CN208266252U - Mask plate - Google Patents
Mask plate Download PDFInfo
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- CN208266252U CN208266252U CN201820714443.0U CN201820714443U CN208266252U CN 208266252 U CN208266252 U CN 208266252U CN 201820714443 U CN201820714443 U CN 201820714443U CN 208266252 U CN208266252 U CN 208266252U
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- mask plate
- vapor deposition
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- main body
- transition region
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Abstract
The utility model relates to a kind of mask plate, including mask plate main body and reinforcement structure, mask plate main body includes the glass surface being oppositely arranged and vapor deposition face；It include: vapor deposition area on vapor deposition face；Illusory district is located at vapor deposition area side；Cutting area is located between illusory district and vapor deposition area；Transition region, around the setting of vapor deposition area, and illusory district and cutting area are respectively positioned on the inside of transition region；Reinforcement structure is set on the vapor deposition face of mask plate main body, and is located in transition region, and reinforcement structure is higher than the plane where vapor deposition face far from the one side of transition region.Above-mentioned mask plate, since the transition region around vapor deposition area is provided with reinforcement structure, therefore the integral thickness of transition region is increased, to increase the overall structural strength of mask plate, and then considerably reduce influence of the factors such as stress concentration, pulling force, gravity to mask plate, to effectively improving the stress condition of cutting area, mask plate unbalance stress caused by thickness is different is achieved the purpose that prevent due to has generated fold.
Description
Technical field
The utility model relates to field of display technology, more particularly to a kind of mask plate.
Background technique
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) is also known as Organic Electricity laser display
Or organic luminous semiconductor, since it is low with driving voltage, actively shine, visual angle is wide, high-efficient, fast response time, Yi Shi
The features such as now wall-mounted display of Panchromatic great-arear and Flexible Displays, therefore gradually replace liquid crystal display (Liquid
Crystal Display, LCD) it is applied on the display terminals such as mobile phone, TV.
In OLED manufacturing technology, the mask plate of vacuum evaporation is vital component, and mask plate can control
Machine material is deposited on the position on screen body, to form different organic patterns on screen body.Mask plate mainly includes general gold
Belong to mask plate (Common Metal Mask, CMM) and precision metallic mask plate (Fine Metal Mask, FMM), wherein general
Metal mask plate is mainly used for that common layer is deposited, and precision metallic mask plate is mainly used for that luminescent layer is deposited.
And currently, having with the continuous improvement that screen accounting of the people to smart machine (especially smart phone) requires
The ultra-narrow frame of superelevation screen accounting even Rimless is designed to current development trend, is accordingly used in realizing that camera shooting, face are known
The electronic device of the functions such as not is usually installed in increasing within the scope of display screen to avoid the space occupied on the outside of display platen edge
Big border width, to the special-shaped display screen with mounting groove occur.And in the production process of special-shaped display screen, structure with
The adaptable mask plate of special-shaped display screen throw the net be installed on solder mask frame during, due to the discontinuity of each position
And it is easy to appear fold, it is reduced so as to cause subsequent display screen pixel vapor deposition position precision.
Utility model content
Based on this, it is necessary to which aiming at the problem that mask plate discontinuity during throwing the net, providing one kind can be solved
State the mask plate of problem.
A kind of mask plate, including mask plate main body and reinforcement structure, the mask plate main body include the glass being oppositely arranged
Face and vapor deposition face；Include: on the vapor deposition face
Area is deposited；
Illusory district is located at the vapor deposition area side；
Cutting area is arranged between the illusory district and the vapor deposition area and around the illusory district；And
Transition region is arranged around the vapor deposition area, and the illusory district is respectively positioned on the transition region with the cutting area and leans on
Nearly vapor deposition area side；
The reinforcement structure is set on the vapor deposition face of the mask plate main body, and is located in the transition region, described to add
Strong structure is higher than the plane where the vapor deposition face far from the one side of the transition region.
