CN208209990U

CN208209990U - A kind of things-internet gateway of multimode signal transmission

Info

Publication number: CN208209990U
Application number: CN201820943088.4U
Authority: CN
Inventors: 蒋平; 陈浩; 王小平; 易丽蓉; 蓝长斌; 陈力骅; 陈晖�
Original assignee: Chongqing Zhongkong Omar Instrument Research Institute Co Ltd
Current assignee: Chongqing Zhongkong Omar Instrument Research Institute Co Ltd
Priority date: 2018-06-19
Filing date: 2018-06-19
Publication date: 2018-12-07
Anticipated expiration: 2028-06-19

Abstract

The utility model discloses a kind of things-internet gateway of multimode signal transmission, including MCU, it further include Power Management Unit, wire transmission mechanism and wireless transmission mechanism, the wire transmission mechanism is provided with RS485 module, Ethernet transmission module, and the wireless transmission mechanism is provided with GPRS communication module and 4G communication module；The Power Management Unit is respectively MCU, RS485 module, Ethernet transmission module, GPRS communication module and the power supply of 4G communication module；The MCU is bi-directionally connected with the power supply of RS485 module, Ethernet transmission module, GPRS communication module and 4G communication module respectively.The utility model has the advantages that the utility model can carry out 485 communications, Ethernet transmission communication, 2G network communication and 4G network communication, it can complete data transfer communications in existing various environment, it can be then laid in any scene using the Internet of Things of the gateway, to really realize the connected Internet of Things effect of object object.

Description

A kind of things-internet gateway of multimode signal transmission

Technical field

The utility model relates to signal transport gateway technical fields, specifically, are related to a kind of object of multimode signal transmission Networking gateway.

Background technique

Gateway is also known as gateway, protocol converter, it acts as network interconnection is realized in network layer, is used for two The different network interconnection of upper-layer protocol.And due to the rise and development of Internet of Things, gateway applies to physics scene more and more In, referred to as things-internet gateway, such as when sedimentation detection, the monitoring data of sedimentation each node of scene generally require to transmit by gateway To terminal, therefore, the design of gateway is of great significance to data transmission.

Existing things-internet gateway is usually single wire transmission or wireless transmission, without being provided simultaneously with RS485 The gateway of wire communication and 4G wireless communication isotype is now badly in need of can adapt to the gateway of the data transmission conditions of varying environment, Whether wired or wirelessly connection and can precisely transmit data.

Utility model content

In response to the above problems, the present invention proposes a kind of Internet of Things of multimode signal transmission for meeting multi-protocol communication Gateway meets limitation of the complex environment to transport protocol, it can be achieved that 485 communications, ethernet communication, 2G communication and 4G communication, Substantially the data of applicable all environment are transmitted.

In order to achieve the above objectives, the specific technical solution that the utility model uses is as follows:

A kind of things-internet gateway of multimode signal transmission, including MCU, Power Management Unit, wire transmission mechanism and wireless Transmission mechanism, the wire transmission mechanism are provided with RS485 module, Ethernet transmission module, the wireless transmission mechanism setting There are GPRS communication module and 4G communication module；

The Power Management Unit is respectively MCU, RS485 module, Ethernet transmission module, GPRS communication module and 4G logical Believe module for power supply；

The MCU respectively with RS485 module, Ethernet transmission module, GPRS communication module and the two-way company of 4G communication module It connects.

By above-mentioned design, the utility model can carry out 485 communications, Ethernet transmission communication, 2G network communication and 4G net Network communication, can complete data transfer communications in existing various environment, can then be laid using the Internet of Things of the gateway in office In what scene, to really realize the connected Internet of Things effect of object object, and the function of MCU can be only limitted to establish channel switch and Data turn to pass, and when there is data to enter MCU, all signal paths all transmit these data, guarantee the receiving end of every class communication mode Required content can be received, naturally it is also possible to the data channel that specific program is selectively switched needs is incorporated into, with section About energy consumption and data transmission cost.

It further describes, the RS485 module includes 2 group of 485 chip circuit, wherein first group of 485 chip circuit include One 485 chip U4 and the one 485 serial ports P1, second group of 485 chip circuit include the 2nd 485 chip U6 and the 2nd 485 serial ports P2；

The A foot of the one 485 chip U4 connects 3 feet of the one 485 serial ports P1, and the B foot of the one 485 chip U4 connects 4 feet of one 485 serial ports P1, the data input pin RXD of the one 485 chip U4 connect the one 485 output pin of MCU, and described The data output pin TXD of one 485 chip U4 connects the one 485 input pin of MCU, and the control foot CON of the one 485 chip U4 connects The one 485 control foot of MCU, the supply pin VCC of the one 485 chip U4 meet the 3.3V direct current of Power Management Unit, institute The lower margin ground connection of the one 485 chip U4 is stated, 1 foot of the one 485 serial ports P1 meets the 24V direct current of Power Management Unit, institute State the 2 feet ground connection of the one 485 serial ports P1；

The A foot of the 2nd 485 chip U6 connects 3 feet of the 2nd 485 serial ports P2, and the B foot of the 2nd 485 chip U6 connects 4 feet of 2 485 serial ports P2, the data input pin RXD of the 2nd 485 chip U6 connect the 2nd 485 output pin of MCU, and described The data output pin TXD of 2 485 chip U6 connects the 2nd 485 input pin of MCU, and the control foot CON of the 2nd 485 chip U6 connects The 2nd 485 control foot of MCU, the supply pin VCC of the 2nd 485 chip U6 meet the 3.3V direct current of Power Management Unit, institute The lower margin ground connection of the 2nd 485 chip U6 is stated, 1 foot of the 2nd 485 serial ports P2 meets the 24V direct current of Power Management Unit, institute State the 2 feet ground connection of the 2nd 485 serial ports P2.

The utility model is preferably provided with 2 groups of identical 485 communications, and when work often only uses one group, another group As spare, the design can reduce the communication failure maintenance frequency of gateway, only just need repairing when all damaging for 2 groups, only Inserted terminal group need to be only changed when one group of failure to work on.

Further design, the Ethernet transmission module include Ethernet chip U13 and communication joint U14, it is described with Too the MOSI foot of the steel wire rack piece U13 Ethernet communication output pin that meets MCU, the MISO foot of the Ethernet chip U13 connect the ether of MCU Input pin is communicated, the clock foot SCLK of the Ethernet chip U13 connects the ether control clock foot of MCU, the Ethernet chip The core chip select pin SCSn of U13 connects the ether chip selection foot of MCU, and the output pin INTn that interrupts of the Ethernet chip U13 meets MCU Ether chip interrupt foot, the resetting pin RSTn of the Ethernet chip U13 connects the ether chip reset foot of MCU, the resetting pin RSTn also concatenates the 3.3V direct current that the four or eight resistance R48 is followed by Power Management Unit；

The data output end group of the Ethernet chip U13 includes TXN foot and TXP foot, wherein TXN foot connects communication joint The TD- output pin of U14, the TXN foot also concatenates the 3.3V direct current that the five or five resistance R55 is followed by Power Management Unit, described TXP foot connects the TD+ output pin of communication joint U14, which also concatenates the May 4th resistance R54 and be followed by Power Management Unit 3.3V direct current, the TXC output pin of the communication joint U14 concatenate the 3.3V that the five or six resistance R56 is followed by Power Management Unit Direct current, the TXC output pin are grounded after also concatenating the four or nine capacitor C49；

