CN208126414U - Ultrasonic fingerprint identifies mould group and display device - Google Patents
Ultrasonic fingerprint identifies mould group and display device Download PDFInfo
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- CN208126414U CN208126414U CN201820788519.4U CN201820788519U CN208126414U CN 208126414 U CN208126414 U CN 208126414U CN 201820788519 U CN201820788519 U CN 201820788519U CN 208126414 U CN208126414 U CN 208126414U
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Abstract
The utility model discloses a kind of ultrasonic fingerprint identification mould group and display devices, and wherein the ultrasonic fingerprint identifies that mould group includes：Underlay substrate；At least one ultrasonic signal transmitting unit and at least one ultrasound signal receipt unit being set on underlay substrate, wherein ultrasonic signal transmitting unit and ultrasound signal receipt unit are located at the same side of underlay substrate and are arranged along first direction interval；It is set to ultrasonic signal transmitting unit and ultrasound signal receipt unit deviates from the piezoelectric sensing layer of underlay substrate side, piezoelectric sensing layer corresponds to thickness of the part of ultrasonic signal transmitting unit on the direction perpendicular to underlay substrate and is greater than thickness of the part of corresponding ultrasound signal receipt unit on the direction perpendicular to underlay substrate；It is set to the first electrode layer that piezoelectric sensing layer deviates from underlay substrate side.The utility model improves fingerprint recognition precision.
Description
Technical field
The utility model relates to ultrasonic fingerprint identification technology field, in particular to a kind of ultrasonic fingerprint identification mould group and
Display device.
Background technique
Ultrasonic fingerprint technology has many unique advantages compared with the fingerprint technique based on capacitive touch screen, including
The smart phone shell made of glass or plastics etc. can be penetrated to be scanned, and scan can not by finger there may be
The dirts such as sweat, hand lotion or condensation influenced, to provide a kind of more stable and accurate fingerprint identification method.?
In the prior art, ultrasonic signal transmitting unit applies the voltage on piezoelectric material, and piezoelectric material converts electrical signals to surpass
Acoustic signals, when on the cover board of finger pressing ultrasonic fingerprint identification mould group, the ridge of fingerprint is directly contacted with cover board, and fingerprint
Paddy and cover board between there are the biggish air of acoustic resistance, therefore when ultrasonic signal by finger surface reflect when, Gu He
The ultrasonic intensity that the position of ridge is reflected back is different, these ultrasonic waves act on the piezoelectric materials again, so that the pressure of different location
Electric material produces different voltage signals, these voltage signals are exported to external circuit simultaneously by ultrasound signal receipt unit
It is detected, so as to identify fingerprint image.
Utility model content
The utility model aims to solve at least one of the technical problems existing in the prior art, proposes a kind of ultrasonic wave and refers to
Line identifies mould group and preparation method thereof and display device.
To achieve the above object, the utility model provides a kind of ultrasonic fingerprint identification mould group, including：
Underlay substrate；
At least one the ultrasonic signal transmitting unit and at least one ultrasonic signal being set on the underlay substrate
Receiving unit, wherein the ultrasonic signal transmitting unit and the ultrasound signal receipt unit are located at the underlay substrate
The same side and along first direction interval be arranged, orthographic projection of the ultrasonic signal transmitting unit on the underlay substrate with
Orthographic projection no overlap of the ultrasound signal receipt unit on the underlay substrate；
The ultrasonic signal transmitting unit and the ultrasound signal receipt unit are set to away from the underlay substrate
The piezoelectric sensing layer of side, the piezoelectric sensing layer correspond to the part of the ultrasonic signal transmitting unit perpendicular to the lining
Thickness on the direction of substrate is greater than the part of the corresponding ultrasound signal receipt unit perpendicular to the underlay substrate
Direction on thickness；
It is set to the first electrode layer that the piezoelectric sensing layer deviates from the underlay substrate side.
Optionally, the ultrasound signal receipt unit includes that multiple ultrasonic signals spaced in a second direction connect
Subelement is received, the first direction intersects with the second direction.
Optionally, the ultrasonic signal transmitting unit includes the strip ultrasonic signal extended in a second direction a hair
Penetrate subelement.
Optionally, the ultrasonic signal transmitting unit includes multiple along the spaced ultrasonic wave letter of the second direction
Number transmitting subelement.
