CN208143329U - A kind of image collecting device and image capturing system - Google Patents
A kind of image collecting device and image capturing system Download PDFInfo
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- CN208143329U CN208143329U CN201820281729.4U CN201820281729U CN208143329U CN 208143329 U CN208143329 U CN 208143329U CN 201820281729 U CN201820281729 U CN 201820281729U CN 208143329 U CN208143329 U CN 208143329U
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Abstract
A kind of image collecting device and image capturing system provided by the utility model, wherein described image acquisition device include：Mainboard and power panel, the mainboard are electrically connected with the power panel；Mainboard includes Sensor interface circuit unit, FPGA module and the FX3 module being sequentially connected；Sensor interface circuit unit is electrically connected with power panel, for being electrically connected with camera or the foundation of image sensor chip；FPGA module is for acquisition camera or the image of image sensor chip, and handles the described image of acquisition；FX3 module is connected with power panel, and the image transmitting for acquiring FPGA to external equipment carries out image quality detection.By the way that the Sensor interface circuit unit, FPGA module and the FX3 module that are sequentially connected are arranged in mainboard, so that the data transmission and processing of image collecting device is very fast, data write rate also gets a promotion, and then improves the production efficiency of image collecting device.
Description
Technical field
The utility model relates to technical field of image processing, adopt more particularly, to a kind of image collecting device and image
Collecting system.
Background technique
With the application of camera and the scientific and technological progress of image procossing related fields, people get over the application scenarios of image
Come it is more extensive, for example, day photographs, shooting, safety monitoring, bio-identification, automobile video, mobile video in photographs, water
Etc., field relevant to camera and image procossing just rapidly enters people's lives, especially in the at full speed of smart phone
Development, mobile phone camera develop to ten million pixel from 100,000 pixels of early stage, and the requirement to image procossing is also higher and higher.
Existing image collecting device includes：Shell and fixed imaging sensor, image acquisition board, mainboard inside the shell
And power panel；Imaging sensor is fixed on case surface, and pin, which is worn from case surface to interior of shell and image acquisition board, to be connected
It connects；Image acquisition board is connect with mainboard signal, and mainboard is connect with power supply partitioned signal.
But existing image acquisition device to image quality be not able to satisfy people increasingly to image quality
It is required that.In order to guarantee better effect of the camera before use, it usually needs be acquired to the image of camera to determine to be
The no image quality standard for meeting camera.People are to compact-sized, acquisition the image sharpness of image collecting device, transmission
Rate, current precision, open short-circuit accuracy detection requirement it is more stringent；At the later period of the image quality of high-pixel camera simultaneously
Reason becomes epochmaking evaluation index, i.e., OTP burning is carried out to the image quality in camera later period promoted camera quality at
For necessary condition, in the case where this high performance-price ratio requires, this has become the common problem that camera relevant industries face.
Utility model content
For the above technical issues, the utility model provides a kind of image collecting device and image capturing system.
In a first aspect, the utility model provides a kind of image collecting device, including：Mainboard and power panel, the mainboard with
The power panel electrical connection；The mainboard includes Sensor interface circuit unit, FPGA module and the FX3 module being sequentially connected；
The Sensor interface circuit unit is electrically connected with the power panel, for being electrically connected with camera or the foundation of image sensor chip
It connects；The FPGA module is carried out for acquisition camera or the image of image sensor chip, and to the described image of acquisition
Processing；The FX3 module is connected with the power panel, and the image transmitting for acquiring the FPGA to external equipment carries out figure
As Quality Detection.
Wherein, the Sensor interface circuit unit is MIPI circuit or DVP circuit；Alternatively, the Sensor interface electricity
Road unit is MIPI circuit and DVP circuit.
Wherein, the image collecting device further includes：Electrical plate, the electrical property plate and the Sensor interface circuit
Unit and FX3 module electrical connection, for detecting the open circuit and short-circuit condition of camera or image sensor chip circuit.
Wherein, the power panel includes：First ARM9 chip, power sense circuit unit, regulating circuit unit and amplification
Circuit unit；The first ARM9 chip by second row needle row mother be electrically connected with the mainboard, the first ARM9 chip and
The regulating circuit unit is connected with the power sense circuit unit, the interaction for power management and power state indication collection
Processing；The power sense circuit unit is used to detect the power supply state of camera or image sensor chip；The pressure regulation electricity
Road unit is electrically connected by second row needle mother row with the mainboard, the regulating circuit unit and the first ARM9 chip
And the amplifier circuit unit is connected, for adjusting supply voltage；The amplifier circuit unit is female by second row needle row
It is electrically connected with the Sensor interface circuit unit on the mainboard, the amplifier circuit unit and the regulating circuit unit phase
Even, for amplifying current signal and the current signal of amplification being provided to camera or image sensor chip.
Wherein, the electrical plate includes：2nd ARM9 chip, open and short detection circuit unit and crystal oscillator；2nd ARM
Chip is arranged needle mother row by third and is electrically connected with the mainboard, the 2nd ARM chip and the open and short detection circuit unit
And the crystal oscillator is connected, the interaction process for opening short-circuit condition instruction set for camera or image sensor chip circuit；Institute
It states open and short detection circuit unit and is electrically connected by third row needle mother row with the mainboard, the open and short detection circuit list
It is first to be connected with the 2nd ARM9 chip, short-circuit condition is opened for detect camera or image sensor chip；The crystal oscillator
For establishing and safeguarding piezoelectric resonator state.
