CN208233389U - Spaceborne heat control system - Google Patents
Spaceborne heat control system Download PDFInfo
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- CN208233389U CN208233389U CN201820691296.XU CN201820691296U CN208233389U CN 208233389 U CN208233389 U CN 208233389U CN 201820691296 U CN201820691296 U CN 201820691296U CN 208233389 U CN208233389 U CN 208233389U
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- satellite platform
- thermistor
- fpga chip
- temperature
- power
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Abstract
Spaceborne heat control system designed by the utility model, one end of resistance is used to connect one end of the thermistor of satellite platform, the power input of power adapter is used to connect the power supply interface of satellite platform, first power output end of power adapter is used to connect the other end of thermistor, the power input of the second source output end connection fpga chip of power adapter, the power input of switch controller is used to connect the power supply interface of satellite platform, the power output end of switch controller is used to connect the power input of the heating sheet of satellite platform, the switch control signal input terminal of the switch control signal output end connection switch controller of fpga chip, the analog voltage amount collection terminal of modulus sampling module is used to acquire the thermistor analog voltage amount of satellite platform, the digital voltage amount output end of modulus sampling module connects Connect the digital voltage amount input terminal of fpga chip.The utility model has the characteristics that high reliablity, Radiation hardness are strong and with high accuracy.
Description
Technical field
The utility model relates to satellite relevant device technical fields, in particular to a kind of spaceborne heat control system.
Background technique
Satellite in periodic process, will not only bear complicated radiation environment in orbit, will also be in face of great temperature difference etc.
Severe environmental conditions, the temperature range that satellite load internal components have it to work normally, especially to needs high-precision work
Load (such as laser communication system), has strict demand to temperature range.Heat control system can carry out load internal temperature
Real-time monitoring, and controlled the temperature inside load (such as 15 DEG C to 20 within the scope of set temperature by control heating sheet
Between DEG C).
Existing spaceborne heat control system is built using single-chip microcontroller with 8 sampling A/D chips, calculates temperature with look-up table mode, temperature
Degree control precision is not high, Radiation hardness is weak.
Utility model content
The purpose of this utility model seeks to provide a kind of spaceborne heat control system, and the utility model has high reliablity, reality
When intellectual monitoring, Radiation hardness is strong and feature with high accuracy.
In order to achieve this, a kind of spaceborne heat control system designed by the utility model, it includes resistance, switch control
Device, power adapter, modulus sampling module, fpga chip, wherein one end of the resistance is used to connect the temperature-sensitive of satellite platform
One end of resistance, the other end ground connection of resistance, the power input of power adapter are used to connect the power supply interface of satellite platform,
First power output end of power adapter is used to connect the other end of thermistor, the second source output end of power adapter
The power input of fpga chip is connected, the power input of switch controller is used to connect the power supply interface of satellite platform, opens
Close the power input of heating sheet of the power output end of controller for connecting satellite platform, the switch control letter of fpga chip
The switch control signal input terminal of number output end connection switch controller, the analog voltage amount collection terminal of modulus sampling module are used for
The thermistor analog voltage amount of satellite platform is acquired, the digital voltage amount output end connection fpga chip of modulus sampling module
Digital voltage amount input terminal.
Thermistor is in series with a resistor using partial pressure mode in the utility model, has the advantages that structure is simple；This is practical
AD sampling A/D chip in novel AD sample circuit uses 24 sampling A/D chips, can be realized the temperature not less than 0.1 DEG C and adopts
Sample precision has the advantages that with high accuracy；The utility model shell uses double-layer metal structure, with strong excellent of Radiation hardness
Point；The utility model also completes digital signal extraction, data type conversion and thermistor temp-resistance with FPGA chip circuit
The realization of the inverse operation of curve has the advantages that real-time is high.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
In figure, 1-satellite platform, 2-thermistors, 3-heating sheets, 4-power supply interfaces, 5-communication interfaces, 6-electricity
Resistance, 7-communication modules, 8-switch controllers, 9-power adapters, 10-modulus sampling modules, 11-fpga chips, 12-
Shell.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
The fpga chip 11 of the utility model is the CPU of system；Thermistor 2 and heating sheet 3 are distributed in satellite platform
Portion's temperature monitoring point；The temperature monitoring mode of thermistor uses partial pressure mode, and by modulus sampling module 10, acquisition is hot in real time
The voltage value that quick resistance 2 divides, and the data of monitoring are transferred to fpga chip 11, fpga chip 11 locates data in real time
The voltage value that thermistor 2 divides is carried out inverse operation and obtains the temperature of 2 monitoring point of thermistor, and judges monitoring point by reason
Whether temperature is in temperature range, and according to judging result, the on-off for exporting heating sheet 3 controls signal.