Optionally, the ultrasonic signal transmitting unit includes first film transistor circuit and emission electrode, and described
The voltage that one thin-film transistor circuit is used to provide external circuit is applied to the emission electrode, the emission electrode and institute
The voltage stated between first electrode excites the piezoelectric sensing layer to generate ultrasonic wave；
The ultrasound signal receipt unit includes the second thin-film transistor circuit and receiving electrode, and the receiving electrode is used
In receiving the voltage handling the ultrasonic wave of digital reflex and converting in the piezoelectric sensing layer, second thin-film transistor circuit is used
In the received voltage of the receiving electrode is transferred to external circuit to sense.
Optionally, the ultrasound signal receipt subelement be parallel to underlay substrate cross sectional shape be rectangle, described section
Face is having a size of 50um*50um.
Optionally, it is rectangle that ultrasonic signal transmitting subelement, which is parallel to the cross sectional shape of underlay substrate, described section
Face is having a size of 50um*50um.
Optionally, the piezoelectric sensing layer corresponds to the part of ultrasonic signal transmitting unit in the side perpendicular to underlay substrate
It is upward with a thickness of 10um, the part of corresponding ultrasound signal receipt unit on the direction perpendicular to underlay substrate with a thickness of
5um。
Optionally, the material for preparing of the piezoelectric sensing layer includes polyvinyl chloride, polycarbonate, Kynoar, gathers partially
One of difluoroethylene, polyvinylidene fluoride trifluoro-ethylene, polymethyl methacrylate, teflon-copolymers.
Optionally, the material for preparing of the first electrode layer includes aluminium.
To achieve the above object, the utility model additionally provides a kind of display device, including：Such as above-mentioned ultrasonic fingerprint
Identify mould group and display panel, the non-light emission side of the display panel is arranged in the ultrasonic fingerprint identification mould group.
To achieve the above object, the utility model additionally provides a kind of preparation method of ultrasonic fingerprint identification mould group, packet
It includes：
One underlay substrate is provided, forms at least one ultrasonic signal transmitting unit and at least one on the underlay substrate
A ultrasound signal receipt unit, wherein the ultrasonic signal transmitting unit and the ultrasound signal receipt unit are located at
The same side of the underlay substrate is simultaneously arranged along first direction interval, and the ultrasonic signal transmitting unit is in the underlay substrate
On orthographic projection and orthographic projection no overlap of the ultrasound signal receipt unit on the underlay substrate；
It is formed in the ultrasonic signal transmitting unit and the ultrasound signal receipt unit away from underlay substrate side
Piezoelectric sensing layer, wherein the piezoelectric sensing layer corresponds to the part of the ultrasonic signal transmitting unit in the vertical substrate
Thickness on the direction of substrate is greater than the part of the corresponding ultrasound signal receipt unit in the side of the vertical underlay substrate
Upward thickness；
First electrode layer is formed away from the underlay substrate side in the piezoelectric sensing layer.
Optionally, described to deviate from underlay substrate side shape in ultrasonic signal transmitting unit and ultrasound signal receipt unit
It is specifically included at piezoelectric sensing layer：
One transfer template is provided, forms piezoelectric sensing material layer in the transfer template and to the piezoelectric sensing material
Layer is patterned；
The piezoelectric sensing material layer that will be patterned into is transferred to the ultrasonic signal transmitting unit and the ultrasonic wave
Signal receiving unit deviates from underlay substrate side, obtains the piezoelectric sensing layer.
Optionally, described to deviate from underlay substrate side shape in ultrasonic signal transmitting unit and ultrasound signal receipt unit
It is specifically included at piezoelectric sensing layer：
It is formed in the ultrasonic signal transmitting unit and the ultrasound signal receipt unit away from underlay substrate side
Amorphous polymeric piezoelectric material layer；
One pressure artwork tool is provided, amorphous polymeric piezoelectric material layer is pressed using pressure artwork tool
Figure；
Crystallization processing is carried out to amorphous polymeric piezoelectric material layer after pressure figure, obtains the piezoelectric sensing
Layer.
