CN208158722U

CN208158722U - Optical system

Info

Publication number: CN208158722U
Application number: CN201820676195.5U
Authority: CN
Inventors: 陈树山; 游证凯; 胡朝彰
Original assignee: TDK Taiwan Corp
Current assignee: TDK Taiwan Corp
Priority date: 2017-06-13
Filing date: 2018-05-07
Publication date: 2018-11-27
Anticipated expiration: 2028-05-07
Also published as: CN109089020A; CN208752322U; CN109089020B

Abstract

The disclosure provides a kind of optical system, includes a fixed part, a movable part, a driving coil, a circuit loop and a magnetic element.Fixed part includes a pedestal and a circuit board, and movable part includes an optical element load-bearing part, is configured to carry an optical element.The magnetic element is the corresponding driving coil, and configuration drives the optical element load-bearing part mobile relative to the pedestal to generate an electromagnetic driving force.The driving coil and the circuit loop are integrally formed on the circuit board, and when observing along the direction of the optical axis perpendicular to the optical element, which partly overlaps with the circuit loop.

Description

Optical system

Technical field

It is the utility model relates to a kind of optical system, in particular to a kind of with the circuit board integrally formed with plate coil Optical system.

Background technique

With the development of science and technology, many electronic devices (such as smart phone or tablet computer) all have photograph or record now The function of shadow.By the photographing module being set on electronic device, it is all kinds of to capture that user can operate electronic device Photo.

The development trend of the electronic device with camera function is constantly advanced towards the direction of ultrathin now.It is general next It says, is made of in photographing module the elements such as camera lens load-bearing part, multiple magnet, multiple coils and circuit board or component, and And these elements or component are the settings that overlies one another along the same direction, such as are stacked along the optical axis direction of camera lens.However, Such stack manner will increase the whole height of photographing module so that in order to micromation purpose and need to reduce electronic device Thickness when, the height of photographing module can not be further reduced.

Therefore, how can be reduced the thickness of photographing module to achieve the purpose that micromation, be worth discussion now and solution Project certainly.

Summary of the invention

In view of this, the disclosure proposes a kind of optical system, to solve the above problem.

Embodiment of the disclosure discloses a kind of optical system, includes a fixed part, a movable part, a driving coil, one Circuit loop and a magnetic element.Fixed part includes a pedestal and a circuit board, and movable part includes that an optical element is held Holder is configured to carry an optical element.The magnetic element corresponds to the driving coil, and configuration is driven with generating an electromagnetic driving force The optical element load-bearing part is mobile relative to the pedestal.Wherein, the driving coil and the circuit loop are integrally formed in the circuit On plate, and along the direction of the optical axis perpendicular to the optical element observe when, the driving coil and the circuit loop part weight It is folded.

In some embodiments, when watching along the optical axis direction, the route of the circuit loop is not weighed with the driving coil It is folded.

In some embodiments, the thickness of the circuit board be slightly less than or equal to the driving coil thickness.

In some embodiments, which includes multiple wire winding layers, and a part of those wire winding layers is contained in In the circuit loop.

In some embodiments, which also includes a position sensor, is set on the circuit board, and by vertical When the direction of the optical axis is observed, which partly overlaps with the driving coil.

In some embodiments, which includes an accommodation groove, is configured to accommodate the position sensor and the driving coil.

In some embodiments, which includes a barricade, is set to the accommodation groove and is located at the position sensor and is somebody's turn to do Between driving coil.

In some embodiments, which also includes a metal fitting, is held with limiting the optical element Holder is in an extreme position.

In conclusion the disclosure provides a kind of optical system, it include a circuit loop, a circuit board and plate coil. Wherein, plate coil and circuit loop are to be integrally formed in circuit board, therefore can reduce plate coil and circuit board in Z axis The whole height in direction, and then optical system is reduced in the height in Z-direction, to achieve the purpose that micromation.

In addition, in certain embodiments, a part of the wire winding layer of plate coil is contained in circuit loop.Imply that electricity Circuit loop in the plate of road is the region shared in plate coil with the part wire winding layer of plate coil, therefore can reduce circuit Plate further makes optical system achieve the purpose that micromation in the length of X-direction and Y direction.

Middle disclosure will be explained below in additional features and benefits in the disclosure, and part can be by aftermentioned specification It has a clear understanding of, or can be learnt by disclosed principle via practice.The features and benefits of the disclosure can be wanted by aftermentioned right The combination of specifically noted instrument or device in asking and realize and obtain.These and other features of the disclosure can be by aftermentioned Specification and claim and become more apparent upon or can be learnt as the principle disclosed in the disclosure via practice.

