CN208189587U - A kind of IC chip for BMS charge-discharge circuit and the BMS charge-discharge circuit based on the IC chip - Google Patents

A kind of IC chip for BMS charge-discharge circuit and the BMS charge-discharge circuit based on the IC chip Download PDF

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Publication number
CN208189587U
CN208189587U CN201820845724.XU CN201820845724U CN208189587U CN 208189587 U CN208189587 U CN 208189587U CN 201820845724 U CN201820845724 U CN 201820845724U CN 208189587 U CN208189587 U CN 208189587U
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pin
resistance
chip
connect
capacitor
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周脉强
徐星德
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Kaimei Semiconductor Suzhou Co ltd
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Wuxi Win Intelligent Technology Co Ltd
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Abstract

The utility model relates to BMS charge-discharge circuit technical fields, specially a kind of IC chip for BMS charge-discharge circuit, using ES0P-8 packing forms, chip exterior has 8 pins, enclosed inside has metal-oxide-semiconductor Q1 and Q2, diode D1 and D2, Q1 grid is as the first pin connecting pin, drain electrode is used as the 8th pin connecting pin, the anode of source electrode and D1 connect and as second pin connecting pins, the cathode of D1 is as the 7th pin connecting pin, the grid of Q2 is as third pin connecting pin, drain electrode is connect and as the 6th pin connecting pin with the anode of D1, the anode of source electrode and D2 connect and as the 4th pin connecting pins, the cathode of D2 is as the 5th pin connecting pin;2 diodes and 2 metal-oxide-semiconductors are integrated in same IC chip by this case, substitute 4 traditional discrete devices, are reduced discrete device in the PCB area occupied of application circuit, are conducive to the optimization and layout of application circuit.

