CN208110457U - A kind of Multifunctional main board using OPS interface - Google Patents

Abstract

The utility model provides a kind of Multifunctional main board using OPS interface, is related to electronic technology field.This uses the Multifunctional main board of OPS interface, and the inner wall bottom side of the mainboard ontology is fixedly installed with blower, and the side of the blower is mutually connected with valve, and the top of the valve is mutually connected with air-exhausting duct.This uses the Multifunctional main board of OPS interface, the compressor being arranged by mainboard body interior, condenser, cooperation between throttle valve and evaporator has achieved the effect that cold wind can be made, reached under the action of blower by air-exhausting duct and tubaeform air outlet and is preferably radiated to chip carrier, it is more preferable compared to upper traditional fan cooling effect of the Multifunctional main board of more traditional OPS interface, what is radiated simultaneously is also more thorough, it radiates to realize to the chip carrier of mainboard body interior, it solves the problems, such as that the Multifunctional main board of OPS interface cannot disperse to be easy to appear well in prolonged use process self heat to burn out.

Description

A kind of Multifunctional main board using OPS interface

Technical field

The utility model relates to electronic technology technical field, specially a kind of Multifunctional main board using OPS interface.

Background technique

Open pluggable specification；It is Intel and the standardized digital label interface specification that display manufacturer formulates jointly. What its OPS interface defined unification includes the signals such as power supply, display, input and output, state instruction, while providing fixed connect The mode of inserting, host, which only passes through OPS interface, to be docked with main equipment, and equipment connection is simple and convenient.

Using the Multifunctional main board of OPS interface during prolonged use, mainboard ontology itself will generate heat, in length During the fever of time, if not in time to mainboard ontology heat dissipation it is easy to appear what mainboard was burnt out to show, but now OPS Multifunctional main board itself heat dissipation performance again be not very well, so causing to hold very much in the long-time use process of mainboard Easily it is in the presence of that mainboard damages.

Utility model content

（One）The technical issues of solution

In view of the deficiencies of the prior art, the utility model provides a kind of Multifunctional main board using OPS interface, solves The Multifunctional main board of OPS interface cannot disperse well in prolonged use process self heat is easy to appear asking of burning out Topic.

（Two）Technical solution

In order to achieve the above object, the utility model is achieved by the following technical programs：It is a kind of using the more of OPS interface Function mainboard, the inner wall bottom side of the mainboard ontology are fixedly installed with blower, and the side of the blower is mutually connected with valve, institute The top for stating valve is mutually connected with air-exhausting duct, is fixedly installed with tubaeform air outlet at the top of the air-exhausting duct, and the one of the valve Side is mutually connected with blast pipe, and the inside of the mainboard ontology is provided with chip carrier, the inner wall bottom other side of the mainboard ontology It is fixedly installed with compressor, the side of the compressor is mutually connected with condenser, and the condenser is communicated far from the side of compressor There is throttle valve, the throttle valve is equipped with evaporator far from the side of condenser, and the front of the mainboard ontology offers connection Interface.

Preferably, the front of the mainboard ontology is fixedly installed with fixed frame, is provided with fastening bolt on the fixed frame.

Preferably, the two sides of the chip carrier are fixedly installed with radiating fin, and the radiating fin is far from chip carrier one Side is fixedly connected with the inside two sides of mainboard ontology.

Preferably, the side of the mainboard ontology is fixedly installed with switch, the output end of the switch respectively with blower and The input terminal of compressor is electrically connected.

Preferably, heat dissipation cavity is offered at the top of the mainboard ontology, the heat dissipation cavity is internally provided with heat dissipation filling Material.

Preferably, mainboard ontology side offers thermovent, and the inside of the thermovent is fixed by the connecting rod peace Equipped with small fan, and thermovent is internally provided with dust filter plate.

（Three）Beneficial effect

The utility model provides a kind of Multifunctional main board using OPS interface.Has following beneficial effect：

1, the Multifunctional main board for using OPS interface, the compressor being arranged by mainboard body interior, condenser, throttling Cooperation between valve and evaporator achieved the effect that cold wind can be made, by air-exhausting duct and tubaeform under the action of blower Air outlet, which reaches, preferably radiates to chip carrier, compared to upper traditional wind of the Multifunctional main board of more traditional OPS interface Fan heat dissipation effect is more preferable, while it is also more thorough to radiate, and radiates to realize to the chip carrier of mainboard body interior, The Multifunctional main board for solving OPS interface cannot disperse to be easy to appear well in prolonged use process self heat to be burnt out The problem of.