The data input pin group of the Ethernet chip U13 includes RXN foot and RXP foot, wherein RXN foot concatenation the five or six Capacitor C56 is followed by the RX- input pin of communication joint U14, and the RXN foot also concatenates the 6th 1 resistance R61 and is followed by communication joint U14 RXC input pin, the RXP foot concatenates the RX+ input pin that the 50th capacitor C50 is followed by communication joint U14, and the RXP foot is also RXC input pin is connected after concatenating the five or nine resistance R59, the RXC input pin is grounded after also concatenating the May 4th capacitor C54；

The first physical layer modes selection foot PMODE0 of the Ethernet chip U13 concatenates the three or eight resistance R38 and is followed by electricity The 3.3V direct current of source control unit, first physical layer modes selection foot PMODE0 are grounded after also concatenating the three or seven resistance R37, The second physical layer modes selection foot PMODE1 of the Ethernet chip U13 concatenates the four or five resistance R45 and is followed by power management list The 3.3V direct current of member, second physical layer modes selection foot PMODE1 are grounded after also concatenating the four or four resistance R44, the ether The third physical layer modes selection foot PMODE2 of steel wire rack piece U13 concatenates the 3.3V that the four or seven resistance R47 is followed by Power Management Unit Direct current, third physical layer modes selection foot PMODE2 are grounded after also concatenating the four or six resistance R46, the Ethernet chip It is grounded after the end the RSVD group concatenation protective resistance of U13；

A working end of the crystal oscillator output pin XO connection third crystal oscillator X3 of the Ethernet chip U13, the third crystal oscillator Another working end of X3 connects crystal oscillator the input pin XI, the crystal oscillator output pin XO of the Ethernet chip U13 and crystal oscillator inputs The five or eight resistance R58 is serially connected between foot XI, the crystal oscillator output pin XO is grounded after also concatenating the four or eight capacitor C48, the crystalline substance Vibration input pin XI is grounded after also concatenating the five or five capacitor C55, and the power end group of the Ethernet chip U13 connects power management list The 3.3V direct current of member, the ground terminal group ground connection of the Ethernet chip U13.

Wire transmission is still transmission mode more stable at this stage, and therefore, design Ethernet transmission can get rid of wireless The environment of the limitation of signal transmission distance and scene, high temperature or the not applicable wireless transmission such as under water still can be passed with Ethernet It is defeated, make the more adaptable of gateway.

Further design, the GPRS communication module includes GPRS chip U1, GSM-SIM deck U2 and antenna J1, institute The data for stating GPRS chip U1 send the GPRS input pin that foot UART1_TXD meets MCU, the data receiver foot of the GPRS chip U1 UART1_RXD connects the GPRS output pin of MCU, the leakage of switch foot PWRKEY connection the first N-type metal-oxide-semiconductor Q1 of the GPRS chip U1 The GPRS of pole, the grid connection MCU of the first N-type metal-oxide-semiconductor Q1 switchs foot, and the grid of the first N-type metal-oxide-semiconductor Q1 also concatenates It is grounded after 5th resistance R5, the source electrode ground connection of the first N-type metal-oxide-semiconductor Q1；

The data of the SIM data pin connection GSM-SIM deck U2 of the GPRS chip U1 transmit foot IO, which transmits foot IO is grounded after also concatenating the 6th capacitor C6, and the data transmission foot IO connects GPRS chip U1's after also concatenating second resistance R2 SIM power foot, the SIM power foot of the GPRS chip U1 are also connected with the supply pin VCC of GSM-SIM deck U2, the GPRS core The clock foot CLK of the SIM clock foot connection GSM-SIM deck U2 of piece U1, clock foot CLK also concatenate the 7th capacitor C7 and are followed by Ground, the resetting pin RST of the SIM resetting pin connection GSM-SIM deck U2 of the GPRS chip U1, resetting pin RST also concatenate the It is grounded after five capacitor C5, the ground terminal group ground connection of the GSM-SIM deck U2；

The work foot of antenna J1, the GPRS chip are connected after the day stitch concatenation first resistor R1 of the GPRS chip U1 The day stitch of U1 is grounded after also concatenating the 4th capacitor C48, is grounded after the work foot concatenation third capacitor C3 of the antenna J1, described The shielding foot group of antenna J1 is grounded；

The supply pin group of the GPRS chip U1 connects the GSM voltage GSM VBAT of Power Management Unit, the GPRS chip The lower margin group of U1 is grounded.

GPRS network belongs to one kind of 2G network, and 2G net now can be described as throughout everywhere, some remote districts Can be carried out 2G network transmission, therefore, design 2G network can need wirelessly communicate and the wireless network of other high transmission rates not Where applicable carries out transmission data by 2G.

Further design, the 4G communication module includes 4G chip U15 and 4G-SIM deck U16, the 4G chip U15 The tenth triode Q10 of data receiver foot UART_RX connection collector, the emitter of the tenth triode Q10 meets the 4G of MCU Output pin, the emitter of the tenth triode Q10 also concatenate the 3.3V direct current that the seven or two resistance R72 is followed by Power Management Unit Electricity, the 70th electricity group R70 of base stage concatenation of the tenth triode Q10 is followed by the 1.8V direct current of Power Management Unit, described The collector of tenth triode Q10 also concatenates the 1.8V direct current that the seven or three resistance R73 is followed by Power Management Unit, the 4G core The data of piece U15 send the emitter of the 11st triode Q11 of foot UART_TX connection, the collector of the 11st triode Q11 The 4G input pin of MCU is connect, the emitter of the 11st triode Q11 also concatenates the seven or four resistance R74 and is followed by the 11st pole The base stage of pipe Q11, the base stage of the 11st triode Q11 also concatenate July 1st electricity group R71 and are followed by Power Management Unit 1.8V direct current, the collector of the 11st triode Q11 also concatenate the Seventh Five-Year Plan resistance R75 and are followed by Power Management Unit 3.3V direct current；

The drain electrode of wake-up the 8th N-type metal-oxide-semiconductor Q8 of input pin WAKEUP_IN connection of the 4G chip U15, the 8th N The 4G of the grid connection MCU of type metal-oxide-semiconductor Q8 wakes up foot, and the grid of the 8th N-type metal-oxide-semiconductor Q8 also concatenates the seven or six resistance R76 After be grounded, the drain electrode of the 8th N-type metal-oxide-semiconductor Q8 also the six or eight resistance R68 of concatenation is followed by the 1.8V direct current of Power Management Unit Electricity, the drain electrode of the 8th N-type metal-oxide-semiconductor Q8 are grounded after concatenating the six or nine capacitor C69, and the source electrode of the 8th N-type metal-oxide-semiconductor Q8 connects Ground；

The drain electrode of the 9th N-type metal-oxide-semiconductor Q9 of resetting pin RESIN_N connection of the 4G chip U15, the 9th N-type metal-oxide-semiconductor The 4G resetting pin of the grid connection MCU of Q9, the grid of the 9th N-type metal-oxide-semiconductor Q9 are grounded after also concatenating the seven or seven resistance R77, The drain electrode of the 9th N-type metal-oxide-semiconductor Q9 also the six or nine resistance R69 of concatenation is followed by the 1.8V direct current of Power Management Unit, described The drain electrode of 9th N-type metal-oxide-semiconductor Q9 is grounded after concatenating the 70th capacitor C70, the source electrode ground connection of the 9th N-type metal-oxide-semiconductor Q9；

