CN208098251U - A kind of semiconductor cooling system that machine drum body is sanded - Google Patents
A kind of semiconductor cooling system that machine drum body is sanded Download PDFInfo
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- CN208098251U CN208098251U CN201820147563.7U CN201820147563U CN208098251U CN 208098251 U CN208098251 U CN 208098251U CN 201820147563 U CN201820147563 U CN 201820147563U CN 208098251 U CN208098251 U CN 208098251U
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- sanded
- type semiconductor
- drum body
- machine drum
- layer
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Abstract
The utility model discloses a kind of semiconductor cooling systems that machine drum body is sanded, including machine drum body is sanded, machine barrel side wall is sanded, cold end insulating materials, metallic conductor, N-type semiconductor and P-type semiconductor, it is enclosed on the outer wall that machine drum body is sanded and machine barrel side wall is sanded, the bottom end that machine barrel side wall is sanded is equipped with cold end insulating materials, the bottom end of the cold end insulating materials is equipped with metallic conductor, N-type semiconductor and P-type semiconductor are installed on the inside of the metallic conductor, the inner surface of the metallic conductor is equipped with rectangular channel, surface is equipped with round card slot at left and right sides of the inner cavity of the rectangular channel, the two sides up and down of the N-type semiconductor and P-type semiconductor are mounted on attachment device.The mode of bonding is connected and is changed to the mode of composable disassembly and connects by the semiconductor cooling system of the sand milling machine drum body, not only securely, once but also N-type semiconductor and P-type semiconductor some damage, can individually be replaced, be reduced costs.
Description
Technical field
The utility model relates to milling apparatus technical field, specially a kind of semiconductor cooling system that machine drum body is sanded.
Background technique
Sand mill is mainly made of rack, motor, grinding cylinder body, main shaft, bearing block etc., and main shaft is placed on bearing block by electricity
Machine drives its rotation, and the front end of main shaft, which is connected with abrasive roller and is placed in abrading cylinder body, carries out grinding and working in dispersion to material,
Since the working time of sand mill is longer, will be generated in be powered its relevant apparatus features and material in grinding and dispersion process a large amount of
Heat prevent the damage of the equipment such as its main shaft to extend the service life of sand mill, also for prevent material in high temperature shape
Under state occur effective ingredient decomposition, generally require to sand mill carry out cooling treatment, currently, common cooling means be using
Coolant liquid or water cool down the sand mill to work, but use this cooling means, and thermal inertia is big, and cooling effect is poor,
Temperature is not easily controlled, such as application No. is 201320625732.0 utility models, including machine drum body, semiconductor cooling is sanded
Device and temperature measurement and display device, semiconductor cooling device mainly include PN junction cold-making block, conducting wire and power supply, and machine barrel is sanded
One layer of insulating materials is surrounded by outside body cylindrical side, the cold end of PN junction cold-making block is mutually be bonded in the insulating materials that machine drum body is sanded with packet
And be evenly distributed on and be sanded around machine drum body, although effectively improving the service life of sand mill and the quality of product, N
Type semiconductor and P-type semiconductor are connected by the way of Nian Jie with metallic conductor, not only insecure, but also N-type semiconductor and p-type
Once some damage of semiconductor, can not individually be replaced, increase cost.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor cooling systems that machine drum body is sanded, to solve above-mentioned background
The problem of being proposed in technology.
To achieve the above object, the utility model provides the following technical solutions：A kind of semiconductor that machine drum body is sanded is cooling
System, including machine drum body is sanded, machine barrel side wall, cold end insulating materials, metallic conductor, N-type semiconductor and P-type semiconductor is sanded,
It is enclosed on the outer wall that machine drum body is sanded and machine barrel side wall is sanded, the bottom end that machine barrel side wall is sanded is equipped with cold end insulation
Material, the bottom end of the cold end insulating materials are equipped with metallic conductor, be equipped on the inside of the metallic conductor N-type semiconductor and
P-type semiconductor, the inner surface of the metallic conductor are equipped with rectangular channel, and surface is equipped at left and right sides of the inner cavity of the rectangular channel
The two sides up and down of round card slot, the N-type semiconductor and P-type semiconductor are mounted on attachment device, and the attachment device includes
Rectangular box, the rectangular box are connected with N-type semiconductor and P-type semiconductor, and the rectangular box matches with rectangular channel, the rectangle
Both side surface is equipped with sliding slot up and down for the inner cavity of case, and the lumen centers position of the rectangular box is equipped with spring, the spring
The left and right sides is mounted on attachment base, and the inside upper and lower ends of the attachment base are mounted on connecting rod, the connecting rod it is outer
Sliding block is installed, the sliding block is connected with sliding slot cooperation, and ball, the ball and circle are inlaid on the outside of the attachment base on wall
Shape card slot matches.