Wherein, the image collecting device further includes：The first pinboard being electrically connected with the mainboard, described first
Pinboard includes 3.0 interface of USB and power switch；The USB3.0 interface is connected with the FX3 module, so that the FX3 mould
Block is connected by 3.0 interface of USB with the external equipment；The power switch is connected with the power panel, for controlling
The connection and disconnection of electric current.
Wherein, first pinboard further includes：Power interface and reseting interface；The power interface is opened with the power supply
It closes and external power supply is connected, for providing electric current for the power panel；The reseting interface is connected with the FPGA module, so that
The external equipment is returned to reset state by the power supply that the reseting interface controls the FPGA module.
Wherein, the image collecting device further includes：The second pinboard being electrically connected with the mainboard, described second
Pinboard is electrically connected with camera or image sensor chip.
Wherein, the image collecting device further includes：Radiator on the main board is set, and the radiator is used
It radiates in for the FPGA module.
Wherein, first pinboard is electrically connected with the mainboard by the 4th row's needle mother row；Second pinboard with
The mainboard passes through the female electrical connection of first row needle row.
Wherein, described device ontology includes：Upper cover and lower cover, the upper cover are fixed by screw with the lower cover；It is described
The top plate of upper cover is equipped with first through hole and the second through-hole, the position pair of the position of the first through hole and second pinboard
It answers, the position of second through-hole is corresponding with the position of the radiator；The side plate of the upper cover is equipped with third through-hole, four-way
Hole and two fifth holes, the position of the third through-hole are corresponding with the position of 3.0 interface of USB；The fourth hole
Position is corresponding with the position of the reseting interface；The position of the fifth hole respectively with the position of the power interface and described
The position of power switch is corresponding；At least one the 6th through-hole is covered under described so that image collecting device and external component into
Row mechanical connection, and described image acquisition device is made to be aerated heat dissipation by the 6th through-hole.
Wherein, the material of described device ontology is aluminium alloy, kirsite, magnesium alloy or engineering plastics；Described device ontology
Made by machining, it is made by being molded into production or by 3D printing, and on the surface of described device ontology with black
Change process layer.
Wherein, the machine of described device ontology crosses bottom equipped with multiple feets, and the feet uses rubber material；And the pad
Foot is fastened by screw or glue and the lower cover.
The third aspect, the utility model provide a kind of image capturing system, including：External equipment, electrical connection device and
Above-mentioned image collecting device；Camera or image sensor chip are fixed on the electrical connection device, and the electrical property connects
Connection device is electrically connected with described image acquisition device, and described image acquisition device is electrically connected with the external equipment；Wherein, described
External equipment includes image measurement module.
Wherein, the electrical connection device is electrically connected with described image acquisition device by the 5th row's needle mother row, and described
Row's needle in 5th row's needle mother row is mounted on the electrical connection device, and mother row in the 5th row's needle mother row is mounted on institute
It states on second pinboard in image collecting device.
Wherein, described image acquisition device is connected with the external equipment by 3.0 data line of USB, the USB 3.0
The USB plug of data line one end is connected with the USB socket on the external equipment, the USB of the 3.0 data line other end of USB
Plug is connected with the USB socket on described image acquisition device.
A kind of image collecting device and image capturing system provided by the utility model, by by mainboard be arranged according to
Secondary connected Sensor interface circuit unit, FPGA module and FX3 module so that the data transmission and processing of image collecting device compared with
Fastly, data write rate also gets a promotion, and then improves the production efficiency of image collecting device.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of image collecting device provided by the embodiment of the utility model；
Fig. 2 is the structural schematic diagram for the image collecting device that another embodiment of the utility model provides；
Fig. 3 is the structural schematic diagram for the image collecting device that another embodiment of the utility model provides；
Fig. 4 a is the annexation figure between mainboard and power panel in Fig. 1-image collecting device shown in Fig. 3；
Fig. 4 b is the annexation figure between mainboard and electrical plate in Fig. 2-image collecting device shown in Fig. 3；
Fig. 4 c is the annexation figure between mainboard and the first pinboard in image collecting device shown in Fig. 3；
Fig. 4 d is the annexation figure between mainboard and the second pinboard in image collecting device shown in Fig. 3；
Fig. 5 a is the structural block diagram of image collecting device shown in FIG. 1；
Fig. 5 b is the structural block diagram of image collecting device shown in Fig. 2；
Fig. 5 c is the structural block diagram of image collecting device shown in Fig. 3；
Fig. 6 is the structural block diagram of three kinds of connection types of mainboard and power panel in Fig. 1-image collecting device shown in Fig. 3；
Fig. 7 is the structural block diagram of power panel in Fig. 1-image collecting device shown in Fig. 3；
Fig. 8 is the structural block diagram of electrical plate in Fig. 2-image collecting device shown in Fig. 3；
Fig. 9 is the structural schematic diagram for the image collecting device that the utility model another embodiment provides；
Figure 10 is the structural block diagram of image capturing system provided by the embodiment of the utility model；
Wherein, 1- image collecting device；2- external equipment 2；3- camera or image sensor chip；4- is electrically connected dress
It sets；10- mainboard；11- first row maternal interface 11；12- second row maternal interface；13- third arranges maternal interface；The 4th row's maternal interface of 14-；
The 6th row's maternal interface of 15-；100-FX3 module；200-FPGA module；300-Sensor interface circuit unit；20- power panel；21-
Second row needle interface；The first ARM9 chip of 22-；23- power sense circuit unit；24- regulating circuit unit；25- amplifying circuit
Unit；30- electrical property plate；31- third arranges needle interface；The 2nd ARM9 chip of 32-；33- crystal oscillator；34- open and short detection circuit unit；
The first pinboard of 40-；3.0 interface of 41-USB；42- power switch；43- power interface；44- reseting interface；The 4th row's needle of 45-
Interface；The second pinboard of 50-；51- first row needle interface；The 5th row's maternal interface of 52-；60- radiator；70- device noumenon；71-
First through hole；The second through-hole of 72-；73- third through-hole；74- fourth hole；75A/75B- fifth hole.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, is explicitly described the technical scheme in the embodiment of the utility model, it is clear that described reality
Applying example is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, ability
It is practical new to belong to this for domain those of ordinary skill every other embodiment obtained without making creative work
The range of type protection.