The data of the USIM data pin connection 4G-SIM deck U16 of the 4G chip U15 transmit foot IO, which transmits foot IO is grounded after also concatenating the six or seven capacitor C67, and the data transmission foot IO connects 4G chip after also concatenating the six or four resistance R64 The USIM supply pin of U15, the USIM supply pin of the 4G chip U15 is also connected with the supply pin VCC of 4G-SIM deck U16, described The clock foot CLK of the USIM clock foot connection 4G-SIM deck U16 of 4G chip U15, clock foot CLK also concatenate the six or eight capacitor It is grounded after C68, the resetting pin RST of the USIM resetting pin connection 4G-SIM deck U16 of the 4G chip U15, resetting pin RST is also It is grounded after concatenating the six or six capacitor C66, the ground terminal group ground connection of the 4G-SIM deck U16；

The 4G working signal foot of the work foot WAKE# connection MCU of the 4G chip U15, work foot WAKE# also concatenate the 6th Three resistance R63 are followed by the 4G voltage 4G VBAT of Power Management Unit, and the power end group of the 4G chip U15 connects power management list The ground terminal group ground connection of 4G voltage the 4G VBAT, the 4G chip U15 of member.

The transmission speed of 4G network is that 2G network can not be reached, therefore, can quick, great Liang Chuan after design 4G communication module Transmission of electricity subdata, it might even be possible to carry out data communication with the mobile terminal for being connected with 4G network.

Further design, further includes storage expanding module, the storage expanding module includes TF card CN1, the TF card The foot 2 of CN1 connects the extension chip select pin of MCU, which also concatenates the 3.3V direct current that the 7th resistance R7 is followed by Power Management Unit, The foot 3 of the TF card CN1 connects the growth data output pin of MCU, which also concatenates the 6th resistance R6 and be followed by Power Management Unit The foot 7 of 3.3V direct current, the TF card CN1 connects the growth data input pin of MCU, which also concatenates the 4th resistance R4 and be followed by electricity The 3.3V direct current of source control unit；

The foot 5 of the TF card CN1 connects the expanding clock foot of MCU, and the foot 6 of the TF card CN1 is grounded, which also goes here and there Connect the 3.3V direct current that the 12nd capacitor C12 is followed by Power Management Unit.

By above-mentioned design, the storage expanding module is bi-directionally connected with MCU and is powered by Power Management Unit, works as gateway Low memory when, can also pass through the extension storage card of access access data.

Be further described, the Power Management Unit include 24V power module, 5V power module, 3.3V power module, 1.8V power module, GSM power module and 4G power module, the 24V power module access input voltage and export 24V direct current Electricity, the 5V power module input 24V direct current obtain 5V direct current, and the 3.3V power module input 5V direct current obtains 3.3V direct current, the 1.8V power module input 3.3V direct current obtain 1.8V direct current, and the GSM power module inputs 5V Direct current obtains GSM voltage GSM VBAT, and the 4G power module input 5V direct current obtains 4G voltage 4G VBAT.

By above-mentioned design, voltage needed for Power Management Unit provides each module: 24V direct current, 5V direct current, 3.3V Voltage needed for direct current, 1.8V direct current and gsm module and 4G module.

Further, the 24V power module includes voltage input serial ports PWORE1, voltage input serial ports PWORE1 Foot 1 connect input power, foot 2 and foot 3 are grounded；

The foot 1 of the voltage input serial ports PWORE1 connects the anode of first diode D1, the yin of first diode D1 Pole concatenation first can reset the anode of the two or five polar capacitor C25 of connection after fuse F1, and the two or five polar capacitor C25 is just Pole exports 24V direct current, and the cathode ground connection of the two or the five polar capacitor C25, the two or the five polar capacitor C25's is positive and negative The two or six capacitor C26 is also serially connected between pole；

The foot 3 of the voltage input serial ports PWORE1 is connected to the cathode of the second diode D2, second diode D2 Plus earth；

The 5V power module includes 5V pressure regulation chip U8, and the voltage input foot VIN of the 5V pressure regulation chip U8 accesses 24V Direct current, voltage input foot VIN are also connected with the anode of the 2nd 1 polar capacitor C21, and the 2nd 1 polar capacitor C21's is negative Pole ground connection, the voltage input foot VIN are grounded after also concatenating the two or two capacitor C22, the voltage output of the 5V pressure regulation chip U8 Foot VOUT concatenates the anode of the two or three polar capacitor C23 of connection after the second inductance L2, and the anode of the two or three polar capacitor C23 is Export 5V direct current, the feedback foot of the anode connection 5V pressure regulation chip U8 of the two or the three polar capacitor C23, the two or three pole Property capacitor C23 cathode ground connection, be also serially connected with the two or four capacitor C24 between the positive and negative anodes of the two or the three polar capacitor C23, institute The voltage output foot VOUT for stating 5V pressure regulation chip U8 is also connected with the cathode of the first zener diode VD1, first zener diode The plus earth of VD1, the lower margin ground connection of the 5V pressure regulation chip U8；

The 3.3V power module includes 3V3 pressure regulation chip U7, the voltage input foot IN access of the 3V3 pressure regulation chip U7 5V direct current, voltage input foot IN are also connected with the anode of the 20th polar capacitor C20, the 20th polar capacitor C20's Cathode ground connection, the anode of the 18th polar capacitor C18 of voltage output foot OUT connection of the 3V3 pressure regulation chip U7, the 18th The anode of polar capacitor C18 exports 3.3V direct current, and the cathode of the 18th polar capacitor C18 is grounded, and the described 18th The 19th capacitor C19, the lower margin ground connection of the 3V3 pressure regulation chip U7 are also serially connected between the positive and negative anodes of polar capacitor C18；

The 1.8V power module includes 1V8 pressure regulation chip U9, the input voltage foot IN access of the 1V8 pressure regulation chip U9 3.3V direct current, the anode of the two or the seven polar capacitor C27 of output voltage foot OUT connection of the 1V8 pressure regulation chip U9, this second The anode of seven polar capacitor C27 exports 1.8V direct current, and the cathode of the two or the seven polar capacitor C27 is grounded, and described second The two or eight capacitor C28, the lower margin ground connection of the 1V8 pressure regulation chip U9 are also serially connected between the positive and negative anodes of seven polar capacitor C27；

The GSM power module includes GSM pressure regulation chip U10, and the input pin IN of the GSM pressure regulation chip U10 accesses 5V Direct current, input pin IN are also connected with the anode of the two or nine polar capacitor C29, and the cathode of the two or the nine polar capacitor C29 connects Ground, the anode of the two or the nine polar capacitor C29 also the 18th resistance R18 of concatenation are followed by the work end feet of GSM pressure regulation chip U10 EN, the work end feet EN are connected to the drain electrode of third N-type metal-oxide-semiconductor Q3, and the grid of third N-type metal-oxide-semiconductor Q3 connects the GSM work of MCU Make foot, the grid of the third N-type metal-oxide-semiconductor Q3 is grounded after concatenating the two or four resistance R24, the source electrode of the third N-type metal-oxide-semiconductor Q3 The output pin OUT of ground connection, the GSM pressure regulation chip U10 exports GSM voltage GSM VBAT, and output pin OUT also concatenates third It is grounded after one capacitor C31, the debugging foot ADJ of the GSM pressure regulation chip U10 is grounded after concatenating the two or two resistance R22, the GSM The 20th resistance R20, the GSM pressure regulation chip U10 are also serially connected between the debugging foot ADJ and output pin OUT of pressure regulation chip U10 Grounding leg ground connection；