Preferably, pressing has anti-corrosion layer on the inner wall that machine drum body is sanded, and the anti-corrosion layer includes phenolic resin
The upper surface pressing of filled layer, the phenolic resin filled layer has polytetrafluoroethylene (PTFE) corrosion resistant layer, the polytetrafluoroethylene (PTFE) corrosion resistant layer
Upper surface pressing have carbon fiber layer.
Preferably, the upper surface pressing of the carbon fiber layer has F-C paint layer.
Preferably, the junction of the spring and attachment base is equipped with securing plate.
Compared with prior art, the utility model has the beneficial effects that：The semiconductor cooling system of the sand milling machine drum body leads to
It crosses rectangular box to match with rectangular channel, rectangular box can be inserted into rectangular channel, when the inner wall of sphere contacts to rectangular channel, square
The outer wall that the inner wall of shape slot squeezes ball pushes attachment base, is connected by sliding block with sliding slot cooperation, attachment base drives connecting rod to push away
Movable slider slides in sliding slot, while attachment base squeezes spring, and ball can enter in rectangular box, when ball slides into
When the position of round card slot, matched by ball and round card slot, spring reset by the springing of card ball into round card slot, can be with
Rectangular box card is moved in rectangular channel, so that N-type semiconductor and P-type semiconductor are fixed on the inside of metallic conductor, when disassembly to
Outside firmly pulls metallic conductor that can squeeze out out of round card slot by ball, so that rectangular box be separated out of rectangular channel
Out, disassembly is completed, the mode of bonding is connected to the mode for being changed to can be assembled disassembly and is connected, not only securely, but also N-type semiconductor
Once can individually be replaced, be reduced costs with some damage of P-type semiconductor.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the rectangular groove structure schematic diagram of the utility model；
Fig. 3 is the attachment device structural schematic diagram of the utility model；
Fig. 4 is the rectangular box schematic diagram of internal structure of the utility model；
Fig. 5 is the anti-corrosion layer structural schematic diagram of the utility model.
In figure：1, machine drum body, 2, sand milling machine barrel side wall, 3, cold end insulating materials, 4, anti-corrosion layer, 401, F-C paint are sanded
Layer, 402, carbon fiber layer, 403, polytetrafluoroethylene (PTFE) corrosion resistant layer, 404, phenolic resin filled layer, 5, metallic conductor, 6, N-type partly leads
Body, 7, P-type semiconductor, 8, attachment device, 801, rectangular box, 802, spring, 803, securing plate, 804, connecting rod, 805, sliding block,
806, attachment base, 807, ball, 808, sliding slot, 9, rectangular channel, 10, round card slot.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-5 is please referred to, the utility model provides a kind of technical solution：A kind of semiconductor cooling system that machine drum body is sanded
System, including machine drum body 1, sand milling machine barrel side wall 2, cold end insulating materials 3, metallic conductor 5, N-type semiconductor 6 and p-type is sanded and partly leads
Body 7, pressing on the inner wall of machine drum body 1, which is sanded, anti-corrosion layer 4, and anti-corrosion layer 4 includes phenolic resin filled layer 404, phenolic aldehyde tree
The upper surface pressing of rouge filled layer 404 has polytetrafluoroethylene (PTFE) corrosion resistant layer 403, the upper surface pressing of polytetrafluoroethylene (PTFE) corrosion resistant layer 403
There is carbon fiber layer 402, the upper surface pressing of carbon fiber layer 402 has F-C paint layer 401, and phenolic resin filled layer 404 has bondingization
It is high to learn activity, thermal stability is good, and good insulation preformance can pass through 403 energy of polytetrafluoroethylene (PTFE) corrosion resistant layer with fire-proof high-temperature resistant antistatic
The corrosion by acid or alkaline medium is avoided, corrosion resistance can be reinforced, is had by carbon fiber layer 402 good mechanical strong
The performances such as degree, electrical property, uvioresistant, the removing of anti-aging and anti-anode, antiseptic property remain of long duration, pass through F-C paint layer
401 effectively increase the smoothness that the inner wall surface of machine drum body 1 is sanded, and the anti-rust function of returning of anti-corrosion is strong, can extend and machine drum body 1 is sanded
