CN208240640U - Concertina type end effector - Google Patents
Concertina type end effector Download PDFInfo
- Publication number
- CN208240640U CN208240640U CN201820745757.7U CN201820745757U CN208240640U CN 208240640 U CN208240640 U CN 208240640U CN 201820745757 U CN201820745757 U CN 201820745757U CN 208240640 U CN208240640 U CN 208240640U
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- end effector
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- cylinder
- telescopic
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- 239000012636 effector Substances 0.000 title claims abstract description 93
- 238000001179 sorption measurement Methods 0.000 claims abstract description 26
- 230000033001 locomotion Effects 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 57
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of concertina type end effectors, including end effector ontology and robotic connector, are connected between end effector ontology and robotic connector by telescopic device；The shape of adsorption orifice on end effector ontology is arc-shaped；The opening width of adsorption orifice is gradually reduced from center to both ends；After end effector ontology draws wafer, robotic connector drives end effector ontology and wafer to retract, cylinder drives end effector ontology and wafer further to retract simultaneously, increase the stroke retracted, revolution carrying is carried out after retraction again, the revolution interference diameter of wafer and end effector ontology can be reduced, the station space occupied when reducing rotary motion, therefore more manipulators can be laid out on the station of same size, improve the utilization rate of station, production efficiency is improved, since the centrifugal force being subject to reduces, piece risk can be reduced.
Description
Technical Field
The utility model relates to a manipulator technical field, concretely relates to end effector.
Background
The end effector is an actuator connected to the end of the robot arm for gripping an item.
With the emphasis of the state on the semiconductor industry, a great supporting policy is released, various semiconductor equipment manufacturers such as bamboo shoots in spring after rain adopt clean robots to transmit wafers, end effectors of the robot actuating mechanisms are mostly fixed in a direct positioning mode and have no flexibility, the length of the end effectors is often determined by the distance between a mechanical arm end joint and a butt joint working platform of a production line, the length of the end effectors directly determines an interference area of a manipulator, the layout of wafer stations required to be taken and placed in the equipment influences the size of the equipment, inevitable space waste is generated, the space utilization rate of the whole wafer processing production line is reduced, and the flexibility of the production line is reduced.
Due to the characteristics of the material of the end effector, the length of the end effector cannot be changed after the end effector is produced, and the station layout only can extrude the space of the station within the farthest wafer taking distance of the end effector except the interference field of the end effector carrying the wafer. After the length of the mechanical arm and the end effector is fixed and the station layout is set correspondingly, the mechanical arm and the end effector can hardly be applied to other equipment, and the transmission efficiency of the whole set of equipment is limited due to the limitation of the distance between the station layout of different equipment and the center of the wafer reversing manipulator. Moreover, the end effector itself is expensive, and once the product is changed in the production line, a new end effector needs to be purchased again, which increases the cost of the whole production line.
In summary, the end effector in the prior art occupies a large working position space, and the efficiency of transporting wafers is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a concertina type end effector for reduce the station space that end effector occupy, and improve the efficiency of transport wafer.
In order to achieve the above purpose, the technical scheme of the utility model is that:
the utility model provides a concertina type end effector, includes end effector body and manipulator connecting piece, is equipped with the telescoping device between end effector body and the manipulator connecting piece, and telescoping device one end is connected with the end effector body, and the other end is connected with the manipulator connecting piece.
The utility model discloses further set up to: the telescopic device is an air cylinder, a piston rod of the air cylinder is fixedly connected with the body of the end effector, and the body of the air cylinder is fixedly connected with the mechanical arm connecting piece.
The utility model discloses further set up to: the end effector body is provided with an adsorption port for adsorbing a wafer, and the adsorption port is arc-shaped.
The utility model discloses further set up to: the circumferential span of the adsorption port is 180 degrees.
The utility model discloses further set up to: and extension sections are arranged at two ends of the adsorption port.
The utility model discloses further set up to: the width of the opening of the adsorption port is gradually reduced from the center to the two ends.
The utility model discloses further set up to: the telescopic type end effector further comprises a cover plate and an end effector mounting plate, the end effector mounting plate is fixedly connected with the telescopic device, the cover plate is fixedly connected with the end effector mounting plate, and the end effector body is fixedly connected between the cover plate and the end effector mounting plate in a pressing mode.
The utility model has the advantages of as follows:
1. after the end effector body absorbs the wafer, the manipulator connecting piece drives the end effector body and the wafer to retract, meanwhile, the air cylinder drives the end effector body and the wafer to further retract, the retracting stroke is increased, and rotary carrying is carried out after retraction, so that the rotary interference diameter of the wafer and the end effector body can be reduced, and the occupied station space during rotary motion is reduced, therefore, more manipulators can be distributed on stations with the same size, the utilization rate of the stations is improved, and the production efficiency is improved;
2. because the retracting stroke is increased, the rotating radius is reduced during the rotating motion, and the centrifugal force borne by the wafer is reduced, so that the rotating speed can be increased, and the working efficiency is improved;
3. because the centrifugal force is reduced, the possibility that the wafer is separated from the body of the end effector due to the action of the centrifugal force is reduced in the rotary conveying process, and the risk that the wafer falls off is reduced.
Drawings
FIG. 1 is a schematic structural view of example 1;
fig. 2 is a schematic view showing a connection structure between the cylinder and the end effector body mounting plate and the robot connecting member in embodiment 1;
FIG. 3 is a schematic view showing the rotation interference diameters of the wafer before and after the expansion and contraction of the air cylinder in example 1;
FIG. 4 is a schematic view showing the relationship between the wafer stress before and after the expansion and contraction of the air cylinder in example 1;
FIG. 5 is a schematic view showing the structure of the adsorption port in example 2;
FIG. 6 is a schematic view showing the structure of the adsorption port in example 3.
Wherein,
1. an end effector body; 11. an adsorption port; 12. a vent hole; 13. an air duct;
2. a cover plate;
3. an end effector mounting plate;
4. a cylinder;
5. a drag chain;
6. a manipulator connecting piece;
7. and (5) a wafer.
Detailed Description
The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
Example 1
The telescopic type end effector is combined with the figures 1 and 2 and comprises an end effector body 1, a cylinder 4 and a manipulator connecting piece 6, wherein the cylinder 4 is positioned between the end effector body 1 and the manipulator connecting piece 6, a cylinder body of the cylinder 4 is fixedly connected with the manipulator connecting piece 6, a piston rod is connected with the end effector, and the cylinder 4 can drive the end effector body 1 to move linearly during telescopic movement.
One side fixedly connected with end effector mounting panel 3 that manipulator connecting piece 6 was kept away from to cylinder 4, the one side that end effector mounting panel 3 kept away from cylinder 4 has apron 2 through fastener fastening connection, and end effector body 1 is compressed tightly and is fixed between apron 2 and end effector mounting panel 3.
The mechanical arm connecting piece 6 is provided with a drag chain 5, one end of the drag chain 5 is fixedly connected with the mechanical arm connecting piece 6, the other end of the drag chain 5 is fixedly connected with the end effector mounting plate 3, and an air path applied to vacuum adsorption or Bernoulli adsorption can be embedded in the drag chain 55. The telescopic end effector needs to adjust air pressure of an air source after the assembly is completed, and the telescopic performance of the air cylinder 4 is guaranteed to be fast and stable.
The working principle is as follows: as shown in fig. 2, when the cylinder 4 retracts, the end effector body 1 extends forward to enlarge the effective wafer taking area 7, so as to perform the wafer taking and placing operation 7. When the cylinder 4 extends out, the end effector body 1 retracts backwards, and the manipulator connecting piece 6 drives the end effector to rotate to carry the taken wafer 7.
As shown in fig. 3, the stroke of the manipulator is not changed, after the manipulator drives the end effector body 1 to retract, the maximum interference rotation diameter of the wafer 7 is S, the stroke of the cylinder 4 is L, on the premise that the manipulator retracts, the cylinder 4 further retracts, the maximum interference rotation diameter of the wafer 7 is D, D is S-2L, the interference rotation area is reduced, the area expansion of taking and placing the wafer process position twice the stroke of the cylinder 4 can be realized, the rotation torque is reduced, and the wafer 7 can be quickly rotated and inverted. When facing different kinds of station overall arrangement, during different wafer size production lines, 4 strokes of adjustable cylinder, or direct change required stroke cylinder 4 can.
When the robot arm performs the wafer 7 inverting process, the robot arm can perform linear motion and rotary motion, and during the linear motion, namely before the wafer 7 is taken and placed, the cylinder 4 retracts (extends) while the arm extends (retracts), and since the distance is determined, the speed is inversely proportional to the time, when the speed is increased, the corresponding time consumption is reduced, and the time required during the linear motion can be shortened through the cooperative motion.
The actual speed V of the end effector body 1 is increased from original Vb to Vb (arm stretching speed) + Vq (cylinder 4 stretching speed), when the end effector body 1 rotates, a wafer to be transported and adsorbed on the end effector body 1 is subjected to a certain centrifugal force, the wafer 7 is dropped or the wafer is displaced, so that the repeated positioning accuracy is seriously reduced, and the moment is larger than the friction force between the wafer and the end effector body 1 due to rapid rotation.
Referring to fig. 4, after the air pressure of the air source and the position of the hole on which the end effector body 1 is attached are limited, the pressure Fn between the corresponding wafer and the end effector body 1 cannot be changed, and the friction force F is Fn × μ (μ is the friction coefficient between the wafer 7 and the end effector body 1) when the wafer 7 is inverted normally.
When the wafer 7 is rotated, the centrifugal force Fa is proportional to the moment Fd, which is F1(F1 is the tangential friction force between the end effector body 1 and the wafer 7 during circular motion) × N (N is the distance between the wafer center and the rotation center), and the friction force F > the centrifugal force Fg during normal wafer-turning 7 process.
When the transfer efficiency is improved, the wafer transfer time is shortened, and the rotational acceleration a is accelerated, the centrifugal force F1 is the acceleration a × the mass m of the wafer 7, the force in the direction of F1 increases, the moment Fd and the centrifugal force Fa increase, and when the frictional force F is smaller than the centrifugal force Fa, dangerous situations such as slipping the wafer 7 or dropping the wafer 7 occur.
When the cylinder 4 extends out, the distance between the center of the wafer and the rotation center is reduced from the original N to N-L (L is the stroke of the cylinder 4). Since F1 is inversely proportional to N in the moment Fd, F1 increases accordingly as N decreases. Because the mass m of the transmitted wafer is not changed, the acceleration a can be increased, the rotation motion speed can be increased under the condition that the original centrifugal force Fa is not increased, and the working efficiency is improved.
When the sliding part of the air cylinder 4 is retracted and the action of taking the wafer 7 is finished, the sliding part of the air cylinder 4 is extended out, the distance between the rotation center and the center of the wafer is reduced, the centrifugal force is reduced, the time required for falling the wafer 7 under the condition that the adsorption force acting on the wafer cannot be increased can be shortened, and the effects of improving the working efficiency and reducing the risk of falling the wafer 7 are achieved.
In the present embodiment, the use of the cylinder 4 is not limited, and other telescopic devices similar to the cylinder 4 may be used, such as a hydraulic cylinder.
Example 2
The retractable end effector is different from that of embodiment 1 in that, as shown in fig. 5, an adsorption port 11 and a vent hole 12 are formed in an end effector body 1, the vent hole 12 is used for communicating with an external gas path, a gas passage 13 is formed inside the end effector body 1, the vent hole 12 is communicated with the adsorption port 11 through the gas passage 13, the external gas path sucks air to the adsorption port 11 through the vent hole 12, the adsorption port 11 is close to the surface of the wafer 7 and adsorbs the wafer 7, the adsorption port 11 is arc-shaped, the circumferential angular span θ is 180 °, the extension length is △ L in the tangential direction at both ends, the circle of the wafer 7 coincides with the circle of the adsorption port 11, the arc-shaped adsorption port 11 enables the wafer 7 to be adsorbed more stably, the stress on the circumference of the wafer 7 is more balanced, the deformation is smaller, therefore, the adsorption force can be increased, the rotation speed can be increased, and the work efficiency can be improved.
Example 3
The retractable end effector is different from that of embodiment 2 in that, as shown in fig. 6, the opening width of the suction port 11 is gradually reduced from the center toward the directions close to both ends, the support area of the end effector body 1 for the wafer 7 is gradually reduced from the center of the suction port 11 toward both ends, and the suction force of the suction port 11 for the wafer 7 is gradually reduced from the center toward both ends, and the solution of the present embodiment can further reduce the deformation of the wafer 7 during the suction process.
Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (7)
1. The utility model provides a concertina type end effector, includes end effector body (1) and manipulator connecting piece (6), characterized by: a telescopic device is arranged between the end effector body (1) and the manipulator connecting piece (6), one end of the telescopic device is connected with the end effector body (1), and the other end of the telescopic device is connected with the manipulator connecting piece (6).
2. The telescopic end effector of claim 1, wherein: the telescopic device is a cylinder (4), a piston rod of the cylinder (4) is fixedly connected with the end effector body (1), and a cylinder body of the cylinder (4) is fixedly connected with the manipulator connecting piece (6).
3. The telescopic end effector of claim 1, wherein: the end effector body (1) is provided with an adsorption port (11) for adsorbing a wafer (7), and the adsorption port (11) is arc-shaped.
4. The telescopic end effector of claim 3, wherein: the circumferential span of the adsorption port (11) is 180 degrees.
5. The telescopic end effector of claim 4, wherein: the two ends of the adsorption port (11) are provided with extension sections.
6. The telescopic end effector of any of claims 3 to 5, wherein: the opening width of the adsorption port (11) is gradually reduced from the center to two ends.
7. The telescopic end effector of claim 1, wherein: the telescopic end effector further comprises a cover plate (2) and an end effector mounting plate (3), the end effector mounting plate (3) is fixedly connected with the telescopic device, the cover plate (2) is fixedly connected with the end effector mounting plate (3), and the end effector body (1) is tightly pressed and fixedly connected between the cover plate (2) and the end effector mounting plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820745757.7U CN208240640U (en) | 2018-05-18 | 2018-05-18 | Concertina type end effector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820745757.7U CN208240640U (en) | 2018-05-18 | 2018-05-18 | Concertina type end effector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208240640U true CN208240640U (en) | 2018-12-14 |
Family
ID=64580734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820745757.7U Active CN208240640U (en) | 2018-05-18 | 2018-05-18 | Concertina type end effector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208240640U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111631235A (en) * | 2020-06-11 | 2020-09-08 | 华天科技（昆山）电子有限公司 | Novel full-automatic oven |
| CN113352336A (en) * | 2021-06-04 | 2021-09-07 | 上海广川科技有限公司 | Rear-mounted eccentric device for wafer overturning |
-
2018
- 2018-05-18 CN CN201820745757.7U patent/CN208240640U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111631235A (en) * | 2020-06-11 | 2020-09-08 | 华天科技（昆山）电子有限公司 | Novel full-automatic oven |
| CN113352336A (en) * | 2021-06-04 | 2021-09-07 | 上海广川科技有限公司 | Rear-mounted eccentric device for wafer overturning |
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