CN208211864U

CN208211864U - A kind of cold, hot two-purpose cup based on semiconductor chilling plate

Info

Publication number: CN208211864U
Application number: CN201720881803.1U
Authority: CN
Inventors: 严亚颉
Original assignee: Individual
Current assignee: Individual
Priority date: 2017-07-20
Filing date: 2017-07-20
Publication date: 2018-12-11
Anticipated expiration: 2027-07-20

Abstract

The utility model provides a kind of cold, hot two-purpose cup based on semiconductor chilling plate, including sequentially connected upper cup body from top to bottom, temperature transition portion and lower cup body, upper cup body includes the first liner and the first shell being arranged inside and outside, it is equipped between first liner and the first shell and leads warm layer, temperature transition portion includes third shell and semiconductor chilling plate and semiconductor chilling plate control circuit, it is close to warm layer bottom surface is led the top surface of semiconductor chilling plate, bottom surface is equipped at least one and leads warm part, lower cup body includes the second liner and second housing being arranged inside and outside, insulating layer is equipped between second liner and second housing.Advantage is: using two cup bodies that semiconductor chilling plate two sides is arranged in, realize one, water cooling one heating in two cup bodies, to make full use of the chill surface and radiating surface of semiconductor chilling plate, while saving energy, cold water and hot water are obtained, structure is simple, and market prospects are wide, and service life is long, it is highly-safe.

Description

A kind of cold, hot two-purpose cup based on semiconductor chilling plate

Technical field

The utility model relates to cup technical field more particularly to a kind of cold, hot two-purpose water based on semiconductor chilling plate Cup.

Background technique

Chinese have the habit drunk water with cup, if winter can drink hot water at any time, summer can drink ice at any time Water is also very big blessing for us.In daily life, if you need to cold drink or the hot water of having a drink, generally require by special The cold drink machine or water heater of door be easy to cause the waste of extra cold drink or hot water since these product capacity are larger.Current city Ordinary cup on field cannot be heated or be freezed to the water in cup, and function is excessively single, it is difficult to meet consumer's need It asks.

Currently, have some designs for reaching above-mentioned target using semiconductor refrigerating technology, but some of them is only The one side of its refrigeration is utilized, does not utilize the another side of thermal energy, other are made also undesirable in terms of the conduction of thermal energy.

The patent No.: CN201220378767.4 is disclosed in the claim of entitled " a kind of temperature control cold, hot two-purpose cup " : a kind of temperature control cold, hot two-purpose cup is arranged semiconductor heating piece using in bottom of cup, semiconductor is arranged in the inner cover of top Cooling piece, to achieve the effect that water water in the cup is heated or freezed.But it has the disadvantage that first, using two and half Conductor cooling piece, each semiconductor chilling plate have the thermal energy of one side to fail to use the phenomenon that there are energy wastes；Second, cup Intracorporal water can only realize heating or refrigeration, cannot obtain hot water and cold water simultaneously, lack wide applicability.

Summary of the invention

To solve the above problems, the utility model discloses a kind of cold, hot two-purpose cup based on semiconductor chilling plate.

In order to reach the goals above, the utility model provides the following technical solutions:

A kind of cold, hot two-purpose cup based on semiconductor chilling plate, it is characterised in that: including sequentially connected from top to bottom Upper cup body, temperature transition portion and lower cup body, the upper cup body include the first liner and the first shell being arranged inside and outside, and described first It is equipped between liner and the first shell and leads warm layer, described lead warm layer (13) are metallic aluminum or metal copper layer, the temperature transition portion It is described partly to lead including third shell and the semiconductor chilling plate being arranged in third shell and semiconductor chilling plate control circuit The top surface of body cooling piece is close to warm layer bottom surface is led, and bottom surface is equipped at least one and leads warm part, described to lead warm part top surface and semiconductor The bottom surface of cooling piece is close to, and leading warm part (4) is metallic aluminium column or metal copper post or heat pipe, the semiconductor chilling plate control electricity Road includes that switch, temperature controller and power supply, the temperature controller are connected with semiconductor chilling plate, and the power supply gives temperature control Device and semiconductor chilling plate power supply processed, the switch control on/off, the lower cup body includes the second liner being arranged inside and outside And second housing, insulating layer is equipped between second liner and second housing.

Further, cup lid is equipped at the top of the upper cup body.

Further, the cup lid is threadedly coupled with upper cup body.

Further, the lower cup body is threadedly coupled with temperature transition portion.

It further, further include muff.

Further, it is equipped with top-down bar shaped liquid level observation panel on the upper cup body and lower cup body, described two The lower end of shape liquid level observation panel all extends to the bottom end of upper cup body and lower cup body.

