CN208187560U - A kind of human body infrared sensing device - Google Patents
A kind of human body infrared sensing device Download PDFInfo
- Publication number
- CN208187560U CN208187560U CN201720166603.8U CN201720166603U CN208187560U CN 208187560 U CN208187560 U CN 208187560U CN 201720166603 U CN201720166603 U CN 201720166603U CN 208187560 U CN208187560 U CN 208187560U
- Authority
- CN
- China
- Prior art keywords
- chip
- human body
- infrared
- voltage
- sensing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 230000005855 radiation Effects 0.000 claims abstract description 22
- 230000006698 induction Effects 0.000 claims abstract description 17
- 238000012545 processing Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000523 sample Substances 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 238000004891 communication Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 3
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052744 lithium Inorganic materials 0.000 claims description 3
- 229910001416 lithium ion Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 229920005591 polysilicon Polymers 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 238000009738 saturating Methods 0.000 claims 1
- 230000001934 delay Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 9
- 238000001914 filtration Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000005616 pyroelectricity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Geophysics And Detection Of Objects (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Human body infrared sensing device provided by the utility model, the infrared energy of human body is converted directly into the voltage signal continuously exported by the thermoelectric pile chip, the thermistor chip forms voltage division signal in circuit in circuit, signal processing is carried out to voltage signal and voltage division signal by induction module ontology again, whether there is the temperature difference as caused by infra-red radiation according to thermoelectric pile chip described in voltage signal and voltage division signal operation and thermistor chip, to judge surrounding space with the presence or absence of human body, avoid having used the delays time to control chip of flexibility ratio difference and in advance to the estimation of delay parameter, improve the accuracy and ease of use of human body sensing；Without light and shade field Fresnel lenses chopping device, the complexity of module is reduced, improves reliability.
Description
Technical field
The utility model relates to infrared detection technology field more particularly to a kind of human body infrared sensing devices.
Background technique
In traditional pyroelectric infrared human body induction module, it will usually realized using delays time to control chip lamps and lanterns, from
Dynamic door etc. is outer to be located at and continues working in certain continuous time.Due to people's activity need lighting hours in specific practical scene,
The uncertainty of automatically-controlled door opening time, running tap water time etc., and the delay parameter of delays time to control chip depends entirely on
The size of delay capacitor, therefore pyroelectric infrared human body induction module is difficult to adjustment delay parameter, was delayed after installation
It is long to be unfavorable for energy conservation and environmental protection and automatic control, be delayed it is too short and it is easy continually switch peripheral hardware, bring inconvenience to people's activity, again
Influence peripheral hardware working life.Meanwhile pyroelectric infrared human body induction module also needs to install the Fresnel lenses copped wave of light and shade field
Device generates " blind area " and " visual field " alternately changed, when someone walks out-of-date, human body before lens in front of sensor
The infra-red radiation of sending just can be received discontinuously by pyroelectricity element, so that its charge polarity be made constantly to convert, be exported
Pulse signal, so static or little movement range human infrared radiation signal cannot be detected.
Utility model content
Based on this, it is necessary to which the human body for providing a kind of human infrared radiation signal that can be static or little movement range is red
Outer sensing device.
A kind of human body infrared sensing device, comprising: power module, the induction module ontology for being electrically connected the power module
And thermal reactor type probe module, the thermal reactor type probe module include the infrared optics receiving unit and heat for receiving infra-red radiation
Heap infrared sensor, the thermal reactor infrared sensor include thermoelectric pile chip and the temperature-sensitive with thermoelectric pile chip electric connection
Resistance chip, in which:
Received infra-red radiation is formed hot spot and focused on the thermoelectric pile chip by the infrared optics receiving unit,
The thermoelectric pile chip forms the voltage signal continuously exported after receiving the hot spot, and the thermistor chip returns in circuit
Voltage division signal is formed in road；
The induction module ontology is according to the voltage signal and voltage division signal, thermoelectric pile chip described in operation and temperature-sensitive electricity
Whether resistance chip has the temperature difference as caused by infra-red radiation, to judge surrounding space with the presence or absence of human body.
In some preferred embodiment, the power module is the low-voltage DC or be that 220V alternating current is converted to
USB interface output low-voltage DC or be chargeable lithium ion or be lithium polymer battery output low-voltage DC or
Person is the low-voltage DC of several dry cells output.
