CN208254301U - The augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface - Google Patents
The augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface Download PDFInfo
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- CN208254301U CN208254301U CN201820010796.2U CN201820010796U CN208254301U CN 208254301 U CN208254301 U CN 208254301U CN 201820010796 U CN201820010796 U CN 201820010796U CN 208254301 U CN208254301 U CN 208254301U
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- heat
- heat exchanger
- heat exchange
- pedestal
- rice leaf
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Abstract
The utility model discloses a kind of augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface, including heat exchange pedestal, heat exchanging body and conductive conduit；Heat exchanging body is made of the heat exchanger fin that multi-disc is arranged side by side；Every heat exchanger fin is sheet, and the surface of every heat exchanger fin is provided with several convex heat exchange ribs；Every heat exchange rib is in long strip, and the section for the rib that exchanges heat is rectangle；All heat exchange ribs are in parallel interval setting on the surface of heat exchanger fin between each other；Conductive conduit is inverted U shape；One end of conductive conduit passes across heat exchange pedestal；The other end of conductive conduit passes across heat exchanging body, and all heat exchanger fins for constituting heat exchanging body are worn together, and all heat exchanger fins are in parallel interval setting between each other.The surface of the utility model heat exchanger fin joined imitative Rice Leaf surface microstructure, and the generation of the bubble on surface can be enhanced and be detached from frequency.
Description
Technical field
The utility model relates to heat transfer enhancement technology fields, and in particular to a kind of reinforcing biography of imitative Rice Leaf micro-structure surface
Hot microelectronics heat exchanger.
Background technique
Currently, most of in heat exchanger in the market is the heat exchanger fin for adopting the smooth surface being made of aluminum or copper, it is this to change
Hot device is advantageous in that the Thermal conductivity using aluminium or copper product, and heat exchanger is attached on mainboard, and the heat of mainboard is passed
It leads on heat exchanger fin, under the drive for the flowing that fan on heat exchangers forms gas, the heat on heat exchanger fin is discharged to the external world,
Play cooling effect.But with modern computer constantly bring forth new ideas and the running memory of computer software constantly increases, it is micro-
Electronics CPU accordingly runs power and also increases, and the heat of generation is consequently increased, the rate of heat transfer and conductivity of heat of traditional heat exchanger fin
The cooling that CPU can be far from satisfying requires, and to microelectronics heat exchanger, more stringent requirements are proposed in this case.It is micro-
The increase of electronic power, heat production increase therewith, continue to use traditional heat exchanger, and cannot exchanging heat in time for traditional heat exchanger fin is led
Pyrogenicity amount constantly accumulates on cpu motherboard, just will appear problems, such as the excessively high computer crash, again of causing of temperature of CPU
It opens, blue screen, or even burns out mainboard.The heat exchange property of CPU has been increasingly becoming an important factor for restriction development of computer.In order to solve
The heat exchange wall surface of this problem, heat exchanging device is strengthened, its heat exchange property is enhanced, and improves the heat-exchange performance of microelectronics heat exchanger
It can be of great significance.
Utility model content
The utility model provides a kind of augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface, can increase
The heat transfer area of heat exchanger, to reach augmentation of heat transfer feature.
To solve the above problems, the utility model is achieved through the following technical solutions:
The augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface, including heat exchange pedestal, heat exchanging body and thermally conductive lead
Pipe；Heat exchanging body is made of the heat exchanger fin that multi-disc is arranged side by side；Every heat exchanger fin is sheet, and the surface of every heat exchanger fin is arranged
There are several convex heat exchange ribs；Every heat exchange rib is in long strip, and the section for the rib that exchanges heat is rectangle；It is all to change
Hot rib is in parallel interval setting on the surface of heat exchanger fin between each other；Conductive conduit is inverted U shape；It crosses one end of conductive conduit
Cross heat exchange pedestal；The other end of conductive conduit passes across heat exchanging body, and all heat exchanger fins for constituting heat exchanging body are worn together,
And all heat exchanger fins are in parallel interval setting between each other.
In above scheme, heat exchange rib extends on the surface of heat exchanger fin along perpendicular to horizontal plane direction.
In above scheme, heat exchanging body is located at the surface of heat exchange pedestal.
In above scheme, heat exchange pedestal is made of pedestal and multi-disc thermally conductive sheet；Wherein pedestal is the cube carried out；It is thermally conductive
Piece is sheet, and erects and be fixed on susceptor surface.
In above scheme, thermally conductive sheet is fixed on the upper surface of pedestal.
In above scheme, the both ends of conductive conduit are opening-like, and communicate with heat transferring medium.
Compared with prior art, a kind of heat exchanger that the utility model is manufactured based on rice microcosmic surface institutional framework,
The surface of heat exchanger fin joined imitative Rice Leaf surface microstructure, and the generation of the bubble on surface can be enhanced and be detached from frequency.This
Its surface of the heat exchanger fin of biomimetic features is opposite, and its area increases 12%-25% with the heat exchanger of smooth surface structure, passes through increasing
Heat exchange element is added to increase heat exchange area to improve the heat exchange efficiency of heat exchanger, to have stronger heat exchange property, so as to fast
Heat on cpu motherboard is transmitted to rapidly on each heat exchanger fin by speed, enhances the heat transfer effect of heat exchanger, reduces heat in master
Accumulation on plate effectively prevents computer blue screen, crashes, extends the service life of mainboard.The utility model has heat-exchange performance more
By force, structure is simple, the tremendous development suitable for the CPU that modern power constantly increases.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface.
