CN208240668U - 一种功率半导体集成式封装用陶瓷模块 - Google Patents
一种功率半导体集成式封装用陶瓷模块 Download PDFInfo
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108109986A (zh) * | 2017-07-13 | 2018-06-01 | 东莞市国瓷新材料科技有限公司 | 一种功率半导体集成式封装用陶瓷模块及其制备方法 |
CN110010596A (zh) * | 2019-03-28 | 2019-07-12 | 西安交通大学 | 一种多芯片并联功率模块用封装结构 |
CN113764357A (zh) * | 2021-08-03 | 2021-12-07 | 桂林电子科技大学 | 导电模块的封装结构 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108109986A (zh) * | 2017-07-13 | 2018-06-01 | 东莞市国瓷新材料科技有限公司 | 一种功率半导体集成式封装用陶瓷模块及其制备方法 |
CN108109986B (zh) * | 2017-07-13 | 2024-04-23 | 西安柏芯创达电子科技有限公司 | 一种功率半导体集成式封装用陶瓷模块及其制备方法 |
CN110010596A (zh) * | 2019-03-28 | 2019-07-12 | 西安交通大学 | 一种多芯片并联功率模块用封装结构 |
CN110010596B (zh) * | 2019-03-28 | 2020-11-10 | 西安交通大学 | 一种多芯片并联功率模块用封装结构 |
CN113764357A (zh) * | 2021-08-03 | 2021-12-07 | 桂林电子科技大学 | 导电模块的封装结构 |
CN113764357B (zh) * | 2021-08-03 | 2024-02-09 | 桂林电子科技大学 | 导电模块的封装结构 |
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