CN208127171U - Unilateral upper piece machine - Google Patents
Unilateral upper piece machine Download PDFInfo
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- CN208127171U CN208127171U CN201820280155.9U CN201820280155U CN208127171U CN 208127171 U CN208127171 U CN 208127171U CN 201820280155 U CN201820280155 U CN 201820280155U CN 208127171 U CN208127171 U CN 208127171U
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- upper piece
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of unilateral upper piece machines, it includes carrier, carrier transmission mechanism, Qu Pian mechanism, chip transmission mechanism and testing agency, parallel is provided with several first slots in the carrier, the carrier for carrying silicon wafer is transmitted on lifting platform by the carrier transmission mechanism, the Qu Pian mechanism is docked with the lifting platform, the Qu Pian mechanism has telescopic first transmission parts, by the lifting of the lifting platform so that first transmission parts protrude into the carrier and take out silicon wafer, the chip transmission mechanism is docked with the Qu Pian mechanism, silicon wafer is transmitted to the chip transmission mechanism by first transmission parts, the chip transmission mechanism is by chip transmission to next station, the testing agency docks with the chip transmission mechanism, the chip transmission mechanism transmission silicon wafer is in the testing agency.To sum up, the unilateral upper piece machine of the utility model can be provided for staff debugging space and realize silicon wafer upper piece and detection it is full-automatic, and improve working efficiency.
Description
Technical field
The utility model relates to photovoltaic manufacturing field, more particularly to a kind of unilateral upper piece machine.
Background technique
In photovoltaic industry chain, solar battery manufacture is core link, and solar battery mainly uses the silicon sun at present
Energy battery, the conventional method for manufacturing silicon solar cell is that the clean p-type in surface or N type silicon wafer are first passed around system first
Suede process forms suede structure；Secondly in silicon chip surface diffusion, the emitter of N+ or P+ is formed, is gone by wet etching
Fall the diffusion layer at silicon chip side and the back side；Then one layer of SiN film with antireflective function is re-formed in its front surface；Finally
Metal electrode is made respectively at the positive back side of silicon wafer, forms crystal silicon solar batteries by sintering process.Wherein, it is produced when diffusion
Raw foreign matter of phosphor or boron, phosphorus or boron can inevitably diffuse to silicon chip side and the back side, eventually lead to short circuit.Therefore, it is necessary to right
The doped silicon at silicon chip of solar cell side and the back side performs etching, to remove the diffusion layer of silicon chip side and the back side.Expand simultaneously
The system knot of dissipating can also form phosphorus silicon or Pyrex in diffusion layer surface, influence battery efficiency, therefore be also required to remove.In production often
Wet-etching technology carries out the cleaning of silicon wafer, and wet etching generally uses the mixed liquor of hydrofluoric acid, nitric acid and sulfuric acid to remove
The phosphorus silicon or Pyrex on each surface of silicon wafer and the diffusion layer for removing battery side and the back side, therefore silicon wafer is in wet etching
Weight before and after technique has differences.However in traditional production technology, silicon wafer is directly entered under the transmission of bilateral upper piece machine
Wet processing pond performs etching, and directly directly transports from bilateral bottom sheet machine after etching, and this upper piece machine is not only not provided with
Weighing unit is sampled inspection, and detection space can not be also provided for weighing unit.In addition, since bilateral upper piece machine is on both sides
Upper piece transmission mechanism is set, so that enough spaces checked and adjusted can not be provided for staff, if weighing unit
It was found that silicon wafer is not inconsistent standardization, staff also to machine can not closely check and debug at once, therefore, in this way
Structure not only cannot achieve piece, the full-automatic and efficient transport such as weighing, be also greatly reduced the qualification rate of silicon wafer, from
And a series of bad phenomenons such as lead to battery drain, it is unable to satisfy existing production requirement.
Therefore, urgent need wants one kind that can provide debugging space for staff, and realizes an and height full-automatic with detection
Unilateral upper piece machine of effect overcomes above-mentioned defect.
Utility model content
Based on this, it is necessary to be directed to prior art problem, debugging space can be provided for staff by providing one kind, and real
Now upper piece and detection is full-automatic and efficient unilateral upper piece machine.
To achieve the goals above, the utility model discloses a kind of unilateral upper piece machines, suitable for the silicon wafer carrier
Carry out transmission and sampling Detection comprising carrier, carrier transmission mechanism, Qu Pian mechanism, chip transmission mechanism and testing agency.Institute
It states in carrier and parallel is provided with several the first slots for silicon wafer insertion, the carrier for carrying silicon wafer is passed by the carrier
Transfer mechanism is transmitted on a lifting platform, and the Qu Pian mechanism is docked with the lifting platform, and the Qu Pian mechanism has telescopic
First transmission parts, by the lifting of the lifting platform so that first transmission parts protrude into the carrier on the lifting platform one by one
Silicon wafer is taken out, the chip transmission mechanism is docked with the Qu Pian mechanism, and silicon wafer is transmitted to described by first transmission parts
Chip transmission mechanism, the chip transmission mechanism is by chip transmission to next station, the testing agency and the chip transmission
Mechanism docking, the transmission silicon wafer of the chip transmission mechanism selectivity is in the testing agency.