The 4G power module includes 4G pressure regulation chip U11, and the electric input pin IN access 5V of the 4G pressure regulation chip U11 is straight Galvanic electricity, electricity input pin IN are also connected with the anode of the 30th polar capacitor C30, and the cathode of the 30th polar capacitor C30 connects Ground, the anode of the 30th polar capacitor C30 also the 19th resistance R19 of concatenation are followed by the working signal of 4G pressure regulation chip U11 Foot EN, the working signal foot EN are connected to the drain electrode of the 4th N-type metal-oxide-semiconductor Q4, and the grid of the 4th N-type metal-oxide-semiconductor Q4 meets the 4G of MCU Work foot, and the grid of the 4th N-type metal-oxide-semiconductor Q4 is grounded after concatenating the two or five resistance R25, the source of the 4th N-type metal-oxide-semiconductor Q4 The electricity output foot OUT of pole ground connection, the 4G pressure regulation chip U11 exports 4G voltage 4G VBAT, and electricity output foot OUT is also concatenated It is grounded after three or two capacitor C32, the debugging end ADJ of the 4G pressure regulation chip U11 is grounded after concatenating the two or three resistance R23, described The 2nd 1 resistance R21, the 4G pressure regulation chip are also serially connected between the debugging end ADJ and electricity output foot OUT of 4G pressure regulation chip U11 The lower margin of U11 is grounded.

It is further described, the MCU is also connected with oscillating circuit, and the oscillating circuit includes the first crystal oscillator X1 and second The working end 1 of crystal oscillator X2, the first crystal oscillator X1 connect the concussion output end of MCU, and the working end 1 also concatenates the three or six capacitor It is grounded after C36, the working end 3 of the first crystal oscillator X1 concatenates the concussion input terminal that the three or three resistance R33 is followed by MCU, the work End 3 is grounded after also concatenating the three or four capacitor C34, and the foot 2 of the first crystal oscillator X1 is grounded with foot 4；

The crystal oscillator input terminal of a termination MCU of the second crystal oscillator X2, the crystal oscillator output end of another termination MCU, the MCU Crystal oscillator input terminal concatenate the three or seven capacitor C37 after be grounded, the crystal oscillator output end of the MCU concatenates the four or three capacitor C43 and is followed by Ground.

The utility model has the beneficial effects that the utility model can carry out 485 communications, Ethernet transmission communicates, 2G network is logical Letter and 4G network communication, can complete data transfer communications in existing various environment, then can be with using the Internet of Things of the gateway It is laid in any scene, to really realize the connected Internet of Things effect of object object.

Detailed description of the invention

Fig. 1 is the structural block diagram of the utility model；

Fig. 2 is the circuit design drawing of embodiment RS485 module；

Fig. 3 is the circuit design drawing of embodiment Ethernet transmission module；

Fig. 3 a is the left half circuit diagram of Fig. 3；

Fig. 3 b is the right half circuit diagram of Fig. 3；

Fig. 4 is the circuit design drawing of embodiment GPRS communication module；

Fig. 4 a is the left half circuit diagram of Fig. 4；

Fig. 4 b is the right half circuit diagram of Fig. 4；

Fig. 5 is the circuit design drawing of embodiment 4G communication module；

Fig. 5 a is the left half circuit diagram of Fig. 5；

Fig. 5 b is the right half circuit diagram of Fig. 5；

Fig. 6 is the circuit design drawing of embodiment MCU；

Fig. 6 a is the left half circuit diagram of Fig. 6；

Fig. 6 b is the right half circuit diagram of Fig. 6；

Fig. 7 is the circuit design drawing of embodiment storage expanding module；

Fig. 8 is the circuit design drawing of embodiment 24V power module；

Fig. 9 is the circuit design drawing of embodiment 5V power module；

Figure 10 is the circuit design drawing of embodiment 3.3V power module；

Figure 11 is the circuit design drawing of embodiment 1.8V power module；

Figure 12 is the circuit design drawing of embodiment GSM power module；

Figure 13 is the circuit design drawing of embodiment 4G power module.

Specific embodiment

With reference to the accompanying drawing and specific embodiment is described in further detail the utility model:

As shown in Figure 1, a kind of things-internet gateway of multimode signal transmission, including MCU, Power Management Unit, wire transmission Mechanism and wireless transmission mechanism, the wire transmission mechanism are provided with RS485 module, Ethernet transmission module, the wireless biography Transfer mechanism is provided with GPRS communication module and 4G communication module；

It further include storage expanding module, the MCU communicates mould with RS485 module, Ethernet transmission module, GPRS respectively Block, 4G communication module and storage expanding module are bi-directionally connected.

The RS485 module is as shown in Fig. 2, include 2 group of 485 chip circuit, wherein first group of 485 chip circuit include One 485 chip U4 and the one 485 serial ports P1, second group of 485 chip circuit include the 2nd 485 chip U6 and the 2nd 485 serial ports P2；

Every group of 485 circuits are further preferably provided with LED light in the present embodiment.

The Ethernet transmission module is as shown in Fig. 3 and Fig. 3 a, Fig. 3 b, including Ethernet chip U13 and communication joint The MOSI foot of U14, the Ethernet chip U13 connect the Ethernet communication output pin of MCU, the MISO foot of the Ethernet chip U13 The Ethernet communication input pin of MCU is connect, the clock foot SCLK of the Ethernet chip U13 connects the ether control clock foot of MCU, described The core chip select pin SCSn of Ethernet chip U13 connects the ether chip selection foot of MCU, and the Ethernet chip U13's interrupts output The ether chip that foot INTn meets MCU interrupts foot, and the resetting pin RSTn of the Ethernet chip U13 connects the ether chip reset of MCU Foot, resetting pin RSTn also concatenate the 3.3V direct current that the four or eight resistance R48 is followed by Power Management Unit；

In the present embodiment, power vd D+3.3V is additionally provided with isolation magnetic bead L3, and power vd D+3.3VA is obtained after isolation, should Power vd D+3.3VA is correspondingly arranged on power filter, i.e., multiple capacitors in parallel are filtered.

