that LED chip is placed directly against high reflecting rate integrates area source Technology, this technology eliminate bracket concept, electroless plating, without Reflow Soldering, without patch process, therefore process reduces nearly one third, Cost also saves one third, and COB light source have high colour developing, shine uniformly, without hot spot, health environment-friendly, installation it is simple, Feature easy to use.Existing COB encapsulation is non-watertight, not dust-proof, therefore is not suitable for open air, is chiefly used in the fields such as room lighting Scape.It is to be sealed using sealing rubber ring with lamp casing mostly, in this way for the LED lamp required with outdoor water-proof Waterproof effect difference and complex production process.Therefore, the prior art is defective, needs to improve.

Existing COB mould group exists following insufficient: 1, many COB mould groups all do not have arranges to what high pressure insulated It applies, it is easy to the phenomenon that high-voltage breakdown occur；2, all imperfect cooling system of many COB mould groups, is unfavorable for inner core The long-time of piece uses.

Utility model content

The COB mould group based on high-voltage linear constant current technology that the purpose of this utility model is to provide a kind of, it is above-mentioned to solve The problem of being proposed in background technique.

To achieve the above object, the utility model provides the following technical solutions: a kind of based on high-voltage linear constant current technology COB mould group, including pedestal and fender bracket, the fender bracket are fixedly installed on base upper surface, pedestal upper surface fender bracket Inside is fixedly installed thermal conductive insulation glue, and the thermal conductive insulation glue is fixedly installed ceramic substrate far from the side of pedestal, described Ceramic substrate is fixedly installed several high voltage LED chips, the ceramic substrate upper surface covering far from the side of thermal conductive insulation glue Convex lens is installed, the LED chip surface is fixedly installed transparent silicon glue-line, transparent silicon glue-line upper surface and convex lens Coolant liquid is injected on the inside of mirror, matcoveredn is fixedly installed in the lens and ceramic substrate junction, and the fender bracket is the bottom of far from One end of seat is equipped with protective cover, and the first screw thread is offered on the inside of the protective cover, is offered on the outside of the fender bracket and first The second screw thread that screw thread matches, the protective cover, which is threadably secured, to be mounted on the fender bracket.

Preferably, the material of the protective layer is rubber material, and the height of the protective layer is lower than the radius of convex lens.

Preferably, the ceramic substrate bottom is fixedly installed several heat-removal bars, and the heat-removal bar surface offers several Through-hole.

Preferably, the high voltage LED chip is at least arranged four.

Preferably, insulating layer is fixedly installed between the high voltage LED chip, the insulating layer surrounding is provided with transparent Layer of silica gel.

Compared with prior art, the utility model has the beneficial effects that

1, the utility model in this way and realizes light source by the way that layer of transparent layer of silica gel is arranged on high voltage LED chip surface Reflection also act the effect to insulate between high voltage LED chip, by the way that insulating layer is fixedly installed between high voltage LED chip, It is played in this way to the second minor insulation between high voltage LED chip, by the way that heat conductive insulating is arranged between pedestal and ceramic substrate Glue effectively avoids the phenomenon that puncturing because of the case where high pressure in this way, greatly improves COB mould group in this way Service life.

2, the utility model is inside convex lens by injecting coolant liquid, in this way can effectively by high voltage LED chip because The heat absorption generated under high pressure is walked, and is played certain protection to high voltage LED chip in this way and is used, makees ceramic base by changing substrate Plate by ceramics there is high-termal conductivity effectively the heat transfer that high voltage LED chip generates to be gone out by heat-removal bar in this way Heat is discharged circulated air, highly effective in this way to protect COB mould group, extends the service life of COPB mould group.

Detailed description of the invention

Fig. 1 is a kind of COB mould group overall structure diagram based on high-voltage linear constant current technology of the utility model；

Fig. 2 is a kind of cross-sectional view of the COB mould group protective cover based on high-voltage linear constant current technology of the utility model；

Fig. 3 is a kind of cross-sectional view of the COB mould group fender bracket based on high-voltage linear constant current technology of the utility model.

In figure: 1- pedestal；2- fender bracket；3- thermal conductive insulation glue；4- ceramic substrate；5- heat-removal bar；6- protective layer；7- is saturating Bright layer of silica gel；8- coolant liquid；9- convex lens；10- protective cover；The first screw thread of 11-；The second screw thread of 12-；13- high voltage LED chip； 14- insulating layer.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of COB based on high-voltage linear constant current technology Mould group, including pedestal 1 and fender bracket 2, the fender bracket 2 are fixedly installed on 1 upper surface of pedestal, 1 upper surface of the pedestal protection Thermal conductive insulation glue 3 is fixedly installed on the inside of frame 2, the thermal conductive insulation glue 3 is fixedly installed ceramic substrate far from the side of pedestal 1 4, the ceramic substrate 4 is fixedly installed several high voltage LED chips 13, the ceramic substrate 4 far from the side of thermal conductive insulation glue 3 Upper surface covering is equipped with convex lens 9, and 13 surface of LED chip is fixedly installed transparent silicon glue-line 7, the transparent silicon glue-line Coolant liquid 8 is injected on the inside of 7 upper surfaces and convex lens 9, matcoveredn is fixedly installed with 4 junction of ceramic substrate in the lens 9 6, the fender bracket 2 is equipped with protective cover 10 far from one end of pedestal 1, and the first screw thread 11 is offered on the inside of the protective cover 10, The second screw thread 12 to match with the first screw thread 11 is offered on the outside of the fender bracket 2, the protective cover 10 is threadably secured It is mounted on the fender bracket 2.