Service life, be sanded machine drum body 1 outer wall on be enclosed be sanded machine barrel side wall 2, be sanded machine barrel side wall 2 bottom end be equipped with it is cold
Insulating materials 3 is held, the bottom end of cold end insulating materials 3 is equipped with metallic conductor 5, and the inside of metallic conductor 5 is equipped with N-type semiconductor
6 and P-type semiconductor 7, the inner surface of metallic conductor 5 is equipped with rectangular channel 9, and surface is equipped at left and right sides of the inner cavity of rectangular channel 9
The two sides up and down of round card slot 10, N-type semiconductor 6 and P-type semiconductor 7 are mounted on attachment device 8, and attachment device 8 includes square
Shape case 801, rectangular box 801 are connected with N-type semiconductor 6 and P-type semiconductor 7, and rectangular box 801 matches with rectangular channel 9, pass through square
Shape case 801 matches with rectangular channel 9, rectangular box 801 can be inserted into rectangular channel 9, two sides table above and below the inner cavity of rectangular box 801
Face is equipped with sliding slot 808, and the lumen centers position of rectangular box 801 is equipped with spring 802, and spring 802 is compressed spring, elasticity system
Number is 21N/CM, and the left and right sides of spring 802 is mounted on attachment base 806, the junction installation of spring 802 and attachment base 806
There is securing plate 803, it can be with the connection of reinforcement spring 802 and attachment base 806, above and below the inside of attachment base 806 by securing plate 803
Both ends are mounted on connecting rod 804, and sliding block 805 is equipped on the outer wall of connecting rod 804, and sliding block 805 cooperates phase with sliding slot 806
Even, it is connected by sliding block 805 with the cooperation of sliding slot 808, attachment base 806 drives connecting rod 804 to push sliding block 805 in sliding slot 808
Sliding, the outside of attachment base 806 is inlaid with ball 807, when ball 807 touches the inner wall of rectangular channel 9, rectangular channel 9 it is interior
The outer wall that wall squeezes ball 807 pushes attachment base 806, while attachment base 806 squeezes spring 802, and ball 807 can be into
Enter in rectangular box 801, ball 807 matches with round card slot 10, when ball 807 slides into the position of round card slot 10, leads to
It crosses ball 807 to match with round card slot 10, spring 802 is resetted 807 springing of card ball into round card slot 10, can be by rectangle
The card of case 801 moves in rectangular channel 9, so that N-type semiconductor 6 and P-type semiconductor 7 are fixed on 5 inside of metallic conductor.
Rectangular box 801 is directed at rectangular channel 9 by installing type, rectangular box 801 can be inserted into rectangular channel 9, when ball 807
When touching the inner wall of rectangular channel 9, the outer wall that the inner wall of rectangular channel 9 squeezes ball 807 pushes attachment base 806,806 band of attachment base
Dynamic connecting rod 804 pushes sliding block 805 to slide in sliding slot 808, while attachment base 806 squeezes spring 802, ball 807
It can enter in rectangular box 801, when ball 807 slides into the position of round card slot 10, spring 802 is resetted 807 bullet of card ball
It moves into round card slot 10, rectangular box 801 can be blocked and be moved in rectangular channel 9, thus by N-type semiconductor 6 and P-type semiconductor 7
It is fixed on the inside of metallic conductor 5, when disassembly firmly pulls metallic conductor 5 can be by ball 807 out of round card slot 10 outward
It squeezes out, so that rectangular box 801 be separated out of rectangular channel 9, completes disassembly, easy to assembly, using flexible.
In the description of the present invention, it should be understood that term " coaxial ", " bottom ", " one end ", " top ", " in
The orientation of the instructions such as portion ", " other end ", "upper", " side ", " top ", "inner", " front ", " center ", " both ends " or position are closed
System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description, rather than
The device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot
It is construed as a limitation of the present invention.
In addition, term " first ", " second ", " third ", " the 4th " are used for description purposes only, and should not be understood as instruction or
It implies relative importance or implicitly indicates the quantity of indicated technical characteristic, define " first ", " second ", " the as a result,
Three ", the feature of " the 4th " can explicitly or implicitly include at least one of the features.
