CN208104537U - Mask plate, display base plate, display device - Google Patents
Mask plate, display base plate, display device Download PDFInfo
- Publication number
- CN208104537U CN208104537U CN201820617481.4U CN201820617481U CN208104537U CN 208104537 U CN208104537 U CN 208104537U CN 201820617481 U CN201820617481 U CN 201820617481U CN 208104537 U CN208104537 U CN 208104537U
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- mask
- mask plate
- display device
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- strip
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- 238000000034 method Methods 0.000 description 34
- 229920002120 photoresistant polymer Polymers 0.000 description 20
- 238000005538 encapsulation Methods 0.000 description 19
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- 238000009713 electroplating Methods 0.000 description 14
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- 229920006280 packaging film Polymers 0.000 description 3
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- Physical Vapour Deposition (AREA)
Abstract
The utility model discloses a kind of mask plate, display base plate, display device, it is related to mask plate technical field, it is to solve during being encapsulated to display device, since the thickness of the Under Coating of generation is thicker, the problem of causing the packaging effect of display device to be affected.The mask plate, including solder mask frame and the multiple mask strips being arranged in the solder mask frame, the mask strip includes the first mask strip extended in a first direction and the second mask strip extended in a second direction, first mask strip and the second mask strip are arranged in a crossed manner and limit multiple open regions, and the open region is used to form film pattern；The mask strip is towards the stop block structure for being provided with protrusion on film layer side to be formed.Mask plate provided by the utility model is for encapsulating display device.
Description
Technical field
The utility model relates to mask plate technical field more particularly to a kind of mask plate, display base plate, display devices.
Background technique
With the continuous development of display technology, Organic Light Emitting Diode (English：Organic Light-Emitting
Diode, hereinafter referred to as OLED) display device is with its self-luminous, high brightness, wide viewing angle, high contrast, deflection, low energy consumption etc.
Characteristic, gradually by the extensive concern of people.This OLED display device uses relatively thin coating of organic material and glass base
Plate production, when a current passes through, the organic material in OLED display device will shine, to realize OLED display device
Display function.
Since the easy water and oxygen with air of the organic material in OLED display device reacts, in order to guarantee
The service life of OLED display device has been increasingly becoming research hotspot to the encapsulation technology of OLED display device.Traditional production
The mode of OLED display device is mainly initially formed the motherboard including multiple OLED display devices, then to OLED display device
Motherboard be integrally packaged, after completing encapsulation, then the motherboard of packaged OLED display device is cut, forms envelope
The independent OLED display device installed.
Currently, when the motherboard to OLED display device is packaged, it is general using the mask plate to match with motherboard with
Motherboard contraposition, the encapsulation boundary for each OLED display device for including in motherboard is limited by mask plate, then passes through chemical gas
Phase sedimentation (English：Chemical Vapor Deposition, abbreviation CVD) it is corresponding with the open region of mask plate on motherboard
Area deposition encapsulating material, to realize encapsulation to OLED display device.However found during actual deposition, in mother
It is still deposited on plate by the part that the non-open region of mask plate covers and has gone up encapsulating material, this partial encapsulation material is referred to as lower
Coating (hereinafter referred to as：Under Coating), the coverage area of Under Coating is from the edge of the opening of mask plate
Start, extends to the edge of OLED display device corresponding with the opening, and from the edge of opening to OLED display
The thickness at the edge of part, Under Coating is gradually thinned.
After completing to the encapsulation of motherboard, generally motherboard is cut using laser, and during cutting,
Thickness of the Under Coating in the edge of OLED display device can have an impact the yield of cutting operation, specifically, when
When thickness of the Under Coating in the edge of OLED display device is too thick, cutting operation is easy so that Under Coating
In crack, and the crackle is easy to further expand the viewing area into OLED display device, causes to influence OLED display
The service life of part.
Utility model content
The purpose of this utility model is to provide a kind of mask plate, display base plate, display devices, for solving to display
Device encapsulate during, since the thickness of the Under Coating of generation is thicker, cause the packaging effect of display device by
The problem of influence.
To achieve the goals above, the utility model provides the following technical solutions：
The first aspect of the utility model provides a kind of mask plate, including solder mask frame and setting are in the solder mask frame
Multiple mask strips, the mask strip includes the first mask strip extended in a first direction and what is extended in a second direction second cover
Film item, first mask strip and second mask strip are arranged in a crossed manner and limit multiple open regions, and the open region is used for
Form film pattern；It is characterized in that, the mask strip is provided with the stop block structure of protrusion towards film layer side to be formed.