Description

A kind of IC chip for BMS charge-discharge circuit and the BMS charge and discharge based on the IC chip Circuit
Technical field
The utility model relates to BMS charge-discharge circuit technical field, specially a kind of IC core for BMS charge-discharge circuit Piece and BMS charge-discharge circuit based on the IC chip.
Background technique
The general structure of existing BMS charge-discharge circuit is as shown in Figure 1, mostly use discrete device to constitute, especially metal-oxide-semiconductor Q1, metal-oxide-semiconductor Q2, diode D1, diode D2 are discrete device, and metal-oxide-semiconductor Q1, Q2 are all made of IRF3205, diode D1, D2 It is all made of 1N4007, this charge and discharge product for allowing for being eventually fabricated has the following characteristics that
1. being substantially all using discrete device, cause pcb board volume big;
2. the distribution capacity of product, inductive interferences are obvious, the Electro Magnetic Compatibility of product is influenced;
3. product job insecurity, failure rate are relatively high.
4. the area of single lithium battery protection board is greater than the size of single lithium battery, have no idea to be fixed on one with lithium battery It rises, causes PCB plate-making cabling more complicated.
Utility model content
For the problems of the prior art, the utility model provides a kind of IC chip for BMS charge-discharge circuit.
To realize the above technical purpose, the technical solution of the utility model is:
A kind of IC chip for BMS charge-discharge circuit, using ES0P-8 packing forms, chip exterior has first to draw Foot, second pin, third pin, the 4th pin, the 5th pin, the 6th pin, the 7th pin and the 8th pin, enclosed inside have Metal-oxide-semiconductor Q1, metal-oxide-semiconductor Q2, diode D1, diode D2, the metal-oxide-semiconductor Q1 grid is as the first pin connecting pin, and drain conduct 8th pin connecting pin, source electrode connect with the anode of diode D1 and as second pin connecting pin, the yin of the diode D1 Pole is as the 7th pin connecting pin, and as third pin connecting pin, drain electrode is connect the grid of metal-oxide-semiconductor Q2 with the anode of diode D1 And as the 6th pin connecting pin, source electrode connect with the anode of diode D2 and as the 4th pin connecting pin, the diode The cathode of D2 is as the 5th pin connecting pin.
A kind of BMS charge-discharge circuit, including IC chip 1, IC chip U2, resistance R1, resistance R2, resistance R3, resistance R4, electricity Hinder R5, resistance R6, resistance R7, resistance R8, resistance R9, resistance R10, resistance R11, resistance R12, capacitor C1, capacitor C2, capacitor C3, capacitor C4 and battery pack, the IC chip U1 use the IC chip for BMS charge-discharge circuit, BMS charge and discharge electricity Road is used for battery set charge/discharge, and the battery pack is made of the battery B1 of sequential series, battery B2 and battery B3, the battery Group includes positive terminal, negative terminals and common terminal;
The first pin of the IC chip U1 is connect with one end of one end of resistance R1 and resistance R2 respectively, second pin with One end of resistance R3 connects, and third pin is connect with the DOUT pin of IC chip U2, and the 4th pin is another with resistance R1 respectively End is connected with one end of resistance R4, the common terminal connection of the 5th pin and battery pack, the cathode of the 6th pin and battery pack The positive terminal of terminals connection, the 7th pin and battery pack connects, the 8th pin respectively with one end of resistance R5 and resistance One end of R6 connects;
The other end of the resistance R2 is connect with the COUT pin of IC chip U2;
The other end of the resistance R3 is connect with the DVN pin of IC chip U2;
The other end of the resistance R4 is connect with the CHSE pin of one end of capacitor C1 and IC chip U2 respectively;
The other end of the capacitor C1 is grounded;
The other end of the resistance R5 is connect with one end of the SENS pin of IC chip U2 and resistance R7 respectively;
The other end of the resistance R6 respectively with the other end of resistance R7, one end of resistance R8, one end of resistance R9, IC core The VSS pin of piece U2, one end of capacitor C2 connect and are grounded with one end of capacitor C3;
The other end of the resistance R8 is connect with the other end of the NTC pin of IC chip U2 and resistance R9 respectively;
The other end of the capacitor C2 is connect with one end of the VCC1 pin of IC chip U2 and resistance R10 respectively;
