CN208060038U - A kind of thin-film thermocouple temperature sensor of embedded multi-layer PCB board - Google Patents
A kind of thin-film thermocouple temperature sensor of embedded multi-layer PCB board Download PDFInfo
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- CN208060038U CN208060038U CN201820341260.9U CN201820341260U CN208060038U CN 208060038 U CN208060038 U CN 208060038U CN 201820341260 U CN201820341260 U CN 201820341260U CN 208060038 U CN208060038 U CN 208060038U
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- thermocouple
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/028—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples using microstructures, e.g. made of silicon
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- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The utility model discloses a kind of thin-film thermocouple temperature sensor of embedded multi-layer PCB board, the film thermocouple sensor includes：Be deposited on it is described through over cleaning, polishing single layer copper-clad plate on film thermocouple and pressed with the single layer copper-clad plate for being coated with film thermocouple to constitute the single layer copper-clad plate of film thermocouple sensor protection plate, wherein film thermocouple includes the insulation film being deposited in single layer copper-clad plate, the rectangular film thermode one being distributed along thermocouple axisymmetrical that is deposited on insulation film, constitutes along mutually overlapped one end that thermocouple axisymmetrical is distributed and two thin film thermoelectric poles one T-type thin film thermoelectric pole two and protective film.The utility model realizes the real-time and accurate measurement to each layer temperature of pcb board；It has many advantages, such as that response is rapid, accurate positioning is convenient, high certainty of measurement.
Description
Technical field
The utility model belongs to sensor technical field, particularly relates to a kind of in pcb board insertion film thermocouple
Film thermocouple sensor, it is suitable for monitoring multi-layer PCB board operation and process in temperature high-accuracy fields of measurement.
Background technology
With the high speed development of the industries such as computer, mobile device, communications service, related electronic products are just towards intelligence
Change, high density, integrated, miniaturization direction are developed, connection and support of the printed circuit board (PCB) as electronic component
Body, plays relay transmission in electronic product, and the electronic product of high-density integrated proposes the quality of pcb board higher
It is required that.Wherein, the interlayer temperature of pcb board is to influence a key factor of pcb board quality and various electronic products service life, PCB
Plate interlayer temperature is always interested in industry and very scabrous technical barrier, excessively high in pcb board drilling process
Interlayer temperature may lead to problems such as the quality of drilling reduce even pcb board insulation and connection failure.And in operational process once
The interlayer temperature of pcb board be more than the threshold value that can bear of pcb board can then cause pcb board to burn, the short circuit of circuit, the feelings such as open circuit
Condition brings about great losses to lives and properties.
It is measured and contact temperature-sensitive Coating measurement currently, pcb board thermometry is mainly non-contact infrared.Its
In, what non-contact infrared measurement mainly measured is the mean temperature on pcb board surface, cannot measure the accurate temperature of intermediate each layer
Degrees of data, though and contact temperature-sensitive Coating measurement can directly measure every layer of temperature data, with micro- sem observation its colour developing
There are large errors so as to cause the large error of measuring temperature data during diameter；Above each measurement method is difficult to meet to survey
Amount requires and there is no the effective ways accurately measured at present.
Invention content
Technical barrier that is accurate, measuring in real time can not be carried out to the interlayer transient temperature of multi-layer PCB board in view of the prior art,
The present invention proposes a kind of thin-film thermocouple temperature sensor of embedded multi-layer PCB board to solve asking in the presence of the prior art
Topic.
To achieve the goals above, the technical solution of the utility model：
A kind of thin-film thermocouple temperature sensor of embedded multi-layer PCB board, which is characterized in that including：
Single layer copper-clad plate；
It is deposited on the insulation film on single layer copper-clad plate surface；
The first film thermode being deposited on the insulation film；
It is mutually overlapped with the first film thermode to constitute the second thin film thermoelectric pole of hot junction；
It is deposited on the protective film on film thermocouple hot junction surface；
First compensating wire of the lead as the first film thermode；
Second compensating wire of the lead as the second thin film thermoelectric pole；
And it is pressed with the single layer copper-clad plate for being coated with film thermocouple to constitute film thermocouple sensor guarantor
The single layer copper-clad plate of backplate.
Further, the first film thermoelectricity extremely two is respectively along the rectangular film warm of thermocouple axisymmetrical distribution
Electrode；Second thin film thermoelectric extremely along thermocouple axisymmetrical be distributed and both ends respectively with two the first film thermode phases
Mutually overlapped T-type thin film thermoelectric pole, the first film thermode mutually overlap the part overlapped with second thin film thermoelectric pole
For hot junction.