The utility model has the advantages that：
In ultrasonic fingerprint identification mould group provided by the utility model and preparation method thereof and the technical solution of display device,
Ultrasonic signal transmitting unit and ultrasound signal receipt unit are located at the same side of underlay substrate and set along first direction interval
It sets, the two sides for avoiding substrate in process of production require directly to contact with producing line transmission channel and cause wherein side destruction
The problem of, yield is improved, and without carrying out Time-sharing control, reduce manufacture difficulty and manufacturing cost.In addition, piezoelectric sensing layer
Thickness of the part of corresponding ultrasonic signal transmitting unit on the direction perpendicular to the underlay substrate is greater than corresponding ultrasonic wave
Thickness of the part of signal receiving unit on the direction perpendicular to the underlay substrate, allows fingerprint recognition signal more preferable
Ground transmitting and reception, improve the accuracy of identification of fingerprint image.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the structure that a kind of ultrasonic fingerprint that the utility model embodiment one provides identifies mould group；
Fig. 2 is the structure top view that a kind of ultrasonic fingerprint that the utility model embodiment one provides identifies mould group；
Fig. 3 is the structure top view that another ultrasonic fingerprint that the utility model embodiment one provides identifies mould group；
Fig. 4 is the process for the preparation method that a kind of ultrasonic fingerprint that the utility model embodiment three provides identifies mould group
Figure；
Fig. 5 a is the signal for the preparation method that a kind of ultrasonic fingerprint that the utility model embodiment three provides identifies mould group
Figure one；
Fig. 5 b is the signal for the preparation method that a kind of ultrasonic fingerprint that the utility model embodiment three provides identifies mould group
Figure two；
Fig. 6 a is showing for the preparation method that another ultrasonic fingerprint that the utility model embodiment three provides identifies mould group
It is intended to one；
Fig. 6 b is showing for the preparation method that another ultrasonic fingerprint that the utility model embodiment three provides identifies mould group
It is intended to two.
Specific embodiment
To make those skilled in the art more fully understand the technical solution of the utility model, with reference to the accompanying drawing to this reality
It is described in detail with a kind of ultrasonic fingerprint identification mould group and preparation method thereof of novel offer, is omitted in the course of the description
It is unnecessary details and function for the disclosure, to prevent understanding of this disclosure from causing to obscure.In the present specification,
Following various embodiments for describing disclosure principle only illustrate, should not be construed as limiting in any way disclosed model
It encloses.Described below referring to attached drawing is used to help the exemplary of the disclosure that comprehensive understanding is defined by the claims and their equivalents
Embodiment.Described below includes a variety of details to help to understand, but these details are considered as being only exemplary.Cause
This, it will be appreciated by those of ordinary skill in the art that in the case where not departing from the scope of the present disclosure and spirit, it can be to herein
The embodiment of description makes various changes and modifications.In addition, for clarity and brevity, known function and structure is omitted
Description.In addition, running through attached drawing, identical appended drawing reference is used for the same or similar function, device and/or operation.In addition, attached
In figure, each section is not necessarily to scale to draw.In other words, the relative size of each section in attached drawing, length etc. and different
It is fixed corresponding with actual ratio.
In the disclosure, term " includes " and " containing " and its derivative mean including rather than limit；Term "or" is packet
Containing property, mean and/or.In addition, in being described below of the disclosure, used directional terminology, such as "upper", "lower",
"left", "right" etc. is used to instruction relative positional relationship, with auxiliary those skilled in the art understand that the embodiment of the present disclosure, and therefore
It should be understood by those skilled in the art that："upper"/"lower" in one direction can be changed to "lower"/"upper" in the opposite direction, and
In another direction, other positions relationship, such as " left side "/" right side " etc. may be become.
Fig. 1 is the cross-sectional view of the structure that a kind of ultrasonic fingerprint that the utility model embodiment one provides identifies mould group, this is super
Sound wave fingerprint recognition mould group is used to obtain the fingerprint recognition image of finger 20 in sensing face 101, which is identification finger
The plane that finger 20 is placed is provided when 20 fingerprint.As shown in Figure 1, in the present embodiment, ultrasonic fingerprint identification mould group includes：
It underlay substrate 110 and is connect in 110 the same side of underlay substrate and along at least one spaced ultrasonic signal of first direction X
Receive unit 121 and at least one ultrasonic signal transmitting unit 122.In ultrasound signal receipt unit 121 and ultrasonic signal
Transmitting unit 122 is provided with piezoelectric sensing layer 130 on a side surface of the underlay substrate 110.Wherein, piezoelectric sensing
Thickness of the part of ultrasonic signal transmitting unit 122 on the direction perpendicular to underlay substrate 110 is corresponded in layer 130 is greater than pressure
Thickness of the part of ultrasound signal receipt unit 121 on the direction perpendicular to underlay substrate 110 is corresponded in electric sensing layer 130
Degree.First electrode layer 140 is provided on a side surface of the piezoelectric sensing layer 130 away from underlay substrate 110.In first electrode layer
140 are additionally provided with insulating layer 150 on a side surface of underlay substrate 110, this insulating layer 150 can play the work of planarization
With and guarantee the other structures mutually insulated of first electrode layer 140 Yu upper layer.