Preferably, the testing agency includes adsorption piece and detection unit, the adsorption piece selectivity from described first
Silicon wafer is adsorbed on transmission parts and is transmitted in the detection unit is detected.
Preferably, the detection unit is the weighing instrument for measuring silicon wafer weight.
Preferably, by the extraneous cover separated with silicon wafer when the testing agency further includes for weighing.
Preferably, the testing agency further includes the first controller and the alarm dress for reminding testing staff to be debugged
It sets, first controller is electrically connected with the detection unit and warning device respectively.
Preferably, the carrier transmission mechanism includes at least two the second transmission for being parallel to each other and being successively arranged in superposition shape
Part, second transmission parts of the lifting platform liftable on most and most under the second transmission parts between, carry the described of silicon wafer
Carrier is transmitted on the lifting platform by second transmission parts.
Preferably, the carrier transmission mechanism further includes the transmission knot for adjusting the second transmission parts tensioning degree
Structure, the drive mechanism include bracket, driving wheel and driven wheel, and the driving wheel is articulated on the bracket, the driven wheel
It is sticked in the bracket, adjusts the distance between the driving wheel and driven wheel to adjust the tensioning journey of second transmission parts
Degree.
Preferably, the driven wheel includes wheel body and shaft, the wheel body is articulated in the shaft, the end of the shaft
Portion has the cutting face to be formed that is recessed towards axle center, and two cutting faces are coplanar, and the end of the shaft is in removably to be sticked in
On the bracket, by change the cutting face in the clamped position on the bracket be adjusted the driving wheel with it is described driven
The distance between wheel.
Preferably, unilateral upper piece machine further includes guiding mechanism, the guiding mechanism is symmetrically disposed on first transmission
The two sides of part are to correct the position of silicon wafer.
Preferably, unilateral upper piece machine further includes liftable cache mechanism, it is provided in the cache mechanism in parallel
Several the second slots for silicon wafer insertion, the cache mechanism be set to the guiding mechanism and the chip transmission mechanism it
Between, silicon wafer is inserted into second slot by first transmission parts one by one, and the chip transmission mechanism is one by one by described second
Chip transmission in slot is to next station.
Preferably, the chip transmission mechanism includes the third transmission parts in arranged in matrix, positioned at described the of first row
Three transmission parts are arranged and are located between first transmission parts and the testing agency in lateral transport, the third of remaining row
Transmission parts are in longitudinal transmission setting.
Preferably, the chip transmission mechanism further includes climbing structure, the climbing structure be located at the described of first row
The connection of third transmission parts, and control the third transmission parts lifting that driving is located at first row.
Preferably, the chip transmission mechanism further includes for adjusting the adaptive pre- of the third transmission parts tensioning degree
Clamp force structure, the adaptive pre-fastening structure include tensioning wheel, fixing piece, regulating part, elastic component and locating part, and described
Bearing up pulley is set on the regulating part, and the locating part connects in fixing after the fixing piece with the regulating part for sliding
It connects, the elastic component is set between the fixing piece and the regulating part in compression shape, and the elastic component perseverance is by the adjusting
Part towards far from fixing piece direction bias, the variation of the tensioning wheel stress will so that the fixing piece and the regulating part it
Between gap carry out automatic adjusument.
Preferably, the fixing piece opposite sides offers the guide groove for regulating part insertion, the regulating part
It is convexly equipped with guide part, the guide part is inserted into the guide groove, and the guide part is along the axial described of the locating part
It is slided in guide groove to adjust the tensioning degree of third transmission parts.
Preferably, described be arranged in longitudinal transmission and be located at the third transmission parts of same row by same motor driven.
Compared with prior art, unilateral upper piece machine of the utility model is due to by carrier transmission mechanism, Qu Pian mechanism, silicon wafer
Multiple mechanisms such as transmission mechanism and testing agency are combined together, and silicon wafer is in carrier transmission mechanism, Qu Pian mechanism and chip transmission
Enter testing agency under the transports such as mechanism, and transport silicon wafer to next station after testing agency's detection, to realize wet process
Chip transmission and detection integration, commissioning staff before etching technics can judge that Si wafer quality is according to the detection data of silicon wafer
It is no to comply with standard and machine is adjusted in time, to improve the quality and qualification rate of silicon wafer；Further, since carrier passes
Transfer mechanism, Qu Pian mechanism, chip transmission mechanism and testing agency are successively in unilateral pipeline system arrangement, can not only be detection
Mechanism provides enough installation spaces, overcomes the shortcomings that traditionally testing agency is arranged without space in piece machine, but also is work people
Member provides the space closely checked and adjusted, to be modified in time, improves production efficiency, the quality of silicon wafer on the whole
With qualification rate etc., meet the needs in market.At the same time, mechanism can be will test as needed and be arranged to various silicon wafer detection dresses
It sets, flexibility is high, strong applicability.To sum up, the unilateral upper piece machine of the utility model can provide debugging space simultaneously for staff
Realize silicon wafer upper piece and detection it is full-automatic, and improve working efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the unilateral upper piece machine of the utility model.
