CN207233481U - High intensity mica tape - Google Patents
High intensity mica tape Download PDFInfo
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- CN207233481U CN207233481U CN201720818149.XU CN201720818149U CN207233481U CN 207233481 U CN207233481 U CN 207233481U CN 201720818149 U CN201720818149 U CN 201720818149U CN 207233481 U CN207233481 U CN 207233481U
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- mica
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- mica paper
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Abstract
A kind of high intensity mica tape, the composite reinforcing layer on its surface is molded over including mica paper layer and by organosilicon adhesive-layer adhesion, wherein, the gross thickness of the composite reinforcing layer is 300 ~ 800 μm, from mica paper layer, laterally outer polyester-imide layer, alkali-free glass fiber cloth and the ratio between the nonwoven layer, the thickness of polyester-imide layer, alkali-free glass fiber cloth and nonwoven layer of being followed successively by is 2:1:1, cellular through hole or form diamond checks through hole is uniformly formed on the polyester-imide layer.The good electric property that there is preferably fire prevention water resistance, and have preferable mechanical strength and buckle resistance energy, be conducive to improve major insulation device of the utility model continuity, so as to improve the technical indicator of related electric equipment, service life and operational reliability.
Description
Technical field
Mica paper arts are the utility model is related to, are specially a kind of high intensity mica for insulation of electrical installation
Band.
Background technology
Mica paper has higher electrical strength and relatively low dielectric loss, while also have resistance to as mica product
Hot, water resistance, chemical stability.And mica tape is to be equipped with appropriate gluing by the supporting material such as mica paper and glass fabric
The insulating materials cut after the baked drying of agent, its electric property with mica paper in itself, while have excellent resistance to
High-temperature behavior and flame resistance energy, and there is good flexibility under normal conditions, available for various fire resisting electromagnetic wire cables, coil
Hot-face insulation liner layer.
But existing mica tape physics defense of resistance to impact grade is low, and function is single, although with certain heat resistance,
Cannot long-time fire resisting, in surrounding environment there are comburant in the case of heat-proof quality it is poor, do not have the effect of high temperature protection,
Tensile strength, hardness and insulation performance are also not satisfactory at the same time, it is difficult to the electrical equipment higher applied to insulating requirements.
Utility model content
The technical problem that the utility model is solved is to provide a kind of high intensity mica tape, and this mica band structure is steady
Calmly, intensity is good, and tensile property is superior, is beneficial to improve the electric property of major insulation, so as to improve the skill of relevant device
Art index, service life and operational reliability, the shortcomings that to solve in above-mentioned background technology.
The technical problem that the utility model is solved is realized using following technical scheme:
A kind of high intensity mica tape, including mica paper layer and answering for its surface is molded over by organosilicon adhesive-layer adhesion
Strengthening course is closed, wherein, the gross thickness of the composite reinforcing layer is 300 ~ 800 μm, and polyester Asia is followed successively by from mica paper layer is laterally outer
Amine layer, alkali-free glass fiber cloth and the ratio between nonwoven layer, the thickness of polyester-imide layer, alkali-free glass fiber cloth and nonwoven layer are 2:1:
1, cellular or form diamond checks through hole is uniformly formed on the polyester-imide layer.
As further improvement of the utility model:
The single hole area of the molding through hole is 50 ~ 120mm on the polyester-imide layer2, and between adjacent through hole
Spacing be 2 ~ 3mm.
The coating thickness of the organosilicon adhesive-layer is 100 ~ 300 μm.
The mica paper layer is double-deck mica paper layer, and two layers of mica paper layer is muscovite paper or synthetic mica paper, two
A layer graphene film layer is formed between layer mica paper, and with being molded a little in the mica paper layer of organosilicon adhesive-layer contact side
Battle array through hole.
Nonwoven cloth in the nonwoven layer preferably uses heat seal non-woven fabrics or melt spraying non-woven fabrics.
The nonwoven layer surface forming has one layer of hot melt adhesive layer, and has one layer in its surface forming by this hot melt adhesive layer
Release film.
Beneficial effect:The utility model is heat-resist, and adhesive strength is high, and tensile strength is high, while also prevents with higher
Fire and waterproofing grade, be conducive to improve major insulation electric property so that improve the technical indicator of electrical equipment, service life and
Operational reliability.
Brief description of the drawings
Fig. 1 is the structure diagram of the utility model preferred embodiment.
Wherein:1st, release film;2nd, hot melt adhesive layer;3rd, nonwoven layer;4th, alkali-free glass fiber cloth;5th, form diamond checks through hole;6th, polyester
Imine layer;7th, organosilicon adhesive-layer;8th, upper strata mica paper;9th, graphene film layer;10th, lower floor's mica paper;11st, dot matrix through hole.
Embodiment
In order to make the technical means, creative features, achievable purpose and effectiveness that the utility model is realized easy to understand, under
Face combines and is specifically illustrating, and the utility model is expanded on further.
Referring to the preferred embodiment of the high intensity mica tape of Fig. 1, in the present embodiment, mica paper tape includes combined mica paper
Layer and composite reinforcing layer, between combined mica ply of paper and composite reinforcing layer by the organosilicon adhesive-layer 7 of one layer of 200 μ m-thick into
Row adhesion is fixed.