In the present embodiment ultrasonic fingerprint identification mould group further include circuit board, for by ultrasonic fingerprint identification mould group and
External circuit realizes electrical connection.It include the first film transistor circuit and hair being electrically connected to each other in ultrasonic signal transmitting unit
Radio pole, ultrasound signal receipt unit include the second thin-film transistor circuit and receiving electrode being electrically connected to each other.Work as ultrasound
When wave fingerprint recognition mould group works, external circuit is brilliant to the first film in ultrasonic signal transmitting unit 122 by circuit board
Body pipe circuit inputs a voltage signal and makes the emission electrode and first electrode layer 140 in ultrasonic signal transmitting unit 122
Between there are voltage difference, this voltage signal acts on corresponding piezoelectric sensing layer 130 and excites the part piezoelectric sensing layer
130 emit ultrasonic wave upwards, can reflect when these ultrasonic waves propagate to finger 20.Due at the fingerprint valley of finger 20 with refer to
Compared to there are the acoustic resistance of more air and air is larger at wrinkle ridge, therefore reflected ultrasonic wave at the fingerprint valley of finger 20
Intensity is greater than reflected signal strength at fingerprint ridge.Piezoelectric sensing layer corresponding to ultrasound signal receipt unit 121
130 convert electric signal of different sizes for these ultrasonic signals and are applied to connecing in ultrasound signal receipt unit 121
It receives on electrode, the second thin-film transistor circuit in ultrasound signal receipt unit 121 passes these electric signals of different sizes
External circuit is handed to be sensed to form fingerprint recognition image.
In the present embodiment, since ultrasound signal receipt unit 121 and ultrasonic signal transmitting unit 122 are located at substrate
The same side of substrate and it is arranged along the interval first direction X, therefore the two sides for avoiding substrate in process of production require and produce
Line transmission channel directly contacts and causes the problem of wherein side is destroyed, and improves yield.In addition, in the prior art, one
As ultrasonic signal transmitting unit and ultrasonic signal transmission/reception unit are separately positioned on to the two sides of substrate, since ultrasonic wave is believed
Perpendicular to underlay substrate, therefore in order to prevent, ultrasonic signal transmitting unit is sent out in the direction of number transmitting unit transmitting ultrasonic signal
The ultrasonic signal penetrated reflects without finger and is directly received and be sensed by ultrasonic wave receiving unit, and the prior art will generally surpass
Acoustic signals transmitting unit and ultrasound signal receipt unit carry out Time-sharing control, to improve signal-to-noise ratio.The utility model provides
Embodiment one in ultrasound signal receipt unit 121 and ultrasonic signal transmitting unit 122 be located at substrate in the same of substrate
Side and along the spaced structure of first direction X, ensure that the ultrasonic signal of ultrasonic signal transmitting unit transmitting will not be not
It handles digital reflex and is directly received by ultrasonic wave receiving unit, there is no need to ultrasonic signal transmitting unit and ultrasonic signal
Receiving unit carries out Time-sharing control, to reduce manufacture difficulty and manufacturing cost.
In addition, the generation of piezoelectricity inductive layer could be excited super since ultrasonic signal transmitting unit needs to provide higher voltage
Sound wave, therefore in order to avoid piezoelectric sensing layer is broken down by high-voltage, by the corresponding ultrasonic signal transmitting unit of piezoelectric sensing layer 130
122 part is arranged relatively thick.And relatively thin piezoelectricity inductive layer is more sensitive to ultrasonic wave, is more advantageous to and believes ultrasonic wave
Number it is changed into electric signal, therefore relatively by the part setting of the corresponding ultrasound signal receipt unit 121 of piezoelectric sensing layer 130
It is thin.To sum up, corresponding to the part of ultrasonic signal transmitting unit 122 in piezoelectric sensing layer 130 perpendicular to underlay substrate 110
Direction on thickness be greater than piezoelectric sensing layer 130 in correspond to the part of ultrasound signal receipt unit 121 perpendicular to substrate
The structure of thickness on the direction of substrate 110 is conducive to ultrasonic signal and preferably emits and receive, improves fingerprint image
Accuracy of identification.