Above-mentioned mask plate, for being deposited on for controlling organic material by the position on vapor deposition screen body during vapor deposition,
To form required organic pattern.The setting of cutting area on mask plate can stop organic material and organic material is avoided to be deposited on
By position corresponding with cutting area on vapor deposition screen body, region is not deposited with what the shape of cutting area matched to be formed.Due to
Transition region around vapor deposition area is provided with reinforcement structure, therefore increases the integral thickness of transition region, to increase mask plate
Overall structural strength, and then the influence of the factors to mask plate such as considerably reduce stress concentration, pulling force, gravity, to have
Effect improves the stress condition of cutting area, and having reached prevents mask plate unbalance stress caused by thickness is different due to generate fold
Purpose.Moreover, because reinforcement structure is higher than vapor deposition face place plane and not glass surface, to avoid influencing subsequent vapor deposition process
Middle glass surface is attached at by the flatness on vapor deposition screen body, and stress of mask plate during throwing the net concentrates on vapor deposition face one
Side, to avoid the influence of glass surface side under tension and reduce the precision that pattern is deposited.
Optionally, the reinforcement structure is multiple, and multiple reinforcement structures are arranged at intervals in the transition region.
Optionally, the reinforcement structure and the mask plate main body, which are integrally formed, is arranged.
Optionally, the thickness of the reinforcement structure is single from the vapor deposition area direction is laterally away from close to the vapor deposition area one
It adjusts big.
Optionally, the ratio range of the maximum gauge of the reinforcement structure and the thickness of the mask plate main body is 0.5-1.
Optionally, transitional pore is offered in the transition region, the transitional pore is from the reinforcement structure far from the glass
One side of face extends to the glass surface.
Optionally, the depth of the transitional pore is less than the mask plate main body in the reinforcement structure and the transition region
The sum of thickness.
Optionally, the transitional pore is multiple, and the depth of the transitional pore is laterally away from institute from close to the vapor deposition area one
State the successively dull reduction of vapor deposition area side.
Optionally, multiple the first vapor deposition holes through the glass surface and the vapor deposition face are equipped in the vapor deposition area；Institute
It states in illusory district and is equipped with multiple second vapor depositions hole, the depth in each second vapor deposition hole along the thickness direction of the mask plate main body
Degree is less than or equal to the thickness of the mask plate main body in the illusory district.
Optionally, the thickness direction in the cutting area along the mask plate main body offers multiple third vapor depositions hole, institute
The depth for stating third vapor deposition hole is less than the thickness of the mask plate main body in the cutting area.
Detailed description of the invention
Fig. 1 is the front view of the partial structurtes of the mask plate of an embodiment；
Fig. 2 is the rearview of the partial structurtes of mask plate shown in FIG. 1；
Fig. 3 is the cross-sectional view of the partial structurtes of the mask plate of an embodiment；
Fig. 4 is the cross-sectional view of the partial structurtes of the mask plate of another embodiment；
Fig. 5 is the cross-sectional view of the partial structurtes of the mask plate of another embodiment；
Fig. 6 is the cross-sectional view of the partial structurtes of the mask plate of another embodiment；
Fig. 7 is the cross-sectional view of the partial structurtes of the mask plate of another embodiment；
Fig. 8 is the cross-sectional view of the partial structurtes of the mask plate of another embodiment；
Fig. 9 is the cross-sectional view of the partial structurtes of the mask plate of another embodiment.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms in fact
It is existing, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes public affairs to the utility model
The understanding for opening content is more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
As shown in Figure 1-Figure 3, a kind of mask plate 100 of this better embodiment, mask plate 100 include mask plate main body and
Reinforcement structure 180.
Mask plate main body includes the glass surface 110 being oppositely arranged and vapor deposition face 120, and wherein glass surface 110 is mask plate 100
Towards by the one side of vapor deposition screen body, vapor deposition face 120 is one side of the mask plate 100 close to evaporation source.It include steaming in mask plate main body
Plate area 130, illusory district 140, cutting area 150 and transition region 160.
Wherein, illusory district 140 is located at vapor deposition 130 side of area, and cutting area 150 is located between illusory district 140 and vapor deposition area 130
And it bends and extends around the edge of illusory district 140.Transition region 160 is arranged around vapor deposition area 130, and illusory district 140 and cutting area 150
It is respectively positioned on side setting of the transition region 160 close to vapor deposition area.Reinforcement structure 180 is set on vapor deposition face 120 and is located at transition region
In 160, reinforcement structure 180 is higher than the plane where vapor deposition face 120 far from a side end face of transition region 160.
