CN208190998U - A kind of PCB construction of cross-layer differential pair of lines - Google Patents
A kind of PCB construction of cross-layer differential pair of lines Download PDFInfo
- Publication number
- CN208190998U CN208190998U CN201820458056.5U CN201820458056U CN208190998U CN 208190998 U CN208190998 U CN 208190998U CN 201820458056 U CN201820458056 U CN 201820458056U CN 208190998 U CN208190998 U CN 208190998U
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- CN
- China
- Prior art keywords
- layer
- via hole
- signal line
- separator
- differential pair
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Abstract
The utility model relates to a kind of PCB constructions of cross-layer differential pair of lines, including the first signals layer, second signal layer and several plane layers being folded between first signals layer and second signal layer, it is characterized by: being emptied on described every layer of plane layer by the figure of eight separator formed that connected by a pair of of circle, it further include the first via hole passed through from figure of eight separator side circle the center point and the second via hole passed through from figure of eight separator other side circle the center point, spacing in the utility model between the first via hole and the second via hole is smaller can close-coupled, radiated noise from the same source can be just effectively suppressed, because only that when cabling is in close proximity to one another, the electromagnetic field of surrounding is likely to close to identical.First via hole is interior larger along spacing with separator with the second via hole, and the interference with other signals cabling (via hole) is also reduced while by sufficiently large separator to fully ensure that impedance is continuous.
Description
Technical field
The utility model relates to PCB technical fields, and in particular to a kind of PCB construction of cross-layer differential pair of lines.
Background technique
The creator of printed circuit board is that Austrian's Borrow's Ace strangles (Paul Eisler), and 1936, he existed first
Printed circuit board is used in radio.From mid-term the 1950s, printed wiring board just starts to be widely used.?
Before PCB occurs, the interconnection between electronic component is all that electric wire is relied on to be directly connected to complete.And now electric wire is used only in
Laboratory, which is done experiment, applies and exists;Printed circuit board occupies the status absolutely controlled certainly in the electronics industry.
With the development of electronic technology, the number of plies of PCB is more and more, and conventional pcb board passes through via hole connection at least two
Signals layer;Internal interference is increasingly severe simultaneously, is unfavorable for the transmission for key signal.And the working principle of differential pair is
So that the signal received is equal to two complementations and be relatively the difference between the signal of reference, therefore can greatly reduce
The electrical noise effect of signal.And the working principle of single-ended signal is the difference for receiving signal and being equal between signal and power supply or ground
Value, therefore the noise in signal or power-supply system cannot effectively be offset.Here it is Difference signal pair high speed signal is so effective
The reason of and it be used for Fast Sequential bus and double data rate memory the reason of.In differential pair, positive and negative both sides are all
It must be transmitted under identical environment along transmission path always.Positive and negative both sides must be closely packed together, so that positive negative signal warp
It is coupled to each other by the electromagnetic field of respective point on these signals.Differential pair is symmetrical, therefore their environment also must be right
Claim.
Certainly, be symmetrically perfectly it is impossible, in actual PCB layout, tend not to meet difference simultaneously
The requirement of design, since pin distribution and cabling space etc. cannot obtain best differential signal as a result, cross-layer cabling can not at this time
It avoids, but since the impedance of via hole is smaller, differential signal can generate reflection in via hole.
Utility model content
Technical problem to be solved by the utility model is: proposing that a kind of reduce is reflected and optimize cross-layer differential pair of lines
PCB construction.
The technical solution that the utility model proposes to solve above-mentioned technical problem is: a kind of PCB of cross-layer differential pair of lines
Structure, including the first signals layer, second signal layer and it is several be folded in it is flat between first signals layer and second signal layer
Surface layer, it is characterised in that: it is emptied on described every layer of plane layer by the figure of eight separator formed that connected by a pair of of circle,
Figure of eight separator position on every layer of plane layer is opposite;
It further include the first via hole passed through from figure of eight separator side circle the center point and from the figure of eight
The second via hole that separator other side circle the center point passes through, first signals layer include the first positive signal line of mirror-image arrangement
With the first negative signal line, the second signal layer includes the second positive signal line and the second negative signal line of mirror-image arrangement, and described
One positive signal line and the second positive signal line pass through via pad respectively and are connected to first via hole, second negative signal line and
Second negative signal line passes through via pad respectively and is connected to second via hole;
Spacing is at least four times of its holes between in the outer wall of first via hole and figure of eight separator side
Diameter, spacing is at least four times of its apertures, institute between in the outer wall of second via hole and the figure of eight separator other side
Stating spacing between the first via hole and second via hole is 40mil-45mil.