Preferably, the part of ultrasonic signal transmitting unit is corresponded in piezoelectric sensing layer 130 perpendicular to underlay substrate 110
Direction on thickness be about 10um, the part of ultrasound signal receipt unit is corresponded in piezoelectric sensing layer 130 perpendicular to lining
Thickness on the direction of substrate 110 is about 5um.
If Fig. 2 is the structure top view that the ultrasonic fingerprint identifies mould group.As Fig. 1 and Fig. 2 together shown in, the embodiment
In, ultrasound signal receipt unit 121 includes the spaced ultrasound signal receipt subelement of multiple Y in a second direction
1211.It is different that ultrasonic wave by the reflection of finger 20 in sensing face 101 generates the piezoelectric sensing layer 130 of different location
Electric signal simultaneously passes to ultrasound signal receipt subelement, is exported to external circuit by circuit board to form fingerprint recognition figure
Picture.Wherein, first direction and second direction are arranged in a crossed manner.Preferably, in the present embodiment, first direction X is in Fig. 2 and Fig. 3
Horizontal direction, second direction Y is illustrate for the vertical direction in Fig. 2 and Fig. 3, in certain the utility model
First direction X and second direction Y are not limited to shown in Fig. 2 and Fig. 3.
Optionally, it is rectangle that ultrasound signal receipt subelement 1211, which is parallel to the cross sectional shape of underlay substrate, section
Side length is 40um to 60um, it is preferable that the size in section is about 50um*50um.Due to the width in a paddy ridge period of finger 20
Degree is usually about 300um, therefore the size of ultrasound signal receipt subelement 1211 is reasonably arranged, so that one of finger 20
The paddy ridge period can correspond to multiple ultrasound signal receipt subelements 1211 to be sensed, and advantageously ensure that fingerprint recognition
Clarity, so that it is guaranteed that the accuracy of fingerprint recognition.The size of ultrasound signal receipt subelement 1211 is in 50um*50um or so
When, the recognition effect of fingerprint is preferable.
Optionally, as shown in Fig. 2, each ultrasonic signal transmitting unit 122 can by independent one in a second direction Y prolong
The ultrasonic wave transmitting subelement 122a composition for the strip stretched.It should be noted that due to each ultrasonic signal transmitting unit
122 voltage signals that are exerted by piezoelectric sensing layer 130 are identical, therefore ultrasonic signal transmitting unit 122 is designed and is grown up
Multiple ultrasound signal receipt subelements 1211 of strip and each column corresponded on second direction Y are configured, and are reduced
Technology difficulty.It is further to note that at this time ultrasonic signal transmitting unit 122 and ultrasound signal receipt unit 121 with
The cabling of circuit board electrical connection need to be set to the fringe region of backboard to get around the ultrasonic wave of strip transmitting subelement 122a, keep away
Exempt from that short circuit occurs；Alternatively, it is provided with insulating layer between ultrasonic signal transmitting unit 122 and ultrasound signal receipt unit 121,
And ultrasonic signal transmitting unit 122 and the cabling of circuit board electrical connection can be set and deviate from the ultrasonic wave of strip in insulating layer
Emit the side of subelement 122a and pass through ultrasonic wave and emit the region subelement 122a, to realize narrow frame.
Optionally, as shown in figure 3, each ultrasonic signal transmitting unit 122 can also be by multiple intervals Y in a second direction
The ultrasonic wave transmitting subelement 122b composition of setting.It is compared to the ultrasonic wave transmitting subelement 122a of strip, which can
Think that ultrasonic signal transmitting unit 122 and ultrasound signal receipt unit 121 and the cabling setting of circuit board electrical connection are being carried on the back
More spaces are reserved in plate intermediate region, and there is no need to all cablings are arranged at back plate edges region to get around strip
Ultrasonic wave emits subelement, so as to realize narrow frame.In addition, the design can first be determined by the variation of sensing electric signals
The contact area of finger 20, and only control the corresponding ultrasonic signal transmitting subelement 122b of the contact area and ultrasonic wave letter
Number receiving subelement 1211 is operable to complete the acquisition to fingerprint image signal, to reduce power consumption.