Fig. 2 is the partial enlarged view of the A of Fig. 1.
Fig. 3 is the top view of the unilateral upper piece machine of the utility model.
Fig. 4 is the structural schematic diagram of the carrier transmission mechanism of the unilateral upper piece machine of the utility model.
Fig. 5 is the driven wheel structure schematic diagram of the carrier transmission mechanism of the unilateral upper piece machine of the utility model.
Fig. 6 is the cutting face of the driven wheel of the carrier transmission mechanism of the unilateral upper piece machine of the utility model in two on bracket
The structural schematic diagram of the distance between the shaft of different clamped positions and driving shaft variation.
Fig. 7 is the structural schematic diagram of the adaptive pre-fastening structure of the unilateral upper piece machine of the utility model.
Fig. 8 is the cross-sectional view under natural conditions of the adaptive pre-fastening structure of the unilateral upper piece machine of the utility model.
Fig. 9 is the cross-sectional view under the working condition of the adaptive pre-fastening structure of the unilateral upper piece machine of the utility model.
Figure 10 is the side view of the adaptive pre-fastening structure of the unilateral upper piece machine of the utility model.
Specific embodiment
For technology contents, the construction feature, the objects and the effects that the utility model is described in detail, below in conjunction with implementation
Mode simultaneously cooperates attached drawing to be explained in detail.
As shown in Figs.1 and 2, the unilateral upper piece machine 100 of the utility model includes carrier 1, carrier transmission mechanism 2, takes
Piece mechanism 4, guiding mechanism 7, chip transmission mechanism 5, testing agency 6 and rack 10.Carrier transmission mechanism 2 is set to rack 10
Side, Qu Pian mechanism 4, guiding mechanism 7, chip transmission mechanism 5 and testing agency 6 are fixed in rack 10, in flat in carrier 1
Capable is provided with several the first slots 11 for silicon wafer insertion, and the carrier 1 for carrying silicon wafer is transmitted to by carrier transmission mechanism 2
On one lifting platform 3, Qu Pian mechanism 4 is docked with lifting platform 3, and Qu Pian mechanism 4 has telescopic first transmission parts 41, by lifting
So that taking out silicon wafer in the carrier 1 that the first transmission parts 41 protrude on lifting platform 3 one by one, guiding mechanism 7 is symmetrically set for the lifting of platform 3
The two sides of the first transmission parts 41 are placed in correct the position of silicon wafer, the first transmission parts of chip transmission mechanism 5 and Qu Pian mechanism 4
41 docking, silicon wafer are transmitted to chip transmission mechanism 5 by the first transmission parts 41, and testing agency 6 docks with chip transmission mechanism 5,
The transmission silicon wafer of 5 selectivity of chip transmission mechanism is in testing agency 6.In order to improve the efficiency of transmission of silicon wafer, make full use of more
The time of silicon wafer supply blank, is additionally provided with cache mechanism 8, delays when changing carrier 1 between guiding mechanism 7 and chip transmission mechanism 5
It deposits mechanism 8 and is liftably connected to rack 10, inserted in cache mechanism 8 in parallel several second for silicon wafer insertion that are provided with
Silicon wafer is inserted into the second slot 81 by slot 81, the first transmission parts 41 one by one, and chip transmission mechanism 5 one by one will be in the second slot 81
Chip transmission is to next station.When replacing carrier 1, the silicon wafer that cache mechanism 8 can be pre-stored within cache mechanism 8 continue to
Chip transmission mechanism 5 is transmitted, to ensure that the lasting supply and transmission of silicon wafer.More specifically, as follows：
It please refers to shown in Fig. 1 and Fig. 3, testing agency 6 includes adsorption piece (not shown), transmission device (not shown), first
Controller (not shown), detection unit 61 and the warning device (not shown) for reminding testing staff to be debugged, adsorption piece
The selective silicon wafer and being transmitted in detection unit 61 of adsorbing from the first transmission parts 41 is examined under the driving of transmission device
It surveys.Detection unit 61 is fixed on rack 10 and is electrically connected with the first controller, and transmission device is fixed on rack 10 and is set to
The top of detection unit 61, adsorption piece are fixed on transmission device and connect with vaccum-pumping equipment to adsorb silicon wafer.It is preferably to examine
Surveying unit 61 is the high-precision weighing instrument for measuring silicon wafer weight, and adsorption piece is suction nozzle, and transmission device includes mobile motor, sliding
Screw rod, guide rail and sliding block, suction nozzle are fixed on sliding block, and guide rail is horizontally fixed on rack 10, and sliding block and guide rail are slidably matched simultaneously
Connect with sliding screw, mobile motor drives sliding screw rotation so that sliding block chip transmission mechanism 5 and detection unit 61 it
Between move.Warning device is fixed on rack 10 and is electrically connected with the first controller, and detection unit 61 is by the weight data of silicon wafer
The first controller is fed back to, the first controller compares feedback data and preset weight standard, once beyond mark
Criterion controls warning device and opens, and staff is at once adjusted whole machine according to the prompt of warning device, to mention
The quality and qualification rate of high silicon wafer.At the same time, since silicon wafer quality itself is excessively light, so the extraneous factor that wind etc. is small
All great error may be brought for testing agency 6, separated in the external world with silicon wafer when in order to weigh, testing agency 6 is additionally provided with
Cover 62, cover 62 are liftably set in rack 10 under the driving of lifting device.It is understood that detection unit 61
It can be changed to other silicon wafer detection devices, such as thickness detection apparatus, be not limited.It is understood that testing agency 6
Can also cooperate the testing agency of bottom sheet machine carry out using, by the cooperative cooperating of the testing agency before and after technique, it can be achieved that
Data comparison, such as the front and back weight detecting of silicon wafer wet-etching technology are detected and carried out to silicon wafer before and after technique, thus
Make the etch amount of silicon wafer closer to standard value, to improve the qualification rate of silicon wafer.