A kind of spaceborne heat control system of the utility model design, as shown in Figure 1, it includes resistance 6, switch controller 8, electricity
Source converter 9, modulus sampling module 10, fpga chip 11, wherein one end of the resistance 6 is for connecting satellite platform 1
One end of thermistor 2, the other end ground connection of resistance 6, the resistance 6 are connected with thermistor 2, play the role of partial pressure, when
When temperature causes thermistor 2 to change, the voltage value variation at 2 both ends of thermistor, the power input of power adapter 9 is used for
The power supply interface 4 of satellite platform 1 is connected, the first power output end of power adapter 9 is for connecting the another of thermistor 2
End, the power input of the second source output end connection fpga chip 11 of power adapter 9, the power supply of switch controller 8 are defeated
Enter to hold the power supply interface 4 for connecting satellite platform 1, the power output end of switch controller 8 is used to connect adding for satellite platform 1
The power input of backing 3, the switch control signal of the switch control signal output end connection switch controller 8 of fpga chip 11
Input terminal, the analog voltage amount collection terminal of modulus sampling module 10 are used to acquire 2 analog voltage of thermistor of satellite platform 1
Amount, the digital voltage amount input terminal of the digital voltage amount output end connection fpga chip 11 of modulus sampling module 10.Thermistor 2
It is located at satellite platform with heating sheet 3 and waits for temperature measuring point.The modulus sampling A/D chip that 24 are used in modulus sampling module 10, to acquisition
The sampling precision of analog voltage amount is 1mV, so that monitoring temperature precision is 0.1 DEG C.Fpga chip 11 is spaceborne heat control system
Processor completes the function that the decoding of RS422 communication data is generated with group code, Digital Signal Processing and switch control signal.
In above-mentioned technical proposal, the resistance value of resistance 6 is 10k Ω.
In above-mentioned technical proposal, it further includes communication module 7, and the data communication end of the fpga chip 11 is used for by logical
Believe that module 7 connects the communication interface 5 of satellite platform 1.
In above-mentioned technical proposal, the communication module 7 (RS422 communication module) is used for the logical of received satellite platform 1
The communication module of letter interface 5 (RS422 communication interface) input makes to can control signal and command signal carries out level conversion and difference
To the conversion of single-ended signal, and the signal after conversion is transferred to the data communication end of fpga chip 11, completing communication module makes
It can control the reception of signal and command signal；The real time temperature information that communication module 7 is also used to export fpga chip 11 is led to
The communication interface 5 that letter data is output to satellite platform 1 after the conversion of level conversion and single-ended transfer difference signal completes real-time temperature
Spend the data receiver of information.
In above-mentioned technical proposal, the resistance 6, switch controller 8, power adapter 9, modulus sampling module 10, FPGA
As in shell 12, shell 12 is made of double layer of metal for chip 11 and communication module 7, and internal layer is aluminium layer, outer layer lead layer, two kinds of gold
Category all has stronger Radiation hardness, using double layer of metal structure, improves Radiation hardness with aspect, also adds object
Intensity, between aluminium layer and lead layer fill conductive filler glue (such as GF-1000), also pass through metal riveting between aluminium layer and lead layer
Mode be fixedly connected.
In above-mentioned technical proposal, the on-off of the output control Signal-controlled switch controller 8 of fpga chip 11, to control
Whether the voltage that the power supply interface 4 of satellite platform 1 exports gives the heating sheet 3 of satellite platform 1 to power, and exports when fpga chip 11
When control signal is high level, switch controller 8 is connected, and the voltage that the power supply interface 4 of satellite platform 1 exports is to satellite platform 1
Heating sheet 3 power, heating sheet 3 work；When the control signal that fpga chip 11 exports is low level, switch controller 8 is disconnected
It opens, the power supply interface 4 of satellite platform 1 is not powered to heating sheet 3, and heating sheet 3 does not work.
In above-mentioned technical proposal, the modulus sampling module 10 is used to acquire the analog voltage-dividing amount of thermistor 2, and carries out
Analog-to-digital conversion, obtains corresponding digital partial pressure amount, and above-mentioned digital partial pressure amount is transferred to fpga chip 11 by modulus sampling module 10.