Optionally, it is rectangle that ultrasonic signal transmitting subelement 122b, which is parallel to the cross sectional shape of underlay substrate, section
Side length is 40um to 60um, it is preferable that the size in section is about 50um*50um.
In addition, it is necessary to which explanation, super due to exciting piezoelectric sensing layer 130 to generate in ultrasonic signal transmitting unit 122
Voltage needed for sound wave is higher, therefore the switch crystal of the first film transistor circuit in ultrasonic signal transmitting unit 122
Pipe needs are especially tailored, to prevent switching transistor to be broken down by high-voltage.
Optionally, the material of piezoelectric sensing layer 130 specifically can be selected but be not limited to：Polyvinyl chloride, polycarbonate gather inclined fluorine
Ethylene, polyvinylidene fluoride (PVDF), polyvinylidene fluoride trifluoro-ethylene (PVDF-TrFE), polymethyl methacrylate
(PMMA), one of copolymers such as polytetrafluoroethylene (PTFE) (TEFLON) or several combinations.
Preferably, the material for preparing of first electrode layer 140 includes aluminium.
In the technical solution of ultrasonic fingerprint identification mould group provided in this embodiment, ultrasonic signal transmitting unit and ultrasound
Wave signal receiving unit is located at the same side of underlay substrate and is arranged along first direction interval, avoids substrate in process of production
Two sides require directly to contact with producing line transmission channel and cause the problem of wherein side is destroyed, improve yield, and nothing
Time-sharing control need to be carried out, manufacture difficulty and manufacturing cost are reduced.In addition, piezoelectric sensing layer corresponds to ultrasonic signal transmitting unit
Thickness of the part on the direction perpendicular to the underlay substrate be greater than the part of corresponding ultrasound signal receipt unit and hanging down
Directly in the thickness on the direction of the underlay substrate, fingerprint recognition signal is allowed preferably to emit and receive, improves finger
The accuracy of identification of print image.
The embodiments of the present invention two provide a kind of display device, which includes：Display panel and ultrasound
The non-light emission side of display panel is arranged in wave fingerprint recognition mould group, ultrasonic fingerprint identification mould group.The display panel may include
Liquid crystal display panel or organic electroluminescent display panel, the ultrasonic fingerprint identify that mould group surpasses using shown in embodiment one
Sound wave fingerprint recognition mould group can be found in the corresponding contents in embodiment one for the statement of ultrasonic fingerprint identification mould group, this
Place repeats no more.
In the technical solution of display device provided in this embodiment,
Ultrasonic signal transmitting unit and ultrasound signal receipt unit are located at the same side of underlay substrate and along first party
It is arranged to interval, the two sides for avoiding substrate in process of production require directly to contact with producing line transmission channel and cause wherein
The problem of side is destroyed improves yield, and without carrying out Time-sharing control, reduces manufacture difficulty and manufacturing cost.In addition,
Piezoelectric sensing layer corresponds to thickness of the part of ultrasonic signal transmitting unit on the direction perpendicular to the underlay substrate and is greater than
Thickness of the part of corresponding ultrasound signal receipt unit on the direction perpendicular to the underlay substrate, so that fingerprint recognition is believed
Number preferably it can emit and receive, improve the accuracy of identification of fingerprint image.
Fig. 4 is the process for the preparation method that a kind of ultrasonic fingerprint that the utility model embodiment three provides identifies mould group
Figure, as shown in figure 4, the preparation method is used to prepare the identification mould group of the ultrasonic fingerprint in embodiment one, which includes：
Step S201, a underlay substrate is provided, forms at least one ultrasonic signal transmitting unit on the underlay substrate
With at least one ultrasound signal receipt unit.
Wherein, ultrasonic signal transmitting unit and ultrasound signal receipt unit are located at the same side of underlay substrate and along
The setting of one direction interval, orthographic projection of the ultrasonic signal transmitting unit on underlay substrate are being served as a contrast with ultrasound signal receipt unit
Orthographic projection no overlap on substrate.Step S202, deviate from ultrasonic signal transmitting unit and ultrasound signal receipt unit
Piezoelectric sensing layer is arranged in underlay substrate side.Piezoelectric sensing layer corresponds to the part of ultrasonic signal transmitting unit perpendicular to substrate
Thickness on the direction of substrate is greater than the part of corresponding ultrasound signal receipt unit on the direction perpendicular to underlay substrate
Thickness
Step S203, first electrode layer is formed away from the underlay substrate side in piezoelectric sensing layer.