In the present invention unless specifically defined or limited otherwise, term " installation ", " setting ", " connection ", " Gu
Calmly ", the terms such as " being screwed on " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；
It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, can also indirectly connected through an intermediary, it can be with
It is the interaction relationship of the connection or two elements inside two elements, unless otherwise restricted clearly, for this field
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of semiconductor cooling system that machine drum body is sanded, including sand milling machine drum body (1), sand milling machine barrel side wall (2), cold end are exhausted
Edge material (3), metallic conductor (5), N-type semiconductor (6) and P-type semiconductor (7), it is described be sanded machine drum body (1) outer wall on wrap
It is wrapped with and machine barrel side wall (2) is sanded, the bottom end that machine barrel side wall (2) are sanded is equipped with cold end insulating materials (3), and the cold end is exhausted
The bottom end of edge material (3) is equipped with metallic conductor (5), is equipped with N-type semiconductor (6) and p-type on the inside of the metallic conductor (5)
Semiconductor (7), it is characterised in that：The inner surface of the metallic conductor (5) be equipped with rectangular channel (9), the rectangular channel (9) it is interior
Surface is equipped with round card slot (10) at left and right sides of chamber, and the two sides up and down of the N-type semiconductor (6) and P-type semiconductor (7) are pacified
Equipped with attachment device (8), the attachment device (8) includes rectangular box (801), the rectangular box (801) and N-type semiconductor (6)
It is connected with P-type semiconductor (7), the rectangular box (801) matches with rectangular channel (9), above and below the inner cavity of the rectangular box (801)
Both side surface is equipped with sliding slot (808), and the lumen centers position of the rectangular box (801) is equipped with spring (802), the spring
(802) it is mounted at left and right sides of attachment base (806), the inside upper and lower ends of the attachment base (806) are mounted on connection
Bar (804) is equipped with sliding block (805) on the outer wall of the connecting rod (804), and the sliding block (805) and sliding slot (808) cooperate phase
Even, it is inlaid with ball (807) on the outside of the attachment base (806), the ball (807) matches with round card slot (10).
2. a kind of semiconductor cooling system that machine drum body is sanded according to claim 1, it is characterised in that：The sand mill
There is anti-corrosion layer (4) pressing on the inner wall of cylinder (1), the anti-corrosion layer (4) includes phenolic resin filled layer (404), described
The upper surface pressing of phenolic resin filled layer (404) has polytetrafluoroethylene (PTFE) corrosion resistant layer (403), the polytetrafluoroethylene (PTFE) corrosion resistant layer
(403) upper surface pressing has carbon fiber layer (402).
3. a kind of semiconductor cooling system that machine drum body is sanded according to claim 2, it is characterised in that：The carbon fiber
The upper surface pressing of layer (402) has F-C paint layer (401).
4. a kind of semiconductor cooling system that machine drum body is sanded according to claim 1, it is characterised in that：The spring
(802) securing plate (803) are installed with the junction of attachment base (806).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820147563.7U CN208098251U (en) | 2018-01-29 | 2018-01-29 | A kind of semiconductor cooling system that machine drum body is sanded |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820147563.7U CN208098251U (en) | 2018-01-29 | 2018-01-29 | A kind of semiconductor cooling system that machine drum body is sanded |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208098251U true CN208098251U (en) | 2018-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820147563.7U Expired - Fee Related CN208098251U (en) | 2018-01-29 | 2018-01-29 | A kind of semiconductor cooling system that machine drum body is sanded |
Country Status (1)
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| CN (1) | CN208098251U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113399099A (en) * | 2021-06-16 | 2021-09-17 | 嘉兴市康立德构件股份有限公司 | Waste and defective product concrete crushing and regenerating process and device |
-
2018
- 2018-01-29 CN CN201820147563.7U patent/CN208098251U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113399099A (en) * | 2021-06-16 | 2021-09-17 | 嘉兴市康立德构件股份有限公司 | Waste and defective product concrete crushing and regenerating process and device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 408102 Chongqing city Fuling District Li Du Goose Village Street office seven groups Patentee after: Chongqing Hongtu New Materials Technology Co.,Ltd. Address before: 408102 Chongqing city Fuling District Li Du Goose Village Street office seven groups Patentee before: CHONGQING HONGTU INK Co.,Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Semiconductor cooling system for sand mill barrels Effective date of registration: 20200421 Granted publication date: 20181116 Pledgee: Chongqing Fuling Branch of Bank of China Ltd. Pledgor: Chongqing Hongtu New Materials Technology Co.,Ltd. Registration number: Y2020500000004 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210623 Granted publication date: 20181116 Pledgee: Chongqing Fuling Branch of Bank of China Ltd. Pledgor: Chongqing Hongtu New Materials Technology Co.,Ltd. Registration number: Y2020500000004 |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181116 Termination date: 20220129 |