Further, the stop block structure includes multiple mutually independent block figures, and the block figure is opened with described
Mouth region corresponds, and each block figure surrounds the corresponding open region.
Further, the block figure is located at the mask strip close to the edge of the open region.
Further, thickness of the block figure where perpendicular to the solder mask frame on the direction of plane exists
Between 20um-60um.
Further, the block figure includes metal backup figure.
Further, the block figure is including trapezoidal or square perpendicular to the section on the mask strip extending direction
Shape.
The technical solution of packaging method based on above-mentioned display base plate, the second aspect of the utility model provide a kind of display
Substrate encapsulates to obtain using above-mentioned mask plate.
Based on the technical solution of above-mentioned display base plate, the third aspect of the utility model provides a kind of display device, including
Above-mentioned display base plate.
In technical solution provided by the utility model, the block of protrusion is formd in the mask strip for limiting open region
Structure, the stop block structure can be limited in the substrate of film layer to be formed, shape on the part covered by the non-open region of mask plate
At film layer thickness and coverage area, therefore mask plate provided by the utility model is being applied production encapsulation layer pattern in
When, which can limit the thickness of the Under Coating of formation and the coverage area of Under Coating, make
It obtains when the subsequent motherboard to display device is cut, crackle is not likely to produce in Under Coating, to ensure that display
The packaging effect of device, moreover, because the thinner thickness of Under Coating, can further be arranged display device with relatively narrow
Border width, to meet the design requirement of ultra-narrow frame.
Detailed description of the invention
Attached drawing described herein is used to provide a further understanding of the present invention, and constitutes one of the utility model
Point, the exemplary embodiment of the utility model and the description thereof are used to explain the utility model, does not constitute to the utility model
Improper restriction.In the accompanying drawings：
Fig. 1 is the schematic diagram that technique is packaged using mask plate in the prior art；
Fig. 2 is the schematic diagram of mask plate provided by the embodiment of the utility model；
Fig. 3 is the schematic diagram that technique is packaged using mask plate provided by the embodiment of the utility model；
Fig. 4 is the schematic diagram of the block figure in mask plate provided by the embodiment of the utility model；
Fig. 5 a- Fig. 5 f is the production flow diagram of stop block structure provided by the embodiment of the utility model.
Appended drawing reference：
1- mask plate, 10- solder mask frame,
11- mask strip, the open region 12-,
13- encapsulation layer pattern, 14- stop block structure,
141- block figure, 15-Under Coating,
The motherboard of 2- display device, 3- photoresist,
4- block forming region, 5- electroplating pool,
6- DC power supply, 7- mask plate ontology,
8- plating target, 91- first direction,
92- second direction.
Specific embodiment
In order to further illustrate mask plate provided by the embodiment of the utility model, display base plate, display device, below with reference to
Figure of description is described in detail.
As stated in the background art, referring to Fig. 1, in the prior art when being packaged to display device, in display device
Motherboard 2 on Under Coating15, and Under Coating15 will form by the part that the non-open region of mask plate 1 covers
Coverage area since the edge of the opening of mask plate 1, extend to the edge of display device corresponding with the opening,
And from the edge of opening to the edge of display device, the thickness of Under Coating15 is gradually thinned；Once Under
When thickness of the Coating15 in the edge of display device is too thick, when being cut by laser, it is easy so that Under
It is cracked in Coating15, and the crackle is easy to further expand the viewing area into display device, causes to influence display
The service life of part.
To solve the above-mentioned problems, traditional solution is usually the setting when carrying out the frame design of display device
Wider frame, to ensure that Under Coating15 has been thinned to a certain degree when reaching the edge of display device, this
Sample is in subsequent cutting technique, it will be able to the generation of good Crack prevention, to ensure that the service life of display device.
But due to needing to be arranged wider frame in above-mentioned traditional solution, it is unable to satisfy the ultra-narrow of display device
Therefore the design of frame how while meeting the design of ultra-narrow frame, reduces, Under Coating15 is thinned as urgently
Problem to be solved.