The GPRS communication module is as shown in Fig. 4 and Fig. 4 a, Fig. 4 b, including GPRS chip U1, GSM-SIM deck U2 and day The data of line J1, the GPRS chip U1 send the GPRS input pin that foot UART1_TXD meets MCU, the number of the GPRS chip U1 The GPRS output pin of MCU, switch foot PWRKEY the first N-type of connection MOS of the GPRS chip U1 are met according to reception foot UART1_RXD The GPRS of the drain electrode of pipe Q1, the grid connection MCU of the first N-type metal-oxide-semiconductor Q1 switchs foot, the grid of the first N-type metal-oxide-semiconductor Q1 Pole is grounded after also concatenating the 5th resistance R5, the source electrode ground connection of the first N-type metal-oxide-semiconductor Q1；

The 4G communication module is as shown in Fig. 5 and Fig. 5 a, Fig. 5 b, including 4G chip U15 and 4G-SIM deck U16, described The collector of the tenth triode Q10 of data receiver foot UART_RX connection of 4G chip U15, the emitter of the tenth triode Q10 The 4G output pin of MCU is connect, the emitter of the tenth triode Q10 also concatenates the seven or two resistance R72 and is followed by Power Management Unit 3.3V direct current, the tenth triode Q10 base stage concatenation the 70th electricity group R70 be followed by Power Management Unit 1.8V it is straight Galvanic electricity, the collector of the tenth triode Q10 also concatenate the 1.8V direct current that the seven or three resistance R73 is followed by Power Management Unit Electricity, the data of the 4G chip U15 send the emitter of the 11st triode Q11 of foot UART_TX connection, the 11st triode The collector of Q11 connects the 4G input pin of MCU, and the emitter of the 11st triode Q11 also concatenates the seven or four resistance R74 and is followed by The base stage of 11st triode Q11, the base stage of the 11st triode Q11 also concatenate July 1st electricity group R71 and are followed by power supply pipe The 1.8V direct current of unit is managed, the collector of the 11st triode Q11 also concatenates the Seventh Five-Year Plan resistance R75 and is followed by power management The 3.3V direct current of unit；

Also it is correspondingly arranged on LED light in the present embodiment and carries out working status indication.

The MCU is also connected with oscillating circuit as shown in Fig. 6 and Fig. 6 a, Fig. 6 b, and the oscillating circuit includes the first crystal oscillator The working end 1 of X1 and the second crystal oscillator X2, the first crystal oscillator X1 connect the concussion output end of MCU, and the working end 1 also concatenates third It being grounded after six capacitor C36, the working end 3 of the first crystal oscillator X1 concatenates the concussion input terminal that the three or three resistance R33 is followed by MCU, The working end 3 is grounded after also concatenating the three or four capacitor C34, and the foot 2 of the first crystal oscillator X1 is grounded with foot 4；

Meanwhile the present embodiment is similarly MCU and is connected with LED light.

The storage expanding module is as shown in fig. 7, comprises TF card CN1, the foot 2 of the TF card CN1 connect the extension piece choosing of MCU Foot, the foot 2 also concatenate the 3.3V direct current that the 7th resistance R7 is followed by Power Management Unit, and the foot 3 of the TF card CN1 connects MCU's Growth data output pin, the foot 3 also concatenate the 3.3V direct current that the 6th resistance R6 is followed by Power Management Unit, the TF card CN1 Foot 7 connect the growth data input pin of MCU, which also concatenates the 3.3V direct current that the 4th resistance R4 is followed by Power Management Unit；

As shown in figures 8-13, the Power Management Unit include 24V power module, 5V power module, 3.3V power module, 1.8V power module, GSM power module and 4G power module, the 24V power module access input voltage and export 24V direct current Electricity, the 5V power module input 24V direct current obtain 5V direct current, and the 3.3V power module input 5V direct current obtains 3.3V direct current, the 1.8V power module input 3.3V direct current obtain 1.8V direct current, and the GSM power module inputs 5V Direct current obtains GSM voltage GSM VBAT, and the 4G power module input 5V direct current obtains 4G voltage 4G VBAT.

As shown in figure 8, the 24V power module includes voltage input serial ports PWORE1, voltage input serial ports PWORE1 Foot 1 connect input power, foot 2 and foot 3 are grounded；

As shown in figure 9, the 5V power module includes 5V pressure regulation chip U8, the voltage input foot of the 5V pressure regulation chip U8 VIN accesses 24V direct current, and voltage input foot VIN is also connected with the anode of the 2nd 1 polar capacitor C21, the 2nd 1 polarity The cathode of capacitor C21 is grounded, and the voltage input foot VIN is grounded after also concatenating the two or two capacitor C22, the 5V pressure regulation chip U8 Voltage output foot VOUT concatenate the second inductance L2 after connect the two or three polar capacitor C23 anode, the two or three polar capacitor The anode of C23 exports 5V direct current, and the anode of the two or the three polar capacitor C23 connects the feedback foot of 5V pressure regulation chip U8, The cathode of two or the three polar capacitor C23 is grounded, and is also serially connected with second between the positive and negative anodes of the two or the three polar capacitor C23 The voltage output foot VOUT of four capacitor C24, the 5V pressure regulation chip U8 is also connected with the cathode of the first zener diode VD1, this The plus earth of one zener diode VD1, the lower margin ground connection of the 5V pressure regulation chip U8；

As shown in Figure 10, the 3.3V power module includes 3V3 pressure regulation chip U7, the voltage of the 3V3 pressure regulation chip U7 Input pin IN accesses 5V direct current, and voltage input foot IN is also connected with the anode of the 20th polar capacitor C20, the 20th pole Property capacitor C20 cathode ground connection, the 18th polar capacitor C18 of voltage output foot OUT connection of the 3V3 pressure regulation chip U7 is just Pole, the anode of the 18th polar capacitor C18 export 3.3V direct current, and the cathode of the 18th polar capacitor C18 is grounded, The 19th capacitor C19, the ground of the 3V3 pressure regulation chip U7 are also serially connected between the positive and negative anodes of the 18th polar capacitor C18 Foot ground connection；

As shown in figure 11, the 1.8V power module includes 1V8 pressure regulation chip U9, the input of the 1V8 pressure regulation chip U9 Voltage foot IN accesses 3.3V direct current, the two or the seven polar capacitor C27 of output voltage foot OUT connection of the 1V8 pressure regulation chip U9 Anode, the anode of the two or seven polar capacitor C27 exports 1.8V direct current, the cathode of the two or the seven polar capacitor C27 It is grounded, is also serially connected with the two or eight capacitor C28, the 1V8 pressure regulation chip U9 between the positive and negative anodes of the two or the seven polar capacitor C27 Lower margin ground connection；

As shown in figure 12, the GSM power module includes GSM pressure regulation chip U10, the input of the GSM pressure regulation chip U10 Foot IN accesses 5V direct current, and input pin IN is also connected with the anode of the two or nine polar capacitor C29, the two or nine polar capacitor The cathode of C29 is grounded, and the anode of the two or the nine polar capacitor C29 also the 18th resistance R18 of concatenation is followed by GSM pressure regulation chip Work the end feet EN, the work end feet EN of U10 is connected to the drain electrode of third N-type metal-oxide-semiconductor Q3, the grid of third N-type metal-oxide-semiconductor Q3 The GSM work foot of MCU is connect, the grid of the third N-type metal-oxide-semiconductor Q3 is grounded after concatenating the two or four resistance R24, the third N-type The source electrode of metal-oxide-semiconductor Q3 is grounded, and the output pin OUT of the GSM pressure regulation chip U10 exports GSM voltage GSM VBAT, the output pin OUT is grounded after also concatenating the 3rd 1 capacitor C31, after the debugging foot ADJ of the GSM pressure regulation chip U10 concatenates the two or two resistance R22 Ground connection, is also serially connected with the 20th resistance R20 between the debugging foot ADJ and output pin OUT of the GSM pressure regulation chip U10, described The grounding leg of GSM pressure regulation chip U10 is grounded；

As shown in figure 13, the 4G power module includes 4G pressure regulation chip U11, the electricity input of the 4G pressure regulation chip U11 Foot IN accesses 5V direct current, and electricity input pin IN is also connected with the anode of the 30th polar capacitor C30, the 30th polar capacitor The cathode of C30 is grounded, and the anode of the 30th polar capacitor C30 also the 19th resistance R19 of concatenation is followed by 4G pressure regulation chip U11 Working signal foot EN, the working signal foot EN be connected to the drain electrode of the 4th N-type metal-oxide-semiconductor Q4, the grid of the 4th N-type metal-oxide-semiconductor Q4 Pole connects the 4G work foot of MCU, and the grid of the 4th N-type metal-oxide-semiconductor Q4 is grounded after concatenating the two or five resistance R25, the 4th N-type The source electrode of metal-oxide-semiconductor Q4 is grounded, and the electricity output foot OUT of the 4G pressure regulation chip U11 exports 4G voltage 4G VBAT, the electricity output Foot OUT is grounded after also concatenating the three or two capacitor C32, and the debugging end ADJ of the 4G pressure regulation chip U11 concatenates the two or three resistance R23 After be grounded, be also serially connected with the 2nd 1 resistance R21, institute between the debugging end ADJ and electricity output foot OUT of the 4G pressure regulation chip U11 State the lower margin ground connection of 4G pressure regulation chip U11.

Claims

1. a kind of things-internet gateway of multimode signal transmission, including MCU, it is characterised in that: further include Power Management Unit, wired Transmission mechanism and wireless transmission mechanism, the wire transmission mechanism are provided with RS485 module, Ethernet transmission module, the nothing Line transmission mechanism is provided with GPRS communication module and 4G communication module；

The Power Management Unit is respectively MCU, RS485 module, Ethernet transmission module, GPRS communication module and 4G communication mould Block power supply；

The MCU is bi-directionally connected with RS485 module, Ethernet transmission module, GPRS communication module and 4G communication module respectively.

2. a kind of things-internet gateway of multimode signal transmission according to claim 1, it is characterised in that: the RS485 mould Block includes 2 group of 485 chip circuit, wherein and first group of 485 chip circuit includes the one 485 chip U4 and the one 485 serial ports P1, Second group of 485 chip circuit includes the 2nd 485 chip U6 and the 2nd 485 serial ports P2；

The A foot of the one 485 chip U4 connects 3 feet of the one 485 serial ports P1, and the B foot of the one 485 chip U4 connects first 4 feet of 485 serial ports P1, the data input pin RXD of the one 485 chip U4 connect the one 485 output pin of MCU, and described first The data output pin TXD of 485 chip U4 connects the one 485 input pin of MCU, and the control foot CON of the one 485 chip U4 connects The one 485 control foot of MCU, the supply pin VCC of the one 485 chip U4 meet the 3.3V direct current of Power Management Unit, institute The lower margin ground connection of the one 485 chip U4 is stated, 1 foot of the one 485 serial ports P1 meets the 24V direct current of Power Management Unit, institute State the 2 feet ground connection of the one 485 serial ports P1；

The A foot of the 2nd 485 chip U6 connects 3 feet of the 2nd 485 serial ports P2, and the B foot of the 2nd 485 chip U6 connects second 4 feet of 485 serial ports P2, the data input pin RXD of the 2nd 485 chip U6 connect the 2nd 485 output pin of MCU, and described second The data output pin TXD of 485 chip U6 connects the 2nd 485 input pin of MCU, and the control foot CON of the 2nd 485 chip U6 connects The 2nd 485 control foot of MCU, the supply pin VCC of the 2nd 485 chip U6 meet the 3.3V direct current of Power Management Unit, institute The lower margin ground connection of the 2nd 485 chip U6 is stated, 1 foot of the 2nd 485 serial ports P2 meets the 24V direct current of Power Management Unit, institute State the 2 feet ground connection of the 2nd 485 serial ports P2.

3. a kind of things-internet gateway of multimode signal transmission according to claim 1, it is characterised in that: the Ethernet passes Defeated module includes that the MOSI foot of Ethernet chip U13 and communication joint U14, the Ethernet chip U13 connect the Ethernet communication of MCU Output pin, the MISO foot of the Ethernet chip U13 connect the Ethernet communication input pin of MCU, the clock of the Ethernet chip U13 Foot SCLK connects the ether control clock foot of MCU, and the core chip select pin SCSn of the Ethernet chip U13 connects the ether chip choosing of MCU Select foot, the output pin INTn that interrupts of the Ethernet chip U13 connects the ether chip of MCU and interrupts foot, the Ethernet chip U13 Resetting pin RSTn connect the ether chip reset foot of MCU, resetting pin RSTn also concatenates the four or eight resistance R48 and is followed by power management The 3.3V direct current of unit；

The data output end group of the Ethernet chip U13 includes TXN foot and TXP foot, wherein TXN foot connects communication joint U14's TD- output pin, the TXN foot also concatenate the 3.3V direct current that the five or five resistance R55 is followed by Power Management Unit, the TXP foot The TD+ output pin of communication joint U14 is connect, which also concatenates the 3.3V direct current that the May 4th resistance R54 is followed by Power Management Unit Electricity, the TXC output pin of the communication joint U14 concatenate the 3.3V direct current that the five or six resistance R56 is followed by Power Management Unit, should TXC output pin is grounded after also concatenating the four or nine capacitor C49；

The data input pin group of the Ethernet chip U13 includes RXN foot and RXP foot, wherein RXN foot concatenates the five or six capacitor C56 is followed by the RX- input pin of communication joint U14, and the RXN foot also concatenates the 6th 1 resistance R61 and is followed by communication joint U14's RXC input pin, the RXP foot concatenate the RX+ input pin that the 50th capacitor C50 is followed by communication joint U14, and the RXP foot is also gone here and there RXC input pin is connected after meeting the five or nine resistance R59, the RXC input pin is grounded after also concatenating the May 4th capacitor C54；

The first physical layer modes selection foot PMODE0 of the Ethernet chip U13 concatenates the three or eight resistance R38 and is followed by power supply pipe The 3.3V direct current of unit is managed, first physical layer modes selection foot PMODE0 is grounded after also concatenating the three or seven resistance R37, described The second physical layer modes selection foot PMODE1 of Ethernet chip U13 concatenates the four or five resistance R45 and is followed by Power Management Unit 3.3V direct current, second physical layer modes selection foot PMODE1 are grounded after also concatenating the four or four resistance R44, the ether steel wire rack The third physical layer modes selection foot PMODE2 of piece U13 concatenates the 3.3V direct current that the four or seven resistance R47 is followed by Power Management Unit Electricity, third physical layer modes selection foot PMODE2 are grounded after also concatenating the four or six resistance R46, the Ethernet chip U13's It is grounded after the end RSVD group concatenation protective resistance；

A working end of the crystal oscillator output pin XO connection third crystal oscillator X3 of the Ethernet chip U13, third crystal oscillator X3's Another working end connects crystal oscillator the input pin XI, the crystal oscillator output pin XO and crystal oscillator input pin XI of the Ethernet chip U13 Between be serially connected with the five or eight resistance R58, the crystal oscillator output pin XO is grounded after also concatenating the four or eight capacitor C48, and the crystal oscillator is defeated Enter after foot XI also concatenates the five or five capacitor C55 and is grounded, the power end group connection Power Management Unit of the Ethernet chip U13 3.3V direct current, the ground terminal group ground connection of the Ethernet chip U13.

4. a kind of things-internet gateway of multimode signal transmission according to claim 1, it is characterised in that: the GPRS communication Module includes the data transmission foot UART1_TXD of GPRS chip U1, GSM-SIM deck U2 and antenna J1, the GPRS chip U1 The GPRS input pin of MCU is connect, the data receiver foot UART1_RXD of the GPRS chip U1 connects the GPRS output pin of MCU, described The drain electrode of switch foot PWRKEY connection the first N-type metal-oxide-semiconductor Q1 of GPRS chip U1, the grid connection of the first N-type metal-oxide-semiconductor Q1 The GPRS of MCU switchs foot, and the grid of the first N-type metal-oxide-semiconductor Q1 is grounded after also concatenating the 5th resistance R5, the first N-type MOS The source electrode of pipe Q1 is grounded；

The data of the SIM data pin connection GSM-SIM deck U2 of the GPRS chip U1 transmit foot IO, which transmits foot IO also It is grounded after concatenating the 6th capacitor C6, the data transmission foot IO also concatenates the SIM electricity of connection GPRS chip U1 after second resistance R2 Source foot, the SIM power foot of the GPRS chip U1 are also connected with the supply pin VCC of GSM-SIM deck U2, the GPRS chip U1's SIM clock foot connects the clock foot CLK of GSM-SIM deck U2, and clock foot CLK is grounded after also concatenating the 7th capacitor C7, described The resetting pin RST of the SIM resetting pin connection GSM-SIM deck U2 of GPRS chip U1, resetting pin RST also concatenate the 5th capacitor C5 After be grounded, the ground terminal group of GSM-SIM deck U2 ground connection；

The work foot of antenna J1 is connected after the day stitch concatenation first resistor R1 of the GPRS chip U1, the GPRS chip U1's Its stitch is grounded after also concatenating the 4th capacitor C48, is grounded after the work foot concatenation third capacitor C3 of the antenna J1, the antenna The shielding foot group of J1 is grounded；

The supply pin group of the GPRS chip U1 meets the GSM voltage GSM VBAT of Power Management Unit, the GPRS chip U1's Lower margin group ground connection.

5. a kind of things-internet gateway of multimode signal transmission according to claim 1, it is characterised in that: the 4G communicates mould Block includes 4G chip U15 and 4G-SIM deck U16, the tenth triode of data receiver foot UART_RX connection of the 4G chip U15 The collector of Q10, the emitter of the tenth triode Q10 connect the 4G output pin of MCU, the emitter of the tenth triode Q10 Also the seven or two resistance R72 of concatenation is followed by the 3.3V direct current of Power Management Unit, the base stage concatenation of the tenth triode Q10 the 70 electricity group R70 are followed by the 1.8V direct current of Power Management Unit, and the collector of the tenth triode Q10 also concatenates the seven or three Resistance R73 is followed by the 1.8V direct current of Power Management Unit, and the data of the 4G chip U15 send foot UART_TX connection the tenth The emitter of one triode Q11, the collector of the 11st triode Q11 connect the 4G input pin of MCU, the 11st triode The emitter of Q11 also concatenates the base stage that the seven or four resistance R74 is followed by the 11st triode Q11, the 11st triode Q11's Base stage also concatenates the 1.8V direct current that July 1st electricity group R71 is followed by Power Management Unit, the current collection of the 11st triode Q11 Pole also concatenates the 3.3V direct current that the Seventh Five-Year Plan resistance R75 is followed by Power Management Unit；

The drain electrode of wake-up the 8th N-type metal-oxide-semiconductor Q8 of input pin WAKEUP_IN connection of the 4G chip U15, the 8th N-type MOS The 4G of the grid connection MCU of pipe Q8 wakes up foot, and the grid of the 8th N-type metal-oxide-semiconductor Q8 also concatenates the seven or six resistance R76 and is followed by Ground, the drain electrode of the 8th N-type metal-oxide-semiconductor Q8 also the six or eight resistance R68 of concatenation are followed by the 1.8V direct current of Power Management Unit, institute It is grounded after stating the six or the nine capacitor C69 of drain electrode concatenation of the 8th N-type metal-oxide-semiconductor Q8, the source electrode ground connection of the 8th N-type metal-oxide-semiconductor Q8；

The drain electrode of the 9th N-type metal-oxide-semiconductor Q9 of resetting pin RESIN_N connection of the 4G chip U15, the 9th N-type metal-oxide-semiconductor Q9's Grid connects the 4G resetting pin of MCU, and the grid of the 9th N-type metal-oxide-semiconductor Q9 is grounded after also concatenating the seven or seven resistance R77, described The drain electrode of 9th N-type metal-oxide-semiconductor Q9 also the six or nine resistance R69 of concatenation is followed by the 1.8V direct current of Power Management Unit, the 9th N The drain electrode of type metal-oxide-semiconductor Q9 is grounded after concatenating the 70th capacitor C70, the source electrode ground connection of the 9th N-type metal-oxide-semiconductor Q9；

The data of the USIM data pin connection 4G-SIM deck U16 of the 4G chip U15 transmit foot IO, which transmits foot IO also It is grounded after concatenating the six or seven capacitor C67, the data transmission foot IO connects 4G chip U15's after also concatenating the six or four resistance R64 USIM supply pin, the USIM supply pin of the 4G chip U15 are also connected with the supply pin VCC of 4G-SIM deck U16, the 4G chip The clock foot CLK of the USIM clock foot connection 4G-SIM deck U16 of U15, after clock foot CLK also concatenates the six or eight capacitor C68 Ground connection, the resetting pin RST of the USIM resetting pin connection 4G-SIM deck U16 of the 4G chip U15, resetting pin RST are also concatenated It is grounded after six or six capacitor C66, the ground terminal group ground connection of the 4G-SIM deck U16；

The 4G working signal foot of the work foot WAKE# connection MCU of the 4G chip U15, work foot WAKE# also concatenate the six or three electricity Resistance R63 is followed by the 4G voltage 4G VBAT of Power Management Unit, and the power end group of the 4G chip U15 connects Power Management Unit The ground terminal group of 4G voltage 4G VBAT, the 4G chip U15 are grounded.

6. a kind of things-internet gateway of multimode signal transmission according to claim 1, it is characterised in that: further include that storage is expanded Module is opened up, the storage expanding module includes TF card CN1, and the foot 2 of the TF card CN1 connects the extension chip select pin of MCU, and the foot 2 is also The 3.3V direct current that the 7th resistance R7 is followed by Power Management Unit is concatenated, the growth data that the foot 3 of the TF card CN1 meets MCU is defeated Foot out, the foot 3 also concatenate the 3.3V direct current that the 6th resistance R6 is followed by Power Management Unit, and the foot 7 of the TF card CN1 meets MCU Growth data input pin, which also concatenates the 3.3V direct current that the 4th resistance R4 is followed by Power Management Unit；

The foot 5 of the TF card CN1 connects the expanding clock foot of MCU, and the foot 6 of the TF card CN1 is grounded, which also concatenates the 12nd Capacitor C12 is followed by the 3.3V direct current of Power Management Unit.

