CN208189974U - A kind of laser chip end face cleavage passivating device - Google Patents
A kind of laser chip end face cleavage passivating device Download PDFInfo
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- CN208189974U CN208189974U CN201820911096.0U CN201820911096U CN208189974U CN 208189974 U CN208189974 U CN 208189974U CN 201820911096 U CN201820911096 U CN 201820911096U CN 208189974 U CN208189974 U CN 208189974U
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Abstract
The utility model relates to a kind of laser chip end face cleavage passivating devices, including sample cavity, pretreatment chamber, cleavage chamber and the passivation chamber being sequentially communicated by sample treatment technique, and the first transport mechanism, the second transport mechanism and third transport mechanism for transmitting sample；There are two sample cavity, pretreatment chamber and the first transport mechanism are respectively provided with, sample cavity includes cavity, sample stage and sample introduction heating device, high-temperature baking is carried out to sample by sample introduction heating device, the steam and impurity in the air depended on sample can be removed, pollution of the external environment impurity to vacuum chamber is reduced.It is provided with transmission fork in third transport mechanism, multiple fixtures for sample described in clamping are installed on transmission fork.Pass through above-mentioned double set disengaging model machine structures and multiple clip design, laser chip end face cleavage passivating device provided by the utility model can significantly shorten the time cost during series of processes, source material service efficiency is greatly improved, complete machine service efficiency is promoted, improves device capbility.
Description
Technical field
The application belongs to field of semiconductor photoelectron technique, and in particular to a kind of laser chip end face cleavage passivating device.
Background technique
Semiconductor laser is in production and in use, its optical element portion will appear degradation phenomena.Degradation phenomena can shadow
The stability ringing the service life of semiconductor laser and using.It pollutes to reduce films on cavity surfaces of semiconductor lasers and brings damage to laser
Wound needs to generate passivation layer in semiconductor cavity face using laser chip end face cleavage passivating device.
As shown in Figure 1, existing laser chip end face cleavage passivating device generally comprises sample cavity, pretreatment chamber, cleavage
Chamber and passivation chamber, sample cavity can accommodate a sample stage, the laser chip sample of lading clearance quantity in sample stage, pretreatment
Chamber, as vacuum buffer region, cleavage chamber carries out cleavage process, and passivation chamber is passivated technique.By the first transport mechanism by sample
Product are sent to pretreatment chamber from sample cavity；Sample is sent to cleavage chamber from pretreatment chamber by the second transport mechanism；Third conveyer
Sample is sent to passivation chamber from cleavage chamber by structure.Complete process flow is that sample enters in sample cavity from atmosphere, by the first transmission
Mechanism is sent to pretreatment chamber, is sent to cleavage chamber by the second transport mechanism and completes cleavage work, is transmitted by third transport mechanism
Passivation technology is completed to passivation chamber, then backtracking to sample cavity takes out treated sample.
Existing laser chip end face cleavage passivating device has the following problems: 1, since end face processing device is that superelevation is true
Empty processing unit, sample enter in vacuum environment from atmosphere, can destroy the vacuum environment of end face processing device；2, laser chip
End face cleavage passivating device single process only allows one-way transmission to operate, during entire Product Process, time for needing to wait
It is longer.
Summary of the invention
In order to solve the above technical problems, the utility model provides a kind of end face processing device, inner vacuum it is good and
The waiting time is short in entire technical process when processing laser chip sample.
Realize that technical solution used by the utility model aim is a kind of laser chip end face cleavage passivating device, packet
Sample cavity, pretreatment chamber, cleavage chamber and the passivation chamber being sequentially communicated by sample treatment technique are included, and for transmitting the sample
The first transport mechanism, the second transport mechanism and third transport mechanism；First transport mechanism be set to the sample cavity with
In the pretreatment chamber；Second transport mechanism is set in the pretreatment chamber and the cleavage chamber；The third transmission
Mechanism is set in the cleavage chamber and the passivation chamber；
There are two the sample cavity, the pretreatment chamber and first transport mechanism are respectively provided with, second conveyer
Structure is set in two pretreatment chambers and the cleavage chamber；
Two sample introduction cavity configurations are identical, include cavity, sample stage and sample introduction heating device；
Offer sample introduction port on the cavity, chamber door be installed on the sample introduction port, the sample stage and it is described into
Sample heating device is all set in the cavity；
It is provided with transmission fork in the third transport mechanism, is equipped with 1 or more for described in clamping on the transmission fork
The fixture of sample, when the sample is sent in the passivation chamber, the transmission fork is protruded into the passivation chamber；
Passivation heating device and evaporation source are provided in the passivation chamber, the evaporation source has 1 or more pipe furnace, each to manage
Opening, the face of the sample transmitted on the sum of area of the opening of each pipe furnace and the transmission fork are all had on furnace
The sum of product matches.