As shown in Figs.1 and 2, carrier transmission mechanism 2 is parallel to each other and including at least two successively in superposition shape setting
The second transmission parts 21, second transmission parts 21 of 3 liftable of lifting platform on most and most under the second transmission parts 21 between, carrying
There is the carrier 1 of silicon wafer to be transmitted on lifting platform 3 by the second transmission parts 21.It is preferably that the quantity of the second transmission parts 21 is 2
It is a, facilitate description in order to following, therefore the second transmission parts 21 for being set on most and most under the second transmission parts 21 be respectively adopted not
It is indicated with label, respectively the second transmission parts 21a and the second transmission parts 21b.Second transmission parts 21a will be loaded with the load of silicon wafer
Tool 1 is transmitted to lifting platform 3 from outside, and due to being provided with multiple first slots 11 in carrier 1, and silicon wafer is stacked in carrier in multi-disc
In 1 in first slot 11, the silicon wafer in carrier 1 can be accurately obtained in order to Shi Qupian mechanism 4, lifting platform 3 is being gone up and down
Steppingly decline under the driving of motor 9, to make the position pair of the first slot 11 and the first transmission parts 41 of Qu Pian mechanism 4
It answers, carrier 1 is transmitted to outside by the second transmission parts 21b after taking piece.It is understood that carrier 1 can also be passed from second
Part 21b is sent to transport to lifting platform 3, lifting motor 9 drives carrier 1 to rise in step-by-step movement and export from the second transmission parts 21a.
It please refers to shown in Fig. 4 and Fig. 5, carrier transmission mechanism 2 further includes the tensioning degree for adjusting the second transmission parts 21
Drive mechanism 22, drive mechanism 22 includes bracket 221, driving wheel 222 and driven wheel 223, and driving wheel 222 is articulated in bracket
On 221, specifically, driving shaft 221a is articulated on bracket 221, driving wheel 222 is set on driving shaft 221a；Driven wheel 223
It is sticked in bracket 221, adjusts the distance between driving wheel 222 and driven wheel 223 to adjust the tensioning journey of the second transmission parts 21
Degree.Specifically, driven wheel 223 includes wheel body 223a and shaft 223b, and wheel body 223a is articulated on shaft 223b, shaft 223b
End have and be recessed towards axle center the cutting face 223c to be formed, the end of shaft 223b can be understood as circular cylinder edge
The structure formed after its axis cutting a part, the end of certain shaft 223b, which directly can be integrally formed or forge, to be obtained
?；Two cutting face 223c are coplanar, to guarantee when the both ends of shaft 223b are fixed, the direction of two cutting face 223c
It is identical, so that the axle center at the both ends shaft 223b is identical at a distance from the axle center of driving shaft 221a；The end of shaft 223b is in can
Being sticked on bracket 221 for disassembly, specifically, is fixedly connected with a fixed plate 224, offers in fixed plate 224 on bracket 221
At least it can be carried out the card slot 224a being fixed towards two different directions for the cutting face 223c of shaft 223b；Certainly, card slot
224a can also be directly opened on bracket 221, fixed plate 224 that no setting is required under the premise of this, therefore be not limited；By changing
The distance between driving wheel 222 and wheel body 223a is adjusted in the clamped position on bracket 221 in cutting face 223c, specifically, will
Shaft 223b is disassembled from card slot 224a, then by the another location card of the cutting face 223c of shaft 223b and card slot 224a
It closes, to change cutting face 223c in the clamped position on bracket 221, makes the axle center of shaft 223b towards separate driving shaft 221a's
The positional shift in axle center, thus adjustable the distance between driving wheel 222 and wheel body 223a.
