CN208299197U - A kind of semiconductor laser photodetector die bond fixture - Google Patents
A kind of semiconductor laser photodetector die bond fixture Download PDFInfo
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- CN208299197U CN208299197U CN201821034470.XU CN201821034470U CN208299197U CN 208299197 U CN208299197 U CN 208299197U CN 201821034470 U CN201821034470 U CN 201821034470U CN 208299197 U CN208299197 U CN 208299197U
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- tube socket
- die bond
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Abstract
A kind of semiconductor laser photodetector die bond fixture, comprising: pedestal, positioning mechanism, charging tray, tube socket location hole, cover board, elastic slice.Cover board fixed mechanism.Pedestal is fixed in photodetector bonder, elargol is applied to the middle position of 12 degree of angle planes of tube socket by point gum head of die bonder；It will be above photodetector die bond to elargol by suction nozzle.Above-mentioned dispensing and die bond process are repeated, until 12 degree of angle planes of all tube sockets complete the die bond of photodetector.Positioning mechanism is finally unclamped, the pedestal after taking out die bond.Tube socket is fixed reliable, and replacement tube socket is convenient, realizes through simple operations, completes dispensing on same fixture using automation equipment and die bond works, provide better condition for next procedure, increasing considerably for struck capacity improves production efficiency.
Description
Technical field
The utility model relates to semiconductor laser encapsulation technology fields, and in particular to a kind of semiconductor laser photoelectricity spy
Survey device die bond fixture.
Background technique
After decades of development, semiconductor laser increasingly obtains known to society, and in many places field
To application, the photoelectric conversion efficiency of semiconductor laser is in 60% or more, significantly larger than the photoelectric conversion effect of other similar products
The advantages that rate, low energy consumption, and heat accumulation is few in device, the service life is long, collimation is good, illumination distances are remote is made in the similar industry of society
It is more and more extensive for a kind of emerging technical application.All kinds of advantages possessed by semiconductor laser determine its it is higher and higher by
The extensive attention of various circles of society.
Since semiconductor laser has, small in size, light-weight, electro-optical efficiency is high, the service life is long and reliability height etc. is excellent
Point has gradually replaced the use of gas and solid state laser in fields such as communication, medical treatment, display, industry production and security protections,
Application range is also gradually extending.Simultaneously with the high speed development of photoelectron technology, the reliability of noise spectra of semiconductor lasers is proposed
Increasingly higher demands.
It works to semiconductor laser long time stability, becomes semiconductor laser design, manufactures most basic requirement.
A kind of photodetector is used in semiconductor laser encapsulation, it plays key effect to laser stabilization work.Photoelectricity is visited
It surveys device and is also the photodiode semiconductor devices that (Photo-Diode) is made of a PN junction, have one direction conductive special
Property.Photodiode be backward voltage effect under work, general illumination light irradiation under, generated electric current
Photoelectric current.If connecting load on external circuit, electric signal is just obtained in load, and this electric signal is with the variation of light
And corresponding change.Photodetector is able to detect the intensity of the back transmitting light of scattering light or semiconductor chip inside encapsulation,
The power of monitoring laser decays, and using this signal as feedback regulation operating current, so that laser be made to obtain invariable power
Output, enhances the stability of laser works.
Semiconductor laser encapsulation production process in, need by photodetector die bond shell 12 degree of angle plane points
On.General operation mode is exactly that upper elargol is first put on 12 degree of angle planes of shell, and photoelectric detector chip is then placed on silver
Above glue.At present on production line, mainly pass through operative employee's handwork for semiconductor laser photodetector die bond
Mode is completed, and using a kind of rectangle mould item, tube socket is fixed on mould item by hand with tweezers, with plastic pin manually by elargol
It is applied in 12 degree of planes of shell, then mould item is placed in semi-automatic die bond equipment, is produced.This scheme it is excellent
Point is easy to operate, but due to the low precision of the fixed tube socket of mould item, when production can only single produced, it is difficult to high-precision from
Dynamicization equipment is produced, and causes that production efficiency is low, consistency is poor, precision is low, it is difficult to ensure that the quality of product.Simultaneously with half
The expansion increasingly of the conductor laser market demand, existing production model have been unable to meet production requirement, therefore, are highly desirable
A kind of utility model photodetector die bond fixture, can by carried out in automation equipment operation in the way of solve above-mentioned ask
Topic improves product quality, improves production efficiency.