Further, the single layer copper-clad plate is pressed by copper foil material layer-prepreg-copper foil material layer according to pcb board
Technique and parameter, which are sequentially overlapped, to be pressed.
Further, the prepreg is treated glass fabric, epoxy resin adhesive liquid on dipping, then through heat
Handle sheeting made of (preliminary drying).
Further, the insulation film be using DC pulse magnetron sputtering add rf bias intermittence deposition prepare and
At SiO2Film；The first film thermode and the first compensating wire are all made of nichrome material preparation；Described
Two thin film thermoelectric poles and the second compensating wire are all made of nickel silicon alloy material preparation；The protective film is using DC pulse
Magnetron sputtering adds rf bias intermittence deposition that SiOxNy protective films are prepared.
Further, film thermocouple sensor further includes when measuring multi-layer PCB board：
Multiple prepregs and intermediate different layers of pcb boards；
Further, the film thermocouple sensor and multiple prepregs and different layers of pcb boards are via pcb board
Process for pressing and parameter pressing are integral；
Further, each thermocouple sensor includes the film thermocouple of two autonomous workings, can be to same temperature
Degree point is measured twice, further improves measurement accuracy.
Compared with prior art, the beneficial effects of the utility model：
The utility model is straight by the film thermocouple sensor that will be coated with film thermocouple composition in single layer copper-clad plate
It connects and is embedded in random layer two and needs in the pcb board layer of monitoring temperature, realize the real-time accurate survey to each layer temperature of pcb board
Amount；It has many advantages, such as that response is rapid, accurate positioning is convenient, high certainty of measurement.
Description of the drawings
Fig. 1 is film thermocouple sensor overall structure figure described in the utility model；
Fig. 2 is the utility model film thermocouple sensor Layering manifestation figure；
Fig. 3 film thermocouple membrane electrode detail views；
Fig. 4 is scheme of installation of the utility model in the measurement of multi-layer PCB board temperature；
In figure：1. as the single layer copper-clad plate of protection board, 2.SiOxNy protective films, 3. the first film thermodes, 4. absolutely
Edge Protection glue, 5. first compensating wires, 6. single layer copper-clad plates, 7. second thin film thermoelectric poles, 8. second compensating wires, 9.SiO2Absolutely
Edge film, 10. conductive silver glues, 11. prepregs are embedded in PCB film thermocouples sensor entirety, and 12. centres are different layers of
Pcb board, A, B. film thermocouple hot junction, M. are embedded in multi-layer PCB board film thermocouple sensor.
Specific implementation mode
To keep the purpose of this utility model, technical solution and advantage clearer, implement below in conjunction with the utility model
Attached drawing in example, is clearly and completely described the technical solution of the utility model, it is clear that described embodiment is this
Utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, the common skill in this field
The every other embodiment that art personnel are obtained without making creative work belongs to the utility model protection
Range.
As Figure 1-Figure 4, the utility model proposes a kind of film thermocouple biographies being embedded in film thermocouple in pcb board
Sensor, which is characterized in that including：By the single layer copper-clad plate 6 of cleaning polishing；The film heat being deposited in the single layer copper-clad plate
Galvanic couple；And it is pressed according to PCB plate lamination technology and parameter to constitute film thermocouple sensing with the single layer copper-clad plate
The single layer copper-clad plate protection board 1 of device.
Further example 1, the film thermocouple include：It is deposited on the insulation film on PCB substrate surface；It is deposited on institute
State the first film thermode 3 on insulation film；It is mutually overlapped with the first film thermode to constitute the of hot junction A, B
Two thin film thermoelectric poles 7；First compensating wire 5 of the lead as the first film thermode；As drawing for the second thin film thermoelectric pole
Second compensating wire 6 of line；And protective film.
In conjunction with 1 further example 2 of example, the first film thermoelectricity extremely two is respectively along thermocouple axisymmetrical point
The rectangular film thermode of cloth；Second thin film thermoelectric extremely along one end of thermocouple axisymmetrical distribution with it is two first thin
Film thermode mutually overlapped T-type thin film thermoelectric pole；Wherein, the first film thermode and the second thin film thermoelectric pole are along heat
Galvanic couple axisymmetrical is distributed and the two connects the rectangle intersection to be formed and be distributed along thermocouple axisymmetrical and is known as hot junction (i.e.