In some preferred embodiment, the induction module ontology includes low-pass filter circuit, operation amplifier chip, signal
It handles chip, control chip, temperature and compensates for circuit, communication chip, Peripheral Interface and relay, the voltage signal is successively through institute
State connected by external interface after low-pass filter circuit, operation amplifier chip, signal processing chip and the control chip it is external
Equipment；The voltage division signal is successively after the temperature compensates for circuit, operation amplifier chip, signal processing chip and communication chip
External equipment is connected by external interface.
In some preferred embodiment, the optics receiving unit includes being arranged along the infra-red radiation light direction of propagation
Several Fresnel lenses and several condenser lenses.
In some preferred embodiment, the optics receiving unit further includes several planes or bi-curved reflection
Mirror, the reflecting mirror are used for the infrared radiating light line reflection to the Fresnel lens.
In some preferred embodiment, the thermal reactor type probe module further includes the anti-tampering component of thermal insulation, and the heat is absolutely
The anti-tampering component of edge includes the pipe sleeve for being set to the pin gasket and the fixed Fresnel lens and condenser lens of bottom end, described
Pin gasket is that perhaps the ceramic material pipe sleeve is metal or plastics or ceramic material, the casing surface plating to plastics
There are infrared optical absorption or reflecting material.
In some preferred embodiment, the thermal reactor infrared sensor further includes infrared fileter, through the infrared filtering
The filtered hot spot of piece focuses on the thermoelectric pile chip, and the infrared fileter is the silicon for being coated with infrared optics Coating Materials
The either infrared fileter of germanium or sapphire or quartz glass.
In some preferred embodiment, the thermoelectric pile chip is serially connected by thermocouple is constituted, the thermocouple
By several pairs of polysilicons and aluminium or Seebeck coefficient difference biggish half on several pieces of receiving planes on the silicon substrate with cavity
Made of conductor material, the hot end of the thermocouple is placed on the membrane structure of the silicon substrate cavity top, the thermoelectricity
Even cold end is placed on the thermally conductive side wall of silicon substrate.
In some preferred embodiment, the thermistor chip is made of the material of negative temperature resistance coefficient, the heat
Quick resistance chip is connect with package casing and/or pedestal with thermal conducting material, and the resistance value of the thermistor chip is in circuit
Branch pressure voltage value in the package casing temperature change and change.
The utility model by adopting the above technical scheme, the beneficial effect is that:
Human body infrared sensing device provided by the utility model, the thermoelectric pile chip are formed continuously after receiving the hot spot
The voltage signal of output, the thermistor chip form voltage division signal, the induction module ontology root in circuit in circuit
According to the voltage signal and voltage division signal, whether thermoelectric pile chip and thermistor chip described in operation have is caused by infra-red radiation
Temperature difference avoid the delays time to control chip for having used flexibility ratio difference and in advance to judge surrounding space with the presence or absence of human body
First to the estimation of delay parameter, the accuracy and ease of use of human body sensing are improved；It is cut without light and shade field Fresnel lenses
Wave apparatus reduces the complexity of module, improves reliability.
Detailed description of the invention
Fig. 1 is the schematic illustration of human body infrared sensing device provided by the embodiment of the utility model.
Fig. 2 is the structural schematic diagram for the thermal reactor type probe module that the utility model preferred embodiment provides.
Fig. 3 is the structural schematic diagram for the thermal reactor infrared sensor that the utility model preferred embodiment provides.
Fig. 4 is the working principle diagram for the human body infrared sensing device that the utility model preferred embodiment provides.
Fig. 5 is the circuit diagram that the utility model embodiment 1 provides.
Fig. 6 is the circuit diagram that the utility model embodiment 2 provides.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms
It realizes, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes to the utility model
The understanding of disclosure is more thorough and comprehensive.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
Referring to Fig. 1, being a kind of schematic illustration of human body infrared sensing device 100 provided by the utility model, comprising:
Power module 110, the induction module ontology 120 and thermal reactor type probe module 130 for being electrically connected the power module.In detailed below
The concrete scheme of all parts is said.