As shown in fig. 6, the end dotted line supplement of shaft 223b is completely rounded to be further understood from this at one
Apply for the end of shaft 223b and the matching relationship of card slot 224a；G represents cutting face 223c in the card on bracket 221 in figure
Coincidence sets the state diagram of the shaft 223b and driving shaft 221a at place, specifically, the cutting face 223c of the end of shaft 223b and card
The clamped position that the left side of slot 224a contradicts, the centre distance of shaft 223b and driving shaft 221a is D1, the engaging position at this time
The centre distance for setting place shaft 223b and driving shaft 221a is minimum；In figure H represent on the basis of G change cutting face 223c in
The state diagram of shaft 223b and driving shaft 221a after clamped position on bracket 221, specifically, the end of shaft 223b is cut
The clamped position that the right side of bevel 223c and card slot 224a contradict, the at this time centre distance of shaft 223b and driving shaft 221a
For D2, the centre distance of shaft 223b and driving shaft 221a is maximum at the clamped position；The difference of D2 and D1 is △ d；Shaft
223b changes the clamped position into H from the clamped position in G, and shaft 223b and the centre distance of driving shaft 221a increase
△ d, to increase the tensile force for the transmission parts being wound between the driving wheel 222 and the wheel body 223a；Conversely, shaft
223b changes the clamped position into G from the clamped position in H, and the centre distance of shaft 223b and driving shaft 221a reduces △
D, to reduce the tensile force for the transmission parts being wound between the driving wheel 222 and the wheel body 223a；When shaft 223b from
When state shown in G changes towards state shown in H in figure, shaft 223b and the centre distance of driving shaft 221a are gradually increased, and are most increased
The distance of big △ d；When state shown in H changes shaft 223b towards state shown in G from figure, shaft 223b and driving shaft 221a
Centre distance be gradually reduced, maximum reduce △ d distance.It can be seen that by adjusting shaft 223b and driving shaft 221a
Centre distance, thus the tensile force of adjustable transmission parts.
It please refers to shown in Fig. 1-3, the first transmission parts 41 of Qu Pian mechanism 4 are telescopic transmission belt, the first transmission parts 41
It is fixed on rack 10 and one end is connect with chip transmission mechanism 5, the other end protrudes into carrier 1 and takes piece and transmit overlapping silicon wafer piecewise
To chip transmission mechanism 5, after the chip transmission in carrier 1, the first transmission parts 41 are shunk to exit carrier 1.
It please refers to shown in Fig. 1-3, chip transmission mechanism 5 includes the third transmission parts 51 in arranged in matrix, is located at first row
Third transmission parts 51 be arranged and is located between the first transmission parts 41 and testing agency 6 in lateral transport, remaining third arranged biography
Part 51 is sent to be arranged in longitudinal transmission, B area is the third transmission parts 51 positioned at first row in figure, and the region C is positioned at remaining in figure
The third transmission parts 51 of row.Preferably it is that the third transmission parts 51 that lateral transport is arranged are provided with a row, is set in longitudinal transmission
The third transmission parts 51 set are provided with two rows, facilitate description in order to following, therefore the third transmission parts 51 for being set to different rows are distinguished
It is indicated using different labels, in the third transmission parts 51 being laterally arranged marked as third transmission parts 51a, in longitudinally disposed
Two ranked third transmission parts 51 respectively marked as third transmission parts 51b and third transmission parts 51c, and third transmission parts 51a, third pass
Part 51b and third transmission parts 51c is sent successively to dock from the bottom to top.It is preferably that the quantity of third transmission parts 51a is 5, third
The quantity of transmission parts 51b and third transmission parts 51c are corresponding with the quantity of third transmission parts 51a, and silicon wafer is transmitted to each third piecewise
Then the corresponding position of transmission parts 51a successively enters under the transmission of third transmission parts 51b and third transmission parts 51c next
Station.Due to third transmission parts 51a and third transmission parts 51b docking setting, inevitably occur between the two influence each other to
Production efficiency is reduced, therefore, chip transmission mechanism 5 is additionally provided with climbing structure 52, and climbing structure 52 is fixed on third transmission parts
The lower section of 51a, and control driving third transmission parts 51a above and below the third transmission parts 51b between go up and down, thus effectively
The movement between third transmission parts 51a and third transmission parts 51b is isolated.Specifically, climbing structure 52 includes cylinder (not shown)
With connecting rod (not shown), the movement of cylinder drive link and pushing tow third transmission parts 51a lifting.Third transmission parts 51 include transmission belt
511 and transmission electrical machine 512, transmission electrical machine 512 drives transmission belt 511 to run, and the third transmission parts 51 positioned at same row are by same
Motor driven, that is, the transmission parts 51a of first row by same motor driven, the transmission parts 51b of second row by same motor driven,
The transmission parts 51c of third row is by same motor driven.Due to silicon wafer wet processing unit require silicon wafer with slow speed into
Enter, therefore, the structure of the third transmission parts 51c and third transmission parts 51a and third transmission parts 51b that are docked with wet processing unit
It is slightly different, is a difference in that third transmission parts 51c further includes second controller (not shown), second controller and third transmit
The transmission electrical machine 512 of part 51c is electrically connected, and the transmission electrical machine 512 that second controller controls third transmission parts 51c operates, thus
Adjust the running speed of the transmission belt 511 of third transmission parts 51c.Velocity pick-up is installed on the wet processing unit of next station
Device (not shown), velocity sensor and second controller are electrically connected, and velocity sensor transmits the speed of wet processing unit
Transmission electrical machine 512 to second controller, second controller control third transmission parts 51c keeps it and wet processing unit
The movement of identical speed and by chip transmission to next station, thus make silicon wafer be decelerated to speed identical with next station again into
Enter next station.The combination of third transmission parts 51b and third transmission parts 51c can not only meet the quick transmission of silicon wafer early period, but also
Meet the jogging speed of manufacturing technique requirent, to improve the production efficiency of silicon wafer.