7. a kind of things-internet gateway of multimode signal transmission according to claim 1, it is characterised in that: the power management Unit includes 24V power module, 5V power module, 3.3V power module, 1.8V power module, GSM power module and 4G power supply Module, the 24V power module access input voltage and export 24V direct current, and the 5V power module input 24V direct current obtains To 5V direct current, the 3.3V power module input 5V direct current obtains 3.3V direct current, the 1.8V power module input 3.3V direct current obtains 1.8V direct current, and the GSM power module input 5V direct current obtains GSM voltage GSM VBAT, described 4G power module input 5V direct current obtains 4G voltage 4G VBAT.

8. a kind of things-internet gateway of multimode signal transmission according to claim 7, it is characterised in that: the 24V power supply Module includes voltage input serial ports PWORE1, and the foot 1 of voltage input serial ports PWORE1 connects input power, and foot 2 and foot 3 are grounded；

The foot 1 of the voltage input serial ports PWORE1 connects the anode of first diode D1, the cathode string of first diode D1 The anode of the two or five polar capacitor C25 of connection after fuse F1 can be resetted by connecing first, and the anode of the two or five polar capacitor C25 is Export 24V direct current, the cathode ground connection of the two or the five polar capacitor C25, the positive and negative anodes of the two or the five polar capacitor C25 it Between be also serially connected with the two or six capacitor C26；

The foot 3 of the voltage input serial ports PWORE1 is connected to the cathode of the second diode D2, and the anode of second diode D2 connects Ground；

The 5V power module includes 5V pressure regulation chip U8, and the voltage input foot VIN of the 5V pressure regulation chip U8 accesses 24V direct current Electricity, voltage input foot VIN are also connected with the anode of the 2nd 1 polar capacitor C21, and the cathode of the 2nd 1 polar capacitor C21 connects Ground, the voltage input foot VIN are grounded after also concatenating the two or two capacitor C22, the voltage output foot of the 5V pressure regulation chip U8 VOUT concatenates the anode that the two or three polar capacitor C23 is connected after the second inductance L2, the anode of the two or three polar capacitor C23, that is, defeated 5V direct current out, the feedback foot of the anode connection 5V pressure regulation chip U8 of the two or the three polar capacitor C23, the two or three polarity The cathode of capacitor C23 is grounded, and is also serially connected with the two or four capacitor C24 between the positive and negative anodes of the two or the three polar capacitor C23, described The voltage output foot VOUT of 5V pressure regulation chip U8 is also connected with the cathode of the first zener diode VD1, first zener diode VD1 Plus earth, the 5V pressure regulation chip U8 lower margin ground connection；

The 3.3V power module includes 3V3 pressure regulation chip U7, and the voltage input foot IN access 5V of the 3V3 pressure regulation chip U7 is straight Galvanic electricity, voltage input foot IN are also connected with the anode of the 20th polar capacitor C20, the cathode of the 20th polar capacitor C20 Ground connection, the anode of the 18th polar capacitor C18 of voltage output foot OUT connection of the 3V3 pressure regulation chip U7, the tenth octupole property The anode of capacitor C18 exports 3.3V direct current, the cathode ground connection of the 18th polar capacitor C18, the tenth octupole property The 19th capacitor C19, the lower margin ground connection of the 3V3 pressure regulation chip U7 are also serially connected between the positive and negative anodes of capacitor C18；

The 1.8V power module includes 1V8 pressure regulation chip U9, and the input voltage foot IN of the 1V8 pressure regulation chip U9 accesses 3.3V Direct current, the anode of the two or the seven polar capacitor C27 of output voltage foot OUT connection of the 1V8 pressure regulation chip U9, the two or seven pole Property capacitor C27 anode export 1.8V direct current, the cathode ground connection of the two or the seven polar capacitor C27, the two or seven pole Property capacitor C27 positive and negative anodes between be also serially connected with the two or eight capacitor C28, the lower margin ground connection of the 1V8 pressure regulation chip U9；

The GSM power module includes GSM pressure regulation chip U10, and the input pin IN of the GSM pressure regulation chip U10 accesses 5V direct current Electricity, input pin IN are also connected with the anode of the two or nine polar capacitor C29, the cathode ground connection of the two or the nine polar capacitor C29, institute Anode also the 18th resistance R18 of concatenation for stating the two or nine polar capacitor C29 is followed by the work end feet EN of GSM pressure regulation chip U10, institute The drain electrode that work end feet EN is connected to third N-type metal-oxide-semiconductor Q3 is stated, the grid of third N-type metal-oxide-semiconductor Q3 connects the GSM work foot of MCU, The grid of the third N-type metal-oxide-semiconductor Q3 is grounded after concatenating the two or four resistance R24, the source electrode ground connection of the third N-type metal-oxide-semiconductor Q3, The output pin OUT of the GSM pressure regulation chip U10 exports GSM voltage GSM VBAT, and output pin OUT also concatenates the 3rd 1 electricity It is grounded after holding C31, the debugging foot ADJ of the GSM pressure regulation chip U10 is grounded after concatenating the two or two resistance R22, the GSM pressure regulation It is also serially connected with the 20th resistance R20 between the debugging foot ADJ and output pin OUT of chip U10, the GSM pressure regulation chip U10's connects Lower margin ground connection；

The 4G power module includes 4G pressure regulation chip U11, and the electric input pin IN of the 4G pressure regulation chip U11 accesses 5V direct current Electricity, electricity input pin IN are also connected with the anode of the 30th polar capacitor C30, and the cathode of the 30th polar capacitor C30 is grounded, The anode of the 30th polar capacitor C30 also the 19th resistance R19 of concatenation is followed by the working signal foot of 4G pressure regulation chip U11 EN, the working signal foot EN are connected to the drain electrode of the 4th N-type metal-oxide-semiconductor Q4, and the grid of the 4th N-type metal-oxide-semiconductor Q4 connects the 4G work of MCU Make foot, the grid of the 4th N-type metal-oxide-semiconductor Q4 is grounded after concatenating the two or five resistance R25, the source electrode of the 4th N-type metal-oxide-semiconductor Q4 Ground connection, the electricity output foot OUT of the 4G pressure regulation chip U11 export 4G voltage 4G VBAT, and electricity output foot OUT also concatenates the It is grounded after three or two capacitor C32, the debugging end ADJ of the 4G pressure regulation chip U11 is grounded after concatenating the two or three resistance R23, the 4G The 2nd 1 resistance R21, the 4G pressure regulation chip are also serially connected between the debugging end ADJ and electricity output foot OUT of pressure regulation chip U11 The lower margin of U11 is grounded.

9. a kind of things-internet gateway of multimode signal transmission according to claim 1, it is characterised in that: the MCU also connects It is connected to oscillating circuit, the oscillating circuit includes the first crystal oscillator X1 and the second crystal oscillator X2, and the working end 1 of the first crystal oscillator X1 connects The concussion output end of MCU, the working end 1 are grounded after also concatenating the three or six capacitor C36, the working end 3 of the first crystal oscillator X1 The concussion input terminal that the three or three resistance R33 is followed by MCU is concatenated, which is grounded after also concatenating the three or four capacitor C34, described The foot 2 of first crystal oscillator X1 is grounded with foot 4；

The crystal oscillator input terminal of a termination MCU of the second crystal oscillator X2, the crystal oscillator output end of another termination MCU, the crystalline substance of the MCU Vibration input terminal is grounded after concatenating the three or seven capacitor C37, and the crystal oscillator output end of the MCU is grounded after concatenating the four or three capacitor C43.