Fig. 1 is the structural schematic diagram of image collecting device provided by the embodiment of the utility model, as shown in Fig. 1 and Fig. 5 a,
The image collecting device includes：Mainboard 10 and power panel 20, the mainboard 10 are electrically connected with the power panel 20；The mainboard 10
Including Sensor interface circuit unit 300, FPGA module 200 and the FX3 module 100 being sequentially connected；The Sensor interface electricity
Road unit 300 is electrically connected with the power panel 20, for being electrically connected with camera or the foundation of image sensor chip 3；It is described
Image of the FPGA module 200 for acquisition camera or image sensor chip 3, and to the described image of acquisition at
Reason；The FX3 module 100 is connected with the power panel 20, the image transmitting for acquiring the FPGA to external equipment 2 into
The detection of row image quality.
Specifically, mainboard 10 being electrically connected with power panel 20, then power panel 20 can be powered for mainboard 10, so that
Mainboard 10 can be used for Image Acquisition and data processing etc..And mainboard 10 includes the Sensor interface circuit unit being sequentially connected
300, FPGA module 200 and FX3 module 100, wherein FPGA module 200 is used for image using low consumption, high-performance and low cost
The fpga chip of processing, the FX3 chip that FX3 module 100 is handled using the high-speed data of USB3.0 bus.And Sensor is connect
Mouth circuit unit 300 is electrically connected with power panel 20, then camera or image sensor chip 3 can pass through Sensor interface circuit list
Member 300 is established with mainboard 10 and is electrically connected, so that FPGA module 200 can be with acquisition camera or image sensor chip 3
Image, and relevant treatment is carried out to the image of acquisition.Since FX3 module 100 connects power panel 20, and the FX3 module can be passed through
100 carry out data transmission supplying with power supply with external equipment 2, for example, external equipment 2 is computer installation, then FX3 module 100
By 200 acquired image of FPGA module be transmitted to external equipment 2 carry out image quality detection, that is, detect acquisition camera or
Whether the image of image sensor chip 3 reaches testing standard.
In the utility model embodiment, by be arranged in mainboard the Sensor interface circuit unit being sequentially connected,
FPGA module and FX3 module, so that the data transmission and processing of image collecting device is very fast, data write rate also gets a promotion,
And then improve the production efficiency of image collecting device.
In addition, FPGA firmware, FX3 firmware and EPROM information are written to 10 phase of mainboard after finishing assembly by mainboard 10
Answer designated space.Mainboard 10 can carry out hollowing out several through-holes for installing fixation in the circuit board.Wiring board on mainboard 10
Surrounding can be used to fix.
On the basis of the above embodiments, as shown in fig. 6, the Sensor interface circuit unit 300 be MIPI circuit or
DVP circuit；Alternatively, the Sensor interface circuit unit 300 is MIPI circuit and DVP circuit.
Specifically, in conjunction with Fig. 6, when Sensor interface circuit unit 300 is MIPI circuit, MIPI circuit can be by the
Two row's maternal interfaces 12 are electrically connected with power panel 20, then image collecting device 1 at this time can be with MIPI class camera or image sense
It surveys device chip 3 to be electrically connected, and then detects the image quality of MIPI class camera or image sensor chip 3.When Sensor interface
When circuit unit 300 is DVP circuit, DVP circuit can be electrically connected by the tenth row's maternal interface 15 with power panel 20, then at this time
Image collecting device 1 can be electrically connected with DVP class camera or image sensor chip 3, and then detect DVP class camera or figure
As the image quality of sensor chip 3.Alternatively, when Sensor interface circuit unit 300 is MIPI circuit and DVP circuit,
MIPI circuit is electrically connected by second row maternal interface 12 with power panel 20, and DVP circuit passes through the tenth row's maternal interface 15 and power panel
20 electrical connection, then image collecting device 1 at this time can simultaneously with MIPI class and DVP class camera or image sensor chip 3
Electrical connection, and then detect the image quality of MIPI class and DVP class camera or image sensor chip 3.