Above-mentioned mask plate 100, for being deposited on for controlling organic material by the position on vapor deposition screen body during vapor deposition
It sets, thus organic pattern needed for being formed.The setting of cutting area 150 on mask plate 100 can stop organic material and avoid organic
Material is deposited on by position corresponding with cutting area 150 on vapor deposition screen body, thus what the shape of formation and cutting area 150 matched
Region is not deposited.Since the transition region 160 around vapor deposition area 130 is provided with reinforcement structure 180, transition region 160 is increased
Integral thickness, to increase the overall structural strength of mask plate 100, and then considerably reduce stress concentration, pulling force, again
Influence of the factors such as power to mask plate 100, to effectively improve the stress condition of cutting area 150, having reached prevents mask plate
100 the unbalance stress caused by thickness is different due to generate the purpose of fold.Moreover, because reinforcement structure 180 is higher than vapor deposition face 120
Place plane and not glass surface 110, so that glass surface 110 during influencing subsequent vapor deposition be avoided to be attached at by vapor deposition screen body
Flatness, and stress of the mask plate 100 during throwing the net concentrates on 120 side of vapor deposition face, to avoid glass surface 110 1
The influence of side under tension and reduce vapor deposition pattern precision.
As shown in Figures 1 and 2, vapor deposition area 130 includes the first vapor deposition area 136 and two second vapor deposition areas 134, the first vapor deposition
Area 136 is generally rectangular shaped, and with two opposite short sides and the long side for connecting two short sides, two second vapor deposition areas 134 are spaced
Set on the both ends of the first vapor deposition 136 1 short sides in area, and the second vapor deposition area 134 is also generally rectangular shaped.Illusory district 140 is also substantially in
Rectangle, and illusory district 140 is set to the first vapor deposition 136 side of area and is located between two second vapor deposition areas 134.Cutting area 150 around
It is arranged around illusory district 140, and close to the edge in vapor deposition area 130, and in the corner position of illusory district 140 in 90 ° of bendings.Such as
This during applying pulling force to mask plate 100 to be fixed in solder mask frame, cuts when not set reinforcement structure 180
The stress for cutting reason and illusory district 140 that the bending place in area 150 is concentrated due to stress is inconsistent, make mask plate 100
It is easy to produce more fold in network process, leads to the yields decline of subsequent vapor deposition process.And in the present embodiment, due to mistake
The reinforcement structure 180 being convexly equipped in area 160 around vapor deposition 130 periphery of area is crossed, therefore increases the integral thickness of transition region 160,
To improve the overall structural strength of mask plate 100, the factors such as stress concentration, pulling force, gravity are thereby reduced to mask plate
100 influence, the uniform stress of the bending place of cutting area 150, thus the fold for generating mask plate 100 during throwing the net
It largely reduces, improves the precision of the organic image formed by the vapor deposition of the mask plate 100.Can connect, vapor deposition area 130 with
The shape of illusory district 140 is without being limited thereto, can be set as needed to be deposited on by vapor deposition screen body and form different patterns.
Specifically in the present embodiment, mask plate 100 includes a reinforcement structure 180, and the reinforcement structure 180 is around vapor deposition
Area 120 is to form closed cyclic structure, so that the integral thickness of transition region 160 is uniformly increased, to increase mask plate 100
Structural strength, make 150 uniform stressed of cutting area.
In another embodiment, reinforcement structure 180 is multiple, and multiple reinforcement structures 180 are arranged at intervals at transition region 160
It is interior.Specifically, in one embodiment, multiple reinforcement structures 180 are along the circumferential setting of transition region 160, each 180 one end of reinforcement structure
Close to vapor deposition area 130, the other end extends to far from vapor deposition 130 direction of area, and 180 parallel interval of multiple reinforcement structures is arranged.?
In another embodiment, from transition region 160, close to vapor deposition 130 side of area, radial interval is arranged multiple reinforcement structures 180 outward.
It is appreciated that the arrangement mode of reinforcement structure 180 is unlimited, in other embodiments, reinforcement structure 180 can also be random interval
A variety of arrangement modes such as setting or interlaced setting.
Further, reinforcement structure 180 and mask plate main body, which are integrally formed, is arranged, therefore integral strength with higher,
Simplify manufacturing process.In other embodiments, the material that intensity is greater than mask plate main body intensity also can be used in reinforcement structure 180
Material is formed, to improve the overall structural strength of mask plate 100.