Measurement end), the protective film is deposited on the thin film thermoelectric in addition to two kinds of thin film thermoelectric poles and compensating wire tie point
In pole surface.
In conjunction with 2 further example 3 of example, the insulation film is to be added between rf bias using DC pulse magnetron sputtering
Having a rest property deposits the SiO being prepared2Insulation film 9；3 and first compensating wire 5 of the first film thermode is all made of nickel
It is prepared by chromium alloy material, that is, NiCr alloy materials；Second thin film thermoelectric pole 7 and the second compensating wire 8 are all made of nisiloy conjunction
It is prepared by golden material, that is, NiSi alloy materials；The protective film adds rf bias on hot junction using DC pulse magnetron sputtering
The SiOxNy protective films 2 that intermittence deposition is prepared,；Wherein, the hot junction shape is rectangular and along sensor axis
It is 2mm × 2mm hot junctions to symmetrical area, can be needed by coating process according to measurement accuracy and response time
Mask is controlled, and can be measured to same temperature data by two symmetrical hot junctions and to be measured essence to increase
Degree, the SiO2Insulation film thickness is 2.5 μm, the first film thermoelectricity extremely nickel-chromium thin film thermode, thickness 800nm,
Second thin film thermoelectric extremely nisiloy thin film thermoelectric pole, thickness 800nm, SiOxNy protective film thickness are 1 μm, the first compensation
Conducting wire is nickel chromium triangle compensating wire, and the second compensating wire is nisiloy compensating wire.
In conjunction with 3 further example 4 of example, the single layer copper-clad plate is by copper foil material layer-prepreg-copper foil material layer
It is sequentially overlapped and is pressed according to PCB plate lamination technology and parameter；By as the single layer copper-clad plate of PCB protection boards according to pcb board
Process for pressing and parameter and the single layer copper-clad plate for being coated with film thermocouple carry out pressing composition film thermocouple sensor entirety M；
And it presses the first film thermode of rear film thermocouple sensor and the first compensating wire conductive adhesive and uses insulating cement
It is protected, the second thin film thermoelectric pole and the second compensating wire conductive adhesive are simultaneously protected with insulating cement；The conduction
Glue is normal temperature quick-drying conductive silver glue 10, and insulation protection glue 4 uses one component room temperature cure silicone rubber insulation protection glue；As protection
The single layer copper-clad plate of plate is used for protective film thermocouple, protection board leaving certain gaps uncovered by the economic plan at film thermocouple lead.
Multiple prepregs and intermediate different layers of pcb boards；
Need to monitor the film thermocouple sensor between the pcb board of transient temperature, and the film positioned at any two
Thermocouple sensor is via PCB plate lamination technology and parameter and the multiple prepreg and intermediate different layers of pcb board pressures
Synthesis is whole；
Further, the manufacturing process provided by the utility model for film thermocouple sensor, including：
Step 1, pretreatment：In order to ensure the accuracy of temperature in drilling process, the single layer copper-clad plate of the utility model, half
Cured sheets are all made of material identical with testing temperature pcb board is waited for and are made；The single layer copper-clad plate of the film thermocouple to be plated cut
Surface is processed by shot blasting firstly the need of on polishing machine with varigrained antiscuffing paste, then carries out the system of sensor structure again
Make；
The preparation of step 2, insulation film：Single layer copper-clad plate Jing Guo polishing treatment is placed in supersonic wave cleaning machine respectively
It is cleaned twice with acetone, alcohol and deionized water, uses N2It is put into the multi-functional composite film coating machine of JZFZJ-50S high vacuum after air-blowing is dry
Vacuum sputtering room in, close sputtering chamber；To ensure that prepared insulation film binding force, compactness, insulating properties are more preferable, preferably
SiO2Insulation film of the insulation film as thermocouple, and rf bias intermittence sedimentation is added using DC pulse magnetron sputtering
Prepare the SiO2Insulation film 9, corresponding technological parameter are on the basis of DC pulse magnetron sputtering plus 60V rf bias,
And it often sputters 20 minutes, suspends 5 minutes；It often sputters 1 hour, suspends 20 minutes；
The preparation of step 3, thin film thermoelectric pole：In the SiO prepared2Single layer copper-clad plate center is symmetrical on insulation film 9
Axis both sides cover NiCr masks, using DC pulse magnetron sputtering method deposition the first film thermode 3, involved by preparation process
And technological parameter refer to SiO2Insulation film 9；NiSi masks are covered on the first film thermode 3 prepared again and are used
DC pulse magnetron sputtering method deposits the second thin film thermoelectric pole 7, and preparation process and the first film thermode 3 are identical；While the