In the utility model embodiment, by providing the circuit form of plurality of optional for Sensor interface circuit unit,
So that image collecting device can acquire the camera of different interface type or the image quality of image sensor chip, mention
The high adaptability of image collecting device.
On the basis of the various embodiments described above, in conjunction with Fig. 2, the image collecting device further includes：Electrical plate 30, institute
Electrical plate 30 is stated to be electrically connected with the Sensor interface circuit unit 300 and the FX3 module 100, for detect camera or
The open circuit and short-circuit condition of 3 circuit of image sensor chip.
Specifically, by mainboard 10 Sensor interface circuit unit 300 and FX3 module 100 be electrically connected with electrical plate 30
It connecing, then the electrical property plate 30 can also be electrically connected by Sensor interface circuit unit 300 with camera or image sensor chip 3,
And it is electrically connected by FX3 module 100 with external equipment 2, and then can use electrical plate 30 and detect camera or image sensing
The open circuit and short-circuit condition of 3 circuit of device chip improve so that the circuit connection of camera or image sensor chip 3 is intact
The reliability of whole image acquisition device 1.
Further, as shown in fig. 7, power panel 20 is electrically connected by second row needle mother row with mainboard 10, i.e., second row is female
Interface 12 is arranged on mainboard 10, and second row needle interface 21 is arranged on power panel 20, as shown in fig. 4 a, for example, second row is female
Interface 12 is double-row maternal interface, second row needle interface 21 is double-row needle interface, for example, double-row maternal interface is 32PIN row
Maternal interface, double-row needle interface are that 32PIN arranges needle interface.That is the first ARM9 chip 22, regulating circuit unit 24 and amplifying circuit
Unit 25 is electrically connected by second row needle interface 21 with the second row maternal interface 12 on mainboard 10, as shown in Figure 7.
And the first ARM9 chip 22, it can be programmed control, with mainboard 10, regulating circuit unit 24, power sense circuit
Unit 23 is electrically connected, for carrying out the instruction set interaction process of power management control and power supply status.Power detecting electricity
Road unit 23 is electrically connected with the first ARM9 chip 22, the inspection for image sensor chip or the power supply state of camera
It surveys.Regulating circuit unit 24 is electrically connected with the first ARM9 chip 22, amplifier circuit unit 25 and mainboard 10, for example, pressure regulation
Circuit unit 24 uses field effect transistor, for adjusting voltage according to parameter setting.Amplifier circuit unit 25 and regulating circuit
Sensor interface circuit on unit 24 and mainboard 10 is electrically connected, for the amplification of current signal, and will be after amplification
Electric current provide and to image sensor chip or camera make its normal work.
In addition, power panel 20 is connect with power switch 42, power switch 42 connect power supply with USB3.0 interface；Or power supply
Switch 42 connect power supply with power interface 43.Power-supply management system firmware is written to power panel after finishing assembly by power panel 20
20 corresponding designated spaces.Power panel 20 can carry out hollowing out several through-holes in the circuit board, for installing fixation.
Further, as shown in figure 8, electrical plate 30 is arranged by third, needle row is female to be electrically connected with mainboard 10, i.e. third row is female
Interface 13 is arranged on mainboard 10, and third is arranged needle interface 31 and is arranged on power panel 20, as shown in Figure 4 b, for example, third arranges needle
Interface 31 is double-row needle interface, for example, double-row needle interface is the interface of 36PIN.That is the 2nd ARM9 chip 32 opens short-circuit inspection
Slowdown monitoring circuit unit 34 and crystal oscillator 33 are arranged needle interface 31 by third and are electrically connected with third row's maternal interface 13 on mainboard 10.And the
Two ARM9 chips 32, can be programmed control, electrically connect with mainboard 10, open and short detection circuit unit 34 and crystal oscillator 33
It connects, the interaction process for opening short-circuit condition instruction set for image sensor chip or utilizing camera interface route.Crystal oscillator 33 and
Two ARM9 chips 32 are electrically connected, the foundation and maintenance for piezoelectric resonator state.Open and short detection circuit unit 34 with
2nd ARM9 chip 32, mainboard 10 are electrically connected, and open short-circuit condition for detection image sensor chip or camera.
In addition, electric property detecting system firmware is written to electrical plate 30 accordingly specified sky after finishing assembly by electrical plate 30
Between.Electrical plate 30 can carry out hollowing out several through-holes in the circuit board, for installing fixation.
On the basis of the various embodiments described above, in conjunction with shown in Fig. 3, Fig. 5 a and Fig. 5 b, the image collecting device is also wrapped
It includes：The first pinboard 40 being electrically connected with the mainboard 10, first pinboard 40 include that 3.0 interface 41 of USB and power supply are opened
Close 42；3.0 interface 41 of USB is connected with the FX3 module 100, so that the FX3 module 100 passes through the USB 3.0
Interface 41 is connected with the external equipment 2；The power switch 42 is connected with the power panel 20, for controlling the connection of electric current
And disconnection.