As shown in Figures 2 and 3, the thickness of reinforcement structure 180 is laterally away from vapor deposition 130 side of area from close to vapor deposition area 130
Increase to dullness, to keep the transmitting of the power in mask plate 100 more uniform and avoid transition region 160 and vapor deposition area 130
The stress of join domain is concentrated.Specifically, the cross section of reinforcement structure 180 is right angled triangle, to make the whole of transition region 160
Body thickness gradually transition and avoid the thickness of mask plate 100 occur suddenly it is larger change and cause to deform and wrinkle phenomenon.
Please continue to refer to Fig. 2 and Fig. 3, the ratio range of the thickness of the maximum gauge and mask plate main body of reinforcement structure 180
For 0.5-1.Preferably, the ratio of the maximum gauge of reinforcement structure 180 and the thickness of mask plate main body is 1.When mask plate main body
With a thickness of 50 μm when, the maximum gauge of reinforcement structure 180 is 100 μm.In this way, reinforcement structure 180 dramatically increases mask plate 100
Intensity while, can avoid mask plate 100 area and thickness it is excessive.And work as the maximum gauge and exposure mask of reinforcement structure 180
When the ratio of the thickness of plate main body is less than 0.5, the thickness of reinforcement structure 180 itself is too small and can not effectively increase structural strength,
And when the ratio of the maximum gauge of reinforcement structure 180 and the thickness of mask plate main body is greater than 1, then lead to reinforcement structure 180
Width is excessive with thickness and considerably increases the area and weight of mask plate 100.
Please continue to refer to Fig. 2, Fig. 4 and Fig. 5, transition region 160 offers transitional pore 182, and transitional pore 182 is from reinforcement structure
180 extend far from 110 1 side of glass surface to glass surface 110, to make to be deposited while increasing the structural strength of mask plate 100
Area 130 and the transition of transition region 160 are more uniform, avoid the thickness of transition region 160 and vapor deposition area 130 and Weight gap excessive.
Further, transitional pore 182 is multiple, and multiple transitional pores 182 are formed by technique is etched partially, transitional pore 182
Depth is less than reinforcement structure 180 and (i.e. transition region 160 is whole thick positioned at the sum of thickness of mask plate main body of transition region 160
Degree), that is, it is in blind hole shape, and the depth of transitional pore 182 is successively single from vapor deposition 130 side of area is laterally away from close to vapor deposition area 130
Adjust and reduce it is small, to keep the transmitting of power in mask plate 100 more uniform.
Specifically in the present embodiment, the cross section of transitional pore 182 is elongated or round (as shown in Figures 4 and 5), and
It is mutually isolated and be not connected to mutually between each transitional pore 182, thus can uniform cutting area 150 stress.It is appreciated that transitional pore
182 shape and arrangement mode are unlimited, can need to be arranged according to different.
In one embodiment, as shown in Figure 2, Figure 6 and Figure 7, be deposited area 130 in be equipped with it is multiple through glass surface 110 with
The first vapor deposition hole 132 in vapor deposition face 120, the thickness direction in illusory district 140 along mask plate main body offer multiple second vapor depositions
The depth in hole 142, each second vapor deposition hole 142 is less than or equal to the thickness of mask plate main body in illusory district 140.Specifically,
Two vapor deposition holes 142 can be formed on vapor deposition face 120 by etching partially technique, and vapor deposition face can also be formed in by full etching technique
On 120.It is appreciated that in other embodiments, illusory district 140 can also be not provided with the second vapor deposition hole 142.
As shown in fig. 6, having when the depth in the second vapor deposition hole 142 is less than the thickness of the mask plate main body in illusory district 140
Machine material can not be covered on by the corresponding position of vapor deposition screen body under the blocking of illusory district 140 during vapor deposition and form screening
Stopper position, consequently facilitating subsequent cutting forms mounting groove.
As shown in fig. 7, and being passed through when the second vapor deposition 142 depth of hole is equal to the thickness of the mask plate main body in illusory district 140
When wearing illusory district 140, the structure of illusory district 140 is similar to the vapor deposition structure in area 130, therefore can further uniform mask plate 100
Stress, alleviate cutting area 150 stress concentration phenomenon.
In one embodiment, as can be seen from figures 8 and 9, cutting area 150 offers multiple third vapor depositions hole 162, and third is steamed
The depth of plated hole 162 is less than the thickness of the mask plate main body in cutting area 150.In this way, organic material can be during vapor deposition
It can not be covered under the blocking of illusory district 140 by the corresponding position of vapor deposition screen body and form cutting surplus, avoid that screen body is deposited
After encapsulation, water oxygen along by vapor deposition screen body and 150 corresponding position of cutting area organic material invade and shorten screen body use the longevity
Life.It is appreciated that cutting area 150 can also be not provided with third vapor deposition hole 162.