Presence based on the above issues, as shown in Figures 2 and 3, the utility model embodiment provide a kind of mask plate, should
Mask plate includes solder mask frame 10 and multiple mask strips 11 for being arranged in solder mask frame 10, and multiple mask strips 11 include along first
The first mask strip and 92 the second mask strip extended, the first mask strip and the second mask strip are handed in a second direction that direction 91 extends
Fork is arranged and limits multiple open regions 12, and open region 12 is used to form film pattern；Mask strip 11 is towards film layer to be formed
Side is provided with the stop block structure 14 of protrusion.
Specifically, the specific structure of above-mentioned mask plate is varied, a kind of specific mask structure being of illustrating below, and right
Its application method is described in detail.Such as：In above-mentioned mask plate, the structure that multiple mask strips 11 are integrated, solder mask frame
10 surround the region of rectangular shape, 11 transverse and longitudinal of multiple mask strips being arranged on mask frame be staggered (such as：First exposure mask
Item is chosen as horizontally extending, and the second mask strip is chosen as extending along the direction vertical with horizontal direction), it can be in rectangle
Multiple open regions 12 are limited in the region of shape, the open region 12 is used to form film pattern, sets in each mask strip 11
It is equipped with the stop block structure 14 of protrusion, which can be limited in the substrate of film layer to be formed, and non-by mask plate opens
The thickness and coverage area of the film layer formed on the part that mouth region covers.It is to be appreciated that stop block structure 14 shown in Figure 2 is empty
Schematic cross-section of the frame portion along the direction A1A2.
It is noted that a variety of film patterns can be made using above-mentioned mask plate, below to form envelope using above-mentioned mask plate
For filling layer pattern 13, the detailed process for forming encapsulation layer pattern 13 is illustrated.Mask plate and to be packaged are shown first
Show that the motherboard 2 of device is aligned so that mask plate be provided with the one of stop block structure 14 facing towards display device motherboard 2, and
So that multiple open regions 12 on mask plate and multiple display devices on the motherboard 2 of display device correspond, each is opened
Mouth region 12 limits the encapsulation boundary of corresponding display device；Then by chemical vapour deposition technique, on the motherboard 2 of display device
Area deposition encapsulating material corresponding with each open region 12, during encapsulation, since stop block structure 14 is arranged in mask plate
Between the motherboard 2 of display device, stream of the encapsulating material in the gap between mask plate and the motherboard 2 of display device is limited
Dynamic property, to reduce the thickness for the Under Coating15 to be formed and the coverage area of Under Coating15.
According to the specific structure and methods for using them of above-mentioned mask plate it is found that mask plate provided by the embodiment of the utility model
In, the stop block structure 14 of protrusion is formd in the mask strip 11 for limiting open region 12, which can limit
In the substrate of film layer to be formed, the thickness and covering model of the film layer formed on the part that is covered by the non-open region of mask plate
It encloses, therefore when applying mask plate provided by the embodiment of the utility model in production encapsulation layer pattern 13, the stop block structure
14 can limit the thickness of the Under Coating15 of formation and the coverage area of Under Coating15, so that rear
It is continuous when being cut to the motherboard 2 of display device, it is not likely to produce crackle in Under Coating15, to ensure that display
The packaging effect of part, moreover, because the thinner thickness of Under Coating15, can further be arranged display device with relatively narrow
Border width, to meet the design requirement of ultra-narrow frame.
Further, above-mentioned stop block structure 14 has various structures, optionally, as shown in figure 4, above-mentioned stop block structure 14 wraps
Multiple mutually independent block figures 141 are included, block figure 141 and open region 12 correspond, and each block figure 141 surrounds
Corresponding open region 12.
Specifically, each block figure 141 is arranged in the mask strip 11 at the edge of corresponding open region 12, and energy
Corresponding open region 12 is enough surrounded, such as：Mask strip 11 surrounds the open region 12 of rectangle, then block figure 141, which is located at, is used for shape
In the mask strip 11 of rectangular open region 12, the open region 12 of rectangle is surrounded.
The stop block structure 14 of above structure makes each open region 12 be provided with block figure 141, and block figure 141 is equal
Corresponding open region 12 can be surrounded, so that block figure 141 can opened when being packaged operation using the mask plate
Each position of mouth region 12 limits the thickness and coverage area of Under Coating15, preferably ensure that display
The packaging effect of part, and meet the design requirement of ultra-narrow frame.
Further, settable block figure 141 is located at mask strip 11 close to the edge of open region 12.
