CN208104284U - A kind of high temperature resistant release film - Google Patents

A kind of high temperature resistant release film Download PDF

Info

Publication number
CN208104284U
CN208104284U CN201820329741.8U CN201820329741U CN208104284U CN 208104284 U CN208104284 U CN 208104284U CN 201820329741 U CN201820329741 U CN 201820329741U CN 208104284 U CN208104284 U CN 208104284U
Authority
CN
China
Prior art keywords
release film
layer
high temperature
temperature resistant
film layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820329741.8U
Other languages
Chinese (zh)
Inventor
王洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Jin Run Jia Photoelectric Technology Co Ltd
Original Assignee
Huizhou Jin Run Jia Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Jin Run Jia Photoelectric Technology Co Ltd filed Critical Huizhou Jin Run Jia Photoelectric Technology Co Ltd
Priority to CN201820329741.8U priority Critical patent/CN208104284U/en
Application granted granted Critical
Publication of CN208104284U publication Critical patent/CN208104284U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a kind of high temperature resistant release films, including:Upper release film layer, high temperature resistant adhesive-layer, high temperature resistant silicon glue-line and the lower release film layer being from top to bottom successively superimposed together;Calcium carbonate granule is provided in the upper release film layer and lower release film layer;The upper release film layer is provided with upper electrically conductive polymer resin layer close to top, and the upper electrically conductive polymer resin layer two sides are all provided with aluminum hydroxide layer;The lower release film layer is provided with lower electrically conductive polymer resin layer close to bottom, and the lower electrically conductive polymer resin layer two sides are all provided with lower aluminum hydroxide layer;Two upper aluminum hydroxide layers be arranged in upper release film layer it is diagonal on, two lower aluminum hydroxide layers be arranged in lower release film layer it is diagonal on.High temperature resistant release film provided by the utility model has good high temperature resistance, very stable during use, nonflammable under high-temperature condition, meanwhile, there is good antistatic property.