In some preferred embodiments, the power module is the low-voltage DC or be that 220V alternating current is converted to
USB interface output low-voltage DC or be chargeable lithium ion or be lithium polymer battery output low-voltage DC or
Person is the low-voltage DC of several dry cells output.
Please refer to figs. 2 and 3, the structural schematic diagram of the respectively described thermal reactor type probe module and thermal reactor infrared sensor,
The thermal reactor type probe module 130 includes the infrared optics receiving unit 131 and thermal reactor infrared sensing for receiving infra-red radiation
Device 132.The thermal reactor infrared sensor 132 includes thermoelectric pile chip 1321 and is electrically connected with the thermoelectric pile chip 1321
Thermistor chip 1322.
Specifically, received infra-red radiation is formed hot spot and focuses on the heat by the infrared optics receiving unit 131
On pile chip 1321, the thermoelectric pile chip 1321 forms the voltage signal continuously exported, the heat after receiving the hot spot
Quick resistance chip 1322 forms voltage division signal in circuit in circuit；The induction module ontology 120 is according to the voltage signal
And whether voltage division signal, thermoelectric pile chip 1321 and thermistor chip 1322 described in operation have the temperature as caused by infra-red radiation
Difference, to judge surrounding space with the presence or absence of human body.
Referring to Figure 4 together, the induction module ontology 120 includes low-pass filter circuit, operation amplifier chip, at signal
It manages chip, control chip, temperature and compensates for circuit temperature setoff circuit, communication chip, Peripheral Interface and relay, the voltage letter
Number successively connect after the low-pass filter circuit, operation amplifier chip, signal processing chip and the control chip by external
Mouth connection external equipment；The voltage division signal successively through the temperature compensate for circuit, operation amplifier chip, signal processing chip and
External equipment is connected by external interface after communication chip.
Referring again to Fig. 2, in some preferred embodiments, the optics receiving unit 131 includes along the infrared spoke
Penetrate several Fresnel lenses 1311 and several condenser lenses 1312 of the setting of the light direction of propagation.
Further, the optics receiving unit 131 can also include several planes or bi-curved reflecting mirror
1313, the reflecting mirror 1313 is used for the infrared radiating light line reflection to the Fresnel lens 1311.It can manage
Infrared radiating light, under the action of reflecting mirror 1313, can be reflexed to the Fresnel lens 1311 by solution as far as possible
On, improve detection efficient.
Referring again to Fig. 2, the thermal reactor type probe module 130 further includes the anti-tampering component 133 of thermal insulation, the thermal insulation
Anti-tampering component 133 includes the pipe sleeve for being set to the pin gasket 1331 and the fixed Fresnel lens and condenser lens of bottom end
1332, the pin gasket 1331 is that perhaps the ceramic material pipe sleeve 1332 is metal or plastics or ceramic material to plastics
Material, the casing surface are coated with infrared optical absorption or reflecting material.
Referring again to Fig. 3, the thermal reactor infrared sensor 132 further includes infrared fileter 1323, through the infrared filtering
The filtered hot spot of piece 1323 focuses on the thermoelectric pile chip 1321, and the infrared fileter 1323 is to be coated with infrared optics
The silicon or germanium or sapphire of Coating Materials or the infrared fileter of quartz glass.
It is appreciated that the infra-red radiation that infrared optics receiving unit 131 receives reflects or straight through the reflecting mirror 1313
It connects and shines Fresnel lens 1311 and/or focusing lens 1312 pool hot spot, carry out light by the infrared fileter 1323
Filtering processing is learned, the influence of environment light is reduced.
In some preferred embodiments, the thermoelectric pile chip 1321 is serially connected structure by thermocouple (not shown)
At, the thermocouple by several pieces of receiving planes on the silicon substrate with cavity several pairs of polysilicons and aluminium or Sai Beike system
Made of the biggish semiconductor material of number difference, the hot end of the thermocouple is placed on the membrane structure of the silicon substrate cavity top
On, the cold end of the thermocouple is placed on the thermally conductive side wall of silicon substrate.