2, the Multifunctional main board for using OPS interface carries out more chip carrier by the radiating fin being arranged on chip carrier Good heat dissipation has reached under the cooperation by the heat dissipation cavity and heat dissipation packing material that are arranged on mainboard ontology to mainboard ontology Heat dissipation effect is best, and do not need consumption the energy it is more environmentally friendly, pass through the thermovent and small heat-dissipating being arranged on mainboard ontology The setting of fan, which has reached, effectively radiates to the progress of mainboard body interior two sides.

Detailed description of the invention

FIG. 1 is a schematic structural view of the utility model；

Fig. 2 is the utility model structure sectional view；

Fig. 3 is the utility model structural side view；

Fig. 4 is the utility model structure top view.

In figure：It is 1 mainboard ontology, 2 blowers, 3 valves, 4 air-exhausting ducts, 5 tubaeform air outlets, 6 blast pipes, 7 compressors, 8 cold Condenser, 9 throttle valves, 10 evaporators, 11 chip carriers, 12 radiating fins, 13 connecting interfaces, 14 heat dissipation cavities, 15 heat dissipation packing materials, 16 thermovents, 17 small-sized heat radiating fans, 18 dust filter plates, 19 fixed frames, 20 fastening bolts, 21 switches.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

The utility model embodiment provides a kind of Multifunctional main board using OPS interface, as shown in Figs 1-4, mainboard ontology 1 Inner wall bottom side be fixedly installed with blower 2, the front of mainboard ontology 1 is fixedly installed with fixed frame 19, sets on fixed frame 19 It is equipped with fastening bolt 20,1 side of mainboard ontology offers thermovent 16, and the inside of thermovent 16, which is fixed by the connecting rod, to be equipped with Small fan 17 has been reached by the setting of the thermovent 16 and small-sized heat radiating fan 17 that are arranged on mainboard ontology 1 to mainboard The progress of 1 inside two sides of ontology effectively radiates, and thermovent 16 is internally provided with dust filter plate 18, the side of blower 2 It is mutually connected with valve 3, the top of valve 3 is mutually connected with air-exhausting duct 4, and the top of air-exhausting duct 4 is fixedly installed with tubaeform air outlet 5, valve The side of door 3 is mutually connected with blast pipe 6, and the inside of mainboard ontology 1 is provided with chip carrier 11, the fixed peace in the two sides of chip carrier 11 Equipped with radiating fin 12, preferably radiated by the radiating fin 12 being arranged on chip carrier 11 to chip carrier 11, heat radiating fin Piece 12 is fixedly connected far from 11 side of chip carrier with the inside two sides of mainboard ontology 1, and the inner wall bottom other side of mainboard ontology 1 is solid Dingan County is equipped with compressor 7, and the side of mainboard ontology 1 is fixedly installed with switch 21, the output end of switch 21 respectively with blower 2 and pressure The input terminal of contracting machine 7 is electrically connected, and the side of compressor 7 is mutually connected with condenser 8, and condenser 8 is communicated far from the side of compressor 7 There is throttle valve 9, throttle valve 9 is equipped with evaporator 10 far from the side of condenser 8, passes through the compression being arranged inside mainboard ontology 1 Cooperation between machine 7, condenser 8, throttle valve 9 and evaporator 10 has achieved the effect that cold wind can be made, in the effect of blower 2 Reached by air-exhausting duct 4 and tubaeform air outlet 5 down and preferably radiated to chip carrier, compared to more traditional OPS interface Upper traditional fan cooling effect of Multifunctional main board is more preferable, while it is also more thorough to radiate, to realize to mainboard sheet Chip carrier 11 inside body 1 radiates, and the front of mainboard ontology 1 offers connecting interface 13, and the top of mainboard ontology 1 opens up There is heat dissipation cavity 14, heat dissipation cavity 14 is internally provided with heat dissipation packing material 15, passes through the heat dissipation cavity 14 being arranged on mainboard ontology 1 Reach best to the heat dissipation effect of mainboard ontology 1 under cooperation with heat dissipation packing material 15, and has not needed the consumption energy more Environmental protection, solve OPS interface Multifunctional main board cannot be dispersed well in prolonged use process self heat it is easy The problem of burning out.

Working principle：When radiating to mainboard ontology, compressor 7 is opened, in compressor 7 by switch 21 first Cooperation condenser 8, throttle valve 9 and evaporator 10 produce cool breeze under working, and at this moment open blower 2, right under operation in blower 2 The cold air that compressor 7 and the cooperation of evaporator 10 generate is absorbed, and is directly blown to the surface of chip carrier 11 by air-exhausting duct 4 Wind is so that the heat dissipation of chip carrier 11 is more efficient, if it is desired to master can be opened by quickly radiating to mainboard ontology 1 The small-sized heat radiating fan 17 of 1 side of plate ontology carries out air draught heat dissipation to equipment.

In conclusion this uses Multifunctional main board of OPS interface, by the compressor 7 that is arranged inside mainboard ontology 1, cold Cooperation between condenser 8, throttle valve 9 and evaporator 10 has achieved the effect that cold wind can be made, has passed through under the action of blower 2 Air-exhausting duct 4 and tubaeform air outlet 5, which reach, preferably radiates to chip carrier, multi-functional compared to more traditional OPS interface Upper traditional fan cooling effect of mainboard is more preferable, while it is also more thorough to radiate, to realize inside to mainboard ontology 1 Chip carrier 11 radiate, solve the Multifunctional main board of OPS interface prolonged use process self heat cannot be very Good dispersing is easy to appear the problem of burning out.

This uses the Multifunctional main board of OPS interface, by the radiating fin 12 that is arranged on chip carrier 11 to chip carrier 11 into Row preferably heat dissipation, has reached pair under the cooperation by the heat dissipation cavity 14 that is arranged on mainboard ontology 1 and heat dissipation packing material 15 The heat dissipation effect of mainboard ontology 1 is best, and do not need consumption the energy it is more environmentally friendly, pass through the heat dissipation being arranged on mainboard ontology 1 The setting of mouth 16 and small-sized heat radiating fan 17, which has reached, effectively radiates to the progress of 1 inside two sides of mainboard ontology.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (6)

1. a kind of Multifunctional main board using OPS interface, including mainboard ontology（1）, it is characterised in that：The mainboard ontology（1） Inner wall bottom side be fixedly installed with blower（2）, the blower（2）Side be mutually connected with valve（3）, the valve（3）'s Top is mutually connected with air-exhausting duct（4）, the air-exhausting duct（4）Top be fixedly installed with tubaeform air outlet（5）, the valve（3） Side be mutually connected with blast pipe（6）, the mainboard ontology（1）Inside be provided with chip carrier（11）, the mainboard ontology（1） The inner wall bottom other side be fixedly installed with compressor（7）, the compressor（7）Side be mutually connected with condenser（8）, described cold Condenser（8）Far from compressor（7）Side be mutually connected with throttle valve（9）, the throttle valve（9）Far from condenser（8）Side peace Equipped with evaporator（10）, the mainboard ontology（1）Front offer connecting interface（13）.

2. a kind of Multifunctional main board using OPS interface according to claim 1, it is characterised in that：The mainboard ontology （1）Front be fixedly installed with fixed frame（19）, the fixed frame（19）On be provided with fastening bolt（20）.

3. a kind of Multifunctional main board using OPS interface according to claim 1, it is characterised in that：The chip carrier （11）Two sides be fixedly installed with radiating fin（12）, the radiating fin（12）Far from chip carrier（11）Side and mainboard sheet Body（1）Inside two sides be fixedly connected.

4. a kind of Multifunctional main board using OPS interface according to claim 1, it is characterised in that：The mainboard ontology （1）Side be fixedly installed with switch（21）, the switch（21）Output end respectively and blower（2）And compressor（7）It is defeated Enter end to be electrically connected.

5. a kind of Multifunctional main board using OPS interface according to claim 1, it is characterised in that：The mainboard ontology （1）Top offer heat dissipation cavity（14）, the heat dissipation cavity（14）Be internally provided with heat dissipation packing material（15）.

6. a kind of Multifunctional main board using OPS interface according to claim 1, it is characterised in that：The mainboard ontology （1）Side offers thermovent（16）, the thermovent（16）Inside be fixed by the connecting rod small fan be installed （17）, and thermovent（16）Be internally provided with dust filter plate（18）.