Detailed description of the invention

Fig. 1 is the schematic diagram of an optical system of one embodiment of the disclosure.

Fig. 2 is the element exploded view of the optical system of one embodiment of the disclosure.

Fig. 3 shows the cross-sectional view of the A-A ' line segment along Fig. 1.

Fig. 4 is the cross-sectional view for showing the B-B ' line segment along embodiment of the present disclosure Fig. 1.

Fig. 5 is the diagrammatic cross-section according to the pedestal of another embodiment of the disclosure, circuit board and plate coil.

Fig. 6 is the diagrammatic cross-section according to the pedestal of another embodiment of the disclosure, circuit board and plate coil.

Fig. 7 is the diagrammatic cross-section according to an optical system of another embodiment of the disclosure.

Description of symbols：

100,100A optical system

102 shells

1021 opening in shell

1023 accommodating spaces

104 frames

1041 grooves

1043 central openings

1045 protrusions

106 upper reed plates

108 optical element load-bearing parts

1081 through holes

110 lower reeds

112 pedestals

1121 holes on base

1123 accommodation grooves

1125 barricades

114,114A circuit board

1141 circuit loops

1143 electrical contacts

116 second elastic elements

118 position sensors

120 metal fittings

DCL plate coil

L1~L8 wire winding layer

The first magnetic element of MEG1

The second magnetic element of MEG2

O optical axis

T1, T2 thickness

Specific embodiment

In order to which purpose, feature and the advantage of the disclosure can be clearer and more comprehensible, special embodiment below, and appended by cooperation Diagram elaborates.Wherein, each element in embodiment is configured to purposes of discussion, not to limit the disclosure.And it is real The part for applying drawing reference numeral in example repeats, and is the relevance being not meant as between different embodiments to simplify the explanation.Following reality The direction term being previously mentioned in example is applied, such as：Upper and lower, left and right, front or rear etc. are only the directions with reference to attached drawings.Therefore, The direction term used is intended to be illustrative and not intended to limit the disclosure.

In addition, the term of relativity, such as " lower " or " bottom " and " higher " or " top " may be used in embodiment, To describe relativeness of the element for another element of diagram.It is appreciated that, if the device overturning of diagram made It turns upside down, then the element described in " lower " side will be as the element in " higher " side.

Here, the term of " about ", " about " is generally represented within the 20% of a given value or range, preferably 10% it It is interior, and within preferably 5%.Given quantity is quantity about herein, implies that in the case where no certain illustrated, still may be used The meaning of implicit " about ", " about ".

Fig. 1 to Fig. 3 is please referred to, Fig. 1 is the schematic diagram of an optical system 100 of one embodiment of the disclosure, and Fig. 2 is the disclosure The element exploded view of one optical system 100 of one embodiment, and Fig. 3 shows the cross-sectional view of the A-A ' line segment along Fig. 1.Optical system 100 can be the camera system with an optical drive component, to carry an optical element (a such as camera lens, non-table in figure Show), and optical system 100 is to be mountable to various electronic devices or portable electronic device (such as smart phone or lithographic plate electricity Brain), the function of image capture is executed for user.In this embodiment, the optical drive component can be to have auto-focusing (AF) voice coil motor (VCM) of function, but not limited to this.In some embodiments, the optical drive component of optical system 100 is also Can have auto-focusing (Auto Focusing, AF) and optical anti-shake (Optical Image Stabilization, OIS) Function.

With continued reference to FIG. 2, Fig. 2 shows the exploded view of the optical system 100 of the embodiment of the present disclosure.Wherein, optical system System 100 includes a shell 102, a frame 104, a upper reed plate 106, an optical element load-bearing part 108, one first magnetic element MEG1, four the second magnetic element MEG2, once reed 110, a pedestal 112, a circuit board 114.Wherein, pedestal 112 be can Shell 102 is fixedly connected to be defined as a fixed part, connection type can be the modes such as riveting, engaging or welding, but It is without being limited thereto, it is fallen in the scope of the present disclosure as long as pedestal 112 can be made to be fixedly connected to shell 102.Wherein, described solid Determining portion can be in other embodiments comprising other elements, such as circuit board 114.Furthermore optical element load-bearing part 108 and frame 104 may be defined as a movable part, mobile relative to the fixed part.