Wherein, step S202 is specifically included：Piezoelectric sensing layer is formed in ultrasonic signal transmitting by the method for transfer
On unit and ultrasound signal receipt unit.Specifically, as shown in Figure 5 a, turn first in special preparation with corresponding pattern
Piezoelectric sensing material layer is formed on die plate 30 and makes piezoelectric sensing material pattern layers, then precisely contraposition, such as Fig. 5 b institute
Show, the piezoelectric sensing material layer 130 ' that will be patterned into, which is transferred in, is provided with ultrasonic signal transmitting unit 122 and ultrasonic signal
To form piezoelectric sensing layer 130 on the substrate 110 of receiving unit 121, so that the corresponding ultrasonic signal transmitting of piezoelectric sensing layer 130
Thickness of the part of unit 122 on the direction perpendicular to underlay substrate is greater than the portion of corresponding ultrasound signal receipt unit 121
Divide the thickness on the direction perpendicular to underlay substrate, so as to complete the preparation of piezoelectric sensing layer 130.
Alternatively, piezoelectric sensing layer is formed in ultrasonic signal transmitting unit by the method for pressure figure and ultrasonic signal connects
It receives on unit.Specifically, as shown in Figure 6 a, first in ultrasonic signal transmitting unit 122 and ultrasound signal receipt unit 121
It is laid with amorphous polymeric piezoelectric material layer 130 ' on surface far from 110 side of substrate, at this point, amorphous piezo-polymeric
Object material layer is in elastomeric state.Then have 40 after accurate contraposition to this using the pressure artwork with corresponding pattern of special preparation
Polymeric piezoelectric material layer 130 ' carries out pressure figure, as shown in Figure 6 b, so that the polymeric piezoelectric material layer 130 ' be made to pattern.Most
130 ' crystallization of the polymeric piezoelectric material layer processing that will be patterned into afterwards, obtains piezoelectric sensing layer 130, and make piezoelectric sensing layer
Thickness of the part of 130 corresponding ultrasonic signal transmitting units 122 on the direction perpendicular to underlay substrate is greater than corresponding ultrasound
Thickness of the part of wave signal receiving unit 121 on the direction perpendicular to underlay substrate.So as to complete piezoelectric sensing layer 130
Preparation.It should be noted that the position density of piezoelectric sensing layer different-thickness is different after pressure figure in order to prevent and prevents pair
The ultrasonic signal transmitting unit 122 and ultrasound signal receipt unit 121 of lower section generate damage, therefore crystallize processed
Journey needs carry out after pressure figure, i.e., need to remain the amorphous state of polymeric piezoelectric material layer 130 ' during pressure figure.
The preparation method of ultrasonic fingerprint provided in this embodiment identification mould group can be used for realizing to be provided in embodiment one
Ultrasonic fingerprint identifies mould group, can be found in embodiment one to the specific descriptions of ultrasonic fingerprint identification mould group, details are not described herein again.
The ultrasonic fingerprint identification mould group that the preparation method of ultrasonic fingerprint identification mould group provided in this embodiment is prepared
Technical solution in, ultrasonic signal transmitting unit and ultrasound signal receipt unit are located at the same side of underlay substrate and along
The setting of one direction interval, the two sides for avoiding substrate in process of production require directly to contact with producing line transmission channel and cause
The problem of wherein side is destroyed improves yield, and without carrying out Time-sharing control, reduces manufacture difficulty and manufacturing cost.Separately
Outside, it is big to correspond to thickness of the part of ultrasonic signal transmitting unit on the direction perpendicular to the underlay substrate for piezoelectric sensing layer
In thickness of the part of corresponding ultrasound signal receipt unit on the direction perpendicular to the underlay substrate, so that fingerprint recognition
Signal preferably can emit and receive, and improve the accuracy of identification of fingerprint image.
It is understood that embodiment of above is merely to illustrate that the principles of the present invention and uses exemplary
Embodiment, however the utility model is not limited thereto.For those skilled in the art, this is not being departed from
In the case where the spirit and essence of utility model, various changes and modifications can be made therein, these variations and modifications are also considered as this reality
With novel protection scope.