Description

A kind of high temperature resistant release film
Technical field
The utility model relates to release technical field of membrane more particularly to a kind of high temperature resistant release films.
Background technique
Release film refers to that film surface can have the film of differentiation, and release film contacts under limited conditions with specific material Do not have viscosity or slight viscosity afterwards.It can be divided by different substrate materials:It is PE release film, PET release film, OPP release film, compound Release film(I.e. substrate is that have two or more material to be combined)Deng.
PET release film is also PET silicon oil membrane, exactly one layer of silicone oil is coated on the surface of PET film, to reduce PET film The adhesive force on surface achievees the effect that release.PET release film should be packed extensively, be printed, silk-screen, bat printing, engraved plate, is thin Membrane switch, flexible circuitry, insulated product, wiring board, laser anti-counterfeit, fitting, electronics, sealing material use film, reflectorized material, waterproof Material, medicine(Cream medicinal paper), sanitary paper, adhesive article, cross cutting stamp processing etc. industry fields.
Release film in the prior art is easy to produce electrostatic when in use, and high temperature resistance is bad, causes to hold when in use Fire easily occurs.
Therefore, the existing technology needs to be improved and developed.
Utility model content
In view of above-mentioned deficiencies of the prior art, the purpose of this utility model is to provide a kind of high temperature resistant release films, it is intended to Solve the problems, such as that release film high temperature resistance in the prior art is bad.
The technical solution of the utility model is as follows:
A kind of high temperature resistant release film, wherein the high temperature resistant release film includes:
The upper release film layer that is from top to bottom successively superimposed together, high temperature resistant adhesive-layer, high temperature resistant silicon glue-line and under it is release Film layer;
Calcium carbonate granule is provided in the upper release film layer and lower release film layer;
The upper release film layer is provided with upper electrically conductive polymer resin layer, the upper electrically conductive polymer resin layer close to top Two sides are all provided with aluminum hydroxide layer;
The lower release film layer is provided with lower electrically conductive polymer resin layer, the lower electrically conductive polymer resin layer close to bottom Two sides are all provided with lower aluminum hydroxide layer;
Two upper aluminum hydroxide layers be arranged in upper release film layer it is diagonal on, two lower aluminum hydroxide layers settings Lower release film layer it is diagonal on.
Preferably, the high temperature resistant release film, wherein section of two upper aluminum hydroxide layers and upper aluminum hydroxide layer Face is all square.
Preferably, the high temperature resistant release film, wherein the thickness of the upper release film layer and lower release film layer is all 30 μm-100μm。
Preferably, the high temperature resistant release film, wherein the high temperature resistant adhesive-layer with a thickness of 20 μm -60 μm.
Preferably, the high temperature resistant release film, wherein the high temperature resistant silicon glue-line with a thickness of 15 μm -50 μm.
Compared with prior art, high temperature resistant release film provided by the utility model, including:From top to bottom successively it is superimposed on Upper release film layer, high temperature resistant adhesive-layer, high temperature resistant silicon glue-line and lower release film layer together;The upper release film layer is release under Film layer is inscribed to be provided with calcium carbonate granule;The upper release film layer is provided with upper electrically conductive polymer resin layer close to top, described Upper electrically conductive polymer resin layer two sides are all provided with aluminum hydroxide layer;The lower release film layer is provided with lower conduction close to bottom Polymer resins layers, the lower electrically conductive polymer resin layer two sides are all provided with lower aluminum hydroxide layer;Two upper hydroxides Aluminium layer be arranged in upper release film layer it is diagonal on, two lower aluminum hydroxide layers be arranged in lower release film layer it is diagonal on, make Obtaining release film has good high temperature resistance, very stable during use, nonflammable under high-temperature condition, meanwhile, tool There is good antistatic property.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the high temperature resistant release film preferred embodiment in the utility model.
Specific embodiment
The utility model provides a kind of high temperature resistant release film, to make the purpose of this utility model, technical solution and effect more Add clear, clear, referring to the drawings and gives an actual example the utility model is further described.It should be appreciated that this place is retouched The specific embodiment stated is only used to explain the utility model, is not used to limit the utility model.
As shown in Figure 1, a kind of high temperature resistant release film provided by the embodiment of the utility model, including:From top to bottom successively fold Upper release film layer 10, high temperature resistant adhesive-layer 20, high temperature resistant silicon glue-line 30 and the lower release film layer 40 being combined;It is described release Film layer 10 and lower release film layer 20, which are inscribed, is provided with calcium carbonate granule 50;The upper release film layer 10 is provided with close to top leads Electric polymer resin layer 60, upper 60 two sides of electrically conductive polymer resin layer are all provided with aluminum hydroxide layer 70;Under described from Type film layer 20 is provided with lower electrically conductive polymer resin layer 80 close to bottom, and lower 80 two sides of electrically conductive polymer resin layer are all arranged There is lower aluminum hydroxide layer 90;Two upper aluminum hydroxide layers 70 be arranged in upper release film layer it is diagonal on, two lower hydrogen Alumina layer 90 be arranged in lower release film layer it is diagonal on.
When it is implemented, the calcium carbonate granule 50 has good stability, it is not easily decomposed, thermal stability is high, in temperature It will not burn when spending relatively high, therefore, fire-retardant effect can be enhanced, so that the high temperature resistance of release film is good. Further, since aluminum hydroxide layer is a kind of inorganic fire-retarded object that application is very wide, the flame retardant effect of release film is improved.
Simultaneously as it is all provided with electrically conductive polymer resin in the outer surface of upper release film layer 10 and lower release film layer 40, The electrically conductive polymer resin can effectively improve the antistatic property of release film, reduce be attached to due to electrostatic interaction from The dust of type film surface improves the high temperature resistance of release film.
When it is implemented, the high temperature resistance of the high temperature resistant adhesive-layer 20 and high temperature resistant silicon glue-line 30 is excellent, meanwhile, it is resistance to High temperature silicon glue-line 30 has good exhaust performance, will not generate bubble, has good stickiness.
In the further preferred embodiment of the utility model, two upper aluminum hydroxide layers 70 and upper aluminum hydroxide layer 90 Section is all square.
In the further preferred embodiment of the utility model, the thickness of the upper release film layer 10 and lower release film layer 40 is all 30μm-100μm。
In the further preferred embodiment of the utility model, the high temperature resistant adhesive-layer 20 with a thickness of 20 μm -60 μm.
In the further preferred embodiment of the utility model, the high temperature resistant silicon glue-line 30 with a thickness of 15 μm -50 μm.
In conclusion high temperature resistant release film provided by the utility model, including:From top to bottom successively it is superimposed together Upper release film layer, high temperature resistant adhesive-layer, high temperature resistant silicon glue-line and lower release film layer;In the upper release film layer and lower release film layer It connects and is provided with calcium carbonate granule;The upper release film layer is provided with upper electrically conductive polymer resin layer, the upper conduction close to top Polymer resins layers two sides are all provided with aluminum hydroxide layer;The lower release film layer is provided with lower conducting polymer close to bottom Resin layer, the lower electrically conductive polymer resin layer two sides are all provided with lower aluminum hydroxide layer;Two upper aluminum hydroxide layers are set Set upper release film layer it is diagonal on, two lower aluminum hydroxide layers be arranged in lower release film layer it is diagonal on so that release Film has good high temperature resistance, very stable during use, nonflammable under high-temperature condition, meanwhile, have good Antistatic property.
It should be understood that the application of the utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come It says, it can be modified or changed according to the above description, and all these modifications and variations all should belong to the appended power of the utility model The protection scope that benefit requires.