Specifically, mask strip 11 is arranged in close to the edge of open region 12 in block figure 141, enables to block figure
141 preferably limit the flow region of encapsulating material, to further define thickness and the covering of Under Coating15
Range ensure that the packaging effect of display device and the design requirement of ultra-narrow frame.
Further, thickness of the above-mentioned block figure 141 in the direction perpendicular to 10 place plane of solder mask frame can be set
It sets between 20um-60um.
Specifically, due to when being packaged technique using mask plate, by mask plate and display device to be packaged
After motherboard 2 is aligned, gap between the motherboard 2 of mask plate and display device to be packaged generally 50um-250um it
Between, thus be arranged thickness of the block figure 141 in the direction perpendicular to 10 place plane of solder mask frame 20um-60um it
Between, and the thickness of block figure 141 is made to be less than the gap between mask plate and the motherboard 2 of display device to be packaged, not only
So that block figure 141 will not the gap between the motherboard 2 to mask plate and display device to be packaged have an impact, it is ensured that
Between block figure 141 can be good at limiting encapsulating material between mask plate and the motherboard 2 of display device to be packaged
The mobility of gap.
Further, the material of above-mentioned block figure 141 is varied, such as：Block figure 141 includes metal backup figure
Shape.
Specifically, when above-mentioned block figure 141 includes metal backup figure, block figure can be formed by electroplating technology
Shape 141, and since electroplating technology is capable of forming the figure of degree of precision, and can be good at the thickness that control is formed by figure
Degree is utilizing the exposure mask for including the metal backup figure so that being formed by metal backup figure pattern precision with higher
When plate is packaged technique, packaging effect preferably ensure that.
Further, above-mentioned block figure 141 is including trapezoidal or square perpendicular to the section on 11 extending direction of mask strip
Shape.
Specifically, above-mentioned block figure 141 is formed as various shapes, such as：It is formed as the block figure of trapezium structure
The block figure 141 of shape 141 or rectangular configuration, it is notable that no matter it is formed by which kind of structure block figure 141 is,
It should all meet and be formed by the inside that orthographic projection of the block figure 141 in mask strip 11 is located at mask strip 11, utilize in this way
When mask plate is packaged, the block figure 141 on mask plate will not generate shadow to the encapsulation layer pattern 13 that open region 12 is formed
It rings, to ensure that packaging effect well.
The production method of mask plate provided by the above embodiment is varied, is described below and a kind of makes above-mentioned mask plate
Specific method.
The method for making mask plate provided by the above embodiment includes：
Step 101, a mask plate ontology is provided, mask plate ontology includes multiple open regions 12；
Specifically, as shown in Figures 2 and 3, above-mentioned mask plate ontology includes solder mask frame 10 and is arranged in solder mask frame 10
On multiple mask strips 11, multiple mask strips 11 limit multiple open regions 12, and open region 12 is used to form encapsulation layer pattern 13.
Step 102, the stop block structure 14 of protrusion is formed on a side surface of mask plate ontology.
Specifically, the stop block structure 14 of protrusion, and the stop block structure 14 are formed in the mask strip 11 in mask plate ontology
On a side surface of mask plate ontology.
According to the detailed process of above-mentioned production mask plate it is found that the production side of mask plate provided by the embodiment of the utility model
In method, the stop block structure 14 of protrusion is formd on the mask plate ontology for including multiple open regions 12, which can
It is limited in the substrate of film layer to be formed, the thickness of the film layer formed on the part covered by the non-open region of mask plate and covering
Range.It, can when being packaged using the mask plate made by the production method of mask plate provided by the embodiment of the utility model
First the motherboard 2 of mask plate and display device to be packaged is aligned, so that mask plate is provided with the one side of stop block structure 14
It is right with each open region 12 on the motherboard 2 of display device then by chemical vapour deposition technique towards the motherboard 2 of display device
The area deposition encapsulating material answered, during encapsulation, since the mother of mask plate and display device is arranged in stop block structure 14
Between plate 2, mobility of the encapsulating material in the gap between mask plate and the motherboard 2 of display device is limited, to reduce
The thickness of the Under Coating15 formed and the coverage area of Under Coating15；As it can be seen that using by this reality
After the mask plate of the production method production of the mask plate provided with new embodiment is packaged, to packaged display device
When motherboard 2 is cut, it is not likely to produce crackle in Under Coating15, thus ensure that the packaging effect of display device, and
And due to the thinner thickness of Under Coating15, display device can be further set with relatively narrow border width, thus
Meet the design requirement of ultra-narrow frame.
Further, in above-mentioned steps 102, the stop block structure 14 of protrusion is formed on a side surface of mask plate ontology
Step specifically includes：
Step 1021, using photoetching process, the block shape for being used to form stop block structure 14 is limited on mask plate ontology
At region 4, as shown in Fig. 5 a- Fig. 5 c；
Specifically, photoresist 3 can be first coated on mask plate ontology, make the cladding mask plate ontology completely of photoresist 3；Then
Photoresist 3 is exposed, photoresist retention area is formed and photoresist removes region, photoresist removal region corresponds to block shape
At region 4, the corresponding region in addition to block forming region 4 of photoresist retention area；Removal is located at photoresist removal region
Photoresist 3 forms block forming region 4.
In more detail, the surrounding using dip coating in mask plate ontology forms photoresist coating, the photoresist coating energy
It is enough to coat mask plate ontology completely, then photoresist is applied using another mask plate for being used to form block forming region 4
Layer is exposed processing, forms photoresist retention area and photoresist removes region, wherein the corresponding light in photoresist removal region
Photoresist coating is not irradiated by light, can be washed by developer solution, and the corresponding photoresist coating of photoresist retention area due to by
It is cured to irradiation, continues to be coated on mask plate ontology, it is therefore, above-mentioned to use photoetching process be in mask plate ontology
On limit accurate block forming region 4.
Step 1022, using electroplating technology, stop block structure 14 is formed in block forming region 4, as shown in Fig. 5 d- Fig. 5 f.
Specifically, plating activation technique can be first used, is lived to the mask plate ontology 7 that block forming region 4 exposes
Change processing；Mask plate ontology 7 after activation processing is placed in the electroplating pool 5 for being loaded with electroplate liquid with plating target 8, by exposure mask
Plate ontology 7 is connect with the cathode of DC power supply 6, and target 8 will be electroplated and connect with the anode of DC power supply 6, is by DC power supply 6
Mask plate ontology 7 and plating target 8 apply electric signal；Under the action of electrical signals, the metal cation in electroplate liquid is in block shape
Electro-deposition occurs on the mask plate ontology 7 exposed at region 4, to form the stop block structure 14 for being located at block forming region 4.
In more detail, above-mentioned to use plating activation technique, the mask plate ontology that block forming region 4 exposes is carried out
The specific method of activation processing is varied, such as：The mask plate that block forming region 4 exposes can be changed by sanding operation
The surface roughness of ontology, so that the surface of the mask plate ontology after polishing is activated activation；Or it can be according to mask plate sheet
The material of body carries out activation activation to the mask plate ontology that block forming region 4 exposes using corresponding chemical reagent.No matter
Which kind of mode activation activation, the mask plate ontology all only exposed to block forming region 4 are carried out to mask plate ontology using
It is activated, and for other regions on mask plate ontology in addition to block forming region 4, due to the photoetching being wrapped by
Gel coating is protected without being activated.
When the mask plate ontology 7 after being activated to be placed in the electroplating pool 5 for be loaded with electroplate liquid, due to mask plate
On ontology 7 in addition to block forming region 4, it is coated with photoresist coating, therefore in the plating process, only block forming region
Coating can be grown on the 4 mask plate ontologies 7 exposed, other places can not be grown, to obtain the gear of high accuracy positioning
Block structure 14.
In addition, the time of control plating can be passed through using electroplating technology when block forming region 4 forms stop block structure 14
Control the thickness for being formed by stop block structure 14, such as：By mask plate ontology 7 be placed on the time in electroplating pool 5 1h~
Between 2h, stop block structure 14 of the thickness between 20um-60um can be formed.It is worth noting that, general plating is grown for 1 hour
Thickness of coating can reach 20um-40um, when being packaged using motherboard of the mask plate to display base plate, by mask plate with
After the motherboard 2 of display device is aligned, the gap between the motherboard 2 of the mask strip 11 on mask plate and display device generally exists
In the range of 50um-250um, it is seen then that the thickness of the stop block structure 14 formed using electroplating technology can be good at matching exposure mask
The order of magnitude in the gap between the mask strip 11 on plate and the motherboard 2 of display device, to limit the Under to be formed well
The thickness and coverage area of Coating15.