Above-mentioned mask plate 100, due to being provided with reinforcement structure 180 in the transition region 160 around vapor deposition area 130,
The integral thickness of transition region 160 is increased, to improve the structural strength of mask plate 100, is not easily susceptible to pulling force, gravity
Influence and generate fold, and since transition region 160 offers the transitional pore 182 of depth gradual change, transition effect can be played
Subsequent evaporation effect is improved with the stress of further uniformly mask plate 100 to achieve the purpose that reduce fold.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of mask plate, which is characterized in that including mask plate main body and reinforcement structure, the mask plate main body includes opposite sets
The glass surface set and vapor deposition face；Include: on the vapor deposition face
Area is deposited；
Illusory district is located at the vapor deposition area side；
Cutting area is arranged between the illusory district and the vapor deposition area and around the illusory district；And
Transition region is arranged around the vapor deposition area, and the illusory district and the cutting area are respectively positioned on the transition region close to steaming
Plate area side；
The reinforcement structure is set on the vapor deposition face of the mask plate main body, and is located in the transition region, the reinforcement knot
Structure is higher than the plane where the vapor deposition face far from the one side of the transition region.
2. mask plate according to claim 1, which is characterized in that the reinforcement structure is multiple, multiple reinforcement knots
Structure is arranged at intervals in the transition region.
3. mask plate according to claim 1 or 2, which is characterized in that the reinforcement structure and the mask plate main body one
Body formed setting.
4. mask plate according to claim 1, which is characterized in that the thickness of the reinforcement structure is from close to the vapor deposition
Area one is laterally away from the vapor deposition area direction dullness and increases.
5. mask plate according to claim 1, which is characterized in that the maximum gauge of the reinforcement structure and the mask plate
The ratio range of the thickness of main body is 0.5-1.
6. mask plate according to claim 1, which is characterized in that offer transitional pore, the transition in the transition region
Hole extends far from one side of glass surface to the glass surface from the reinforcement structure.
7. mask plate according to claim 6, which is characterized in that the depth of the transitional pore be less than the reinforcement structure with
The sum of the thickness of the mask plate main body in the transition region.
8. mask plate according to claim 7, which is characterized in that the transitional pore is multiple, the depth of the transitional pore
From being laterally away from close to the vapor deposition area one, the vapor deposition area side is successively dull to be reduced.
9. mask plate according to claim 1, which is characterized in that be equipped in the vapor deposition area multiple through the glass surface
Hole is deposited with the first of the vapor deposition face；Multiple second are equipped with along the thickness direction of the mask plate main body in the illusory district to steam
The depth of plated hole, each second vapor deposition hole is less than or equal to the thickness of the mask plate main body in the illusory district.
10. mask plate according to claim 1, which is characterized in that along the thickness of the mask plate main body in the cutting area
Degree direction offers multiple third vapor depositions hole, and the depth in third vapor deposition hole is less than the mask plate main body in the cutting area
Thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820714443.0U CN208266252U (en) | 2018-05-14 | 2018-05-14 | Mask plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820714443.0U CN208266252U (en) | 2018-05-14 | 2018-05-14 | Mask plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208266252U true CN208266252U (en) | 2018-12-21 |
Family
ID=64681797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820714443.0U Active CN208266252U (en) | 2018-05-14 | 2018-05-14 | Mask plate |
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| Country | Link |
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| CN (1) | CN208266252U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111778475A (en) * | 2019-04-04 | 2020-10-16 | 陕西坤同半导体科技有限公司 | Mask plate |
| CN113215529A (en) * | 2021-04-30 | 2021-08-06 | 合肥维信诺科技有限公司 | Precision mask plate and mask plate assembly |
-
2018
- 2018-05-14 CN CN201820714443.0U patent/CN208266252U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111778475A (en) * | 2019-04-04 | 2020-10-16 | 陕西坤同半导体科技有限公司 | Mask plate |
| CN113215529A (en) * | 2021-04-30 | 2021-08-06 | 合肥维信诺科技有限公司 | Precision mask plate and mask plate assembly |
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