Received 4 voltage of power supply interface is converted to System on Chip/SoC operating voltage (such as by the power adapter 9 in above scheme
5V, 3.3V, 2.5V and 1.2V, 5V voltage are supplied to control circuit of opening the light, 3.3V circuit to AD sample circuit and FPGA chip circuit
Electricity, 2.5V and 1.2V power to FPGA chip circuit).
In above-mentioned technical proposal, in satellite platform when the temperature change of temperature measuring point, the resistance value of thermistor 2 is also with covariant
Change, the voltage value at 2 both ends of thermistor also changes, and the voltage value and satellite platform at 2 both ends of thermistor wait for temperature measuring point
Temperature is in corresponding curved line relation, the 2 digital voltage amount of thermistor that modulus sampling module 10 samples modulus sampling module 10
It is transferred to fpga chip 11,2 digital voltage amount of thermistor is substituted into the temperature and computing the resistor value of thermistor 2 by fpga chip 11
Formula is arrived the voltage and temperature dependence of thermistor 2 by inverse operation, sampled further according to modulus sampling module 10
2 digital voltage amount of thermistor, is calculated the temperature value that satellite platform waits for temperature measuring point.
The working process of the utility model is as follows:
Step 1: modulus sampling module 10 acquires the branch pressure voltage value on thermistor 2 in real time；
Step 2: the 2 digital voltage amount of thermistor that modulus sampling module 10 samples is transferred to by modulus sampling module 10
2 digital voltage amount of thermistor is substituted into the temperature and computing the resistor value formula of thermistor 2 by fpga chip 11, fpga chip 11,
The voltage and temperature dependence that thermistor 2 is arrived by inverse operation, the temperature-sensitive electricity sampled further according to modulus sampling module 10
2 digital voltage amounts are hindered, the temperature value that satellite platform waits for temperature measuring point is calculated；
The resistance value of thermistor 2 is Rx, and thermistor both end voltage is Vx, and power-switching circuit 9 is mentioned to 6 linkage section of resistance
High supply voltage is V0, and 6 resistance value of resistance is 10K Ω, and measured temperature T then has relational expression as follows:
Rx=10 × Vx/ (V0-Vx) (1)；
T=2c/ (- b+ (b2-4c(a-In1000Rx))0.5) (2)
Wherein, a, b, c are the calibration coefficient of thermistor 2, (1) formula are substituted into (2) formula, by measuring obtained temperature-sensitive
The voltage value Vx at 2 both ends of resistance, can be calculated temperature value T.
The satellite platform being calculated is waited for that the temperature value of temperature measuring point and satellite platform temperature are supervised by step 3:FPGA chip 11
The preset value of measuring point is compared；
When satellite platform when the temperature value of temperature measuring point be less than satellite platform temperature monitoring point preset value when, fpga chip 11
The control signal of output is low level, and switch controller 8 disconnects, and the power supply interface 4 of satellite platform 1 is not powered to heating sheet 3, is added
Backing 3 does not work；
When satellite platform when the temperature value of temperature measuring point be more than or equal to satellite platform temperature monitoring point preset value when, FPGA core
Piece 11 export control signal be high level, switch controller 8 be connected, the voltage that the power supply interface 4 of satellite platform 1 exports to
The heating sheet 3 of satellite platform 1 is powered, and heating sheet 3 works；
Fpga chip 11 carries out closed-loop control by temperature of the switch controller 8 to satellite platform temperature monitoring point, thus
The temperature of satellite platform temperature monitoring point is set to be lower than the preset value of satellite platform temperature monitoring point.
The content that this specification is not described in detail belongs to the prior art well known to professional and technical personnel in the field.
Claims (7)
1. a kind of spaceborne heat control system, it is characterised in that: it include resistance (6), switch controller (8), power adapter (9),
Modulus sampling module (10), fpga chip (11), wherein one end of the resistance (6) is used to connect the temperature-sensitive of satellite platform (1)
One end of resistance (2), the other end ground connection of resistance (6), the power input of power adapter (9) is for connecting satellite platform
(1) power supply interface (4), the first power output end of power adapter (9) are used to connect the other end of thermistor (2), electricity
The power input of second source output end connection fpga chip (11) of source converter (9), the power supply of switch controller (8) are defeated
Enter to hold the power supply interface (4) for connecting satellite platform (1), the power output end of switch controller (8) is flat for connecting satellite
The power input of the heating sheet (3) of platform (1), the switch control signal output end connection switch controller of fpga chip (11)
(8) switch control signal input terminal, the analog voltage amount collection terminal of modulus sampling module (10) is for acquiring satellite platform (1)
Thermistor (2) analog voltage amount, digital voltage amount output end connection fpga chip (11) of modulus sampling module (10)
Digital voltage amount input terminal.