Specifically, by the way that the first pinboard 40 to be electrically connected with mainboard 10, and each interface is arranged at the first pinboard
On 40, that is, when being not provided with the first pinboard 40,3.0 interface 41 of USB and power switch 42 are arranged on mainboard 10, are passed through
Each interface is arranged on the first pinboard 40, so that the interface on mainboard 10 is independently gone out, simplifies the knot of mainboard 10
Structure.And first pinboard 40 can arrange mother by the 4th row's needle and be electrically connected with mainboard 10, as illustrated in fig. 4 c, i.e. the 4th row's maternal interface 14
It is arranged on mainboard 10, the 4th row's needle interface 45 is arranged on the first pinboard 40, for example, the 4th row's needle interface 45 is double-row
Needle interface, for example, double-row needle interface is 22PIN interface.
3.0 interface 41 of USB and power switch 42 are set on the first pinboard 40, then FX3 module 100 can pass through the USB
3.0 interfaces 41 are electrically connected with external equipment 2, for example, 3.0 interface 41 of USB is USB B type socket, USB3.0 interface can be used for
The image data that data transmission and power supply power supply, i.e. FX3 module 100 can be acquired mainboard 10 by 3.0 interface 41 of USB
It is transmitted to external equipment 2, so that external equipment 2 carries out image quality detection to the image that mainboard 10 acquires.Power switch 42 can
The on-off of 20 current status of power panel is controlled, for example, power switch 42 is key switch, microswitch, toggle switch, dial-up are opened
Pass or touch-switch etc., the on-off for power supply control.
Further, as shown in Figure 5 c, the first pinboard 40 further includes power interface 43 and reseting interface 44, and power supply connects
Mouthfuls 43 are electrically connected with power switch 42 and external power supply, i.e. the connection that can control power panel 20 Yu external power supply of power switch 42
Or disconnect, when power panel 20 is connected to external power supply, independent power supply can be provided for whole image acquisition device 1, for example, being
The DC power supply of the offer of image collecting device 1 12V1A.Reseting interface 44 is electrically connected with FPGA module 200, so that external equipment 2
It is electrically connected by the reseting interface 44 with FPGA module 200, for example, external equipment 2 is computing device, so that external equipment
The power supply of the long-range control mainboard 10 of 2 sections, so that the power supply of mainboard 10 is returned to reset state.
In addition, the first pinboard 40 can carry out hollowing out several through-holes in the circuit board, for installing fixation.
On the basis of the various embodiments described above, as shown in figure 3, the image collecting device, further includes：With the mainboard
Second pinboard 50 of 10 electrical connections, second pinboard 50 are electrically connected with camera or image sensor chip 3.
Specifically, by connecting the second pinboard 50 on mainboard 10, the interface position of mainboard 10 can be extended, so that mainboard
10 can more conveniently be electrically connected with camera or image sensor chip 3.Second pinboard 50 is female and main by first row needle row
Plate 10 is electrically connected, and as shown in figure 4d, i.e., first row maternal interface 11 is arranged on mainboard 10, is arranged first on the second pinboard 50
Needle interface is arranged, for example, first row maternal interface 11 is double-row maternal interface, first row needle interface 51 is double-row needle interface, preferably
Ground, first row maternal interface 11 are that 40PIN arranges maternal interface, and first row needle interface 51 can be 40PIN row's needle interface.And second
Pinboard 50 is electrically connected with camera or image sensor chip 3, for example, the second pinboard 50 is female by the 5th row's needle row and connects
The electrical connection device 4 for connecing camera or image sensor chip 3 is electrically connected, i.e., it is female that the 5th row is arranged on the second pinboard 50
The 5th row's needle interface is arranged in interface 52 on electrical connection device 4, for example, the 5th row's maternal interface 52 is double-row mesh, preferably
Ground, the 5th row's maternal interface 52 can be 40PIN row's maternal interface.And second pinboard 50 and power panel 20 and electrical connection device 4
By the female electrical connection of row needle row, any one interface encounters damage wherein, can be updated by replacing, thus
The maintenance cost in client's later period can be reduced, while improving the flexibility of whole device.
In addition, the second pinboard 50 can carry out hollowing out several through-holes in the circuit board, for installing fixation.
On the basis of the various embodiments described above, the image collecting device further includes：It is arranged on the mainboard 10
Radiator 60, the radiator 60 are used to radiate for the FPGA module 200.
Specifically, since FPGA module 200 is for acquisition camera or the image of image sensor chip 3, and processing
Relevant calculation, then FPGA module 200 needs to carry out a large amount of, quick operation, then FPGA module 200 can generate certain heat
Amount can be then that FPGA module 200 radiates by the radiator 60, in turn by the way that radiator 60 is arranged on mainboard 10
The temperature for reducing FPGA module 200, so that FPGA module 200 will not be influenced because a large amount of, quick operation is carried out for a long time
Its efficiency, and then improve the Image Acquisition efficiency and relevant treatment efficiency of image collecting device 1.For example, radiator 60 can be
Metal fin, fan or water cooling plant etc..