Claims (5)

1. a kind of high temperature resistant release film, which is characterized in that the high temperature resistant release film includes:
Upper release film layer, high temperature resistant adhesive-layer, high temperature resistant silicon glue-line and the lower release film layer being from top to bottom successively superimposed together;
Calcium carbonate granule is provided in the upper release film layer and lower release film layer;
The upper release film layer is provided with upper electrically conductive polymer resin layer, the upper electrically conductive polymer resin layer two sides close to top All it is provided with aluminum hydroxide layer;
The lower release film layer is provided with lower electrically conductive polymer resin layer, the lower electrically conductive polymer resin layer two sides close to bottom All it is provided with lower aluminum hydroxide layer;
Two upper aluminum hydroxide layers be arranged in upper release film layer it is diagonal on, two lower aluminum hydroxide layers are arranged under Release film layer it is diagonal on.
2. high temperature resistant release film according to claim 1, which is characterized in that two upper aluminum hydroxide layers and upper hydrogen-oxygen The section for changing aluminium layer is all square.
3. high temperature resistant release film according to claim 1, which is characterized in that the upper release film layer and lower release film layer Thickness is all 30 μm -100 μm.
4. high temperature resistant release film according to claim 1, which is characterized in that the high temperature resistant adhesive-layer with a thickness of 20 μ m-60μm。
5. high temperature resistant release film according to claim 1, which is characterized in that the high temperature resistant silicon glue-line with a thickness of 15 μ m-50μm。
CN201820329741.8U 2018-03-09 2018-03-09 A kind of high temperature resistant release film Active CN208104284U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820329741.8U CN208104284U (en) 2018-03-09 2018-03-09 A kind of high temperature resistant release film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820329741.8U CN208104284U (en) 2018-03-09 2018-03-09 A kind of high temperature resistant release film

Publications (1)

Publication Number Publication Date
CN208104284U true CN208104284U (en) 2018-11-16

Family

ID=64126160

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820329741.8U Active CN208104284U (en) 2018-03-09 2018-03-09 A kind of high temperature resistant release film

Country Status (1)

Country Link
CN (1) CN208104284U (en)

Similar Documents

Publication Publication Date Title
TW398163B (en) The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof
CN102143646B (en) Stiffening plate for printed circuit board
TWI242256B (en) Electrode sheet for electrostatic chucking device, electrostatic chucking device and method of adsorption
CN104861190A (en) Process for preparing antistatic modified PET release film
CN104842610A (en) Antistatic single-sided silicon-coated PET release film
CN208104284U (en) A kind of high temperature resistant release film
CN208104277U (en) A kind of release film that bonding force is strong
JP2011210877A (en) Flexible printed-wiring board, and method of manufacturing the same
TW201400293A (en) Thermally conductive substrate article
CN105219315A (en) A kind of sedimentation-prevention type pressure-sensitive conductive glue and preparation method thereof
CN108203544A (en) A kind of printed circuit board and preparation method thereof
TWM447653U (en) Circuit board structure of high heat-conductivity
CN207560460U (en) High-insulativity wiring board
CN104924715A (en) Antistatic double-side silicon-coating PET release film
CN208104279U (en) A kind of polarizer relase film
CN201657483U (en) Reinforcement plate for printed circuit board
CN101613517A (en) The resin prepreg body is formed glue, heat radiation film and manufacture method thereof
CN104974364A (en) Manufacturing method of silicon-double-coated PET release film
CN208022076U (en) A kind of special release films of OCA
TWI417339B (en) Resin composition
CN103796419B (en) Extinction black stiffening plate for printed circuit board (PCB)
CN208104278U (en) A kind of anti-scratch type release film
CN104985897A (en) Anti-static modified PET release film
CN208104283U (en) A kind of AB glue release film
CN212910181U (en) Novel copper-clad aluminum substrate

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant