CN208111202U - A kind of high-strength composite mica paper - Google Patents
A kind of high-strength composite mica paper Download PDFInfo
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- CN208111202U CN208111202U CN201820212962.7U CN201820212962U CN208111202U CN 208111202 U CN208111202 U CN 208111202U CN 201820212962 U CN201820212962 U CN 201820212962U CN 208111202 U CN208111202 U CN 208111202U
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- resin film
- film layer
- polyacrylamide resin
- mica paper
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Abstract
A kind of high-strength composite mica paper, including substrate, it is characterized in that, the polyacrylamide resin film layer with form diamond checks hollow hole of one layer of alkali-free glass fiber cloth and a formable layer on alkali-free glass fiber cloth is formed on one side surface of substrate, and then straight forming has one layer of polyacrylamide resin film layer with form diamond checks hollow hole on another side surface of substrate, and stratus mother's lodicule layer has then been separately formed in the outer surface of two sides polyacrylamide resin film layer.The utility model surface smoothness is high, and mechanical strength is better than common mica paper several times, can effectively meet industry to the strength demand of mica paper.
Description
Technical field
The utility model relates to mica products field of insulating, specially a kind of height for having higher-strength and tear resistance
Intensity combined mica paper.
Background technique
Mica is the general name of a kind of hydrous alumino silicates class, is had using mica as mica paper prepared by raw material electrical strong
Degree is high, the electrology characteristic that dielectric loss is low, sheet resistance and volume resistance are high, while also having high temperature resistant, chemical stability etc.
Good characteristic has in coating, paint, fire-fighting and electric utility and is widely applied very much, wherein by mica slurrying and by mica
Starching the mica paper made of paper technology is one of widest application approach of current mica.
Currently, industrial main insulating properties and heat resistance and anti acid alkali performance using mica paper, is mainly used using upper
The insulating materials of affected electrical equipment and electrotechnical apparatus.But prior art manufacture mica paper mechanical strength need into
The raising of one step is to meet increasingly harsh industrial production demand.
Utility model content
The technical issues of the utility model is solved is to provide a kind of high-strength composite mica paper, to solve above-mentioned background
Disadvantage in technology.
The technical issues of the utility model is solved is realized using following technical scheme：
A kind of high-strength composite mica paper, including substrate form one layer of alkali-free glass fibre on one side surface of substrate
The polyacrylamide resin film layer with form diamond checks hollow hole of Wei Bu and a formable layer on alkali-free glass fiber cloth, and in substrate
Another side surface on then straight forming have one layer of polyacrylamide resin film layer with form diamond checks hollow hole, and it is poly- in two sides
The outer surface of acrylamide resin film layer has then been separately formed stratus mother's lodicule layer.
In the present invention, the base band is copper-plated graphite piece or Ni-coated graphite piece, with a thickness of 30 ~ 40 μm.
In the present invention, the polyacrylamide resin film layer in both side surface by epoxide-resin glue with it is corresponding
Adjacent structure adhesion and whole compaction moulding.
In the present invention, the thickness in monolayer of the mica lodicule layer is 50 ~ 80 μm, is starched for non-calcinated type muscovite
Piece, the partial size of the mica flake of mica lodicule layer are -50 mesh ~+200 mesh.
In the present invention, the polyacrylamide resin film layer with form diamond checks hollow hole with a thickness of 40 ~ 60 μm,
And the long-diagonal of the form diamond checks hollow hole of molding on it and the length ratio of short diagonal are 3:1, the single hole hole face of hollow hole
Product is 3 ~ 5cm2, pitch of holes is 1 ~ 1.5cm.
Beneficial effect：The utility model preferably maintains performance of mica paper itself, meanwhile, surface smoothness is high, and
Guarantee and improve the mica content in mica tape, so that the long-term electrical life of insulation solidfied material is significantly increased, so that mica
The stretch-proof of paper and tear resistance are effectively reinforced, and mechanical strength and tensile resistance are the same thickness of traditional one-component
The several times of the mica paper of degree can effectively meet its industrial application.
Detailed description of the invention
Fig. 1 is the end face detailed schematic of the utility model preferred embodiment.
Wherein：1, the first mica lodicule layer；2, alkali-free glass fiber cloth；3, substrate；4, the second mica lodicule layer；5, second
Polyacrylamide resin film layer；6, the first polyacrylamide resin film layer.
Specific embodiment
In order to be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, under
Face combines and is specifically illustrating, and the utility model is further described.
Referring to a kind of preferred embodiment of high-strength composite mica paper of Fig. 1, in the present embodiment, including substrate 3, the base
Material 3 is the Ni-coated graphite piece that a layer thickness is 40 μm, and the alkali-free glass fibre that a layer thickness is 42 μm is formed on upper surface
Cloth 2, the alkali-free glass fiber cloth 2 mainly to improve its physical stability, temperature resistance denaturation can and anti-pull performance, and in alkali-free
The surface forming of glass fabric 2 has the first polyacrylamide resin film layer 6, and relative to alkali-free glass fibre on substrate 3
The second polyacrylamide resin film layer 5 is then formed on the another side of cloth 2, and respectively in the first polyacrylamide resin film layer 6
And second polyacrylamide resin film layer 5 form the first mica lodicule layer 1 and the second mica lodicule layer 4.