The other end of the capacitor C3 is connect with one end of the VCC2 pin of IC chip U2 and resistance R11 respectively
One end of the capacitor C4 is grounded, and the other end connects with one end of the VCC3 pin of IC chip U2 and resistance R12 respectively It connects;
The other end of the resistance R10 is connect with the anode of battery B1;
The other end of the resistance R11 is connect with the anode of battery B2;
The other end of the resistance R12 is connect with the anode of battery B3.
From the above, it can be seen that the utility model has following advantages:
The utility model uses chip composite package technology, is optimized by packaging technology, by 2 diodes and 2 metal-oxide-semiconductors It is integrated in same ESOP-8 encapsulation the inside, IC chip is formed, substitutes the deviding device of traditional 2 diodes and 2 metal-oxide-semiconductors Part, to reduce this four discrete devices in the area occupied of PCB, when this IC chip is applied to BMS charge-discharge circuit When, the volume of entire PCB can not only be effectively reduced, and advantageously reduce the line loss of entire electric power loop, optimization system The distribution capacity of system, inductive interferences, improve the Electro Magnetic Compatibility of system, and then improve the reliability of system, when making its work more Stablize, failure rate is lower.
Detailed description of the invention
Fig. 1 is the circuit diagram of the prior art;
Fig. 2 is the circuit diagram of the utility model;
Fig. 3 is the encapsulation schematic diagram of the utility model;
Fig. 4 is the circuit diagram that the utility model is applied in BMS charge-discharge circuit.
Specific embodiment
In conjunction with Fig. 2 to Fig. 4, a specific embodiment of the utility model is described in detail, but not to the power of the utility model Benefit requires to do any restriction.
As shown in Figures 2 and 3, a kind of IC chip for BMS charge-discharge circuit, using ES0P-8 packing forms, chip Outside has the first pin, second pin, third pin, the 4th pin, the 5th pin, the 6th pin, the 7th pin and the 8th Pin, enclosed inside have metal-oxide-semiconductor Q1, metal-oxide-semiconductor Q2, diode D1, diode D2, and the metal-oxide-semiconductor Q1 grid is as the first pin Connecting pin, drain electrode are used as the 8th pin connecting pin, and source electrode connect with the anode of diode D1 and as second pin connecting pin, institute The cathode of diode D1 is stated as the 7th pin connecting pin, the grid of metal-oxide-semiconductor Q2 is as third pin connecting pin, drain electrode and two poles The anode of pipe D1 connects and as the 6th pin connecting pin, and source electrode connect with the anode of diode D2 and connects as the 4th pin End, the cathode of the diode D2 is as the 5th pin connecting pin.
Wherein: metal-oxide-semiconductor Q1 is PMOS tube, and metal-oxide-semiconductor Q2 is NMOS tube.
The function of first pin is defined as: G1, the control electrode of metal-oxide-semiconductor Q1;
The function of second pin is defined as: DVN, voltage detection terminal;
The function of third pin is defined as: G2, the control terminal of metal-oxide-semiconductor Q1;
The function of 4th pin is defined as: VERF, feedback end;
The function of 5th pin is defined as: C-, the common end of battery pack;
The function of 6th pin is defined as: P-, the negative terminal of battery pack;
The function of 7th pin is defined as: P+, the anode of battery pack;
The function of 8th pin is defined as: SENS, current detecting end.
The utility model uses chip composite package technology, is optimized by packaging technology, by 2 diodes and 2 metal-oxide-semiconductors It is integrated in same ESOP-8 encapsulation the inside, IC chip is formed, substitutes 2 NMOS tube IRF3205 in existing scheme and 2 two Pole pipe 1N4007.
Said chip is substituted to the discrete device applications of traditional 2 diodes and 2 metal-oxide-semiconductors in specific application circuit (such as: BMS charge-discharge circuit) when, it can reduce this four discrete devices in the area occupied of application circuit PCB, and be conducive to whole The optimization and layout of a application circuit PCB.