The material of the protective layer 6 is rubber material, and the height of the protective layer 6 is lower than the radius of convex lens 9, in this way may be used To play the effect of water proof and dust proof；4 bottom of ceramic substrate is fixedly installed several heat-removal bars 5, and 5 surface of heat-removal bar is opened Equipped with several through-holes, can be radiated to ceramic substrate by natural wind；The high voltage LED chip 13 is at least arranged four, The leading constant current effect of high pressure thus may be implemented；Insulating layer 14 is fixedly installed between the high voltage LED chip 13, it is described exhausted 14 surrounding of edge layer is provided with transparent silicon glue-line 7, can be to avoid the appearance of high-voltage breakdown phenomenon.

Working principle: when in use by giving high voltage LED chip 13, by being arranged one layer on 13 surface of high voltage LED chip Transparent silicon glue-line 7, to the isolated insulation for carrying out first layer between high voltage LED chip 13, by solid between high voltage LED chip 13 Surely setting insulating layer 14 is effectively avoided in high pressure so in this way to the second minor insulation is carried out between high voltage LED chip 13 The phenomenon that situation punctures, by the way that high voltage LED chip 13 is fixed on ceramic substrate 4, due to that can be generated in the case where high pressure acts on A large amount of heat, can effectively be conducted heat by ceramic substrate 4, and heat-removal bar is fixedly installed in 4 bottom of ceramic substrate 5, the thermal energy that can effectively spread out of ceramic substrate 4 is discharged, right in this way by injecting coolant liquid 8 above transparent silicon glue-line 7 High voltage LED chip 13 carries out second and radiates, and effectively prevents the phenomenon that high-voltage LED chip 13 is damaged because of high temperature, passes through A protective layer 6 is set in convex lens 9 and 4 junction of ceramic substrate, the effect of dustproof and waterproof is played, by outside COB mould group Portion's setting pedestal 1, fender bracket 2 and protective cover 10 in this way play a very good protection to COB mould group, by pedestal 1 and pottery Between porcelain substrate 4 be arranged one layer of thermal conductive insulation glue 3, in this way and realize heat dissipation effect also avoid because high pressure occur breakdown and The phenomenon of 1 electricity of pedestal occurs.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (5)

1. a kind of COB mould group based on high-voltage linear constant current technology, including pedestal (1) and fender bracket (2), it is characterised in that: institute It states fender bracket (2) and is fixedly installed on pedestal (1) upper surface, be fixedly installed and lead on the inside of pedestal (1) the upper surface fender bracket (2) Thermal insulation glue (3), the thermal conductive insulation glue (3) are fixedly installed ceramic substrate (4), the ceramics far from the side of pedestal (1) Substrate (4) is fixedly installed several high voltage LED chips (13) far from the side of thermal conductive insulation glue (3), on the ceramic substrate (4) Surface covering is equipped with convex lens (9), and LED chip (13) surface is fixedly installed transparent silicon glue-line (7), the transparent silicon It is injected with coolant liquid (8) on the inside of glue-line (7) upper surface and convex lens (9), the lens (9) and ceramic substrate (4) junction are solid Surely matcoveredn (6) are set, the fender bracket (2) is equipped with protective cover (10), the protective cover far from the one end of pedestal (1) (10) inside offers the first screw thread (11), offers second to match with the first screw thread (11) on the outside of the fender bracket (2) Screw thread (12), the protective cover (10), which is threadably secured, to be mounted on the fender bracket (2).

2. a kind of COB mould group based on high-voltage linear constant current technology according to claim 1, it is characterised in that: the guarantor The material of sheath (6) is rubber material, and the height of the protective layer (6) is lower than the radius of convex lens (9).

3. a kind of COB mould group based on high-voltage linear constant current technology according to claim 1, it is characterised in that: the pottery Porcelain substrate (4) bottom is fixedly installed several heat-removal bars (5), and heat-removal bar (5) surface offers several through-holes.

4. a kind of COB mould group based on high-voltage linear constant current technology according to claim 1, it is characterised in that: the height LED chip (13) are pressed at least to be arranged four.

5. a kind of COB mould group based on high-voltage linear constant current technology according to claim 1, it is characterised in that: the height It is fixedly installed with insulating layer (14) between pressure LED chip (13), insulating layer (14) surrounding is provided with transparent silicon glue-line (7)。