On the basis of the various embodiments described above, as shown in figure 9, described device ontology 70 includes：Upper cover and lower cover, it is described on
Lid is fixed by screw with the lower cover；The top plate of the upper cover is equipped with first through hole 71 and the second through-hole 72, and described first is logical
The position in hole 71 is corresponding with the position of second pinboard 50, the position of the position of second through-hole 72 and the radiator 60
Set correspondence；The side plate of the upper cover is equipped with third through-hole 73, fourth hole 74 and two fifth hole 75A/75B, the third
The position of through-hole 73 is corresponding with the position of 3.0 interface 41 of USB；The position of the fourth hole 74 and the reseting interface
44 position is corresponding；It is opened respectively with the position of the power interface 43 and the power supply position of the fifth hole 75A/75B
The position of pass 42 is corresponding；At least one the 6th through-hole is covered under described, so that image collecting device 1 and external component carry out machine
Tool connection, and described image acquisition device 1 is made to be aerated heat dissipation by the 6th through-hole.
Specifically, as shown in fig. 7, device noumenon 70 is arranged in the external of image collecting device, by image collecting device 1
It is placed on inside the device noumenon 70, that is, by mainboard 10, power panel 20, electrical plate 30, the first pinboard 40 and the second pinboard
50 etc. are arranged inside device noumenon 70, so that device noumenon 70 plays the role of protecting electronic component.Device noumenon 70
It is fixed by screw by upper cover and lower cover, i.e., device noumenon 70 is casing, and the upper cover of casing is by top plate, side plate, foreboard
With back plate form, and top plate, side plate, front and rear panels pass through screw carry out it is affixed.And foreboard by screw and top plate and under
After covering tightly admittedly, the one degree of freedom of mainboard 10 can be limited；It, can and after back plate is fastened by screw and top plate and lower cover
To limit the one degree of freedom of mainboard 10.
The top plate of upper cover is equipped with first through hole 71 and the second through-hole 72, the position of first through hole 71 and the second pinboard 50
Position it is corresponding, for example, the shape of first through hole 71 and the second pinboard 50 is in the same size, for the second pinboard 50 of exposing
On the 5th row's maternal interface 52.The position of second through-hole 72 is corresponding with the position of radiator 60, for example, the second through-hole 72 includes equal
Multiple circular holes of even distribution, for being aerated heat dissipation for radiator 60.
And third through-hole 73, fourth hole 74 and two fifth hole 75A/75B are equipped on the side plate of upper cover, and
The position of third through-hole 73 is corresponding with the position of 3.0 interface 41 of USB, for example, the shape of third through-hole 73 and 3.0 interface of USB
41 it is in the same size, for the exposed of interface.The position of fourth hole 74 is corresponding with the position of reseting interface 44, for example, the 4th
The shape of through-hole 74 is in the same size with reseting interface 44, for the exposed of reseting interface 44.The position of fifth hole 75A/75B
It is corresponding with the position of power interface 43 and power switch 42, for example, the shape of fifth hole 75A/75B and power switch 42 and electricity
Source interface 43 it is in the same size, for the exposed of interface and switch, while can be used for ventilation and heat.
Lower lid is equipped at least one the 6th through-hole, then image collecting device 1 can pass through the 6th through-hole and external component
It is mechanically connected, image collecting device 1 can also be aerated heat dissipation etc. by the 6th through-hole.
In addition, several through-holes can also be arranged on the foreboard of upper cover and/or back plate, using the through-hole be aerated heat dissipation or
Screw etc. is installed.And the inside setting deep gouge at the two sides of lower cover, the two sides of the wiring board for placing mainboard 10, from
And make the limit of 10 4 freedom degrees of mainboard.
Further, the material of device noumenon 70 is aluminium alloy, kirsite, magnesium alloy or engineering plastics；Device noumenon 70
Made by machining, it is made by being molded into production or by 3D printing.And melanism is carried out to the surface of device noumenon 70
Processing, for example, Darkening process is that device noumenon 70 is placed in electroplating liquid medicine to aoxidize, by black coating；Or it is filling
The surface for setting ontology 70 carries out phosphatization, so that the surface of device noumenon 70 forms black treated layer.It is set on the surface of equipment ontology
Set the heat dissipation that one layer of black coating is conducive to whole image acquisition device 1.And device noumenon 70 machine cross bottom setting it is more
A feet, and feet uses rubber material；And feet is fastened by screw or glue and lower cover.
The image collecting device that the various embodiments described above provide have compact-sized, small in size, compatible high, good reliability and
The advantages that installation is convenient is not only applicable in handwork, is also suitble to automated machine operation；Measure camera or image sensor core
The standby current of piece 3 is more acurrate more convenient；Flexible open-short circuit voltage and test electric current setting, make test result closer
True value；Faster, data write rate promotes one times to data transmission and processing, is more advantageous to raising production efficiency.
Figure 10 is a kind of image capturing system provided by the embodiment of the utility model, which is characterized in that including：External equipment
2, electrical connection device 4 and above-mentioned image collecting device 1；Camera or image sensor chip 3 are fixed on the electrical property and connect
On connection device 4, the electrical connection device 4 is electrically connected with described image acquisition device 1, described image acquisition device 1 with it is described
External equipment 2 is electrically connected；Wherein, the external equipment 2 includes image measurement module.