Compared with prior art, the utility model has the beneficial effects that:

1, using two cup bodies that semiconductor chilling plate two sides is arranged in, when the chill surface of semiconductor chilling plate is in a cup body Water when being cooled down, the heat of radiating surface is fully absorbed by the water in another cup body, realizes one cooling of water in two cup bodies One heating while saving energy, obtains cold water and heat to make full use of the chill surface and radiating surface of semiconductor chilling plate Water, structure is simple, and market prospects are wide；

2, it leads warm layer and leads warm the part metallic aluminium or metal copper material outstanding using heat transfer efficiency, improve semiconductor chilling plate To the refrigeration and heating efficiency of water in cup body；

3, the temperature controller in semiconductor chilling plate control circuit can prevent the excessive exercise of semiconductor chilling plate, extend The service life of semiconductor chilling plate；

4, using muff, heated and refrigeration two glasss of intracorporal water can both be kept the temperature, can also be prevented User is scalded when upper cup body is equipped with hot water；

5, it is all made of bar shaped liquid level observation panel, in upper cup body and lower cup body convenient for users to that can observe in real time by interior liquid Face height improves semiconductor chilling plate safety in utilization.

Detailed description of the invention

Fig. 1 is a kind of structural schematic diagram of the cold, hot two-purpose cup based on semiconductor chilling plate of the utility model.

Fig. 2 is semiconductor chilling plate control electricity in a kind of cold, hot two-purpose cup based on semiconductor chilling plate of the utility model The structural schematic diagram on road.

Reference signs list:

1- upper cup body, the first liner of 11-, the first shell of 12-, 13- lead warm layer, 2- temperature transition portion, 21- third shell, 22- semiconductor chilling plate, 23- are switched, 24- temperature controller, 25- power supply, 3- lower cup body, the second liner of 31-, outside 32- second Shell, 33- insulating layer, 4- lead warm part, 5- cup lid, 6- bar shaped liquid level observation panel.

Specific embodiment

With reference to the accompanying drawings and detailed description, the utility model is furtherd elucidate, it should be understood that following specific embodiment parties Formula is merely to illustrate the utility model rather than limitation the scope of the utility model.It should be noted that making in being described below Word "front", "rear", "left", "right", "up" and "down" refer to that the direction in attached drawing, word "inner" and "outside" respectively refer to Be directed towards or far from geometric center of specific component direction.

Embodiment 1

As shown, a kind of cold, hot two-purpose cup based on semiconductor chilling plate, including it is sequentially connected from top to bottom on Cup body 1, temperature transition portion 2 and lower cup body 3, upper cup body 1 include the first liner 11 and the first shell 12 that are arranged inside and outside, in first It is equipped between gallbladder 11 and the first shell 12 and leads warm layer 13, wherein the first liner 11 and lead warm layer 13 are barrel-like structure, and lead temperature Layer 13 is fitted in completely on the outer wall of the first liner 11, wherein leading warm layer (13) is metallic aluminum or metal copper layer；Temperature transition Portion 2 includes third shell 21 and the semiconductor chilling plate 22 being arranged in third shell 21 and semiconductor chilling plate control electricity Road, the top surface of semiconductor chilling plate 22 are close to warm 13 bottom surface of layer is led, and bottom surface is equipped at least one and leads warm part 4, lead warm 4 top surface of part It is close to the bottom surface of semiconductor chilling plate 22, and leads warm part (4) as metallic aluminium column or metal copper post or heat pipe, lower cup body 3 and include The second liner 31 and second housing 32 being arranged inside and outside are equipped with insulating layer 33 between the second liner 31 and second housing 32.In this reality It applies in example, leading warm part 4 is one, and is arranged in 22 bottom surface of semiconductor chilling plate center, but those skilled in the art can be according to reality Border heat transfer efficiency needs, and increases the quantity for leading warm part 4.In addition, the warm layer 13 of leading in the present embodiment is metallic aluminum or metallic copper Layer, leading warm part 4 is metallic aluminium column or metal copper post or heat pipe, to guarantee the transmission efficiency of heat.

Wherein, semiconductor chilling plate control circuit includes switch 23, temperature controller 24 and power supply 25, temperature controller 24 It is connected with semiconductor chilling plate 22, power supply 25 is powered to temperature controller 24 and semiconductor chilling plate 22, and switch 23 controls power supply 25 on-off.Temperature controller 24 can prevent the excessive exercise of semiconductor chilling plate, extend the service life of semiconductor chilling plate.? In the present embodiment, power supply 25 can be replaced with power interface by semiconductor chilling plate control circuit, then be connected by power interface External power supply powers to semiconductor chilling plate control circuit, and external power supply can be vehicle power supply, battery etc..

In the present embodiment, the top surface of semiconductor chilling plate 22 is radiating surface, and bottom surface is chill surface, when work, first to Water, later on switch 23 are added in upper cup body 1 and lower cup body 3, so that semiconductor chilling plate 22 is started to work, semiconductor refrigerating 22 underrun of piece leads warm part 4 and freezes to the water in lower cup body 3, while its top surface is by leading in 13 pairs of upper cup body 1 of warm layer Water heated, to obtain hot water in upper cup body 1, obtain cold water in lower cup body 3, make full use of semiconductor chilling plate 22 chill surface and radiating surface obtains cold water and hot water while saving energy, and structure is simple, and market prospects are wide.

In the present embodiment, cup lid 5 is equipped at the top of upper cup body 1, and cup lid 5 is threadedly coupled with upper cup body 1, so as to upper The water heated in cup body 1 is kept the temperature, and prevents water from splashing out cup body.

In the present embodiment, lower cup body 3 is threadedly coupled with temperature transition portion 2, convenient for users to turning lower cup body 3 and temperature The separation of portion 2 is changed, and the water in lower cup body 3 is drunk.

It in the present embodiment, further include muff (not shown), it both can be intracorporal to heated and refrigeration two glasss Water is kept the temperature, and can also prevent from scalding user when upper cup body is equipped with hot water, in use, when heating upper cup body 1 When, muff is first installed, to prevent heat loss when heating, improves heating efficiency.

In the present embodiment, top-down bar shaped liquid level observation panel 6, two bar shapeds are equipped on upper cup body 1 and lower cup body 3 The lower end of liquid level observation panel 6 all extends to the bottom end of upper cup body 1 and lower cup body 3, thus interior convenient for users to that can observe in real time Liquid level, prevent in cup body due to causing security risk using semiconductor chilling plate 22 when water is less or water shortage.

Embodiment 2

In the present embodiment, the top surface of semiconductor chilling plate 22 is chill surface, and bottom surface is radiating surface, when work, first to Water, later on switch 23 are added in upper cup body 1 and lower cup body 3, so that semiconductor chilling plate 22 is started to work, semiconductor refrigerating 22 underrun of piece is led warm part 4 and is heated to the water in lower cup body 3, while its top surface is by leading in 13 pairs of upper cup body 1 of warm layer Water freeze, to obtain cold water in upper cup body 1, obtain hot water in lower cup body 3, make full use of semiconductor chilling plate 22 chill surface and radiating surface obtains cold water and hot water while saving energy, and structure is simple, and market prospects are wide.

In the present embodiment, cup lid 5 is equipped at the top of upper cup body 1, and cup lid 5 is threadedly coupled with upper cup body 1, so as to upper Cold water in cup body 1 is kept the temperature, and prevents water from splashing out cup body.

In the present embodiment, further include muff (not shown), can it is heated and refrigeration two glasss of intracorporal water into Row heat preservation.

Technological means disclosed in the utility model is not limited only to technological means disclosed in above embodiment, also Including technical solution consisting of any combination of the above technical features.It should be pointed out that for the ordinary skill of the art For personnel, without departing from the principle of this utility model, several improvements and modifications can also be made, these are improved and profit Decorations are also considered as the protection scope of the utility model.

Claims

1. a kind of cold, hot two-purpose cup based on semiconductor chilling plate, it is characterised in that: on sequentially connected from top to bottom Cup body (1), temperature transition portion (2) and lower cup body (3), the upper cup body (1) include the first liner (11) being arranged inside and outside and One shell (12) is equipped between first liner (11) and the first shell (12) and leads warm layer (13), and gold is in described lead warm layer (13) Belong to aluminium layer or metal copper layer, the temperature transition portion (2) includes half of third shell (21) and setting in third shell (21) Conductor cooling piece (22) and semiconductor chilling plate control circuit, the top surface of the semiconductor chilling plate (22) and lead warm layer (13) Bottom surface is close to, and bottom surface is equipped at least one and leads warm part (4), the bottom surface for leading warm part (4) top surface Yu semiconductor chilling plate (22) It is close to, and leading warm part (4) is metallic aluminium column or metal copper post or heat pipe, the semiconductor chilling plate control circuit includes switch (23), temperature controller (24) and power supply (25), the temperature controller (24) are connected with semiconductor chilling plate (22), the electricity Source (25) powers to temperature controller (24) and semiconductor chilling plate (22), and the switch (23) controls power supply (25) on-off, institute Stating lower cup body (3) includes the second liner (31) and second housing (32) being arranged inside and outside, outside second liner (31) and second Insulating layer (33) are equipped between shell (32).

2. a kind of cold, hot two-purpose cup based on semiconductor chilling plate according to claim 1, it is characterised in that: on described Cup lid (5) are equipped at the top of cup body (1).

3. a kind of cold, hot two-purpose cup based on semiconductor chilling plate according to claim 2, it is characterised in that: the cup Lid (5) is threadedly coupled with upper cup body (1).

4. a kind of cold, hot two-purpose cup based on semiconductor chilling plate according to claim 1, it is characterised in that: under described Cup body (3) is threadedly coupled with temperature transition portion (2).

5. a kind of cold, hot two-purpose cup based on semiconductor chilling plate according to claim 1, it is characterised in that: further include Muff.

6. a kind of cold, hot two-purpose cup based on semiconductor chilling plate according to claim 1, it is characterised in that: on described Top-down bar shaped liquid level observation panel (6), the two bar shapeds liquid level observation panel (6) are equipped on cup body (1) and lower cup body (3) Lower end all extend to the bottom end of upper cup body (1) and lower cup body (3).