Fig. 2 is the structural schematic diagram of heat exchanger fin.
Fig. 3 is enlarged diagram at A in Fig. 2.
Figure label: 1, conductive conduit；2, exchange heat pedestal；2-1, pedestal；2-2, thermally conductive sheet；3, heat exchanging body；3-1, heat exchange
Piece；3-2, heat exchange rib.
Specific embodiment
For the purpose of this utility model, technical solution and advantage is more clearly understood, below in conjunction with specific example, and join
According to attached drawing, the utility model is further described.It should be noted that the direction term mentioned in example, such as "upper",
"lower", " in ", " left side " " right side ", "front", "rear" etc., be only the direction with reference to attached drawing.Therefore, the direction used is intended merely to illustrate
Not it is used to limit the protection scope of the utility model.
A kind of augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface, as shown in Figure 1, include heat exchange pedestal 2,
Heat exchanging body 3 and conductive conduit 1.Conductive conduit 1 is inverted U shape.The both ends of conductive conduit 1 both can be in closed form, can also be in open
Mouth shape.In order to improve heat exchange efficiency, in the preferred embodiment in the utility model, the both ends of the conductive conduit 1 are in out
Mouth shape, heat transferring medium flows to the other end by one end of conductive conduit 1 at this time.The heat transferring medium can be air or freon etc.
Heat transferring medium.One end of conductive conduit 1 passes across heat exchange pedestal 2, and the other end of conductive conduit 1 passes across heat exchanging body 3.Heat exchanging body
The 3 heat exchanger fin 3-1 being arranged side by side by multi-disc are constituted, these heat exchanger fins 3-1 is worn together by conductive conduit 1, and to own
Heat exchanger fin 3-1 is in parallel interval setting between each other, forms heat exchanger channels between every 2 heat exchanger fin 3-1.The utility model is preferred
In embodiment, the width of heat exchanger channels is 2mm, and effect is to increase the contact area of heat exchanger fin 3-1 and air.Heat exchanging body 3
In the surface of heat exchange pedestal 2.
Heat exchange pedestal 2 is made of pedestal 2-1 and multi-disc thermally conductive sheet 2-2.Pedestal 2-1 is the cube carried out, pedestal 2-1's
Centre is embedded with silicon.Thermally conductive sheet 2-2 is sheet, and erects and be fixed on the surface pedestal 2-1.In the present invention, thermally conductive sheet 2-2 can
To be located on six surfaces of pedestal 2-1, but consider cost and thermal conductivity, it is thermally conductive in the preferred embodiment in the utility model
Piece 2-2 is only secured to the upper surface of pedestal 2-1.The thermally conductive sheet 2-2 can be smooth surface, or non-smooth surface.
In the preferred embodiment in the utility model, the thermally conductive sheet 2-2 can also be provided with imitative as heat exchanger fin 3-1 on its surface
The rib of Rice Leaf micro-structure surface.Referring to Fig. 1.
Every heat exchanger fin 3-1 is sheet, and the surface of every heat exchanger fin 3-1 is provided with several convex heat exchange ribs
3-2.In the preferred embodiment in the utility model, every heat exchanger fin 3-1 with a thickness of 3mm, a length of 50mm, width 30mm.Every
The rib 3-2 that exchanges heat is in long strip, and the section for the rib 3-2 that exchanges heat is rectangle.Table of the heat exchange rib 3-2 in heat exchanger fin 3-1
Face can extend along perpendicular to horizontal plane direction, can also extend along level in horizontal plane direction, it might even be possible to along inclined direction
Extend.It is described to change to improve heat exchange efficiency in order to allow condensed water to be effectively discharged in the preferred embodiment in the utility model
Hot rib 3-2 extends on the surface of heat exchanger fin 3-1 along perpendicular to horizontal plane direction.All heat exchange rib 3-2 are heat exchanger fin 3-1's
Surface is in parallel interval setting between each other, forms groove between every 2 heat exchange ribs 3-2.It is preferably implemented in the utility model
In example, groove is the microstructure groove of wide 0.3mm and high 0.2mm.The surface heat exchanger fin 3-1 is according to imitative Rice Leaf microcosmic surface system
It makes, is a kind of bionic surface with good hydrophobic structure, large-sized groove optical grating construction with Rice Leaf surface,
And have wellability identical with Rice Leaf surface, the boiling heat transfer on the surface heat exchanger fin 3-1 can be enhanced, increase surface
Frequency bubble production and be detached from.The heat exchanger heat exchanger channels of the imitative Rice Leaf microcosmic surface of this structure-reinforced the utility model
Wall enhances the coefficient of heat transfer, so that effective must conduct heat.Referring to figs. 2 and 3.
Heat exchange pedestal 2 is the heat transfer for connecting CPU, and the heat of CPU increases and heat exchanger fin 3- after the structure conduction
1 contact area.When CPU work generates a large amount of heat, the pedestal 2-1 for the heat exchange substrate being attached on CPU has good thermally conductive
Property, the heat in CPU small area is transmitted on the heat exchanger fin 3-1 of heat exchanging body 3 by thermally conductive sheet 2-2 and heat exchange catheter.It is bionical
Its surface the heat exchanger fin 3-1 of structure is opposite, and its area increases 12%-25% with the heat exchanger of smooth surface structure, passes through increase
Heat exchange element increases heat exchange area to improve the heat exchange efficiency of heat exchanger, quickly heat is transmitted in heat exchanger channels, in channel
Gas be discharged in the external world in the flowing that fan rotates the gas to be formed, it is better than traditional heat exchangers heat exchange property to realize, extensively
It is general to be applied in all kinds of microelectronics.
The utility model microelectronics heat exchanger fin 3-1 is based on good hydrophobic Rice Leaf surface microstructure
On the basis of, its surface texture data is extracted by reverse-engineering, obtains the two dimensional character figure on rice surface, is carried out according to its data
Three-dimensional modeling.The heat exchanger fin 3-1 is the same wellability having the same with the identical groove structure in Rice Leaf surface.
The heat exchanger fin 3-1 of the imitative Rice Leaf surface texture shows the static hydrophobicity almost the same with Rice Leaf, and enhances and change
The boiling on the surface backing 3-1, good boiling property can reinforce the bubble formation on surface and be detached from frequency, enhance heat exchange
The coefficient of heat transfer on surface.The heat exchange property of microelectronics heat exchanger heat exchanger fin 3-1 is further enhanced, is improved between mainboard and heat exchanger
Heat-transfer effect, effectively optimize the heat transfer effect of traditional heat exchangers.
In conclusion the utility model is based on Rice Leaf microscale surface features, changed to micro heat exchanger by this feature is bionical
On the surface backing 3-1, to increase the heat transfer area of heat exchanger, thus reach augmentation of heat transfer feature, the miniature heat exchange of this bionic surface
Device can effectively reduce the volume of heat exchanger in same heat exchange amount, reduce manufacturing cost.
It should be noted that although the above embodiment described in the utility model be it is illustrative, this is not to this
The limitation of utility model, therefore the utility model is not limited in above-mentioned specific embodiment.The utility model is not being departed from
In the case where principle, the other embodiment that all those skilled in the art obtain under the enlightenment of the utility model is accordingly to be regarded as
Within the protection of the utility model.
Claims (5)
1. the augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface, characterized in that including heat exchange pedestal (2), heat exchange
Body (3) and conductive conduit (1)；
The heat exchanger fin (3-1) that heat exchanging body (3) is arranged side by side by multi-disc is constituted；Every heat exchanger fin (3-1) is sheet, and every is changed
The surface of backing (3-1) is provided with several convex heat exchange ribs (3-2)；Every heat exchange rib (3-2) is in long strip, and
The section of heat exchange rib (3-2) is rectangle；All heat exchange rib (3-2) are in flat on the surface of heat exchanger fin (3-1) between each other
Row interval setting；
Heat exchange pedestal (2) is made of pedestal (2-1) and multi-disc thermally conductive sheet (2-2)；Wherein pedestal (2-1) is the cube carried out；
Thermally conductive sheet (2-2) is sheet, and erects and be fixed on the surface pedestal (2-1)；The surface thermally conductive sheet (2-2) is provided with the micro- knot of imitative Rice Leaf
The rib on structure surface；
Conductive conduit (1) is inverted U shape；One end of conductive conduit (1) passes across heat exchange pedestal (2)；The other end of conductive conduit (1)
It passes across heat exchanging body (3), and all heat exchanger fins (3-1) for constituting heat exchanging body (3) is worn together, and all heat exchanger fin (3-
1) it is arranged between each other in parallel interval.
2. the augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface according to claim 1, characterized in that change
Hot rib (3-2) extends on the surface of heat exchanger fin (3-1) along perpendicular to horizontal plane direction.
3. the augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface according to claim 1 or 2, feature
It is that heat exchanging body (3) is located at the surface of heat exchange pedestal (2).
4. the augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface according to claim 1, thermally conductive sheet (2-2)
It is fixed on the upper surface of pedestal (2-1).
5. the augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface according to claim 1, characterized in that lead
The both ends of heat pipe (1) are opening-like, and communicate with heat transferring medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820010796.2U CN208254301U (en) | 2018-01-04 | 2018-01-04 | The augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820010796.2U CN208254301U (en) | 2018-01-04 | 2018-01-04 | The augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208254301U true CN208254301U (en) | 2018-12-18 |
Family
ID=64619987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820010796.2U Expired - Fee Related CN208254301U (en) | 2018-01-04 | 2018-01-04 | The augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208254301U (en) |
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2018
- 2018-01-04 CN CN201820010796.2U patent/CN208254301U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181218 Termination date: 20200104 |