CN208215787U - A kind of silica gel piece body layer die for processing - Google Patents
A kind of silica gel piece body layer die for processing Download PDFInfo
- Publication number
- CN208215787U CN208215787U CN201820755201.6U CN201820755201U CN208215787U CN 208215787 U CN208215787 U CN 208215787U CN 201820755201 U CN201820755201 U CN 201820755201U CN 208215787 U CN208215787 U CN 208215787U
- Authority
- CN
- China
- Prior art keywords
- tringle
- group
- template
- channel
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
A kind of silica gel piece body layer die for processing, including matching used cope plate, lower template, left template, right mould plate, front template, rear pattern plate, it is characterized in that, array is disposed with upper channel tringle group and lower channel tringle group symmetrical above and below between front template and rear pattern plate, there are gaps between upper channel tringle group and lower channel tringle group, upper channel tringle group is door type structure, front through hole template and rear through-hole template are respectively equipped on the outside of front template and rear pattern plate, equal array has lateral strip bulge in front through hole template and rear through-hole template, front template and rear pattern plate are equipped with perforation corresponding with lateral strip bulge, outer end face contact after lateral strip bulge insertion perforation with upper channel tringle group and lower channel tringle group.The silica gel piece body layer structure that can provide heat loss through convection channel is added in processable body layer out, improves silica gel piece heat dissipation effect.
Description
Technical field
The utility model relates to silica gel pieces, especially related with a kind of structure of silica gel piece body layer die for processing.
Background technique
Silica gel piece is widely used in electronics industry, as important thermal component, has indispensable importance.With
The rapid development of electronics industry, integrated chip technology are constantly progressive, higher and higher for the demand of heat dissipation, and each details dissipates
Heat treatment, will all restrict the operation stability of entire electronic device.Therefore, it is necessary to process the better silica gel piece knot of heat dissipation performance
Structure, to meet the needs of application.
Utility model content
The utility model mentions a kind of silica gel piece body layer die for processing, and adding in processable body layer out can provide convection current
The silica gel piece body layer structure of heat dissipation channel improves silica gel piece heat dissipation effect.
The utility model uses following technology:
A kind of silica gel piece body layer die for processing, including matching used cope plate, lower template, left template, right mould plate,
Front template, rear pattern plate, which is characterized in that between front template and rear pattern plate array be disposed with upper channel tringle group symmetrical above and below and
Lower channel tringle group, there are gap between upper channel tringle group and lower channel tringle group, upper channel tringle group is door type structure, preceding
Front through hole template and rear through-hole template, equal array in front through hole template and rear through-hole template are respectively equipped on the outside of template and rear pattern plate
There is lateral strip bulge, front template and rear pattern plate are equipped with perforation corresponding with lateral strip bulge, lateral strip bulge insertion
After perforation with the outer end face contact of upper channel tringle group and lower channel tringle group.
The top surface of the upper channel tringle group is contacted with cope plate bottom surface, the bottom surface of lower channel tringle group and lower die plate top surface
Contact.
After the transverse direction strip bulge insertion perforation, front template and rear pattern plate medial surface and upper channel tringle group and lower channel
There are gaps for the outer end face of tringle group.
The position of opening of the perforation is matched with the outer end face of upper channel tringle group and lower channel tringle group.
The utility model the utility model has the advantages that
Die space is constituted by the template of front and back up and down, adds the upper channel that can form the thermally conductive groove in top and bottom
Tringle group and lower channel tringle group, and vertical passageway can be formed by upper channel tringle group and lower channel tringle group, it recycles horizontal
The level ventilation hole being connected to vertical passageway is formed to strip bulge, the silica gel piece body layer processed has heat dissipation channel, mentions
High heat dissipation effect.
Detailed description of the invention
Fig. 1 is the utility model overall structure diagram.
Fig. 2 is the utility model middle section structural schematic diagram.
Fig. 3 is the silica gel piece ontology schematic diagram of a layer structure of the utility model processing.
Fig. 4 is A-A direction view in Fig. 2.
Specific embodiment
As shown in Figure 1 and 2, a kind of silica gel piece body layer die for processing, including matching used cope plate 01, lower template
02, left template 03, right mould plate 04, front template 06, rear pattern plate 05, array is disposed with right up and down between front template 06 and rear pattern plate 05
It is much of channel tringle group 11 and lower channel tringle group 12, between existing between upper channel tringle group 11 and lower channel tringle group 12
Gap, upper channel tringle group 11 are door type structure, and front through hole template 21 is respectively equipped on the outside of front template 06 and rear pattern plate 05 and is led to afterwards
Equal array has lateral strip bulge 23, front template 06 and rear pattern plate on hole template 22, front through hole template 21 and rear through-hole template 22
05 is equipped with perforation 07 corresponding with lateral strip bulge 23, after lateral strip bulge 23 insertion perforation 07 with upper channel tringle group
11 and lower channel tringle group 12 outer end face contact.The top surface of the upper channel tringle group 11 is contacted with 01 bottom surface of cope plate, under
The bottom surface of channel tringle group 12 is contacted with 02 top surface of lower template.After the transverse direction strip bulge 23 insertion perforation 07, front template 06
There are gaps with the outer end face of 05 medial surface of rear pattern plate and upper channel tringle group 11 and lower channel tringle group 12.The perforation 07
Position of opening is matched with the outer end face of upper channel tringle group 11 and lower channel tringle group 12.