Aforementioned shell 102 has a hollow structure, and is formed with an opening in shell 1021 thereon, is formed on pedestal 112 There is a holes on base 1121, the center of opening in shell 1021 corresponds to the optics member that optical element load-bearing part 108 is carried The optical axis O of part (not shown), and holes on base 1121 corresponds to be arranged in the Image Sensor below pedestal 112 (not shown).Shell 102 can have an accommodating space 1023, to accommodate aforesaid frame 104, upper reed plate 106, optics member Part load-bearing part 108, the first magnetic element MEG1, those the second magnetic element MEG2 and lower reed 110.In addition, shell 102 is also Circuit board 114 and pedestal 112 can be accommodated.Furthermore the first magnetic element MEG1 and being somebody's turn to do corresponding to the first magnetic element MEG1 A little second magnetic element MEG2 may be defined as optical drive component above-mentioned, is electrically connected at circuit board 114 and can drive optics Element load-bearing part 108 is moved relative to pedestal 112 along the direction optical axis O.

As shown in Fig. 2, optical element load-bearing part 108 has a hollow annular structure, and there is pass through aperture 1081, It is configured with corresponding sealed screwed tooth structure (not shown) between middle through hole 1081 and the optical element, the optics member can be enabled Part is locked in through hole 1081.In this embodiment, the first magnetic element MEG1 is to surround to be set to optical element load-bearing part On 108.In addition, frame 104 has multiple grooves 1041 and a central opening 1043.In this embodiment, frame 104 has Four grooves 1041, to accommodate aforementioned four the second magnetic element MEG2, but groove 1041 and the second magnetic element MEG2 Quantity embodiment without being limited thereto.In this embodiment, the shape of the second magnetic element MEG2 can be strip, but not limited to this, Such as there can be different shapes in other embodiments.

Optical element load-bearing part 108 and aforementioned optical element are to be set in central opening 1043 and can be relative to frame 104 is mobile.More specifically, as shown in figure 3, optical element load-bearing part 108 is can be connected by upper reed plate 106 and lower reed 110 It is connected to frame 104 and is suspended in central opening 1043.When the first magnetic element MEG1 is powered, four the second magnetic elements MEG2 can generate electromagnetic driving force (electromagnetic force) with the first magnetic element MEG1, drive optics member whereby Part load-bearing part 108 is mobile along optical axis O (Z-direction) relative to frame 104 and pedestal 112, to carry out auto-focusing (Auto Focusing).It in certain embodiments, may include at least one multipole magnet in aforementioned second magnetic element MEG2 (multipole magnet), to be incuded with corresponding first magnetic element MEG1 and drive optical element load-bearing part 108 move along the direction optical axis O to focus.

It is to be understood that upper reed plate 106 and lower reed 110 may respectively be one first elastic element.In this embodiment, on Reed 106 can be two reeds of separation, and lower reed 110 can then be one of the forming, but not limited to this.For example, upper spring Piece 106 can also be one of the forming in other embodiments.

As shown in Fig. 2, circuit board 114 is to be set on pedestal 112, and in this embodiment, circuit board 114 can be soft for one Property circuit board (Flexible Printed Circuit, FPC), but not limited to this.Furthermore optical system 100 is also comprising an electricity Road circuit 1141 and four plate coil DCL, are set to circuit board 114.In this embodiment, plate coil DCL is can to make For a driving coil, and circuit loop 1141 and four plate coil DCL be integrally formed in it is on circuit board 114 or interior.In In this embodiment, circuit loop 1141 is the conducting wire on circuit board 114, is configured to be electrically connected plate coil DCL and at least one Electrical contact 1143.As shown in Fig. 2, circuit board 114 has multiple electrical contacts 1143, configure to connect electronic device above-mentioned Main circuit board (not shown).It is worth noting that, four plate coil DCL are to correspond respectively to those the second magnetic members Part MEG2 setting.

In addition, as shown in Fig. 2, optical system 100 additionally comprises four the second elastic elements 116, wherein each second bullet Property element 116 all there is string configuration, for example, a column or linear structure, but not limited to this.Wherein, each second bullet Property element 116 one end be connection upper reed plate 106, and the other end of the second elastic element 116 is to be connected to circuit board 114. It is configured by aforementioned structure, optical element load-bearing part 108 and its optical element (not shown) carried can lead to frame 104 It crosses four the second elastic elements 116 of deflection and is moved relative to pedestal 112 along the direction of X-Y plane.