Based on above-mentioned IC chip, design a kind of BMS charge-discharge circuit, as shown in figure 4, include IC chip U1, IC chip U2, Resistance R1, resistance R2, resistance R3, resistance R4, resistance R5, resistance R6, resistance R7, resistance R8, resistance R9, resistance R10, resistance R11, resistance R12, capacitor C1, capacitor C2, capacitor C3, capacitor C4 and battery pack, IC chip U1 are used and are described previously for BMS The IC chip of charge-discharge circuit, the battery management chip TH8003 of the preferred Texas Instrument's production of IC chip U2, the BMS charge and discharge electricity Road is used for battery set charge/discharge, and battery pack is made of the battery B1 of sequential series, battery B2 and battery B3, and battery pack includes just Pole terminals, negative terminals and common terminal;
The first pin of IC chip U1 is connect with one end of one end of resistance R1 and resistance R2 respectively, second pin and resistance One end of R3 connects, and third pin is connect with the DOUT pin of IC chip U2, the 4th pin respectively with the other end of resistance R1 and One end of resistance R4 connects, the common terminal C- connection of the 5th pin and battery pack, and the cathode of the 6th pin and battery pack connects The positive terminal P+ connection of line end P- connection, the 7th pin and battery pack, the 8th pin respectively with one end of resistance R5 and electricity Hinder one end connection of R6;
The other end of resistance R2 is connect with the COUT pin of IC chip U2;
The other end of resistance R3 is connect with the DVN pin of IC chip U2;
The other end of resistance R4 is connect with the CHSE pin of one end of capacitor C1 and IC chip U2 respectively;
The other end of capacitor C1 is grounded;
The other end of resistance R5 is connect with one end of the SENS pin of IC chip U2 and resistance R7 respectively;
The other end of resistance R6 respectively with the other end of resistance R7, one end of resistance R8, one end of resistance R9, IC chip U2 VSS pin, one end of capacitor C2, one end of capacitor C3, battery pack negative terminals P- connection and be grounded;
The other end of resistance R8 is connect with the other end of the NTC pin of IC chip U2 and resistance R9 respectively;
The other end of capacitor C2 is connect with one end of the VCC1 pin of IC chip U2 and resistance R10 respectively;
The other end of capacitor C3 is connect with one end of the VCC2 pin of IC chip U2 and resistance R11 respectively
One end of capacitor C4 is grounded, and the other end is connect with one end of the VCC3 pin of IC chip U2 and resistance R12 respectively;
The other end of resistance R10 is connect with the anode of battery B1;
The other end of resistance R11 is connect with the anode of battery B2;
The other end of resistance R12 is connect with the anode of battery B3.
In above-mentioned BMS charge-discharge circuit, the discrete of traditional 2 diodes and 2 metal-oxide-semiconductors is substituted using integrated chip U1 Device has the advantage that
1. the volume of entire PCB can effectively be reduced, convenient for fixing with battery;
2. can reduce the cabling complexity of entire PCB, and then advantageously reduce the line loss of entire electric power loop;
3. being conducive to optimize distribution capacity, the inductive interferences of charge-discharge system, the Electro Magnetic Compatibility of system is improved;
4. being conducive to improve the reliability of charge-discharge system, more stable when making its work, failure rate is lower.
In conclusion the utility model has the advantage that the utility model by packaging technology, by 2 diodes and 2 Metal-oxide-semiconductor is integrated in same ESOP-8 encapsulation the inside, forms IC chip, substitutes traditional 2 diodes and 2 metal-oxide-semiconductors Discrete device, to reduce the PCB area occupied of this four discrete devices, when this IC chip is applied to BMS charge and discharge When circuit, the volume of entire PCB can not only be effectively reduced, and advantageously reduce the line loss of entire electric power loop, it is excellent The distribution capacity of change system, inductive interferences improve the Electro Magnetic Compatibility of system, and then improve the reliability of system, make its work When it is more stable, failure rate is lower.
It is understood that being merely to illustrate the utility model above with respect to the specific descriptions of the utility model and not being It is limited to technical solution described in the utility model embodiment.Those skilled in the art should understand that still can be with It modifies to the utility model or equivalent replacement, to reach identical technical effect;Needs are used as long as meeting, all in this reality Within novel protection scope.