Wherein, the first polyacrylamide resin film layer 6 is consistent with 5 structure of the second polyacrylamide resin film layer, material one
It is 40 μm of polyacrylamide resin film layers with form diamond checks hollow hole that cause, which is a layer thickness, and forms form diamond checks on it
The long-diagonal of hollow hole and the length ratio of short diagonal are 3:1, the single hole hole area of hollow hole is 3cm2, pitch of holes 2cm；
And pass through asphalt mixtures modified by epoxy resin in both side surface in the first polyacrylamide resin film layer 6 and the second polyacrylamide resin film layer 5
Rouge glue and corresponding adjacent structure adhesion and whole compaction moulding.And it is corresponding be molded over the first polyacrylamide resin film layer 6 with
The first mica lodicule layer 1 on 5 surface of the second polyacrylamide resin film layer and the structure of the second mica lodicule layer 4 are also consistent,
Its thickness is 50 μm, is formed for non-calcinated type muscovite lodicule, and the partial size for the mica flake being molded in mica lodicule layer
For -50 mesh ~+200 mesh.
Basic principles, main features, and advantages of the present invention has been shown and described above.Current row
The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (6)
1. a kind of high-strength composite mica paper, including substrate, which is characterized in that form one layer of nothing on one side surface of substrate
The polyacrylamide resin film layer with form diamond checks hollow hole of alkali containing glass fibre cloth and a formable layer on alkali-free glass fiber cloth,
And then straight forming has one layer of polyacrylamide resin film layer with form diamond checks hollow hole on another side surface of substrate, and
The outer surface of two sides polyacrylamide resin film layer has then been separately formed stratus mother's lodicule layer.
2. high-strength composite mica paper according to claim 1, which is characterized in that the substrate be copper-plated graphite piece or
Ni-coated graphite piece, with a thickness of 30~40 μm.
3. high-strength composite mica paper according to claim 1, which is characterized in that the polyacrylamide resin film layer exists
Pass through epoxide-resin glue and corresponding adjacent structure adhesion and whole compaction moulding in both side surface.
4. high-strength composite mica paper according to claim 1, which is characterized in that the thickness in monolayer of the mica lodicule layer
It is 50~80 μm, is non-calcinated type muscovite lodicule, the partial size of the mica flake of mica lodicule layer is -50 mesh~+200 mesh.
5. high-strength composite mica paper according to claim 1, which is characterized in that the polyacrylamide resin film layer
With a thickness of 40~60 μm.
6. high-strength composite mica paper according to claim 1, which is characterized in that in the polyacrylamide resin film layer
Form diamond checks hollow hole long-diagonal and short diagonal length ratio be 3:1, the single hole hole area of hollow hole is 3~5cm2,
Pitch of holes is 1~1.5cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820212962.7U CN208111202U (en) | 2018-02-07 | 2018-02-07 | A kind of high-strength composite mica paper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820212962.7U CN208111202U (en) | 2018-02-07 | 2018-02-07 | A kind of high-strength composite mica paper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208111202U true CN208111202U (en) | 2018-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820212962.7U Active CN208111202U (en) | 2018-02-07 | 2018-02-07 | A kind of high-strength composite mica paper |
Country Status (1)
| Country | Link |
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| CN (1) | CN208111202U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110117918A (en) * | 2019-04-22 | 2019-08-13 | 湖南荣泰新材料科技有限公司 | A kind of resin glue spraying mica paper and its pulping method |
| CN113690001A (en) * | 2021-08-06 | 2021-11-23 | 怀化鑫崀峰钙业有限公司 | Preparation method of mica paper tape with high thermal conductivity |
-
2018
- 2018-02-07 CN CN201820212962.7U patent/CN208111202U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110117918A (en) * | 2019-04-22 | 2019-08-13 | 湖南荣泰新材料科技有限公司 | A kind of resin glue spraying mica paper and its pulping method |
| CN110117918B (en) * | 2019-04-22 | 2021-09-24 | 湖南荣泰新材料科技有限公司 | Resin glue-sprayed mica paper and manufacturing method thereof |
| CN113690001A (en) * | 2021-08-06 | 2021-11-23 | 怀化鑫崀峰钙业有限公司 | Preparation method of mica paper tape with high thermal conductivity |
| CN113690001B (en) * | 2021-08-06 | 2023-03-03 | 怀化鑫崀峰钙业有限公司 | Preparation method of mica paper tape with high thermal conductivity |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 414517 east side of Xingdong Road, Wushi Park, high tech Zone, Wushi Town, Pingjiang County, Yueyang City, Hunan Province Patentee after: PINGJIANG XINGKE MICA PRODUCTS Co.,Ltd. Address before: 410000 Xingwang Road, Wushi Industrial Park, Pingjiang high tech Industrial Park, Wushi Town, Pingjiang County, Yueyang City, Hunan Province Patentee before: PINGJIANG XINGKE MICA PRODUCTS Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |