CN208290460U

CN208290460U - Silicon wafer-plastic double-layer compound lens mold

Info

Publication number: CN208290460U
Application number: CN201820865924.1U
Authority: CN
Inventors: 张治国; 孙宇轩
Original assignee: Individual
Current assignee: Individual
Priority date: 2018-06-06
Filing date: 2018-06-06
Publication date: 2018-12-28
Anticipated expiration: 2028-06-06

Abstract

The utility model relates to a kind of silicon wafer-plastic double-layer compound lens molds, including upper mold, lower die, sleeve and positioning ring, four layers of step are coaxially formed in the outer of lower die, it successively reduces from inside to outside, outermost is first layer step, most inner side is the 4th layer of step, in the top surface coaxial package sleeve of first layer step, one positioning ring of second layer step top surface coaxial package of lower die in sleeve, the coaxial spiral-lock upper mold in the upper square socket of positioning ring, a land is produced at the top of upper mold, the land bottom surface is overlapped in the top surface of sleeve, the bottom surface periphery of upper mold is contacted with the top surface of positioning ring, the bottom surface of upper mold is formed with an arc groove in positioning ring, silicon wafer is placed in the 4th layer of step of lower die, plastics are placed in the top surface of silicon wafer.The utility model can make molded lens form mechanical self-latching structure；Positioning ring is equipped with overflow launder, Unneeded plastic can be discharged, and facilitate the taking-up of compound lens.

Description

Silicon wafer-plastic double-layer compound lens mold

Technical field

The utility model belongs to mould applications, is related to lens, especially a kind of silicon wafer-plastic double-layer compound lens mold.

Background technique

Currently, compound lens mainly uses glued form, as Chinese patent CN1354081A just proposes a kind of veneer type The molding machine of compound lens.In the molding machine, ultraviolet hardening resin layer, including positioning group are formed on basis material Part, shell, the 1st regulating mechanism, metal die, the 2nd regulating mechanism, ultraviolet radiation device.The device has the disadvantage that

1. the dosage of plastics is difficult to hold.In injection molding and solidification process, the volume of plastics can change, the molding side Method lacks the measurement process that corresponding measure simplifies quantity of plastics.

2. molded lens stability is poor.It is molding when materials at two layers adhesion strength is poor due to using glued construction Mirror has the possibility of cracking.

Utility model content

The purpose of this utility model is to provide one kind can manufacture using silicon wafer as underlying basal, and plastics are upper layer of material , possess the finishing die of the compound lens of mechanical self-latching structure.

The utility model is realized by following technology path:

A kind of silicon wafer-plastic double-layer compound lens mold, including upper die and lower die, sleeve and positioning ring, in the outer of lower die Four layers of step coaxially are formed with, are successively reduced from inside to outside, outermost is first layer step, most inner side is the 4th layer of step, The top surface coaxial package sleeve of one layer of step, one positioning ring of second layer step top surface coaxial package of lower die in sleeve, fixed Coaxial spiral-lock upper mold in the upper square socket of position ring produces a land at the top of upper mold, which is overlapped in the top surface of sleeve, The bottom surface periphery of upper mold is contacted with the top surface of positioning ring, and the bottom surface of upper mold is formed with an arc groove in positioning ring, in lower die 4th layer of step places silicon wafer, places plastics in the top surface of silicon wafer.

Moreover, being formed with an overflow launder on positioning ring.

Moreover, sleeve outer rim is concordant with lower die outer rim.

Moreover, the outer rim of the land of upper mold is concordant with the outer rim of sleeve.

Moreover, the inner wall of sleeve and the outer wall of positioning ring are spaced apart.

Moreover, the diameter of the 4th layer of step of lower die is less than the diameter of silicon wafer.

Moreover, the vertical face contact of the third layer step of the inner wall lower and lower die of positioning ring.

Moreover, the length of the arc groove is greater than the diameter of the 4th layer of step of lower die and is less than lower die third layer step Diameter.

The advantages of the utility model and the utility model has the advantages that

1, the utility model can make molded lens form mechanical self-latching structure；Positioning ring is equipped with overflow launder, can be discharged Unneeded plastic, and facilitate the taking-up of compound lens.

2, the utility model silicon wafer diameter makes to mould between positioning ring inner surface diameter and the 4th layer of stepped diameters of lower die The upper surface of silicon wafer can be completely covered in material after solidifying.