It is appreciated that when the human body that shell temperature is t appears in the search coverage of the thermal reactor probe module 130,
It is λ=η t that wavelength, which can be given off,4Infrared energy, it is described thin when the hot spot focuses on the thermoelectric pile chip 1321
Membrane structure just absorbs infrared energy E0=hc/ λ just generates temperature to heat up Δ t between the cool and heat ends of the thermocouple
The positive and negative interpolar of poor Δ T, the thermocouple will generate thermo-electromotive force Vn, the positive and negative interpolar of the thermoelectric pile must arrive several
The sum of a thermo-electromotive force of thermocouple being together in series Vtotal=V1+V2+…+Vn, the sum of described thermo-electromotive force is continuously to export
Voltage signal.
In some preferred embodiments, the thermistor chip 1322 is made of the material of negative temperature resistance coefficient,
The thermistor chip is connect with package casing and/or pedestal with thermal conducting material, and the resistance value of the thermistor chip exists
Branch pressure voltage value in circuit changes with the temperature in the package casing and is changed.
It is appreciated that the voltage signal continuously exported, the temperature difference being proportional between thermoelectric pile chip hot and cold side；Cold end temperature
Degree is proportional to the determinand in absorbed infra-red radiation source with thermistor chip (i.e. ambient air temperature is consistent), hot-side temperature
Body surface temperature is respectively search coverage ambient temperature and people's shell temperature in the utility model preferred embodiment, that is, connects
Continuous voltage signal is proportional to the temperature difference between object under test surface and surrounding air.
Referring again to Fig. 4, it will be understood that in the voltage signal successively through the low-pass filter circuit, operation amplifier core
After piece, signal processing chip and the control chip and the voltage division signal successively compensates for circuit, operation amplifier through the temperature
After chip, signal processing chip and communication chip；The induction module ontology 120 according to the voltage signal and voltage division signal,
Whether thermoelectric pile chip 1321 and thermistor chip 1322 described in operation have the temperature difference as caused by infra-red radiation, to sentence
Disconnected surrounding space whether there is human body, then pass through the relay and/or communication chip and electrical peripheral hardware according to pre-set programs
Interface Controller external equipment.
Ambient air temperature changes only in a certain range will affect the thermoelectric pile chip voltage signal and the temperature-sensitive
Resistance chip voltage division signal, the big voltage signal variation that operation will not be caused to obtain, and by selecting the suitable induction mould
It is corresponding to be set as people's shell temperature by the circuit element parameter value of rear class control section in block body for the threshold value for triggering control action
The obtained big voltage signal of operation.
Human body infrared sensing device provided by the utility model, the thermoelectric pile chip 1321 are formed after receiving the hot spot
The voltage signal continuously exported, the thermistor chip 1322 form voltage division signal, the induction mould in circuit in circuit
Block body 120 according to the voltage signal and voltage division signal, thermoelectric pile chip described in operation and thermistor chip whether have by
Temperature difference caused by infra-red radiation, to judge that surrounding space with the presence or absence of human body, avoids the delay control for having used flexibility ratio difference
Coremaking piece and in advance to the estimation of delay parameter, improves the accuracy and ease of use of human body sensing；Without light and shade field
Fresnel lenses open up wave apparatus, reduce the complexity of module, improve reliability.
The following are specific embodiment parts:
Embodiment 1
First way such as Fig. 5 is powered using 5V DC power supply, and power adaptor interface can be with selection standard microUSB
Female mouth, to facilitate power supply；When there are when infrared radiation signal, the heat absorption of thermoelectric pile chip generates thermo-electromotive force in induction region, from
1,3 pins of Sensor export small voltage signal Vtotal, VtotalThrough R1 and C1, the RC circuit that R2 and C2 are constituted, primary filtration
After falling HF noise signal, common mode noise signal is removed using IC1 based filtration, while defeated after IC1 carries out operation amplifier
Voltage g out1*Vtotal, enlargement ratio g1 determines by R2/R1；The voltage division signal V of thermistorNTCIt is defeated from 2,4 pins of Sensor
Out, the RC circuit constituted through R7 and C5, after primary filtration falls HF noise signal, by IC2 to g1*VtotalAnd VNTCCarry out difference
Comparison operation, output voltage signal Δ V=g1*Vtotal-VNTC, reflect the temperature difference between measured target body surface and environment
Δ T=a* Δ V, thermoelectric voltage coefficient a are determined by the electronic parameter of Sensor and IC；By the electronics member for choosing suitable parameters
Part, enables Δ V driving triode Q1, thus the 1 of turn-on relay, 2 pins, relay 3,4 pins are disconnected, 4,5 pins
Closure then controls external equipment work；Or Δ V directly carries out operation by control chip IC 3 (not including in schematic diagram),
Judge whether the thermoelectric pile chip and thermistor chip have the temperature difference as caused by infra-red radiation, to be inferred to incude
It whether there is human body on the different directions of module surrounding space, then pass through the relay and/or communication according to pre-set programs
Chip IC 4 (not including in schematic diagram) and Peripheral Interface J1 (not including in schematic diagram) control external equipment work.Due to circuit
Continuous work, which generates accumulation of heat, will cause heating, joined the resistance R6 and thermal reactor of positive temperature resistor coefficient in the present embodiment
Thermistor chip composition temperature in infrared sensor compensates for circuit, after modular circuit heating, the branch pressure voltage of the two one
Increase, a reduction selects suitable parameter value, can cancel out each other in certain temperature range of drift, to enhance length
The stability of Time Continuous work.
Embodiment 2
First way such as Fig. 6, difference from Example 1 are relay using 12V DC power supply power supply, and power supply is suitable
Orchestration interface can be no longer superfluous here with selection standard 3.5mm power supply mother's mouth, to be suitable for the usage scenario of high-power external equipment
It states.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (9)
1. a kind of human body infrared sensing device characterized by comprising power module, the sense for being electrically connected the power module
Module body and thermal reactor type probe module are answered, the thermal reactor type probe module includes connecing for receiving the infrared optics of infra-red radiation
Receive component and thermal reactor infrared sensor, the thermal reactor infrared sensor includes thermoelectric pile chip and electrical with the thermoelectric pile chip
The thermistor chip of connection, in which:
Received infra-red radiation is formed hot spot and focused on the thermoelectric pile chip by the infrared optics receiving unit, described
Thermoelectric pile chip forms the voltage signal continuously exported after receiving the hot spot, and the thermistor chip is in circuit in circuit
Form voltage division signal；
The induction module ontology is according to the voltage signal and voltage division signal, thermoelectric pile chip and thermistor core described in operation
Whether piece has the temperature difference as caused by infra-red radiation, to judge surrounding space with the presence or absence of human body.
2. human body infrared sensing device according to claim 1, which is characterized in that the power module turns for 220V alternating current
The low-voltage DC got in return or for USB interface output low-voltage DC or be chargeable lithium ion or be lithium polymerization
The low-voltage DC of object battery output or the low-voltage DC exported for several dry cells.
3. human body infrared sensing device according to claim 1, which is characterized in that the induction module ontology includes low pass
Filter circuit, operation amplifier chip, signal processing chip, control chip, temperature compensate for circuit, communication chip, Peripheral Interface and
Relay, the voltage signal is successively through the low-pass filter circuit, operation amplifier chip, signal processing chip and the control
External equipment is connected by external interface after chip；The voltage division signal successively compensates for circuit, operation amplifier core through the temperature
External equipment is connected by external interface after piece, signal processing chip and communication chip.
4. human body infrared sensing device according to claim 1, which is characterized in that the optics receiving unit includes along institute
State several Fresnel lenses and several condenser lenses of the setting of the infra-red radiation light direction of propagation.
5. human body infrared sensing device according to claim 4, which is characterized in that if the optics receiving unit further includes
Dry plane or bi-curved reflecting mirror, the reflecting mirror is used for the infrared radiating light line reflection is saturating to the Fresnel
On mirror.
6. human body infrared sensing device according to claim 4, which is characterized in that the thermal reactor type probe module further includes
The anti-tampering component of thermal insulation, the anti-tampering component of thermal insulation include the pin gasket and the fixed Fresnel for being set to bottom end
The pipe sleeve of lens and condenser lens, the pin gasket be plastics perhaps the ceramic material pipe sleeve be metal or plastics or
Person's ceramic material, the casing surface are coated with infrared optical absorption or reflecting material.
7. human body infrared sensing device according to claim 1, which is characterized in that the thermal reactor infrared sensor further includes
Infrared fileter focuses on the thermoelectric pile chip, the infrared fileter through the filtered hot spot of the infrared fileter
To be coated with the silicon of infrared optics Coating Materials or the infrared fileter of germanium or sapphire or quartz glass.
8. human body infrared sensing device according to claim 7, which is characterized in that the thermoelectric pile chip is by thermocouple phase
Mutually be together in series composition, and the thermocouple is by several pairs of polysilicons and aluminium on several pieces of receiving planes on the silicon substrate with cavity
Or made of the biggish semiconductor material of Seebeck coefficient difference, the hot end of the thermocouple is placed on silicon substrate cavity top
On the membrane structure in portion, the cold end of the thermocouple is placed on the thermally conductive side wall of silicon substrate.
9. human body infrared sensing device according to claim 8, which is characterized in that the thermistor chip is by negative temperature
The material of resistance coefficient is made, and the thermistor chip is connect with package casing and/or pedestal with thermal conducting material, the temperature-sensitive
The branch pressure voltage value of the resistance value of resistance chip in circuit changes with the temperature in the package casing and is changed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720166603.8U CN208187560U (en) | 2017-02-23 | 2017-02-23 | A kind of human body infrared sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720166603.8U CN208187560U (en) | 2017-02-23 | 2017-02-23 | A kind of human body infrared sensing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208187560U true CN208187560U (en) | 2018-12-04 |
Family
ID=64441708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720166603.8U Withdrawn - After Issue CN208187560U (en) | 2017-02-23 | 2017-02-23 | A kind of human body infrared sensing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208187560U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106872051A (en) * | 2017-02-23 | 2017-06-20 | 深圳市美思先端电子有限公司 | A kind of human body infrared induction installation |
-
2017
- 2017-02-23 CN CN201720166603.8U patent/CN208187560U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106872051A (en) * | 2017-02-23 | 2017-06-20 | 深圳市美思先端电子有限公司 | A kind of human body infrared induction installation |
| CN106872051B (en) * | 2017-02-23 | 2023-12-19 | 深圳市美思先端电子有限公司 | Human body infrared induction device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106872051B (en) | Human body infrared induction device | |
| CN202975737U (en) | Smart home voice housekeeper robot | |
| US20210058028A1 (en) | Solar photovoltaic module remote access module switch and real-time temperature monitoring | |
| US20180342978A1 (en) | Method and apparatus for a solar panel | |
| CN101866020B (en) | Intelligent detection method for detecting dynamic and static human body | |
| US4716511A (en) | Surge current-limiting circuit | |
| CN208187560U (en) | A kind of human body infrared sensing device | |
| CN204457114U (en) | A kind ofly be convenient to the power distribution cabinet finding keyhole | |
| CN102413613A (en) | Electricity-saving control device method and method for human body detection based on capacitance effect | |
| CN206166816U (en) | Intelligent closestool controller | |
| US10122320B2 (en) | Solar panel personality engine | |
| US20180083452A1 (en) | Solar panel commercial applications | |
| Saha et al. | Design of MPPT mounted solar based double coil DC electric cooker with smart temperature control device | |
| CN201401756Y (en) | Full-automatic infrared inductive lamp holder | |
| CN204226246U (en) | A kind of indoor ceiling fan of recloser | |
| CN207706497U (en) | City bus station lighting system | |
| CN206478729U (en) | Heating installation and heating system | |
| CN208491554U (en) | The pillow of automatic controlled height | |
| CN210840138U (en) | Wireless control infrared induction energy-saving lamp based on arduino single-chip microcomputer | |
| Muhammad et al. | DESIGN AND IMPLEMENTATION OF AUTOMATIC LIGHT CONTROL WITH BIDIRECTIONAL COUNTING SENSOR | |
| CN204944535U (en) | The infrared thermal release electric of pole low energy consumption, humiture, light sensor integrative sensor | |
| CN207382650U (en) | On-load tap changers of transformers controller | |
| CN206712766U (en) | A kind of diffusing reflection power switch of light | |
| CN203907741U (en) | Illuminable and portable LED warmer | |
| CN110400990B (en) | Battery temperature control method and battery temperature control circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20181204 Effective date of abandoning: 20231219 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20181204 Effective date of abandoning: 20231219 |