Two overlapping regions that one thin film thermoelectric pole 3 and the second thin film thermoelectric pole 8 are formed form hot junction A, B of thermocouple；
The preparation of step 4, protective film：By the pin portions aluminium of the first film thermode 3 and the second thin film thermoelectric pole 7
Foil paper package is tight, after allowing remaining thermode to expose, then except the first film thermode 3 and the second thin film thermoelectric pole 7 and
DC pulse magnetron sputtering deposition is used in thermoelectricity pole surface except first compensating wire 5,8 tie point of the second compensating wire
SiOxNy protective films 2, preparation process and the preparation process with reference to the first film thermode 3 or the second thin film thermoelectric pole 7；
It is step 5, the first compensating wire 5 is Nian Jie with conductive silver glue with the first film thermode 3 and stood in room temperature one small
When, two second compensating wires are hinged rear Nian Jie with conductive silver glue with the second thin film thermoelectric pole 7 and stand one hour；It waits being bonded
Appropriate one component room temperature cure silicone rubber insulation protection glue 4 is coated on conductive silver glue 10 with protection pin abutting edge after securely；
The installation of step 6, film thermocouple sensor：According to test between the film thermocouple sensor M prepared
It needs to be put into different layers of pcb boards 12, it is then that prepreg 11 and film thermocouple sensor M is thin according to prepreg-
The sequence of film thermocouple sensor-prepreg is put into togerther pcb board pressing machine after neatly being overlapped with pcb board and carries out pressing processing
Operation, when needing test temperature, film thermocouple sensor M is connect with testing element can carry out temperature monitoring experiment.
The preferable specific implementation mode of the above, only the utility model, but the scope of protection of the utility model is not
Be confined to this, any one skilled in the art within the technical scope disclosed by the utility model, according to this practicality
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (3)
1. a kind of thin-film thermocouple temperature sensor of embedded multi-layer PCB board, which is characterized in that including：
Single layer copper-clad plate；The single layer copper-clad plate presses work by copper foil material layer-prepreg-copper foil material layer according to pcb board
Skill and parameter, which are sequentially overlapped, to be pressed；
It is deposited on the insulation film on single layer copper-clad plate surface；
The first film thermode being deposited on the insulation film；
It is mutually overlapped with the first film thermode to constitute the second thin film thermoelectric pole of hot junction；
It is deposited on the protective film on film thermocouple hot junction surface；
First compensating wire of the lead as the first film thermode；
Second compensating wire of the lead as the second thin film thermoelectric pole；
And it is pressed with the single layer copper-clad plate for being coated with film thermocouple to constitute film thermocouple sensor protection plate
Single layer copper-clad plate protection board；
Wherein, the first film thermoelectricity extremely two is respectively along the rectangular film thermode of thermocouple axisymmetrical distribution；Institute
State the second thin film thermoelectric extremely along thermocouple axisymmetrical distribution and both ends mutually overlapped with two the first film thermodes respectively
T-type thin film thermoelectric pole, the first film thermode mutually overlaps the part overlapped with second thin film thermoelectric pole and connect for heat
Point.
2. thin-film thermocouple temperature sensor according to claim 1, it is characterised in that：
The insulation film is to add rf bias intermittence to deposit the SiO being prepared using DC pulse magnetron sputtering2Film；
The first film thermode and the first compensating wire are all made of nichrome material preparation；Second thin film thermoelectric pole with
And second compensating wire be all made of nickel silicon alloy material preparation；The protective film is to add radio frequency using DC pulse magnetron sputtering
SiOxNy protective films are prepared in bias intermittence deposition.
3. thin-film thermocouple temperature sensor according to claim 1, it is characterised in that：
The film thermocouple sensor includes two film thermocouples worked independently from each other can be clicked through to same temperature
Row measures twice.
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| CN201820341260.9U CN208060038U (en) | 2018-03-13 | 2018-03-13 | A kind of thin-film thermocouple temperature sensor of embedded multi-layer PCB board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111982325A (en) * | 2020-07-24 | 2020-11-24 | 清华大学深圳国际研究生院 | Structure for measuring temperature of cutter by using thin-film thermocouple and preparation method |
-
2018
- 2018-03-13 CN CN201820341260.9U patent/CN208060038U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111982325A (en) * | 2020-07-24 | 2020-11-24 | 清华大学深圳国际研究生院 | Structure for measuring temperature of cutter by using thin-film thermocouple and preparation method |
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