It, can be with the corresponding second magnetic member when the plate coil DCL in circuit board 114 is powered in this embodiment Part MEG2 induction generates electromagnetic driving force, drives optical element load-bearing part 108,104 edge of the optical element and frame whereby X-Y plane it is mobile.Therefore, if optical element load-bearing part 108 can be driven by aforementioned electromagnetic when optical system 100 is shaken Power drives in moving on X-Y plane, and it is anti-to reach optics whereby for movement when being shaken with compensation optical system 100 Hand shakes the purpose of (Optical Image Stabilization).In addition, optical system 100 also may include having at least one position Sensor 118 is set, is configured to sense displacement of the optical element load-bearing part 108 relative to pedestal 112.In this embodiment, optics System 100 may include two position sensors 118, configure to sense optical element load-bearing part 108 respectively relative to pedestal 112 Along X-axis and along the displacement of Y-axis.It should be noted that the quantity embodiment without being limited thereto of position sensor 118.

It please also refer to Fig. 2 to Fig. 4, Fig. 4 indicates the cross-sectional view of the B-B ' line segment along embodiment of the present disclosure Fig. 1.In order to clear Chu indicates, only indicates pedestal 112, circuit board 114, plate coil DCL and position sensor 118 in Fig. 4.Such as Fig. 2 and Fig. 4 institute Show, a part of plate coil DCL is the ontology that circuit board 114 is protruded from along-Z-direction, and pedestal 112 also may include Four accommodation grooves 1123 are configured to accommodate corresponding plate coil DCL and position sensor 118.

It is worth noting that, as shown in figure 4, (such as along Y-axis side when along direction observation perpendicular to optical axis O To), plate coil DCL (driving coil) is to partly overlap with circuit loop 1141, and position sensor 118 is and plate line Enclose a part overlapping of DCL.For example, as shown in figure 4, plate coil DCL includes 8 wire winding layer L1~L8, when along Y When axis direction is observed, wire winding layer L1 is Chong Die with circuit loop 1141 with L2, and wire winding layer L3~L8 and circuit loop 1141 are not Overlapping.In addition, position sensor 118 is Chong Die with wire winding layer L3~L5, and not be overlapped with L6~L8 with wire winding layer L1, L2.

On the other hand, when the direction viewing along optical axis O, circuit loop 1141 and plate coil DCL be not be overlapped.Meaning That is, circuit loop 1141 is formed at the areas outside of plate coil DCL.In this way be design configurations, plate coil DCL It can provide biggish electromagnetic driving force with corresponding second magnetic element MEG2.

Furthermore as shown in figure 4, there is circuit board 114 a thickness T1, plate coil DCL to have a thickness in this embodiment T2 is spent, and the thickness T1 of circuit board 114 is less than the thickness T2 of plate coil DCL.However, in other embodiments, plate The thickness T2 of coil DCL also can be equal to the thickness T1 of circuit board 114, be can be according to actual demand depending on.

In addition, plate line can be reduced since plate coil DCL is the design being integrally formed in circuit board 114 DCL and circuit board 114 are enclosed in the whole height of Z-direction, and then reduces optical system 100 in the height in Z-direction, to reach To the purpose of micromation.

Referring to FIG. 5, Fig. 5 is the pedestal 112, circuit board 114A and plate coil according to another embodiment of the disclosure The diagrammatic cross-section of DCL.This embodiment is similar to the embodiment of Fig. 4, and difference is one of the wire winding layer of plate coil DCL Divide and is contained in circuit loop 1141.As shown in figure 5, the wire winding layer L1 and L2 of plate coil DCL are contained within circuit loop 1141 routes that are interior and being electrically connected at circuit loop 1141.

Since the circuit loop 1141 in circuit board 114 is to share plate line with the wire winding layer L1 and L2 of plate coil DCL The region (in the region between two dotted lines in Fig. 5) in DCL is enclosed, therefore the configuration of such structure can reduce circuit board 114 in the length of X-direction and Y direction, and optical system 100 is further made to achieve the purpose that micromation.

In addition, referring to FIG. 6, Fig. 6 is the pedestal 112, circuit board 114A and plate according to another embodiment of the disclosure The diagrammatic cross-section of coil DCL.This embodiment is similar to the embodiment of Fig. 5, and it may include a barricade that difference, which is pedestal 112 also, 1125, it is set in accommodation groove 1123 and between position sensor 118 and plate coil DCL.