Further, first positive signal line, the first negative signal line, the second positive signal line and the second negative signal line are
The linkage section for being used to be connected with via pad by front end and the span line connecting with linkage section rear end are constituted, the linkage section and institute
Stating angle between span line is 120 degree of -135 degree, and the convergence part between the linkage section and the span line is smooth excessiveness
Arc.
It further, further include the bottom surface layer for being located at bottom, between the bottom surface layer and the second signal layer
First via hole and the second via hole are bored empty by back.
The beneficial effects of the utility model are:
Spacing in the utility model between the first via hole and the second via hole it is smaller can close-coupled, from same
The radiated noise in source can be just effectively suppressed, because only that the electromagnetic field of surrounding is likely to when cabling is in close proximity to one another
Close to identical.First via hole is interior larger along spacing with separator with the second via hole, sufficiently protects by sufficiently large separator
Card impedance also reduces the interference with other signals cabling (via hole) while continuous, because energy of electromagnetic field is as distance is in
What quadratic relationship was successively decreased, when general line spacing is more than 4 times of line widths, the interference between them can be ignored substantially.
And the first via hole and the second via hole, the first positive signal line and the first negative signal line, second in the present invention
Tend to stringent mirror settings between positive signal line and the second negative signal, ensure that differential signal timing.
Detailed description of the invention
The PCB construction of the cross-layer differential pair of lines of the utility model is described further with reference to the accompanying drawing.
Fig. 1 is the structural schematic diagram of the PCB construction of cross-layer differential pair of lines in the utility model;
Fig. 2 is the front view of Fig. 1.
Specific embodiment
Embodiment
According to Fig. 1, the PCB construction of the cross-layer differential pair of lines in the utility model, including the first signals layer, second
Signals layer and several plane layers 1 being folded between first signals layer and second signal layer, on described every layer of plane layer 1
It empties by the figure of eight separator 2 formed that connected by a pair of of circle, the 8-shaped separator 2 on every layer of plane layer 1
Position is opposite.
It further include the first via hole 3 passed through from the 2 side circle the center point of figure of eight separator and from " 8 " word
The second via hole 4 that 2 other side circle the center point of shape separator passes through, first signals layer include the first positive letter of mirror-image arrangement
Number line 5 and the first negative signal line 6, the second signal layer includes the second positive signal line 7 and the second negative signal line of mirror-image arrangement
8, first positive signal line 5 and the second positive signal line 7 are connected to first via hole 3 by via pad respectively, and described
Two negative signal lines 8 and the second negative signal line 8 are connected to second via hole 4 by via pad respectively.
Spacing is at least four times of its holes between in the outer wall of first via hole 3 and 2 side of figure of eight separator
Spacing is at least four times of its apertures between in diameter, the outer wall of second via hole 4 and 2 other side of figure of eight separator,
Spacing is 40mil-45mil between first via hole 3 and second via hole 4.
It can be used as preferably: first positive signal line 5, the first negative signal line 6, the second positive signal line 7 and second
Negative signal line 8 is that the linkage section for being used to be connected with via pad by front end and the span line connecting with linkage section rear end are constituted,
Angle is 120 degree of -135 degree, the rank between the linkage section and the span line between the linkage section and the span line
Socket part is the arc of smooth excessiveness.
It can be used as preferably: further including the bottom surface layer 9 positioned at bottom, be located at the bottom surface layer 9 and second letter
The first via hole 3 and the second via hole 4 between number floor are bored empty from back.