Claims (11)
1. a kind of ultrasonic fingerprint identifies mould group, which is characterized in that including：
Underlay substrate；
At least one the ultrasonic signal transmitting unit and at least one ultrasound signal receipt being set on the underlay substrate
Unit, wherein the ultrasonic signal transmitting unit and the ultrasound signal receipt unit are located at the same of the underlay substrate
Side simultaneously along first direction interval be arranged, orthographic projection of the ultrasonic signal transmitting unit on the underlay substrate with it is described
Orthographic projection no overlap of the ultrasound signal receipt unit on the underlay substrate；
The ultrasonic signal transmitting unit and the ultrasound signal receipt unit are set to away from the underlay substrate side
Piezoelectric sensing layer, the piezoelectric sensing layer corresponds to the part of the ultrasonic signal transmitting unit perpendicular to the substrate base
Thickness on the direction of plate is greater than the part of the corresponding ultrasound signal receipt unit in the side perpendicular to the underlay substrate
Upward thickness；
It is set to the first electrode layer that the piezoelectric sensing layer deviates from the underlay substrate side.
2. ultrasonic fingerprint according to claim 1 identifies mould group, which is characterized in that
The ultrasound signal receipt unit includes multiple ultrasound signal receipt subelements spaced in a second direction, institute
First direction is stated to intersect with the second direction.
3. ultrasonic fingerprint according to claim 2 identifies mould group, which is characterized in that
The ultrasonic signal transmitting unit includes the strip ultrasonic signal extended in a second direction a transmitting subelement.
4. ultrasonic fingerprint according to claim 2 identifies mould group, which is characterized in that
The ultrasonic signal transmitting unit includes multiple single along spaced ultrasonic signal transmitting of the second direction
Member.
5. ultrasonic fingerprint according to claim 1 identifies mould group, which is characterized in that
The ultrasonic signal transmitting unit includes first film transistor circuit and emission electrode, the first film transistor
The voltage that circuit is used to provide external circuit is applied to the emission electrode, between the emission electrode and the first electrode
Voltage excite the piezoelectric sensing layer to generate ultrasonic wave；
The ultrasound signal receipt unit includes the second thin-film transistor circuit and receiving electrode, and the receiving electrode is for connecing
Receipts handle the voltage that the ultrasonic wave of digital reflex converts in the piezoelectric sensing layer, and second thin-film transistor circuit is used for will
The received voltage of receiving electrode is transferred to external circuit to be sensed.
6. ultrasonic fingerprint according to claim 2 identifies mould group, which is characterized in that
The cross sectional shape that the ultrasound signal receipt subelement is parallel to underlay substrate is rectangle, and the sectional dimension is
50um*50um。
7. ultrasonic fingerprint according to claim 3 identifies mould group, which is characterized in that
It is rectangle that the ultrasonic signal transmitting subelement, which is parallel to the cross sectional shape of underlay substrate, and the sectional dimension is
50um*50um。
8. ultrasonic fingerprint according to claim 1 identifies mould group, which is characterized in that the corresponding ultrasound of the piezoelectric sensing layer
The part of wave signal transmitter unit on the direction perpendicular to underlay substrate with a thickness of 10um, corresponding ultrasound signal receipt list
Member part on the direction perpendicular to underlay substrate with a thickness of 5um.
9. ultrasonic fingerprint according to claim 1 identifies mould group, which is characterized in that the piezoelectric sensing layer prepares material
Material includes polyvinyl chloride, polycarbonate, Kynoar, polyvinylidene fluoride, polyvinylidene fluoride trifluoro-ethylene, poly- methyl-prop
One of e pioic acid methyl ester, teflon-copolymers.
10. ultrasonic fingerprint according to claim 1 identifies mould group, which is characterized in that the preparation of the first electrode layer
Material includes aluminium.
11. a kind of display device, which is characterized in that including：Ultrasonic fingerprint is known as described in any in the claims 1-10
The non-light emission side of the display panel is arranged in other mould group and display panel, the ultrasonic fingerprint identification mould group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820788519.4U CN208126414U (en) | 2018-05-24 | 2018-05-24 | Ultrasonic fingerprint identifies mould group and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820788519.4U CN208126414U (en) | 2018-05-24 | 2018-05-24 | Ultrasonic fingerprint identifies mould group and display device |
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| CN208126414U true CN208126414U (en) | 2018-11-20 |
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| CN (1) | CN208126414U (en) |
Cited By (7)
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