2. spaceborne heat control system according to claim 1, it is characterised in that: it further includes communication module (7), the FPGA
The data communication end of chip (11) is used for the communication interface (5) by communication module (7) connection satellite platform (1).
3. spaceborne heat control system according to claim 2, it is characterised in that: the communication module (7) is used for will be received
The communication module of communication interface (5) input of satellite platform (1) makes to can control signal and command signal carries out level conversion and difference
The conversion of single-ended signal is assigned to, and the signal after conversion is transferred to the data communication end of fpga chip (11), completes communication mould
Block makes the reception that can control signal and command signal；Communication module (7) is also used to the real time temperature for exporting fpga chip (11)
The communication data of information is output to the communication interface of satellite platform (1) after the conversion of level conversion and single-ended transfer difference signal
(5) data receiver of real time temperature information is completed.
4. spaceborne heat control system according to claim 2, it is characterised in that: the resistance (6), switch controller (8), electricity
Source converter (9), modulus sampling module (10), fpga chip (11) and communication module (7) are interior as shell (12), shell (12)
Be made of double layer of metal, internal layer is aluminium layer, outer layer lead layer, fill conductive filler glue between aluminium layer and lead layer, aluminium layer and lead layer it
Between be also fixedly connected by way of metal riveting.
5. spaceborne heat control system according to claim 1, it is characterised in that: fpga chip (11) is for exporting control signal
The on-off of control switch controller (8), to whether control the voltage of power supply interface (4) output of satellite platform (1) to satellite
The heating sheet (3) of platform (1) is powered, and when the control signal of fpga chip (11) output is high level, switch controller (8) is led
Logical, the voltage that the power supply interface (4) of satellite platform (1) exports is powered to the heating sheet (3) of satellite platform (1), heating sheet (3) work
Make；When the control signal of fpga chip (11) output is low level, switch controller (8) is disconnected, the power supply of satellite platform (1)
Interface (4) is not powered to heating sheet (3), and heating sheet (3) does not work.
6. spaceborne heat control system according to claim 5, it is characterised in that: the modulus sampling module (10) is for acquiring
The analog voltage-dividing amount of thermistor (2), and analog-to-digital conversion is carried out, obtain corresponding digital partial pressure amount, modulus sampling module (10)
Above-mentioned digital partial pressure amount is transferred to fpga chip (11).
7. spaceborne heat control system according to claim 6, it is characterised in that: wait for the temperature change of temperature measuring point in satellite platform
When, the resistance value of thermistor (2) also follows variation, and the voltage value at thermistor (2) both ends also changes, thermistor (2)
The voltage value at both ends waits for that the temperature of temperature measuring point is in corresponding curved line relation with satellite platform, and modulus sampling module (10) adopts modulus
Thermistor (2) digital voltage amount of egf block (10) sampling is transferred to fpga chip (11), and fpga chip (11) is electric by temperature-sensitive
(2) the digital voltage amount of resistance substitutes into the temperature and computing the resistor value formula of thermistor (2), arrives thermistor by inverse operation
(2) voltage and temperature dependence are calculated further according to thermistor (2) digital voltage amount of modulus sampling module (10) sampling
Obtain the temperature value that satellite platform waits for temperature measuring point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820691296.XU CN208233389U (en) | 2018-05-09 | 2018-05-09 | Spaceborne heat control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820691296.XU CN208233389U (en) | 2018-05-09 | 2018-05-09 | Spaceborne heat control system |
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| Publication Number | Publication Date |
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| CN208233389U true CN208233389U (en) | 2018-12-14 |
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| CN201820691296.XU Active CN208233389U (en) | 2018-05-09 | 2018-05-09 | Spaceborne heat control system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109781302A (en) * | 2019-02-26 | 2019-05-21 | 北京空间飞行器总体设计部 | A kind of loading temperature health control method for inertial space observation satellite |
| CN112198915A (en) * | 2020-10-22 | 2021-01-08 | 上海卫星工程研究所 | Satellite double-super-platform magnetic levitation electric drive temperature compensation method and system |
-
2018
- 2018-05-09 CN CN201820691296.XU patent/CN208233389U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109781302A (en) * | 2019-02-26 | 2019-05-21 | 北京空间飞行器总体设计部 | A kind of loading temperature health control method for inertial space observation satellite |
| CN112198915A (en) * | 2020-10-22 | 2021-01-08 | 上海卫星工程研究所 | Satellite double-super-platform magnetic levitation electric drive temperature compensation method and system |
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