Chinese patent literature CN102570285A proposes a kind of T056 shell die bonding fixture, and fixture includes bottom
Plate, the connection strap being set on bottom plate and the holding clamp being fixed on connection strap are set on the connection strap both sides of the face
It is equipped with spring pull rod, spring fixed link is correspondingly arranged on the bottom plate, bottom plate is described by small axis and connection strap hinge
Spring is provided between spring pull rod and spring fixed link；Bottom plate described in the utility model and connection strap contact position are provided with inclined-plane
Plate, the skewback and level are in 7 degree of angles.The utility model can be fast and reliable to T056 type infrared semiconductor laser pipe
Seat carries out positioning clamping, by shirtsleeve operation, can be completed on same fixture on vertical plane and on 7 degree of angle planes dispensing and
The stickup of chip.Originally the secondary clamping without progress shell, reduces operation sequence, improves work efficiency.But this is practical
Novel be disadvantageous in that between the fixture connection strap and bottom plate is fixed using spring, is easily deformed for a long time using spring,
Cause tube socket clamping precision poor.As long as simultaneously the tubulature seat 30 of each fixture one time, quantity is very little, inconvenient and efficiency compared with
It is low；And whole device component is more, and precise part needed for processing and assembling is more difficult, and the manufacturing cost of equipment is high, no
Suitable for batch production.
Summary of the invention
The utility model in order to overcome the shortcomings of the above technology, provide a kind of mechanism it is simple, using reliable, operation side
Just, the semiconductor laser photodetector die bond fixture of production efficiency is improved.
The utility model overcomes the technical solution used by its technical problem to be:
A kind of semiconductor laser photodetector die bond fixture, comprising:
Pedestal is installed in the automatic die bond equipment of photodetector by fixed mechanism, and it is fixed to be provided on the pedestal
Position mechanism；
Charging tray, the upper end is horizontally disposed several tube socket mounting bars being parallel to each other, on the tube socket mounting bar
Spaced set has several tube socket location holes in the horizontal direction；
Cover board, is located at charging tray upper end, is provided with several long holes corresponding with tube socket mounting bar on cover board, outside each long hole
Side is provided with several elastic slices corresponding with tube socket location hole；
Cover board fixed mechanism, is set on charging tray, for cover board and charging tray to be connected and fixed；
The tube socket location hole is less than the small sircle hole structure of big hole internal diameter by big hole and positioned at the internal diameter of big hole lower end
At big hole and small sircle hole same axis, the internal diameter of the big hole and the outer diameter of tube socket match, be provided in the big hole
The positioning protrusion to match with the positioning groove of tube socket, tube socket are plugged in the big hole of tube socket location hole, positioning protrusion insertion
In the positioning groove of tube socket, the pipe leg of tube socket is located in small sircle hole；
After cover board is fixed on charging tray by cover board fixed mechanism, each tube socket mounting bar is inserted into corresponding long hole,
Elastic slice is pressed in the upper surface of tube socket.
Further, above-mentioned fixed mechanism includes longitudinally disposed in several mounting holes on pedestal, and bolt passes through installation
Hole back spin is together in the automatic die bond equipment of photodetector.
Further, above-mentioned positioning mechanism includes the horizontally disposed block I in base rear end, sets along the vertical direction
It is placed in the block II at base right side end, be set to the locating piece at chassis left side end along the vertical direction and is set to pedestal left lower side
Elbow at angle presss from both sides, and is combined with fixing screws in the locating piece.
Further, above-mentioned cover board fixed mechanism includes the pin being horizontally placed at left and right sides of cover board respectively and dials
Bar, bolt pass through driving lever back spin together in charging tray, and driving lever outboard end is provided with gib head, when driving lever turns to horizontality, hook
Head is hooked on corresponding pin.
In order to make 12 degree of angle planes of tube socket be in horizontality, the axis of above-mentioned tube socket location hole and the angle of horizontal plane
It is 78 degree.
Preferably, above-mentioned elastic slice is made of stainless steel material punching press.
It is positioned the beneficial effects of the utility model are: several tube sockets are inserted corresponding tube socket on each tube socket mounting bar
Kong Zhong.It by cover plate lid to charging tray upper end, and is fixed on charging tray by cover board fixed mechanism, each elastic slice on cover board is pressed in
The upper surface of corresponding tube socket.Charging tray is placed on pedestal later, so that charging tray is moved to operating position by positioning mechanism.It will
Pedestal is fixed in photodetector bonder, and elargol is applied in 12 degree of angle planes of tube socket by point gum head of die bonder
Between position；It will be above photodetector die bond to elargol by suction nozzle.Above-mentioned dispensing and die bond process are repeated, until all tube sockets
12 degree of angle planes complete photodetector die bond.Positioning mechanism is finally unclamped, the pedestal after taking out die bond.Tube socket is solid
Fixed reliable, replacement tube socket is convenient, realizes through simple operations, is completed on same fixture using automation equipment dispensing with admittedly
Crystalline substance work, provides better condition for next procedure, increasing considerably for struck capacity improves production efficiency.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the utility model；
Fig. 2 is the schematic perspective view of the pedestal of the utility model；
Fig. 3 is the schematic perspective view of the charging tray of the utility model；
Fig. 4 is the structural schematic diagram at the tube socket location hole position of the utility model；
Fig. 5 is the schematic perspective view of the cover board of the utility model；
The cover board and the structural schematic diagram after charging tray locking that Fig. 6 is the utility model；
Fig. 7 is the structural schematic diagram at the elastic slice position of the utility model；
Fig. 8 is the schematic perspective view of the tube socket of the utility model；
In figure, 1. pedestal, 2. charging tray, 3. cover board, 4. photodetector, 5. elbow presss from both sides 6. locating piece, 7. block, I 8. block
II 9. fixing screws, 10. mounting hole, 11. driving lever, 12. tube socket location hole, 13. bolt, 14. gib head, 15. big holes 16. are small
21. long hole of circular hole 17. positioning protrusion, 18. tube socket mounting bar, 19. pin, 20. elastic slice, 22. tube socket.
Specific embodiment
1 the utility model is described further to attached drawing 8 with reference to the accompanying drawing.
A kind of semiconductor laser photodetector die bond fixture, comprising:
Pedestal 1 is installed in the automatic die bond equipment of photodetector by fixed mechanism, positioning is provided on pedestal 1
Mechanism；Charging tray 2, the upper end is horizontally disposed several tube socket mounting bars 18 being parallel to each other, edge on tube socket mounting bar 18
Horizontal direction spaced set has several tube socket location holes 12；Cover board 3, is located at 2 upper end of charging tray, be provided on cover board 3 it is several with
The corresponding long hole 21 of tube socket mounting bar 18, each 21 outboard end of long hole are provided with several bullets corresponding with tube socket location hole 12
Piece 20；Cover board fixed mechanism is set on charging tray 2, for cover board 3 and charging tray 2 to be connected and fixed；Tube socket location hole 12 is by great circle
The small sircle hole 16 that hole 15 and internal diameter positioned at 15 lower end of big hole are less than 15 internal diameter of big hole is constituted, big hole 15 and small sircle hole 16
The outer diameter of same axis, the internal diameter and tube socket 22 of big hole 15 matches, and the positioning groove with tube socket 22 is provided in big hole 15
The positioning protrusion 17 to match, tube socket 22 are plugged in the big hole 15 of tube socket location hole 12, and positioning protrusion 17 is inserted into tube socket 22
Positioning groove in, the pipe leg of tube socket 22 is located in small sircle hole 16；When cover board 3 is fixed on charging tray 2 by cover board fixed mechanism
Afterwards, each tube socket mounting bar 18 is inserted into corresponding long hole 21, and elastic slice 20 is pressed in the upper surface of tube socket 22.By several tube sockets 22
It inserts on each tube socket mounting bar 18 in corresponding tube socket location hole 12.The lid of cover board 3 is arrived into 2 upper end of charging tray, and passes through cover board
Fixed mechanism is fixed on charging tray 2, and each elastic slice 20 on cover board 3 is pressed in the upper surface of corresponding tube socket 22.It later will material
Disk 2 is placed on pedestal 1, so that charging tray 2 is moved to operating position by positioning mechanism.Pedestal 1 is fixed on photodetector to consolidate
On brilliant machine, elargol is applied to the middle position of 12 degree of angle planes of tube socket 22 by point gum head of die bonder；By suction nozzle by light
Above 4 die bond to elargol of electric explorer.Above-mentioned dispensing and die bond process are repeated, until 12 degree of angle planes of all tube sockets 22 are completed
The die bond of photodetector 4.Positioning mechanism is finally unclamped, the pedestal 1 after taking out die bond.Tube socket 22 is fixed reliable, replacement
22 convenience of tube socket, realizes through simple operations, completes dispensing on same fixture using automation equipment and die bond works, be
Next procedure provides better condition, and increasing considerably for struck capacity improves production efficiency.
Embodiment 1:
Fixed mechanism can be following structure comprising longitudinally disposed in several mounting holes 10 on pedestal 1, bolt is worn
10 back spin of mounting hole is crossed together in the automatic die bond equipment of photodetector.
Embodiment 2:
Positioning mechanism can be following structure comprising the horizontally disposed block I 7 in 1 rear end of pedestal, along perpendicular
Histogram is to being set to the block II 8 of 1 right-hand end of pedestal, be set to the locating piece 6 of 1 left-hand end of pedestal along the vertical direction and set
It is placed in the elbow folder 5 of 1 lower-left edge of pedestal, is combined with fixing screws 9 in locating piece 6.When each tube socket mounting bar in charging tray 2
After being all fitted with tube socket 22 in tube socket location hole 12 on 18, charging tray 2 is placed on pedestal 1, makes upper end and the block of charging tray 2
I 7 are in contact, and the left-hand end of charging tray 2 is in contact with locating piece 6, later by rotary fixing screw nail 9, make the head of fixing screws 9
End driving charging tray 2 is locked the lower-left end of charging tray 2 using elbow folder 5 to close at block II 8, it is final realize 2 upper end of charging tray with
Block I 7 contacts, and right end contacts with block II 8, after positioning and fixation.
Embodiment 3:
Cover board fixed mechanism can be following structure comprising be horizontally placed on the pin 19 of 3 left and right sides of cover board respectively
And driving lever 11, bolt 13 pass through 11 back spin of driving lever together in charging tray 2,11 outboard end of driving lever is provided with gib head 14, when driving lever 11
When turning to horizontality, gib head 14 is hooked on corresponding pin 19.After cover board 3 fastens on charging tray 2, stir downwards
Bar 11, when it being made to turn to horizontality, gib head 14 is hooked on realization being locked to cover board 3 on pin 19, easy to operate,
Driving lever 11 need to be only rotated backward when unlock.
Embodiment 4:
The axis of tube socket location hole 12 and the angle of horizontal plane are 78 degree.It can guarantee tube socket 22 all on charging tray 12
12 degree of inclined-planes are cancelled out each other with 12 degree of angle planes of tube socket, and 12 degree of angle planes of each tube socket on fixture is enable to be nearly at same put down
Face, this ensure that dispensing and die bond when producing in automation equipment, can carry out, while being able to carry out continuous work simultaneously,
The relevant height parameter that equipment is set again is not needed.
Embodiment 5:
Elastic slice 20 can be made of stainless steel material punching press.
Claims (6)
1. a kind of semiconductor laser photodetector die bond fixture characterized by comprising
Pedestal (1) is installed in the automatic die bond equipment of photodetector by fixed mechanism, is provided on the pedestal (1)
Positioning mechanism；
Charging tray (2), the upper end is horizontally disposed several tube socket mounting bars (18) being parallel to each other, the tube socket mounting bar
(18) spaced set has several tube socket location holes (12) in the horizontal direction on；
Cover board (3) is located at charging tray (2) upper end, is provided with several long holes corresponding with tube socket mounting bar (18) on cover board (3)
(21), each long hole (21) outboard end is provided with several elastic slices (20) corresponding with tube socket location hole (12)；
Cover board fixed mechanism is set on charging tray (2), for cover board (3) and charging tray (2) to be connected and fixed；
The tube socket location hole (12) is by big hole (15) and is located at the internal diameter of big hole (15) lower end less than in big hole (15)
The small sircle hole (16) of diameter is constituted, big hole (15) and small sircle hole (16) same axis, the internal diameter and tube socket of the big hole (15)
(22) outer diameter matches, and the positioning protrusion to match with the positioning groove of tube socket (22) is provided in the big hole (15)
(17), tube socket (22) is plugged in the big hole (15) of tube socket location hole (12), and positioning protrusion (17) insertion tube socket (22) is determined
In the groove of position, the pipe leg of tube socket (22) is located in small sircle hole (16)；
After cover board (3) is fixed on charging tray (2) by cover board fixed mechanism, each tube socket mounting bar (18) is inserted into corresponding length
In hole (21), elastic slice (20) is pressed in the upper surface of tube socket (22).
2. semiconductor laser photodetector die bond fixture according to claim 1, it is characterised in that: the fixed machine
Structure includes longitudinally disposed in several mounting holes (10) on pedestal (1), and bolt passes through mounting hole (10) back spin and visits together in photoelectricity
It surveys in the automatic die bond equipment of device.
3. semiconductor laser photodetector die bond fixture according to claim 1, it is characterised in that: the localization machine
Structure includes the horizontally disposed block I (7) in pedestal (1) rear end, the gear for being set to pedestal (1) right-hand end along the vertical direction
Block II (8), the locating piece (6) for being set to pedestal (1) left-hand end along the vertical direction and it is set to pedestal (1) lower-left edge
Elbow presss from both sides (5), is combined with fixing screws (9) in the locating piece (6).
4. semiconductor laser photodetector die bond fixture according to claim 1, it is characterised in that: the cover board is solid
Determining mechanism includes the pin (19) and driving lever (11) being horizontally placed at left and right sides of cover board (3) respectively, and bolt (13), which passes through, to be dialled
Bar (11) back spin is together in charging tray (2), and driving lever (11) outboard end is provided with gib head (14), when driving lever (11) turns to level
When state, gib head (14) is hooked on corresponding pin (19).
5. semiconductor laser photodetector die bond fixture as claimed in any of claims 1 to 4, feature exist
In: the axis of the tube socket location hole (12) and the angle of horizontal plane be 78 degree.
6. semiconductor laser photodetector die bond fixture according to claim 5, it is characterised in that: the elastic slice
(20) it is made of stainless steel material punching press.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821034470.XU CN208299197U (en) | 2018-07-02 | 2018-07-02 | A kind of semiconductor laser photodetector die bond fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821034470.XU CN208299197U (en) | 2018-07-02 | 2018-07-02 | A kind of semiconductor laser photodetector die bond fixture |
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| Publication Number | Publication Date |
|---|---|
| CN208299197U true CN208299197U (en) | 2018-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821034470.XU Active CN208299197U (en) | 2018-07-02 | 2018-07-02 | A kind of semiconductor laser photodetector die bond fixture |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110676686A (en) * | 2018-07-02 | 2020-01-10 | 潍坊华光光电子有限公司 | Die bonding clamp and die bonding method for photoelectric detector of semiconductor laser |
-
2018
- 2018-07-02 CN CN201821034470.XU patent/CN208299197U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110676686A (en) * | 2018-07-02 | 2020-01-10 | 潍坊华光光电子有限公司 | Die bonding clamp and die bonding method for photoelectric detector of semiconductor laser |
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