Specifically, by camera or 3 fixed placement of image sensor chip on electrical connection device 4, and will be electrical
Attachment device 4 is electrically connected with image collecting device 1, then can pass through 1 acquisition camera of image collecting device or image sensor
The image of chip 3, and image collecting device 1 can also carry out image quality detection to acquired image.And by Image Acquisition
Device 1 is electrically connected with external equipment 2, for example, external equipment 2 is computer installation etc.；And image measurement is equipped in external equipment 2
Module, then acquired image is transmitted to external equipment 2 by image collecting device 1, can be surveyed by the image in the external equipment 2
Die trial block carries out image quality detection to image.
Further, electrical connection device 4 is arranged mother by the 5th row's needle with image collecting device 1 and is electrically connected, wherein
5th row's needle is mounted on the 5th row's needle interface on electrical connection device 4, and the 5th mother row is mounted in image collecting device 1
The 5th row's maternal interface 52 on second pinboard 50, i.e. camera on electrical connection device 4 or image sensor chip 3 pass through
5th row's needle mother row is electrically connected with the second pinboard 50.Image collecting device 1 can pass through USB with being electrically connected for external equipment 2
The connection of 3.0 data lines, for example, one of 3.0 data line of USB is A type USB plug, other end is Type B USB plug, Type B USB
Socket is mounted on image collecting device 1, and A type USB socket is mounted on external equipment 2.
Image collecting device 1 can acquire power supply status, electrical signals, the image letter of image sensor chip or camera
Number etc., the related data of image sensor chip or camera can also be read, and real-time display is on external equipment 2.Into one
Step ground, image collecting device 1 can transmit data in image sensor chip or camera, and the space write-in in it
Relevant data.
When carrying out image detection using the image capturing system, firstly, camera or two image sensor chips are put
Onto the electrical connection device 4 being connected with image collecting device 1, and make electrical connection processing on-state.It is set secondly, starting is external
Image measurement module in standby 2, and parameter setting is carried out according to the model of image sensor chip or camera and is lighted, image sense
The parameter setting for surveying device chip or camera can be configured before product is lighted by manual operations, can also be in product point
It is configured before bright by operating in advance and searching for adaptation operation automatically.Then, by image measurement module to image sensor
Chip or camera carry out image quality detection, whether reach survey with the image quality of detection image sensor chip or camera
Test-object is quasi-.Corrected parameter is written to image sensor after detecting the actual state of image quality, then through replication tool
It is set to meet testing standard in the recordable space that chip or camera are specified.
Finally it should be noted that：Above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that：
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement；And these are modified or replaceed, various embodiments of the utility model technology that it does not separate the essence of the corresponding technical solution
The spirit and scope of scheme.
Claims (17)
1. a kind of image collecting device, which is characterized in that including：Device noumenon and setting in the intrinsic mainboard of described device and
Power panel, the mainboard are electrically connected with the power panel；
The mainboard includes Sensor interface circuit unit, FPGA module and the FX3 module being sequentially connected；
The Sensor interface circuit unit is electrically connected with the power panel, for establishing with camera or image sensor chip
Electrical connection；
The FPGA module is carried out for acquisition camera or the image of image sensor chip, and to the described image of acquisition
Processing；
The FX3 module is connected with the power panel, and the image transmitting for acquiring the FPGA to external equipment carries out figure
As Quality Detection.
2. image collecting device according to claim 1, which is characterized in that the Sensor interface circuit unit is MIPI
Circuit or DVP circuit；Alternatively, the Sensor interface circuit unit is MIPI circuit and DVP circuit.
3. image collecting device according to claim 1 or 2, which is characterized in that further include：Electrical plate, the electrical property plate
It is electrically connected with the Sensor interface circuit unit and the FX3 module, for detecting camera or image sensor chip electricity
The open circuit and short-circuit condition on road.
4. image collecting device according to claim 1, which is characterized in that the power panel includes：First ARM9 chip,
Power sense circuit unit, regulating circuit unit and amplifier circuit unit；
The first ARM9 chip is electrically connected by second row needle mother row with the mainboard, the first ARM9 chip and the tune
Volt circuit unit is connected with the power sense circuit unit, the interaction process for power management and power state indication collection；
The power sense circuit unit is used to detect the power supply state of camera or image sensor chip；
The regulating circuit unit is electrically connected by second row needle mother row with the mainboard, the regulating circuit unit and institute
It states the first ARM9 chip and the amplifier circuit unit is connected, for adjusting supply voltage；
The amplifier circuit unit is electrically connected by second row needle mother row with the Sensor interface circuit unit on the mainboard
It connects, the amplifier circuit unit is connected with the regulating circuit unit, for amplifying current signal and believing the electric current of amplification
Number it is provided to camera or image sensor chip.
5. image collecting device according to claim 3, which is characterized in that it is described electrical property plate include：2nd ARM9 chip,
Open and short detection circuit unit and crystal oscillator；
The 2nd ARM chip is arranged needle mother row by third and is electrically connected with the mainboard, the 2nd ARM chip with it is described open it is short
Alignment detection circuit unit and the crystal oscillator are connected, and open short-circuit condition instruction set for camera or image sensor chip circuit
Interaction process；
The open and short detection circuit unit is arranged needle mother row by the third and is electrically connected with the mainboard, the open and short detection
Circuit unit is connected with the 2nd ARM9 chip, opens short-circuit condition for detect camera or image sensor chip；
The crystal oscillator is for establishing and safeguarding piezoelectric resonator state.