Further, since the coating grown using electroplating technology, bulk composition is controllable, such as：Iron-based, Ni-based, copper can be selected
Base, aluminium base etc. is used as bulk composition, and alloying element type and content are controllable in the coating formed, thus entire coating at
Point, qualitative regulation degree it is very big, therefore using electroplating technology formed stop block structure 14 can be good at match mask plate
Property required by mask strip 11 in ontology 7.
According to the detailed process of production stop block structure 14 provided by the above embodiment it is found that exposure mask provided by the above embodiment
In the production method of plate, the block forming region for being used to form stop block structure 14 can be accurately limited first with photoetching process
4, high-precision stop block structure 14 is then formed in block forming region 4 by electroplating technology, therefore, using by above-mentioned implementation
When the mask plate for the production method production that example provides is packaged technique, it can be good at the Under that limitation is formed
The thickness of Coating15 and the coverage area of Under Coating15.
Further, in above-mentioned steps 102, the stop block structure 14 of protrusion is formed on a side surface of mask plate ontology
Step can also specifically include：Using photoetching process, the block shape for being used to form stop block structure is limited on mask plate ontology
At region；Using chemical plating process or gas-phase deposition, stop block structure is formed in block forming region.
Specifically, after limiting block forming region on mask plate ontology using photoetching process, a variety of sides can be passed through
Method further makes stop block structure, and in addition to the electroplating technology of above-mentioned use, chemical plating process or gas-phase deposition also can be used
Stop block structure is formed in block forming region, certainly, the method for forming stop block structure is not limited only to the these types of mode provided.
Further, as shown in figure 4, in above-mentioned steps 1022, in the step of block forming region 4 forms stop block structure 14
It may particularly include：Multiple mutually independent block figures 141 are formed, block figure 141 and open region 12 correspond, each gear
Corresponding open region 12 is surrounded in block graphics 141.
Specifically, multiple mutually independent block forming regions 4 are first formed on mask plate ontology using photoetching process, it should
Block forming region 4 and open region 12 correspond, and each block forming region 4 surrounds corresponding open region 12；Then it adopts
With electroplating technology, is corresponded in multiple block forming regions 4 and form multiple block figures 141, be formed by multiple blocks
Figure 141 is mutually indepedent, and block figure 141 and open region 12 correspond, and each block figure 141 surrounds corresponding opening
Area 12.
In mask plate using production method provided by the above embodiment production, the block knot that is formed on mask plate ontology
Structure 14 includes multiple block figures 141, and each block figure 141 can surround corresponding open region 12, so that utilizing
When the mask plate is packaged operation, block figure 141 can limit Under in each position of open region 12
The thickness and coverage area of Coating15, preferably ensure that the packaging effect to display device, and meet ultra-narrow frame
Design requirement.
When being packaged using above-mentioned mask plate to display base plate, include the following steps：
Step 201, mask plate provided by the above embodiment and display base plate to be packaged are aligned, mask plate setting
Have the one of stop block structure 14 facing towards display base plate；
Specifically, the motherboard 2 of mask plate and display device to be packaged is aligned, so that mask plate is provided with block
The one of structure 14 and makes multiple open regions 12 on mask plate and the motherboard 2 of display device facing towards the motherboard 2 of display device
On multiple display devices correspond, each open region 12 limits the encapsulation boundary of corresponding display device.
Step 202, the deposition of inorganic encapsulated material is carried out, inorganic encapsulated material is deposited by the open region 12 on mask plate
On display base plate, packaging film is formed.
Specifically, the inorganic material such as SiON and SiNx can be selected as encapsulating material, by the open region 12 on mask plate,
Deposition forms packaging film on display base plate.
It is provided by the above embodiment due to being used in the packaging method of display base plate provided by the embodiment of the utility model
Mask plate is packaged, therefore, on the display base plate using packaging method provided by the embodiment of the utility model encapsulation, formation
Under Coating15 have relatively thin thickness and lesser coverage area so that encapsulation after display base plate not only have it is good
Good packaging effect, and can satisfy the design requirement of ultra-narrow frame.
Further, in above-mentioned steps 201, mask plate and the step of display base plate contraposition are specifically included：By mask plate
It the distance between is aligned with display base plate, and makes mask strip 11 and display base plate in mask plate between 50um-250um.
Specifically, when aligning mask plate and display base plate, be arranged the mask strip 11 in mask plate and display base plate it
Between distance between 50um-250um, packaging film can not only be formed on display device well, it is ensured that covering
Stop block structure 14 of the thickness formed on diaphragm plate between 20um-60um can be good at limiting the thickness of Under Coating15
Degree and coverage area.
The utility model embodiment additionally provides a kind of display base plate, is encapsulated using mask plate provided by the above embodiment
It arrives.
Since display base plate provided by the embodiment of the utility model encapsulates to obtain using mask plate provided by the above embodiment,
Therefore, the Under Coating formed on display base plate provided by the embodiment of the utility model has relatively thin thickness and smaller
Coverage area but also can satisfy ultra-narrow frame so that the display base plate after encapsulation not only has good packaging effect
Design requirement.
The utility model embodiment additionally provides a kind of display device, including display base plate provided by the above embodiment.
Since display device provided by the embodiment of the utility model includes display base plate provided by the above embodiment,
Display device provided by the embodiment of the utility model equally has good packaging effect, and can satisfy setting for ultra-narrow frame
Meter demand.
Unless otherwise defined, the technical term or scientific term that the disclosure uses should be the utility model fields
The ordinary meaning that the interior personage with general technical ability is understood." first ", " second " used in the disclosure and similar word
Language is not offered as any sequence, quantity or importance, and is used only to distinguish different component parts." comprising " or " packet
Containing " etc. similar word mean to occur the element or object before the word cover appear in the word presented hereinafter element or
Object and its equivalent, and it is not excluded for other elements or object.The similar word such as " connection " or " connected " is not limited to
Physics or mechanical connection, but may include electrical connection, it is either direct or indirect."upper", "lower",
"left", "right" etc. is only used for indicating relative positional relationship, and after the absolute position for being described object changes, then the relative position is closed
System may also correspondingly change.
It is appreciated that ought such as layer, film, region or substrate etc element be referred to as be located at another element "above" or "below"
When, which " direct " can be located at "above" or "below" another element, or may exist intermediary element.
In the description of above embodiment, particular features, structures, materials, or characteristics can be at any one or more
It can be combined in any suitable manner in a embodiment or example.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (8)
1. a kind of mask plate, including solder mask frame and the multiple mask strips being arranged in the solder mask frame, the mask strip packet
The second mask strip for including the first mask strip extended in a first direction and extending in a second direction, first mask strip and described
Second mask strip is arranged in a crossed manner and limits multiple open regions, and the open region is used to form film pattern；It is characterized in that, institute
State the stop block structure that mask strip is provided with protrusion towards film layer side to be formed.
2. mask plate according to claim 1, which is characterized in that the stop block structure includes multiple mutually independent blocks
Figure, the block figure and the open region correspond, and each block figure surrounds the corresponding open region.
3. mask plate according to claim 2, which is characterized in that the block figure is located at the mask strip close to described
The edge of open region.
4. mask plate according to claim 2, which is characterized in that the block figure is perpendicular to the solder mask frame institute
Thickness on the direction of plane is between 20um-60um.
5. mask plate according to claim 2, which is characterized in that the block figure includes metal backup figure.
6. mask plate according to claim 2, which is characterized in that the block figure extends perpendicular to the mask strip
Section on direction includes trapezoidal or rectangle.
7. a kind of display base plate, which is characterized in that encapsulate to obtain using mask plate as described in any one of claims 1 to 6.
8. a kind of display device, which is characterized in that including display base plate as claimed in claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820617481.4U CN208104537U (en) | 2018-04-27 | 2018-04-27 | Mask plate, display base plate, display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820617481.4U CN208104537U (en) | 2018-04-27 | 2018-04-27 | Mask plate, display base plate, display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208104537U true CN208104537U (en) | 2018-11-16 |
Family
ID=64117494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820617481.4U Withdrawn - After Issue CN208104537U (en) | 2018-04-27 | 2018-04-27 | Mask plate, display base plate, display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208104537U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598281A (en) * | 2018-04-27 | 2018-09-28 | 京东方科技集团股份有限公司 | Mask plate and preparation method thereof, display base plate and its packaging method, display device |
-
2018
- 2018-04-27 CN CN201820617481.4U patent/CN208104537U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598281A (en) * | 2018-04-27 | 2018-09-28 | 京东方科技集团股份有限公司 | Mask plate and preparation method thereof, display base plate and its packaging method, display device |
| CN108598281B (en) * | 2018-04-27 | 2024-03-15 | 京东方科技集团股份有限公司 | Mask plate, manufacturing method thereof, display substrate, packaging method thereof and display device |
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