Claims (2)

1. a kind of IC chip for BMS charge-discharge circuit, it is characterised in that: use ES0P-8 packing forms, chip exterior tool There are the first pin, second pin, third pin, the 4th pin, the 5th pin, the 6th pin, the 7th pin and the 8th pin, it is interior Portion is packaged with metal-oxide-semiconductor Q1, metal-oxide-semiconductor Q2, diode D1, diode D2, the metal-oxide-semiconductor Q1 grid as the first pin connecting pin, Drain electrode is used as the 8th pin connecting pin, and source electrode connect with the anode of diode D1 and as second pin connecting pin, two pole The cathode of pipe D1 is as the 7th pin connecting pin, and the grid of metal-oxide-semiconductor Q2 is as third pin connecting pin, and drain electrode is with diode D1's Anode connects and as the 6th pin connecting pin, and source electrode connect with the anode of diode D2 and as the 4th pin connecting pin, institute The cathode of diode D2 is stated as the 5th pin connecting pin.
2. a kind of BMS charge-discharge circuit, it is characterised in that: including IC chip 1, IC chip U2, resistance R1, resistance R2, resistance R3, Resistance R4, resistance R5, resistance R6, resistance R7, resistance R8, resistance R9, resistance R10, resistance R11, resistance R12, capacitor C1, capacitor C2, capacitor C3, capacitor C4 and battery pack, the IC chip U1 is using as described in claim 1 for BMS charge-discharge circuit IC chip, BMS charge-discharge circuit are used for battery set charge/discharge, the battery pack by the battery B1 of sequential series, battery B2 and Battery B3 is constituted, and the battery pack includes positive terminal, negative terminals and common terminal;
The first pin of the IC chip U1 is connect with one end of one end of resistance R1 and resistance R2 respectively, second pin and resistance One end of R3 connects, and third pin is connect with the DOUT pin of IC chip U2, the 4th pin respectively with the other end of resistance R1 and One end of resistance R4 connects, and the common terminal of the 5th pin and battery pack connects, the negative terminal of the 6th pin and battery pack The positive terminal of end connection, the 7th pin and battery pack connects, the 8th pin respectively with one end of resistance R5 and resistance R6 One end connection;
The other end of the resistance R2 is connect with the COUT pin of IC chip U2;
The other end of the resistance R3 is connect with the DVN pin of IC chip U2;
The other end of the resistance R4 is connect with the CHSE pin of one end of capacitor C1 and IC chip U2 respectively;
The other end of the capacitor C1 is grounded;
The other end of the resistance R5 is connect with one end of the SENS pin of IC chip U2 and resistance R7 respectively;
The other end of the resistance R6 respectively with the other end of resistance R7, one end of resistance R8, one end of resistance R9, IC chip U2 VSS pin, capacitor C2 one end connect and be grounded with one end of capacitor C3;
The other end of the resistance R8 is connect with the other end of the NTC pin of IC chip U2 and resistance R9 respectively;
The other end of the capacitor C2 is connect with one end of the VCC1 pin of IC chip U2 and resistance R10 respectively;
The other end of the capacitor C3 is connect with one end of the VCC2 pin of IC chip U2 and resistance R11 respectively
One end of the capacitor C4 is grounded, and the other end is connect with one end of the VCC3 pin of IC chip U2 and resistance R12 respectively;
The other end of the resistance R10 is connect with the anode of battery B1;
The other end of the resistance R11 is connect with the anode of battery B2;
The other end of the resistance R12 is connect with the anode of battery B3.
CN201820845724.XU 2018-06-01 2018-06-01 A kind of IC chip for BMS charge-discharge circuit and the BMS charge-discharge circuit based on the IC chip Active CN208189587U (en)

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CN201820845724.XU CN208189587U (en) 2018-06-01 2018-06-01 A kind of IC chip for BMS charge-discharge circuit and the BMS charge-discharge circuit based on the IC chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820845724.XU CN208189587U (en) 2018-06-01 2018-06-01 A kind of IC chip for BMS charge-discharge circuit and the BMS charge-discharge circuit based on the IC chip

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CN208189587U true CN208189587U (en) 2018-12-04

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Effective date of registration: 20200604

Address after: 214421 Xiangyang Village, Huashi Town, Jiangyin, Wuxi, Jiangsu, 1-8

Patentee after: JIANGSU SUNWARD ELECTRONIC TECHNOLOGY Co.,Ltd.

Address before: 103, building 214000, block D, Information Technology Industrial Park, 21 Changjiang Road, new Wu District, Jiangsu, Wuxi

Patentee before: WUXI GONGYING INTELLIGENT TECHNOLOGY Co.,Ltd.

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Effective date of registration: 20240123

Address after: 215612 No.1 Huatai Road, Fenghuang Town, Zhangjiagang City, Suzhou City, Jiangsu Province

Patentee after: Kaimei Semiconductor (Suzhou) Co.,Ltd.

Country or region after: China

Address before: No. 1-8 Xiangyang Road, Xiangyang Village, Huashi Town, Jiangyin City, Wuxi City, Jiangsu Province, 214421

Patentee before: JIANGSU SUNWARD ELECTRONIC TECHNOLOGY CO.,LTD.

Country or region before: China