It please refers to shown in Fig. 7 and Fig. 8, chip transmission mechanism 5 further includes for adjusting 51 tensioning degree of third transmission parts
Adaptive pre-fastening structure 53, adaptive pre-fastening structure 53 include tensioning wheel 531, fixing piece 532, regulating part 533, elasticity
Part 534 and locating part 535.Tensioning wheel 531 is set on regulating part 533 by 531 axis 531a of tensioning wheel, selectable to incite somebody to action
Tensioning wheel 531, which is fixed on regulating part 533, not to be rotated, and can also enable tensioning wheel 531 by 531 axis 531a of tensioning wheel in regulating part
It is rotated on 533.Locating part 535 is fixedly connected after fixing piece 532 with regulating part 533 in sliding, so that fixing piece 532
It is connected with regulating part 533, there are gaps between fixing piece 532 and regulating part 533, and elastic component 534 is in compression shape setting
Between fixing piece 532 and the gap of regulating part 533, in its natural state, 534 perseverance of elastic component is by regulating part 533 towards far from solid
Determine the direction bias of part 532, the variation of 531 stress of tensioning wheel carries out the gap between fixing piece 532 and regulating part 533
Automatic adjusument.
Fig. 7 and Figure 10 is please referred to, specifically, is adjusted when adaptive pre-fastening structure 53 is applied to chip transmission mechanism 5
Part 533 does not deflect, and the guide groove 532a being inserted into for regulating part 533 is offered in the opposite two sides of fixing piece 532,
And guide part 533a is convexly equipped on the corresponding position of regulating part 533, guide part 533a is inserted into guide groove 532a, guiding
Portion 533a is slided in guide groove 532a along the axial of locating part 535, during transmission belt 511 is run, guide part 533a
With the tensile force variation of transmission belt 511, sliding can make transmission belt 511 be kept for appropriate in guide groove 532a accordingly
Clamp force avoids the occurrence of skidding or excessively tight situation.Certainly, operator can also be provided with hole confession on fixing piece 532
The guide part 533a of regulating part 533 is inserted into, and can be slided in hole；Also guide part can be convexly equipped on fixing piece 532
533a offers the guide groove 532a for guide part 533a insertion in the opposite sides of regulating part 533 accordingly.
Please refer to Fig. 8 to Fig. 9, adaptive pre-fastening structure 53 in the raw when, elastic component 534 is permanent by regulating part
533 towards far from fixing piece 532 direction bias, in its natural state, the bottom to the bottom of guide groove 532a of guide part 533a
Between distance be L1, when adaptive pre-fastening structure 53 is in running order, transmission belt 511 is around on tensioning wheel 531, fixed
Part 532 is fixed in rack 10, is limited between fixing piece 532 and regulating part 533 by locating part 535, works as transmission belt
When 511 tensile force rises, transmission belt 511 gives tensioning wheel 531 1 power along the direction F, and the stress of tensioning wheel 531 becomes larger,
Since tensioning wheel 531 is arranged on regulating part 533, power suffered by tensioning wheel 531 is transferred to elastic component 534 by regulating part 533
In, elastic component 534 compresses, and tensioning wheel 531 and regulating part 533 change with elastic component 534, and regulating part 533 is along locating part 535
The axial direction towards close to fixing piece 532 slide, the distance of regulating part 533 to fixing piece 532 shortens, at this time guide part
533a regards position bottom to the distance between the bottom of guide groove 532a as L2, and distance L2 < L1, to adjust transmission belt 511
Tensioning degree makes transmission belt 511 remain to moving around tensioning wheel 531 for abutting；Conversely, the tensile force when transmission belt 511 declines
When, transmission belt 511 relaxes, and the stress of tensioning wheel 531 becomes smaller, and extends elastic component 534, makes regulating part 533 along locating part
The 535 axial direction towards separate fixing piece 532 is slided, and is kept regulating part 533 elongated to the distance of fixing piece 532, is adjusted transmission
With 511 tensioning degree, so that transmission belt 511 is remained to moving around tensioning wheel 531 for abutting, avoid the occurrence of skidding.
In conjunction with shown in Fig. 1 to Figure 10, the course of work of upper piece machine 100 unilateral to the utility model is described in detail：
The second transmission parts 21a, the second transmission parts 21a that the carrier 1 for neatly setting silicon wafer is placed in carrier transmission mechanism 2 will
Carrier 1 transport to lifting platform 3, the first transmission parts 41 of Qu Pian mechanism 4 stretch in carrier 1, lifting platform 3 steppingly successively under
Drop, the first transmission parts 41 spread out of silicon wafer piecewise, and silicon wafer is directly transferred to silicon after guiding mechanism 7 is to the correction of position of silicon wafer
Piece transmission mechanism 5 is transmitted to cache mechanism 8, and cache mechanism 8 rises and temporary part is transmitted across fast silicon wafer, chip transmission
The third transmission parts 51a of mechanism 5 is by silicon wafer lateral transport, so that silicon wafer be made to be distributed in third transmission parts 51a's evenly and at intervals
Corresponding position, the decline of climbing structure 52 interlock third transmission parts 51a and drop to the lower section of third transmission parts 51b, make silicon wafer from the
Three transmission parts 51a switch to third transmission parts 51b, and third transmission parts 51b passes chip transmission to third transmission parts 51c, third
Send part 51c that silicon wafer is made to be decelerated to speed identical with next station, then by chip transmission to next station, third transmission parts 51a
Rise to the top of third transmission parts 51b and the first transmission parts 41 with Qu Pian mechanism 4 again under the pushing tow of climbing structure 52
Sustained height is maintained to reset.Until after silicon wafer is all spread out of in current carrier 1, the first transmission parts 41 of Qu Pian mechanism 4,
Empty carrier 1 is delivered to the second transmission parts 21b under being located at most by lifting platform 3, and when carrier 1 is replaced, cache mechanism 8 declines simultaneously
Pre-stored silicon wafer is discharged to keep continuously transmitting for silicon wafer.Testing agency 6 is randomly to the silicon in chip transmission mechanism 5
Piece carries out quality sampling Detection, and silicon wafer is simultaneously placed into detection list by transmission device by the adsorption piece absorption silicon wafer of testing agency 6
Member 61 is weighed, and chip transmission is gone back to chip transmission mechanism 5 after weighing and feeds back weighing data to the first controller, if repeatedly taking out
Examine unqualified, then the warning device in testing agency 6 will issue alarm signal to notify testing staff to debug and modify.
In conjunction with shown in Fig. 1-Figure 10, unilateral upper piece machine of the utility model is due to by carrier transmission mechanism 2, Qu Pian mechanism
4, multiple mechanisms such as chip transmission mechanism 5 and testing agency 6 are combined together, and silicon wafer is in carrier transmission mechanism 2, Qu Pian mechanism 4
It is waited with chip transmission mechanism 5 and enters testing agency 6 under transports, and transport silicon wafer to next station after testing agency 6 is detected,
To realize the chip transmission before wet-etching technology and detection integration, commissioning staff can sentence according to the detection data of silicon wafer
Whether disconnected Si wafer quality complies with standard and is adjusted in time to machine, to improve the quality and qualification rate of silicon wafer；Further
Ground, since carrier transmission mechanism 2, Qu Pian mechanism 4, chip transmission mechanism 5 and testing agency 6 are successively in unilateral pipeline system cloth
Set, enough installation spaces can not only be provided for testing agency 6, overcome traditionally piece machine without space setting testing agency 6
Disadvantage, but also provide the space closely checked and adjusted for staff and improved on the whole to be modified in time
Production efficiency, quality and qualification rate of silicon wafer etc. meet the needs in market.At the same time, mechanism 6 can be will test as needed to set
Various silicon wafer detection devices are set to, flexibility is high, strong applicability.To sum up, the unilateral upper piece machine of the utility model can be work
Personnel provide debugging space and realize silicon wafer upper piece and detection it is full-automatic, and improve working efficiency.
Natural, this unilateral upper piece machine can also be used in transmission and detection in photovoltaic art in addition to silicon wafer,
Other can also be used in need in the technical field of feeding, be not limited with photovoltaic art.
It above disclosure is merely preferred embodiments of the utility model, certainly cannot be practical new to limit this with this
The interest field of type, therefore equivalent variations made according to the patent scope of the utility model still belong to the utility model and are covered
Range.
Claims (15)
1. a kind of unilateral upper piece machine, suitable for carrying out transmission and sampling Detection to the silicon wafer carrier, which is characterized in that the list
Side upper piece machine includes：
Carrier, the carrier is interior to be provided with several the first slots for silicon wafer insertion in parallel；
Carrier transmission mechanism, the carrier for carrying silicon wafer are transmitted on a lifting platform by the carrier transmission mechanism；
Qu Pian mechanism, the Qu Pian mechanism are docked with the lifting platform, and the Qu Pian mechanism has telescopic first transmission parts,
By the lifting of the lifting platform so that taking out silicon wafer one by one in the carrier that first transmission parts protrude on the lifting platform；
Chip transmission mechanism, the chip transmission mechanism are docked with the Qu Pian mechanism, and silicon wafer is passed by first transmission parts
Transport to the chip transmission mechanism, the chip transmission mechanism is by chip transmission to next station；
Testing agency, the testing agency dock with the chip transmission mechanism, the transmission of the chip transmission mechanism selectivity
Silicon wafer is in the testing agency.
2. unilateral upper piece machine as described in claim 1, it is characterised in that：The testing agency includes that adsorption piece and detection are single
Member, adsorbing silicon wafer from first transmission parts and being transmitted in the detection unit for the adsorption piece selectivity are examined
It surveys.
3. unilateral upper piece machine as claimed in claim 2, it is characterised in that：The detection unit is to measure the weighing of silicon wafer weight
Instrument.
4. unilateral upper piece machine as claimed in claim 3, it is characterised in that：It will be outer when the testing agency further includes for weighing
The cover that boundary and silicon wafer separate.
5. unilateral upper piece machine as claimed in claim 2, it is characterised in that：The testing agency further includes the first controller and use
In the warning device for reminding testing staff to be debugged, first controller is electric with the detection unit and warning device respectively
Property connection.
6. unilateral upper piece machine as described in claim 1, it is characterised in that：The carrier transmission mechanism includes at least two mutually flat
Row and successively in the second transmission parts of superposition shape setting, second transmission parts of the lifting platform liftable on most with most under the
Between two transmission parts, the carrier for carrying silicon wafer is transmitted on the lifting platform by second transmission parts.
7. unilateral upper piece machine as claimed in claim 6, it is characterised in that：The carrier transmission mechanism further includes for adjusting
The drive mechanism of the second transmission parts tensioning degree is stated, the drive mechanism includes bracket, driving wheel and driven wheel, the driving wheel
Be articulated on the bracket, the driven wheel is sticked in the bracket, adjust the distance between the driving wheel and driven wheel from
And adjust the tensioning degree of second transmission parts.
8. unilateral upper piece machine as claimed in claim 7, it is characterised in that：The driven wheel includes wheel body and shaft, the wheel
Body is articulated in the shaft, and the end of the shaft has the cutting face to be formed that is recessed towards axle center, and two cutting faces are coplanar,
The end of the shaft is in being removably sticked on the bracket, by changing the cutting face in the engaging on the bracket
The distance between driving wheel described in position-adjustable and the driven wheel.
9. unilateral upper piece machine as described in claim 1, it is characterised in that：It further include guiding mechanism, the guiding mechanism is symmetrical
Ground is set to the two sides of first transmission parts to correct the position of silicon wafer.
10. unilateral upper piece machine as claimed in claim 9, it is characterised in that：It further include liftable cache mechanism, the caching
In parallel several the second slots for silicon wafer insertion that are provided in mechanism, the cache mechanism be set to the guiding mechanism with
Between the chip transmission mechanism, silicon wafer is inserted into second slot by first transmission parts one by one, the chip transmission
Mechanism is one by one by the chip transmission in second slot to next station.
11. unilateral upper piece machine as described in claim 1, it is characterised in that：The chip transmission mechanism includes in arranged in matrix
Third transmission parts, the third transmission parts positioned at first row are arranged in lateral transport and are located at first transmission parts and institute
It states between testing agency, the third transmission parts of remaining row are in longitudinal transmission setting.
12. unilateral upper piece machine as claimed in claim 11, it is characterised in that：The chip transmission mechanism further includes jacking knot
Structure, the climbing structure connects with the third transmission parts for being located at first row, and control driving positioned at described the of first row
The lifting of three transmission parts.
13. unilateral upper piece machine as claimed in claim 11, it is characterised in that：The chip transmission mechanism further includes for adjusting
The adaptive pre-fastening structure of the third transmission parts tensioning degree, the adaptive pre-fastening structure include tensioning wheel, fixation
Part, regulating part, elastic component and locating part, the tensioning wheel are set on the regulating part, and the locating part is worn in sliding
It is fixedly connected after crossing the fixing piece with the regulating part, the elastic component is set to the fixing piece and the tune in compression shape
It saves between part, the elastic component perseverance is by the regulating part towards far from fixing piece direction bias, the change of the tensioning wheel stress
Changing will make the gap between the fixing piece and the regulating part carry out automatic adjusument.
14. unilateral upper piece machine as claimed in claim 13, it is characterised in that：The fixing piece opposite sides is offered for institute
The guide groove of regulating part insertion is stated, the regulating part is convexly equipped with guide part, and the guide part is inserted into the guide groove, described
Guide part is slided in the guide groove along the axial of the locating part to adjust the tensioning degree of third transmission parts.
15. unilateral upper piece machine as claimed in claim 11, it is characterised in that：It is described to be arranged in longitudinal transmission and be located at same row
The third transmission parts by same motor driven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820280155.9U CN208127171U (en) | 2018-02-27 | 2018-02-27 | Unilateral upper piece machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820280155.9U CN208127171U (en) | 2018-02-27 | 2018-02-27 | Unilateral upper piece machine |
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| CN208127171U true CN208127171U (en) | 2018-11-20 |
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| CN201820280155.9U Expired - Fee Related CN208127171U (en) | 2018-02-27 | 2018-02-27 | Unilateral upper piece machine |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231643A (en) * | 2018-02-27 | 2018-06-29 | 东莞晟能自动化设备有限公司 | Unilateral upper piece machine |
| CN110349894A (en) * | 2019-06-13 | 2019-10-18 | 上海提牛机电设备有限公司 | Wafer charging equipment and wafer handling system |
-
2018
- 2018-02-27 CN CN201820280155.9U patent/CN208127171U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231643A (en) * | 2018-02-27 | 2018-06-29 | 东莞晟能自动化设备有限公司 | Unilateral upper piece machine |
| CN110349894A (en) * | 2019-06-13 | 2019-10-18 | 上海提牛机电设备有限公司 | Wafer charging equipment and wafer handling system |
| CN110349894B (en) * | 2019-06-13 | 2021-08-03 | 上海提牛机电设备有限公司 | Wafer loading equipment and wafer processing system |
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