Silica gel piece processing, obtained silica gel piece body layer such as Fig. 3 ~ 4 institute are carried out by silica gel piece body layer die for processing
Show: hot groove 31 being formed by upper channel tringle group 11 and lower channel tringle group 12 in body layer upper and lower surfaces and is erected
Straight channel 32, thermally conductive groove 11 are in bar shaped, and array spacings are arranged, Vertical Channel 12 is located at thermally conductive 31 both ends of groove towards body layer
The direction at center, thermally conductive groove 31 are connected to Vertical Channel 32;Body layer side passes through lateral strip bulge 23 and forms multiple companies
The level ventilation hole 33 of logical Vertical Channel 32.The Vertical Channel 32 of body layer upper surface does not connect with the Vertical Channel 32 of lower surface
It is logical.The thermally conductive groove 31 of bar shaped, Vertical Channel 32, level ventilation hole 33 constitute heat loss through convection channel, and realizing is not influencing structure
In the case where stability, the convection effects inside silica gel piece with peripheral air are improved, to improve heat dissipation effect.
Claims (4)
1. a kind of silica gel piece body layer die for processing, including matching used cope plate (01), lower template (02), left template
(03), right mould plate (04), front template (06), rear pattern plate (05), which is characterized in that battle array between front template (06) and rear pattern plate (05)
Column are disposed with upper channel tringle group (11) and lower channel tringle group (12) symmetrical above and below, upper channel tringle group (11) and lower channel
There are gap between tringle group (12), upper channel tringle group (11) is door type structure, front template (06) and rear pattern plate (05) outside
It is respectively equipped with front through hole template (21) and rear through-hole template (22), equal array in front through hole template (21) and rear through-hole template (22)
Have lateral strip bulge (23), front template (06) and rear pattern plate (05) are equipped with perforation corresponding with lateral strip bulge (23)
(07), lateral strip bulge (23) is inserted into perforation (07) outer end with upper channel tringle group (11) and lower channel tringle group (12) afterwards
Face contact.
2. silica gel piece body layer die for processing according to claim 1, which is characterized in that the upper channel tringle group
(11) top surface is contacted with cope plate (01) bottom surface, and the bottom surface of lower channel tringle group (12) is contacted with lower template (02) top surface.
3. silica gel piece body layer die for processing according to claim 1, which is characterized in that the transverse direction strip bulge
(23) after insertion perforation (07), front template (06) and rear pattern plate (05) medial surface and upper channel tringle group (11) and lower channel tringle
There are gaps for the outer end face of group (12).
4. silica gel piece body layer die for processing according to claim 1, which is characterized in that the aperture of the perforation (07)
Position is matched with the outer end face of upper channel tringle group (11) and lower channel tringle group (12).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820755201.6U CN208215787U (en) | 2018-05-21 | 2018-05-21 | A kind of silica gel piece body layer die for processing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820755201.6U CN208215787U (en) | 2018-05-21 | 2018-05-21 | A kind of silica gel piece body layer die for processing |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208215787U true CN208215787U (en) | 2018-12-11 |
Family
ID=64509161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820755201.6U Expired - Fee Related CN208215787U (en) | 2018-05-21 | 2018-05-21 | A kind of silica gel piece body layer die for processing |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208215787U (en) |
-
2018
- 2018-05-21 CN CN201820755201.6U patent/CN208215787U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10375859B2 (en) | Ganged shielding cage with thermal passages | |
US9980411B2 (en) | Connector, connector assembly and apparatus | |
US20110317359A1 (en) | Fan duct for electronic components of electronic device | |
CN203574938U (en) | PCB with goldfingers and connector for transmission line | |
CN101083888A (en) | Heat radiating device | |
US8523616B2 (en) | Electrical connector including contacts and housing recesses and air pockets for improved impedance | |
TW201423028A (en) | Airflow guide cover | |
US20160227668A1 (en) | Cooling module and heat sink | |
CN208215787U (en) | A kind of silica gel piece body layer die for processing | |
US20160212880A1 (en) | Air guide cooling module and air guide heat sink | |
CN203301922U (en) | Heat dissipation device | |
CN102770003B (en) | Heat abstractor | |
CN204578953U (en) | A kind of dispel the heat and heat insulation vehicle audio navigation casing | |
CN101754657A (en) | Radiating device | |
CN206353616U (en) | electrical connector | |
CN212183809U (en) | Environment-friendly circuit board | |
CN103781331A (en) | Radiating device | |
CN205039144U (en) | Heat radiator of chip | |
CN206892734U (en) | A kind of Shockproof computer mainboard | |
CN206976321U (en) | Fin | |
CN214676309U (en) | Semi-fan-shaped three-fork tooth hollow hole radiator | |
TWM589912U (en) | Improved terminal structure of electric connector | |
CN205997298U (en) | A kind of injection mold | |
CN205430872U (en) | Electronic radiator | |
TWM497426U (en) | Air-guiding heat sink module and air-guiding heat sink |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181211 Termination date: 20200521 |
|
CF01 | Termination of patent right due to non-payment of annual fee |