Preferably, the laser chip end face cleavage passivating device further includes 4 sets of vacuum evacuation devices, 4 sets of vacuum evacuation devices
In:
1 set of vacuum evacuation device is separately connected two sample cavitys；
1 set of vacuum evacuation device is separately connected two pretreatment chambers；
Remaining 2 sets of vacuum evacuation devices connect one to one with the cleavage chamber and the passivation chamber respectively.
Preferably, it is connected on the pipeline of the sample cavity and the pretreatment chamber, connection pretreatment chamber and the cleavage chamber
Pipeline on, and on the pipeline of the connection cleavage chamber and the passivation chamber be mounted on valve.
Preferably, the vacuum degree of the pretreatment chamber, the cleavage chamber and the passivation chamber is above the sample cavity
Maximum vacuum.
Preferably, it being also provided on the cavity and vacuumizes port, described vacuumize is equipped with vacuum lead on port,
The vacuum lead is connected to the corresponding vacuum evacuation device of the sample cavity.
Preferably, it is also provided with back pressure port on the cavity, back pressure pipeline is installed on the back pressure port, described time
Pressure pipeline is connected to a feeder.
Preferably, it is interconnected between two sample cavitys, is connected on the pipeline of two sample cavitys and valve is installed
Door；
It is interconnected between two pretreatment chambers, valve is installed on the pipeline of the pretreatment chamber of connection two.
Preferably, the sample introduction heating device is specially electric boiling plate；
The passivation heating device is specially Electrothermal ring.
Preferably, the shape of the electric boiling plate and the shape of sample cavity match.
Preferably, the sample introduction heating device is set in the cavity, and far from the sample introduction port.
As shown from the above technical solution, in laser chip end face cleavage passivating device provided by the utility model, in sample introduction
Sample introduction heating device is arranged in intracavitary portion, passes through sample introduction heating devices heat sample cavity interior environment temperature, sample cavity internal high temperature
Environment carries out high-temperature baking to sample, the steam and impurity in the air depended on sample can be removed, due to eliminating in advance
The steam and impurity in air depended on sample, does not have gas after sample enters vacuum environment and overflows from sample, subtract
Few pollution of the external environment impurity to vacuum chamber, thus the inner vacuum of whole device is good.
The study found that when the steam and impurity in the air depended on sample introduction heating device removal sample need to spend longer
Between, general baking time is a few hours, since existing laser chip end face cleavage passivating device single process only allows unidirectionally
Transmission operation, without storage device in sample cavity, sample introduction goes out the shared entrance of sample, it is therefore necessary to complete last round of production
It just can be carried out the sample introduction operation of next round product after product outflow device, therefore during entire Product Process, need to wait
Time it is longer, this is one of entire used time in Product Process period longer reason.
The means of transportation of sedimentation unit (passivation chamber) configuration is only capable of propping up in existing laser chip end face cleavage passivating device
Hold the deposition operation of single clamp (one sample of a fixture clamping), can not centrally stored, unified operation, and device front end is single
Secondary sample introduction quantity is up to dozens of.Meanwhile it being required to heat up to evaporation source in passivation chamber before and after each step passivation operation
Cooling is handled, therefore will cause the waste of plenty of time cost and source material in passivation technology, causes facet passivation technique
Yield is lower, this is the two of entire used time in Product Process period longer reason.
In order to shorten the entire Product Process period, in laser chip end face cleavage passivating device provided by the utility model,
There are two sample cavity, pretreatment chamber and the first transport mechanism are respectively provided with, two sample cavitys, two pretreatment chambers and two first biographies
Mechanism is sent to form two sets disengaging model machine structures, it is a set of in two sets disengaging model machine structures to be used for sample introduction, another set of be used for sample out, and two sets
The function of passing in and out model machine structure can enable devices to meet two-wheeled sample point according to process progress in sample introduction/go out between sample to switch
The requirement that do not store can carry out the heated baking of next round sample in last round of sample handling processes, therefore last round of
Sample can carry out next round sample introduction while going out sample, save the waiting time of two-wheeled technology room.
In addition, multiple fixtures are configured on transmission fork in laser chip end face cleavage passivating device provided by the utility model,
So that transmission fork not only has transmittability, also there is sample storage ability, the sample for completing vacuum cleavage can be temporarily stored in
It in transmission fork, after collecting specified number sample, is unified in passivation unit and is passivated operation, due to the opening of each pipe furnace
The sum of the area of sample transmitted on the sum of area and transmission fork matches, it is ensured that the uniformity of plated film on each sample,
In at the same time, the sample size that passivation technology can be handled is obviously improved.
Pass through above-mentioned double set disengaging model machine structures and multiple clip design, laser chip end face provided by the utility model cleavage
Passivating device can significantly shorten the time cost during series of processes, greatly improve source material service efficiency, and promoting complete machine makes
With efficiency, device capbility is improved.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of existing laser chip end face cleavage passivating device；
Description of symbols: 1- sample cavity；2- pre-processes chamber；3- cleavage chamber；4- is passivated chamber；The first transport mechanism of 5-；6-
Second transport mechanism；7- third transport mechanism.
Fig. 2 is the schematic view of the front view of the laser chip end face cleavage passivating device of the utility model embodiment；
Fig. 3 is the overlooking structure diagram of the laser chip end face cleavage passivating device of the utility model embodiment；
Description of symbols: 1a- sample cavity A, 1b- sample cavity B；2a- pre-processes chamber A, and 2b- pre-processes chamber B；3- cleavage
Chamber；4- is passivated chamber；The first transport mechanism B of the first transport mechanism of 5a- A, 5b-；The second transport mechanism of 6-；7- third transport mechanism；
8- pipeline；9- valve.
Fig. 4 is the structural schematic diagram of sample cavity in the cleavage passivating device of the utility model laser chip end face；
Description of symbols: 1- sample cavity；11- cavity, 11a- sample introduction port, 11b- vacuumize port, and 11c- back pressure is logical
Mouthful, 11d- sample cavity transmits port；12- sample stage；13- sample introduction heating device；14- chamber door；15- vacuum lead；16- back pressure
Pipeline.
Fig. 5 is the structural schematic diagram that chamber is passivated in the cleavage passivating device of the utility model laser chip end face；
Description of symbols: 4- is passivated chamber；41- is passivated heating device；42- evaporation source；43- pipe furnace；44- transmission fork；45-
Fixture；46- is passivated chamber and transmits port.
Fig. 6 is the structural schematic diagram that fork is transmitted in the cleavage passivating device of the utility model laser chip end face；
Description of symbols: 44- transmission fork；44a- pitches handle；44b- yoke；44c- mounting groove；45- fixture.
Specific embodiment
In order to make the application the technical staff in the technical field be more clearly understood that the application, with reference to the accompanying drawing,
Technical scheme is described in detail by specific embodiment.
In the utility model embodiment, referring to figs. 2 and 3, a kind of laser chip end face cleavage passivating device, including press
Sample cavity 1 that sample treatment technique is sequentially communicated, pretreatment chamber 2, cleavage chamber 3 and passivation chamber 4, and for transmitting sample
One transport mechanism 5, the second transport mechanism 6 and third transport mechanism 7；First transport mechanism 5 is set to sample cavity 1 and pretreatment chamber
In 2, for transmission of the sample between sample cavity 1 and pretreatment chamber 2；Second transport mechanism 6 is set to pretreatment chamber 2 and cleavage
In chamber 3, for transmission of the sample between pretreatment chamber 2 and cleavage chamber 3；Third transport mechanism 7 is set to cleavage chamber 3 and passivation
In chamber 4, for transmission of the sample between cleavage chamber 3 and passivation chamber 4.
In the present embodiment, the sample cavity 1, pretreatment chamber 2 and there are two the first transport mechanism 5 is respectively provided with, the second conveyer
Structure 6 is set in two pretreatments chamber 2a, 2b and cleavage chamber 3, and the length adaptability of the second transport mechanism 6 lengthens, and is used for sample
In the transmission that two pre-process between chamber 2a, 2b and cleavage chamber 3.