Referring to FIG. 7, Fig. 7 is the diagrammatic cross-section according to an optical system 100A of another embodiment of the disclosure.Such as Fig. 7 Shown, optical system 100A also may include two metal fittings 120, be set to the two sides of optical element load-bearing part 108.Specifically For, metal fitting 120 is to be formed in optical element load-bearing part in a manner of injection molding in mould (inset molding) On 108.When optical element load-bearing part 108 is moved by electromagnetic driving force along Z-direction, metal fitting 120 can limit light Learn element load-bearing part 108 in an extreme position, such as with the protrusion 1045 of frame 104 or with the second magnetic element MEG2 phase It mutually abuts and limits optical element load-bearing part 108 in a upper limit position or a lower limit position, to avoid optical element carrying Other elements in part 108 and optical system 100A are collided and are damaged.

Since metal fitting 120 is made of metal material, metal fitting 120 compared to plastic cement can have compared with High intensity, and optical element load-bearing part 108 can also be further decreased along the height of Z-direction, make optical system 100A achievees the purpose that micromation.

In conclusion the disclosure provides a kind of optical system, comprising a circuit loop 1141, a circuit board 114 and put down Board coil DCL.Wherein, plate coil DCL and circuit loop 1141 are to be integrally formed in circuit board 114, therefore can reduce Plate coil DCL and circuit board 114 and then reduce optical system 100 in the height in Z-direction in the whole height of Z-direction Degree, to achieve the purpose that micromation.

In addition, in certain embodiments, a part of the wire winding layer of plate coil DCL is contained within circuit loop 1141 It is interior.Imply that the circuit loop 1141 in circuit board 114 is shared in plate coil DCL with the part wire winding layer of plate coil DCL Region, therefore circuit board 114 can be reduced in the length of X-direction and Y direction, further reach optical system 100 The purpose of micromation.

Although embodiment of the disclosure and its advantage have been disclosed as above, it will be appreciated that any technical field Middle technical staff is not departing from spirit and scope of the present disclosure, when can change, substitute with retouching.In addition, the guarantor of the disclosure Shield range be not necessarily limited by technique in specification in the specific embodiment, machine, manufacture, material composition, device, method and Step, technical staff can understand existing or following the developed work from disclosure disclosure in any technical field Skill, machine, manufacture, material composition, device, method and step, as long as can implement in the embodiment here more or less the same Function or the more or less the same result of acquisition can all be used according to the disclosure.Therefore, the protection scope of the disclosure includes above-mentioned technique, machine Device, manufacture, material composition, device, method and step.In addition, the other embodiment of each claim composition, and the disclosure Protection scope also includes the combination of each claim and embodiment.

Claims

1. a kind of optical system, which is characterized in that include：

One fixed part includes a pedestal and a circuit board；

One movable part includes an optical element load-bearing part, configures to carry an optical element；

One driving coil；

One circuit loop；And

One magnetic element, the corresponding driving coil, configuration drive the optical element load-bearing part opposite to generate an electromagnetic driving force It is mobile in the pedestal；

Wherein the driving coil and the circuit loop are integrally formed on the circuit board, and along one perpendicular to the optical element When the direction observation of optical axis, which partly overlaps with the circuit loop.

2. optical system as described in claim 1, which is characterized in that when being watched along the optical axis direction, the circuit loop Route and the driving coil be not be overlapped.

3. optical system as described in claim 1, which is characterized in that the thickness of the circuit board is slightly less than or is equal to the driving line The thickness of circle.

4. optical system as described in claim 1, which is characterized in that the driving coil includes multiple wire winding layers, and those A part of wire winding layer is contained in the circuit loop.

5. optical system as described in claim 1, which is characterized in that the optical system also includes a position sensor, setting In on the circuit board, and when by direction observation perpendicular to the optical axis, which partly overlaps with the driving coil.

6. optical system as claimed in claim 5, which is characterized in that the pedestal includes an accommodation groove, is configured to accommodate the position Set sensor and the driving coil.

7. optical system as claimed in claim 6, which is characterized in that the pedestal include a barricade, be set to the accommodation groove and Between the position sensor and the driving coil.

8. optical system as described in claim 1, which is characterized in that the optical element load-bearing part also includes that a metal abuts Part, to limit the optical element load-bearing part in an extreme position.