Wherein, combined mica ply of paper includes upper strata mica paper 8 and lower floor's mica paper 10, and in upper strata mica paper 8 with
A layer graphene film layer 9 is also formed between layer mica paper 10, upper strata mica paper 8 and lower floor's mica paper 10 are muscovite paper,
And the dot matrix through hole 11 being distributed in dot matrix is also formed on upper strata mica paper 8.The gross thickness of composite reinforcing layer is 400 μm, bag
Include the polyester-imide layer 6 that the thickness being molded over successively on organosilicon adhesive-layer 7 is 200 μm, the alkali-free glass fiber cloth that thickness is 100 μm
4 and thickness be 100 μm of nonwoven layer 3, meanwhile, form diamond checks through hole 5 is also uniformly formed on polyester-imide layer 6, the water chestnut
The single hole long-diagonal length of trellis through hole 5 is 15mm, and short diagonal length is 5mm, between adjacent form diamond checks through hole 5
Gap spacing is 3mm.
In the present embodiment, equipment or electric component surface are molded into order to facilitate mica tape, on 3 surface of nonwoven layer
Form one layer of hot melt adhesive layer 2, and have one layer of release film 1 in its surface forming by this hot melt adhesive layer 2, when use can be by taking off
Release film 1 is opened to realize that the bonding of mica tape operates.
The advantages of basic principle, main feature and the utility model of the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description
Simply illustrate the utility model principle, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
Various changes and modifications are had, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed scope is defined by the appending claims and its equivalent thereof.
Claims (7)
1. high intensity mica tape, it is characterised in that be molded over its table including mica paper layer and by organosilicon adhesive-layer adhesion
The composite reinforcing layer in face, wherein, the gross thickness of the composite reinforcing layer is 300 ~ 800 μm, is followed successively by from mica paper layer is laterally outer
Polyester-imide layer, alkali-free glass fiber cloth and the ratio between nonwoven layer, the thickness of polyester-imide layer, alkali-free glass fiber cloth and nonwoven layer
For 2:1:1, cellular through hole or form diamond checks through hole is uniformly formed on the polyester-imide layer.
2. high intensity mica tape according to claim 1, it is characterised in that molding described logical on the polyester-imide layer
The single hole area in hole is 50 ~ 120mm2, and the spacing between adjacent through hole is 2 ~ 3mm.
3. high intensity mica tape according to claim 1, it is characterised in that the coating thickness of the organosilicon adhesive-layer is
100~300μm。
4. high intensity mica tape according to claim 1, it is characterised in that the mica paper layer is double-deck mica paper layer,
Two layers of mica paper layer is muscovite paper or synthetic mica paper, and a layer graphene film layer is formed between two layers of mica paper.
5. high intensity mica tape according to claim 4, it is characterised in that the mica paper with organosilicon adhesive-layer contact side
Dot matrix through hole is formed on layer.
6. high intensity mica tape according to claim 1, it is characterised in that the nonwoven cloth in the nonwoven layer is preferred
Using heat seal non-woven fabrics or melt spraying non-woven fabrics.
7. high intensity mica tape according to claim 1, it is characterised in that the nonwoven layer surface forming has one layer of heat
Melt layer, and have one layer of release film in its surface forming by this hot melt adhesive layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720818149.XU CN207233481U (en) | 2017-07-07 | 2017-07-07 | High intensity mica tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720818149.XU CN207233481U (en) | 2017-07-07 | 2017-07-07 | High intensity mica tape |
Publications (1)
Publication Number | Publication Date |
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CN207233481U true CN207233481U (en) | 2018-04-13 |
Family
ID=61853264
Family Applications (1)
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CN201720818149.XU Active CN207233481U (en) | 2017-07-07 | 2017-07-07 | High intensity mica tape |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111276282A (en) * | 2020-01-06 | 2020-06-12 | 湖北平安电工股份有限公司 | Non-anti-sticking fire-resistant mica tape and preparation method thereof |
CN111489849A (en) * | 2020-04-17 | 2020-08-04 | 江苏中广核金沃电子科技有限公司 | High-strength mica tape |
CN113690001A (en) * | 2021-08-06 | 2021-11-23 | 怀化鑫崀峰钙业有限公司 | Preparation method of mica paper tape with high thermal conductivity |
-
2017
- 2017-07-07 CN CN201720818149.XU patent/CN207233481U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111276282A (en) * | 2020-01-06 | 2020-06-12 | 湖北平安电工股份有限公司 | Non-anti-sticking fire-resistant mica tape and preparation method thereof |
CN111489849A (en) * | 2020-04-17 | 2020-08-04 | 江苏中广核金沃电子科技有限公司 | High-strength mica tape |
CN113690001A (en) * | 2021-08-06 | 2021-11-23 | 怀化鑫崀峰钙业有限公司 | Preparation method of mica paper tape with high thermal conductivity |
CN113690001B (en) * | 2021-08-06 | 2023-03-03 | 怀化鑫崀峰钙业有限公司 | Preparation method of mica paper tape with high thermal conductivity |
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