The laser chip end face cleavage passivating device is ultrahigh vacuum processing unit, by vacuum evacuation device to above-mentioned each
Chamber provides vacuum environment, and sample is transitioned into vacuum environment by atmospheric environment in sample cavity 1, therefore in sample cavity 1
Vacuum degree changes that (vacuum degree uses mode defined below herein: vacuum degree=(standard atmospheric pressure-is between the range of 0~D1
System pressure)/standard atmospheric pressure), and pre-process chamber 2, cleavage chamber 3 and passivation chamber 4 and be then chronically in vacuum environment, inside
Vacuum degree maintains a fixed numbers: (pretreatment chamber) D2, (cleavage chamber) D3, (passivation chamber) D4.Due to sample treatment be from
Atmosphere enters vacuum environment, and each chamber uses the progressive design of vacuum degree, i.e. sample cavity 1, pretreatment chamber 2, cleavage chamber 3, passivation
The vacuum degree relationship of chamber 4 are as follows: D1 < D2 < D4, D1 < D3 < D4.
Since the vacuum degree between each chamber is different, interrupter is set between each chamber, specifically
, on the pipeline 8 of connection sample cavity 1 and pretreatment chamber 2, on the pipeline 8 of connection pretreatment chamber 2 and cleavage chamber 3, and connection is solved
Valve 9 is mounted on the pipeline 8 of reason chamber 3 and passivation chamber 4.Also be interconnected between two sample cavitys 1a, 1b, connection two into
Valve 9 is installed on the pipeline 8 of sample chamber 1；It is interconnected between two pretreatment chambers 2a, 2b, is connected to the pipe of two pretreatment chambers 2
Valve 9 is installed, valve 9 is only opened when sample transmits on road 8.
It is corresponding, above-mentioned each self-configuring of each chamber a set of vacuum evacuation device (not shown), i.e. the present embodiment
It include 4 sets vacuum evacuation devices in the cleavage passivating device of laser chip end face, in 4 sets of vacuum evacuation devices: 1 set of vacuum evacuation device is distinguished
Two sample cavitys 1a, 1b are connected, the specification needs of the vacuum pump of the set vacuum evacuation device increase accordingly；1 set of vacuum evacuation device point
Not Lian Jie two pretreatments chamber 2a, 2b, the vacuum pump of the set vacuum evacuation device specification needs increase accordingly；Remaining 2 sets are taken out very
Empty device connects one to one with cleavage chamber 3 and passivation chamber 4 respectively.
Since the vacuum degree in sample cavity 1 is in upset condition, and it is then long-term to pre-process chamber 2, cleavage chamber 3 and passivation chamber 4
In vacuum environment, internal vacuum maintains a fixed numbers, the laser chip end face cleavage passivation of the present embodiment
Device uses upper and lower level double-layer arrangement structure, i.e. two sample cavitys 1a, 1b are set to lower layer, corresponding 2 the first transport mechanisms
5a, 5b are arranged along the vertical direction.And it pre-processes chamber 2, cleavage chamber 3 and passivation chamber 4 and is then respectively positioned on upper layer, corresponding second transmission
Mechanism 6 and third transport mechanism 7 are horizontally disposed, this arrangement form can make laser chip end face cleavage passivation dress
The whole occupied space set is minimum, improves space utilization rate.
In the present embodiment, two sample cavity 1a, 1b structures are identical, and referring to fig. 4, two sample cavitys 1a, 1b include cavity
11, sample stage 12 and sample introduction heating device 13, sample stage 12 and sample introduction heating device 13 are all set in cavity 11, sample stage 12
For loading laser chip sample, sample introduction heating device 13 is used to carry out high-temperature baking to laser chip sample, to remove sample
On steam and impurity in the air that depends on.In the present embodiment, sample introduction heating device 13 is specially electric boiling plate, in other implementations
It, can also be using the heating method of illumination heating in example.The shape of electric boiling plate and the shape of sample cavity 1 match, with sufficiently,
It is evenly heated 1 interior environment temperature of sample cavity.In order to guarantee that heating effect, sample introduction heating device 13 are needed far from sample introduction port 11a,
On the one hand in the heat loss of sample introduction passage port, on the other hand heat radiation is reduced in the opposite side of the preferred sample introduction port of its installation site
Prevent sample introduction heating device from interfering the operation of entry/exit sample.
Sample cavity 1 is the transitional cavity of atmospheric environment and vacuum environment, therefore multiple through-holes are offered on cavity 11, specifically
Including sample introduction port 11a, vacuumize port 11b, back pressure port 11c and transmission port 11d.Sample introduction port 11a is used for laser core
The sample introduction of piece sample or out sample are equipped with chamber door 14 on sample introduction port 11a.It vacuumizes and vacuum lead is installed on port 11b
15, vacuum lead 15 is connected to the corresponding vacuum evacuation device (not shown) of sample cavity 1, vacuumizes for sample cavity 1.It returns
Back pressure pipeline 16 is installed on pressure port 11c, back pressure pipeline 16 is connected to a feeder (not shown), the feeder
Effect be to be inflated before sample out into sample cavity 1, the gas filled can be nitrogen or other gases, will be true in sample cavity 1
Altitude is gradually recovered unlatching and smooth sample out convenient for chamber door 14 for atmospheric pressure.Transmission port 11d is then used for laser chip
The transmission of sample.
Laser chip sample is clamping in transmit process on dedicated fixture, and referring to Fig. 5, sample enters passivation chamber
Deposition plating passivation is carried out in 4, is needed when passivation using 44 transmission fixtures 45 of transmission fork, transmission fork 44 is fixed on third conveyer
The end of structure 7, when sample is sent in passivation chamber 4, transmission fork 44 is protruded into passivation chamber 4.
Referring to Fig. 6, the structure that fork is transmitted in existing laser chip end face cleavage passivating device is can be used in transmission fork 44, including
44a and yoke 44b are provided with the mounting groove 44c for accommodating fixture 45 by fork in yoke 44b.By passing in this present embodiment
It send and installs 2 on fork 44 with upper fixture 45, therefore the length of yoke 44b is corresponded to and lengthened.
It referring to Fig. 5, is passivated in chamber 4 and is provided with passivation heating device 41 and evaporation source 42, evaporation source 42 itself is equipped with adding
Thermal is escaped after the internal deposition raw material heating loaded, is evaporated on sample surfaces, evaporation source 42 has 1 or more
Pipe furnace 42 all has opening on each pipe furnace 42, the sample transmitted on the sum of area of opening of each pipe furnace 42 and transmission fork 44
The sum of area matches.
In the present embodiment, transmission fork 44 can accommodate 3 fixtures 45 simultaneously, and corresponding, evaporation source 42 has 3 pipe furnaces 42,
The opening of each pipe furnace 42 is directed at corresponding fixture, in other embodiments, can also pass through the opening face of the single pipe furnace 42 of expansion
The long-pending passivation demand to meet multiple samples.Being passivated heating device 41, transmission fork 44 and evaporation source 42, sequence is arranged from top to bottom,
Passivation heating device 41 is used to heat sample, enables the raw material of evolution smoothly to deposit to sample surfaces and forms passivating film,
It is specially Electrothermal ring that heating device 41 is passivated in the present embodiment, heats sample, since sample size increases, phase by heat radiation
The area for the Electrothermal ring answered needs to increase.
The course of work of laser chip end face cleavage passivating device provided by the utility model embodiment are as follows:
1, by laser chip sample from the sample stage 12 that atmosphere is put into one of sample cavity 1a, sample cavity 1a is closed
Chamber door 14, sample introduction heating device 13 work, to laser chip sample carry out high-temperature baking to remove the sky depended on product
Steam and impurity in gas, while sample cavity 1a corresponding vacuum evacuation device work, extract out air in sample cavity 1a, steam and
Impurity；Cool down after specific temperature toasts a period of time, next step transmitting can be carried out later by being down to assigned temperature；
2, sample is sent to pretreatment chamber 2a from sample cavity 1a by the first transport mechanism 5a, pre-processes chamber 2a as vacuum
Buffer area；
3, sample is sent to cleavage chamber 3 from pretreatment chamber 2a by the second transport mechanism 6, carries out solution science and engineering in cleavage chamber 3
Skill；
4, sample is sent to passivation chamber 4 from cleavage chamber 3 by third transport mechanism 7, is passivated technique in passivation chamber；
Sample after cleavage is temporarily stored on transmission fork 44, after transmission fork 44 collects specified number sample, is unified in
It is passivated operation in passivation chamber 4, is then successively spread out of；
5, the sample backtracking (passivation chamber 4 --- cleavage chamber 3 --- pre-processes chamber 2a) after being passivated takes to sample cavity 1a
Treated out sample；
6, during wheel sample returns to outflow herein, while the baking operation of next round sample is carried out, it may be assumed that
By next round laser chip sample from the sample stage 12 that atmosphere is put into another sample cavity 1b, the sample cavity is closed
The chamber door 14 of 1b, sample introduction heating device 13 work, and carry out high-temperature baking to laser chip sample and depend on product to remove
Steam and impurity in air, while the corresponding vacuum evacuation device work of sample cavity 1b, extract air, the steam in sample cavity 1b out
And impurity, cool down after specific temperature toasts a period of time, next step transmitting can be carried out by being down to after assigned temperature, by the
Sample is sent to pretreatment chamber 2b from sample cavity 1b by one transport mechanism 5b；
7, after last round of sample enters in sample cavity 1a, sample is transmitted from pretreatment chamber 2b by the second transport mechanism 6
To cleavage chamber 3, sequence carries out the subsequent technique of epicycle processing.
Through the foregoing embodiment, the utility model has the advantages that or advantage:
1) in laser chip end face cleavage passivating device provided by the utility model, sample introduction is set inside sample cavity and is heated
Device, by sample introduction heating devices heat sample cavity interior environment temperature, sample cavity internal high temperature environment carries out high temperature to sample
Baking, can remove the steam and impurity in the air depended on sample, due to being eliminated in the air depended on sample in advance
Steam and impurity, do not have gas after sample enters vacuum environment and overflowed from sample, reduce external environment impurity to true
The pollution of plenum chamber, thus the inner vacuum of whole device is good.
2) in laser chip end face cleavage passivating device provided by the utility model, sample cavity, pretreatment chamber and first are passed
It send there are two mechanism is respectively provided with, two sample cavitys, two pretreatment chambers and two the first transport mechanisms form two sets of disengaging model machines
Structure, in two sets of disengaging model machine structures it is a set of for sample introduction, it is another set of for going out sample, and two sets functions of passing in and out model machine structures can root
According to process progress sample introduction/go out sample between switch, enable devices to meet the requirement that two-wheeled sample is stored respectively, in last round of sample
The heated baking of next round sample can be carried out in product treatment process, therefore under can carrying out while last round of sample goes out sample
One wheel sample introduction, saves the waiting time of two-wheeled technology room, and the significant time cost shortened during series of processes promotes complete machine
Service efficiency improves device capbility.
3) in laser chip end face cleavage passivating device provided by the utility model, multiple fixtures is configured on transmission fork, are made
Fork, which must be transmitted, not only has transmittability, also has sample storage ability, the sample for completing vacuum cleavage can be temporarily stored in biography
It send in fork, after collecting specified number sample, is unified in passivation unit and is passivated operation, due to the face of the opening of each pipe furnace
The sum of the area of sample transmitted in the sum of product and transmission fork matches, it is ensured that the uniformity of plated film on each sample,
In the identical time, the sample size that passivation technology can be handled is obviously improved, and greatly improves the service efficiency of source material.
Although the preferred embodiment of the application has been described, but one of ordinary skilled in the art once knows substantially
Creative concept, then additional changes and modifications may be made to these embodiments.It is wrapped so the following claims are intended to be interpreted as
It includes preferred embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (10)
1. a kind of laser chip end face cleavage passivating device, including be sequentially communicated by sample treatment technique sample cavity, pretreatment
Chamber, cleavage chamber and passivation chamber, and the first transport mechanism, the second transport mechanism and third conveyer for transmitting the sample
Structure；First transport mechanism is set in the sample cavity and the pretreatment chamber；Second transport mechanism is set to institute
It states in pretreatment chamber and the cleavage chamber；The third transport mechanism is set in the cleavage chamber and the passivation chamber；It is special
Sign is:
There are two the sample cavity, the pretreatment chamber and first transport mechanism are respectively provided with, second transport mechanism is set
It is placed in two pretreatment chambers and the cleavage chamber；
Two sample introduction cavity configurations are identical, include cavity, sample stage and sample introduction heating device；
Sample introduction port is offered on the cavity, chamber door is installed on the sample introduction port, and the sample stage and the sample introduction add
Thermal is all set in the cavity；
It is provided with transmission fork in the third transport mechanism, is equipped with 2 or more for sample described in clamping on the transmission fork
Fixture, when the sample is sent in the passivation chamber, transmission fork is protruded into the passivation chamber；
It is provided with passivation heating device and evaporation source in the passivation chamber, the evaporation source has 1 an or more pipe furnace, on each pipe furnace
All have opening, the area of the sample transmitted on the sum of area of the opening of each pipe furnace and the transmission fork it
With match.
2. laser chip end face cleavage passivating device as described in claim 1, it is characterised in that: the laser chip end face solution
Reason passivating device further includes 4 sets of vacuum evacuation devices, in 4 sets of vacuum evacuation devices:
1 set of vacuum evacuation device is separately connected two sample cavitys；
1 set of vacuum evacuation device is separately connected two pretreatment chambers；
Remaining 2 sets of vacuum evacuation devices connect one to one with the cleavage chamber and the passivation chamber respectively.
3. laser chip end face cleavage passivating device as claimed in claim 2, it is characterised in that: be connected to the sample cavity and institute
On the pipeline for stating pretreatment chamber, on the pipeline of connection pretreatment chamber and the cleavage chamber, and the connection cleavage chamber with it is described
It is passivated on the pipeline of chamber and is mounted on valve.
4. laser chip end face cleavage passivating device as claimed in claim 3, it is characterised in that: the pretreatment chamber, described
The vacuum degree of cleavage chamber and the passivation chamber is above the maximum vacuum of the sample cavity.
5. laser chip end face cleavage passivating device as claimed in claim 2, it is characterised in that: be also provided on the cavity
Port is vacuumized, described vacuumize is equipped with vacuum lead on port, the vacuum lead is connected to the sample cavity pair
The vacuum evacuation device answered.
6. laser chip end face cleavage passivating device as claimed in claim 5, it is characterised in that: be also provided on the cavity
Back pressure port is equipped with back pressure pipeline on the back pressure port, and the back pressure pipeline is connected to a feeder.
7. laser chip end face cleavage passivating device as claimed in claim 2, it is characterised in that: between two sample cavitys
It is interconnected, is connected on the pipeline of two sample cavitys and valve is installed；
It is interconnected between two pretreatment chambers, valve is installed on the pipeline of the pretreatment chamber of connection two.
8. the laser chip end face cleavage passivating device as described in any one of claims 1 to 7, it is characterised in that: it is described into
Sample heating device is specially electric boiling plate；
The passivation heating device is specially Electrothermal ring.
9. laser chip end face cleavage passivating device as claimed in claim 8, it is characterised in that: the shape of the electric boiling plate
Match with the shape of sample cavity.
10. the laser chip end face cleavage passivating device as described in claim 1 or 9, it is characterised in that: the sample introduction heating dress
It installs and is placed in the cavity, and far from the sample introduction port.
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| CN201820911096.0U CN208189974U (en) | 2018-06-13 | 2018-06-13 | A kind of laser chip end face cleavage passivating device |
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| CN201820911096.0U CN208189974U (en) | 2018-06-13 | 2018-06-13 | A kind of laser chip end face cleavage passivating device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114204409A (en) * | 2022-02-18 | 2022-03-18 | 武汉锐晶激光芯片技术有限公司 | Chip cavity surface processing device |
| CN114498289A (en) * | 2022-04-01 | 2022-05-13 | 苏州长光华芯光电技术股份有限公司 | Ultrahigh vacuum cleavage coating device and working method thereof |
| CN117096724A (en) * | 2023-10-20 | 2023-11-21 | 度亘核芯光电技术(苏州)有限公司 | Cavity surface cleaning and passivating method |
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2018
- 2018-06-13 CN CN201820911096.0U patent/CN208189974U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114204409A (en) * | 2022-02-18 | 2022-03-18 | 武汉锐晶激光芯片技术有限公司 | Chip cavity surface processing device |
| CN114498289A (en) * | 2022-04-01 | 2022-05-13 | 苏州长光华芯光电技术股份有限公司 | Ultrahigh vacuum cleavage coating device and working method thereof |
| CN114498289B (en) * | 2022-04-01 | 2022-07-01 | 苏州长光华芯光电技术股份有限公司 | Ultrahigh vacuum cleavage coating device and working method thereof |
| CN117096724A (en) * | 2023-10-20 | 2023-11-21 | 度亘核芯光电技术(苏州)有限公司 | Cavity surface cleaning and passivating method |
| CN117096724B (en) * | 2023-10-20 | 2024-02-06 | 度亘核芯光电技术(苏州)有限公司 | Cavity surface cleaning and passivating method |
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