Detailed description of the invention

Fig. 1 is the front section view of the utility model mold；

The three-dimensional explosive view of Fig. 2 the utility model mold；

Fig. 3 is silicon wafer-plastic double-layer compound lens product figure；

Fig. 4 is the moulding process flow process figure for being the utility model mold；

Specific embodiment

The utility model is described in further detail with reference to the accompanying drawing and by specific embodiment, and following embodiment is only retouched The property stated, it is not restrictive, protection scope of this utility model cannot be limited by this.

A kind of silicon wafer-plastic double-layer compound lens mold, including upper mold 1, lower die 4, sleeve 2 and positioning ring 3, in lower die Outer is coaxially formed with four layers of step, successively reduces from inside to outside, and outermost is first layer, most inner side is the 4th layer, in first layer Top surface coaxial package sleeve, sleeve outer rim is concordant with lower die outer rim, in sleeve lower die second layer coaxial package one position Ring, the coaxial spiral-lock upper mold in the upper square socket of positioning ring produce a land at the top of upper mold, which is overlapped in the top of sleeve Face, the outer rim of land and the outer rim of sleeve are concordant, and the bottom surface periphery of upper mold is contacted with the top surface of positioning ring, the upper mold in positioning ring Bottom surface be formed with an arc groove, in the 4th layer of placement silicon wafer 7 of lower die, place plastics 6 in the top surface of silicon wafer.The arc of upper mold Groove is pressed in above plastics, and plastics solidification encases silicon wafer after heating, and an overflow launder 5, extra plastics are formed on positioning ring It is flowed out from the overflow launder.

The utility model is at application method.

As shown in figure 4, carry out measurement process (Fig. 4 (a)) first, according to after shaping mould assembly closure by upper die and lower die and The volume that the closed area that the inside of positioning ring is constituted subtracts the silicon wafer measures plastics, and keeps it compound more than being used to form Amount of plastic required for mirror carries out deformation process (Fig. 4 (b)), silicon wafer is placed on to the top layer of lower die, in the top layer of silicon wafer later The plastics that calculate are placed, are heated to after certain temperature making the shape of plastic deformation die face；Then, curing process (Fig. 4 is carried out (c)), plastics solidification.Finally, being taken out process (Fig. 4 (d)), the compound lens after solidification is removed from the molds, and with overflow Stream part separation.

Above-described is only preferred embodiments of the present invention, it is noted that for the ordinary skill of this field For personnel, under the premise of not departing from utility model design, various modifications and improvements can be made, these belong to this reality With novel protection scope.

Claims

1. a kind of silicon wafer-plastic double-layer compound lens mold, it is characterised in that: including upper die and lower die, sleeve and positioning ring, The outer of lower die is coaxially formed with four layers of step, successively reduces from inside to outside, and outermost is first layer step, most inner side is the 4th layer Step, in the top surface coaxial package sleeve of first layer step, the second layer step top surface coaxial package of lower die is certain in sleeve Position ring, the coaxial spiral-lock upper mold in the upper square socket of positioning ring produce a land at the top of upper mold, which is overlapped in set The top surface of cylinder, the bottom surface periphery of upper mold are contacted with the top surface of positioning ring, and the bottom surface of upper mold is formed with an arc groove in positioning ring, Silicon wafer is placed in the 4th layer of step of lower die, places plastics in the top surface of silicon wafer.

2. silicon wafer according to claim 1-plastic double-layer compound lens mold, it is characterised in that: be formed on positioning ring One overflow launder.

3. silicon wafer according to claim 1-plastic double-layer compound lens mold, it is characterised in that: sleeve outer rim and lower die Outer rim is concordant.

4. silicon wafer according to claim 1-plastic double-layer compound lens mold, it is characterised in that: outside the land of upper mold Edge is concordant with the outer rim of sleeve.

5. silicon wafer according to claim 1-plastic double-layer compound lens mold, it is characterised in that: the inner wall of sleeve and fixed The outer wall of position ring is spaced apart.

6. silicon wafer according to claim 1-plastic double-layer compound lens mold, it is characterised in that: the 4th layer of platform of lower die The diameter of rank is less than the diameter of silicon wafer.

7. silicon wafer according to claim 1-plastic double-layer compound lens mold, it is characterised in that: under the inner wall of positioning ring The vertical face contact of the third layer step of portion and lower die.

8. silicon wafer according to claim 1-plastic double-layer compound lens mold, it is characterised in that: the arc groove Length is greater than the diameter of the 4th layer of step of lower die and is less than the diameter of lower die third layer step.