6. image collecting device according to claim 1, which is characterized in that further include：Be electrically connected with the mainboard
One pinboard, first pinboard include 3.0 interface of USB and power switch；
3.0 interface of USB is connected with the FX3 module so that the FX3 module by 3.0 interface of USB with it is described
External equipment is connected；
The power switch is connected with the power panel, for controlling the connection and disconnection of electric current.
7. image collecting device according to claim 6, which is characterized in that first pinboard further includes：Power supply connects
Mouth and reseting interface；
The power interface is connected with the power switch and external power supply, for providing electric current for the power panel；
The reseting interface is connected with the FPGA module, so that the external equipment passes through described in reseting interface control
The power supply of FPGA module is returned to reset state.
8. image collecting device according to claim 7, which is characterized in that further include：Be electrically connected with the mainboard
Two pinboards, second pinboard are electrically connected with camera or image sensor chip.
9. image collecting device according to claim 8, which is characterized in that further include：Be arranged on the main board dissipate
Hot device, the radiator are used to radiate for the FPGA module.
10. image collecting device according to claim 9, which is characterized in that first pinboard and the mainboard are logical
Cross the female electrical connection of the 4th row's needle row；Second pinboard is electrically connected with the mainboard by first row needle mother row.
11. image collecting device according to claim 9, which is characterized in that described device ontology includes：Upper cover is under
Lid, the upper cover are fixed by screw with the lower cover；
The top plate of the upper cover is equipped with first through hole and the second through-hole, the position of the first through hole and second pinboard
Position is corresponding, and the position of second through-hole is corresponding with the position of the radiator；
The side plate of the upper cover is equipped with third through-hole, fourth hole and two fifth holes, the position of the third through-hole and institute
The position for stating 3.0 interface of USB is corresponding；The position of the fourth hole is corresponding with the position of the reseting interface；Described 5th is logical
The position in hole is corresponding with the position of the position of the power interface and the power switch respectively；
At least one the 6th through-hole is covered under described, so that image collecting device is mechanically connected with external component, and
Described image acquisition device is set to be aerated heat dissipation by the 6th through-hole.
12. image collecting device according to claim 11, which is characterized in that the material of described device ontology is aluminium conjunction
Gold, kirsite, magnesium alloy or engineering plastics；
Described device ontology makes made by machining, by being molded into production or by 3D printing, and in described device
The surface of ontology has black treated layer.
13. image collecting device according to claim 11, which is characterized in that the machine of described device ontology is crossed bottom and is equipped with
Multiple feets, the feet use rubber material；And the feet is fastened by screw or glue and the lower cover.
14. a kind of image capturing system, which is characterized in that including：External equipment, electrical connection device and such as claim 1-7,
The described in any item image collecting devices of 9-13；
Camera or image sensor chip are fixed on the electrical connection device, the electrical connection device and described image
Acquisition device electrical connection, described image acquisition device are electrically connected with the external equipment；
Wherein, the external equipment includes image measurement module.
15. a kind of image capturing system, which is characterized in that including：External equipment, electrical connection device and such as claim 8-13
Described in any item image collecting devices；
Camera or image sensor chip are fixed on the electrical connection device, the electrical connection device and described image
Acquisition device electrical connection, described image acquisition device are electrically connected with the external equipment；
Wherein, the external equipment includes image measurement module.
16. image capturing system according to claim 15, which is characterized in that the electrical connection device and described image
Acquisition device is by the female electrical connection of the 5th row's needle row, and row's needle in the 5th row's needle mother row is mounted on the electric connection dress
It sets, the row in the 5th row's needle mother row is female to be mounted on second pinboard in described image acquisition device.
17. image capturing system described in 4 or 16 according to claim 1, which is characterized in that described image acquisition device with it is described
External equipment is connected by 3.0 data line of USB, on the USB plug and the external equipment of described 3.0 data line one end USB
USB socket be connected, the USB plug of the 3.0 data line other end of USB and the USB socket phase on described image acquisition device
Even.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820281729.4U CN208143329U (en) | 2018-02-28 | 2018-02-28 | A kind of image collecting device and image capturing system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820281729.4U CN208143329U (en) | 2018-02-28 | 2018-02-28 | A kind of image collecting device and image capturing system |
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| Publication Number | Publication Date |
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| CN208143329U true CN208143329U (en) | 2018-11-23 |
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ID=64286376
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111028231A (en) * | 2019-12-27 | 2020-04-17 | 易思维（杭州）科技有限公司 | Workpiece position acquisition system based on ARM and FPGA |
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2018
- 2018-02-28 CN CN201820281729.4U patent/CN208143329U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111028231A (en) * | 2019-12-27 | 2020-04-17 | 易思维（杭州）科技有限公司 | Workpiece position acquisition system based on ARM and FPGA |
| CN111028231B (en) * | 2019-12-27 | 2023-06-30 | 易思维（杭州）科技有限公司 | Workpiece position acquisition system based on ARM and FPGA |
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