Spacing in the utility model between the first via hole 3 and the second via hole 4 it is smaller can close-coupled, from same
The radiated noise in a source can be just effectively suppressed, because only that the electromagnetic field of surrounding just may be used when cabling is in close proximity to one another
It can be close to identical.First via hole 3 and the second via hole 4 with it is larger along spacing in separator 2, by sufficiently large separator 2 come
Fully ensure that the interference also reduced while impedance is continuous with other signals cabling (via hole) because energy of electromagnetic field be with
Successively decrease apart from square, when general line spacing is more than 4 times of line widths, the interference between them can be ignored substantially.
And in the present invention the first via hole 3 and the second via hole 4, the first positive signal line 5 and the first negative signal line 6,
Tend to stringent mirror settings between second positive signal line 7 and the second negative signal, ensure that differential signal timing.
The utility model is not limited to the above embodiment, the technical solution of above-mentioned each embodiment of the utility model that
This can form new technical solution with combined crosswise, and in addition all technical solutions formed using equivalent replacement, are all fallen within practical
In the protection scope of novel requirement.
Claims (3)
1. a kind of PCB construction of cross-layer differential pair of lines, including the first signals layer, second signal layer and several it is folded in described
Plane layer between one signals layer and second signal layer, it is characterised in that: emptied on described every layer of plane layer by a pair
Circle connects the figure of eight separator of composition, and the figure of eight separator position on every layer of plane layer is opposite;
Further include the first via hole passed through from figure of eight separator side circle the center point and is isolated from the figure of eight
The second via hole that disk other side circle the center point passes through, first signals layer include the first positive signal line and of mirror-image arrangement
One negative signal line, the second signal layer include the second positive signal line and the second negative signal line of mirror-image arrangement, and described first just
Signal wire and the second positive signal line pass through via pad respectively and are connected to first via hole, second negative signal line and second
Negative signal line passes through via pad respectively and is connected to second via hole;
Spacing is at least four times of its apertures, institute between in the outer wall of first via hole and figure of eight separator side
State in the outer wall and the figure of eight separator other side of the second via hole that spacing is at least four times of its apertures between, described the
Spacing is 40mil-45mil between one via hole and second via hole.
2. the PCB construction of cross-layer differential pair of lines according to claim 1, it is characterised in that: first positive signal line,
One negative signal line, the second positive signal line and the second negative signal line be be used for by front end the linkage section that is connected with via pad and with
The span line of linkage section rear end connection is constituted, and angle is 120 degree of -135 degree between the linkage section and the span line, described
Convergence part between linkage section and the span line is the arc of smooth excessiveness.
3. the PCB construction of cross-layer differential pair of lines according to claim 2, it is characterised in that: further include positioned at the bottom of bottom
Surface layer, the first via hole and the second via hole between the bottom surface layer and the second signal layer are bored empty from back.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820458056.5U CN208190998U (en) | 2018-04-03 | 2018-04-03 | A kind of PCB construction of cross-layer differential pair of lines |
Applications Claiming Priority (1)
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CN201820458056.5U CN208190998U (en) | 2018-04-03 | 2018-04-03 | A kind of PCB construction of cross-layer differential pair of lines |
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CN208190998U true CN208190998U (en) | 2018-12-04 |
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CN201820458056.5U Expired - Fee Related CN208190998U (en) | 2018-04-03 | 2018-04-03 | A kind of PCB construction of cross-layer differential pair of lines |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112164927A (en) * | 2020-06-17 | 2021-01-01 | 中航光电科技股份有限公司 | Aviation connector meeting definition of standard ten-gigabit network signals |
-
2018
- 2018-04-03 CN CN201820458056.5U patent/CN208190998U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112164927A (en) * | 2020-06-17 | 2021-01-01 | 中航光电科技股份有限公司 | Aviation connector meeting definition of standard ten-gigabit network signals |
CN112164927B (en) * | 2020-06-17 | 2022-04-19 | 中航光电科技股份有限公司 | Aviation connector meeting definition of standard ten-gigabit network signals |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181204 Termination date: 20200403 |
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CF01 | Termination of patent right due to non-payment of annual fee |