CN208045533U - A kind of LED package - Google Patents

A kind of LED package Download PDF

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Publication number
CN208045533U
CN208045533U CN201820399784.3U CN201820399784U CN208045533U CN 208045533 U CN208045533 U CN 208045533U CN 201820399784 U CN201820399784 U CN 201820399784U CN 208045533 U CN208045533 U CN 208045533U
Authority
CN
China
Prior art keywords
led
negative electrode
positive electrode
conductive part
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820399784.3U
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Chinese (zh)
Inventor
高春瑞
郑剑飞
林志洪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Dacol Photoelectronics Technology Co Ltd
Original Assignee
Xiamen Dacol Photoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Dacol Photoelectronics Technology Co Ltd filed Critical Xiamen Dacol Photoelectronics Technology Co Ltd
Priority to CN201820399784.3U priority Critical patent/CN208045533U/en
Application granted granted Critical
Publication of CN208045533U publication Critical patent/CN208045533U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a kind of LED package, including:LED support, LED chip, metal contact wires and packaging plastic, the LED support includes substrate and the positive electrode and negative electrode that are arranged at intervals in the substrate, it further include an at least fixing piece, it is fixedly connected with the fixing piece between positive electrode and negative electrode, to fix the relative position of positive electrode and negative electrode, the ceramic insulation portion deformation of fixing piece is small, the substrate between positive electrode and negative electrode can be effectively prevent because expanding with heat and contract with cold so that the two relative position changes, ensure therefore metal contact wires will not disconnect, its connection structure is simple, stability is good, service life is long.Further, the first conductive part and the second conductive part is arranged in the both ends in ceramic insulation portion, can be used for welding metal connecting line, has the characteristics that convenient welding, shortens metal contact wires length.

Description

A kind of LED package
Technical field
The utility model is related to LED fields, and in particular to LED encapsulation fields are especially to provide a kind of simple in structure, stable Good, the with long service life LED package of property.
Background technology
LED chip can sample after being packaged and to form packaging body and carry out performance and the detection in service life.In LED performances And in the detection in service life, " thermal shock " experiment is an important criteria (description of test:In the case of LED lamp bead is not lighted, Be placed in experimental facilities, setting high temperature such as 120 DEG C of -15min -40 DEG C of -15min progress alternate cycles).Lamp after overtesting Pearl, the expansion occurred under cold-hot condition due to lamp bead packing colloid are shunk, and different degrees of deformation will occur in internal wire rod And damage.Experiment be examine bank design reasonability and whether reasonably effectively tested using the coefficient of expansion size of colloid Card, therefore, cycle-index is more, illustrates that lamp bead quality is better.
Since LED support is there are positive and negative electrode, it is fixed using insulating materials (i.e. substrate) between two metal electrodes And insulation.The lamp bead of different insulative material determines different heat resistances and the different coefficients of expansion.Since different LED is encapsulated The difference of the used material of body, the i.e. material of metal electrode and substrate are different, and the coefficient of expansion is different, causes in two electricity of lamp bead Between pole substrate expansion it is larger, cause herein stress it is larger, wire rod is easily deformed, in addition disconnect, as shown in Figure 1.Thus may be used Know, it is used into the larger environment of the temperature difference, the stability of the LED package is poor, and service life cannot be guaranteed.
Utility model content
For this purpose, the utility model provides, one kind is simple in structure, stability is good, LED package with long service life.
To achieve the above object, a kind of LED package provided by the utility model, including:LED support, LED chip, gold Belong to connecting line and packaging plastic, the LED support includes substrate and the positive electrode and negative electrode that are arranged at intervals in the substrate, is gone back Including an at least fixing piece, the fixing piece includes ceramic insulation portion and is respectively arranged at the first of the ceramic insulation portion both ends The ceramic insulation portion of conductive part and the second conductive part, the fixing piece is set between positive electrode and negative electrode, and ceramic insulation First conductive part and the second conductive part at portion both ends are fixed on by crystal-bonding adhesive on positive electrode and negative electrode respectively;The LED core Piece die bond is electrically connected the positive electrode and negative electrode, the packaging plastic covering by metal contact wires respectively on LED support The LED chip and metal contact wires.
Another preferred embodiment of the utility model, the first conductive part and the second conductive part of the fixing piece are silver-plated Layer.
The thickness of further Dun, the silver coating are -60 microinch of 40 microinch.
Another preferred embodiment of the utility model, the fixing piece be equipped with it is multiple, multiple fixing pieces are arranged side by side in just Between electrode and negative electrode.
Another preferred embodiment of the utility model, on the positive electrode, the LED chip is just for the LED chip die bond Pole is electrically connected to by metal contact wires on the first conductive part, and the cathode of the LED chip is electrically connected to by metal contact wires On negative electrode.
Another preferred embodiment of the utility model, the LED chip die bond on negative electrode, bear by the LED chip Pole is electrically connected to by metal contact wires on the second conductive part, and the anode of the LED chip is electrically connected to by metal contact wires On positive electrode.
Another preferred embodiment of basic utility model, the crystal-bonding adhesive are elargol or tin cream.
Another preferred embodiment of the utility model, the packaging plastic are transparent silica gel or fluorescent glue.
By technical solution provided by the utility model, have the advantages that:
It is fixedly connected with fixing piece between positive electrode and negative electrode, to fix the relative position of positive electrode and negative electrode, The ceramic insulation portion deformation of fixing piece is small, and the substrate between positive electrode and negative electrode can be effectively prevent because expanding with heat and contract with cold so that the two Relative position changes, and ensures therefore metal contact wires will not disconnect, and connection structure is simple, and stability is good, uses Long lifespan.Further, the first conductive part and the second conductive part is arranged in the both ends in ceramic insulation portion, can be used for welding metal connection Line has the characteristics that convenient welding, shortens metal contact wires length.
Description of the drawings
Fig. 1 show the broken string schematic diagram of LED package in background technology;
Fig. 2 show the encapsulating structure schematic diagram of LED package in embodiment one;
Fig. 3 show the encapsulating structure schematic diagram of LED package in embodiment two.
Specific implementation mode
To further illustrate that each embodiment, the utility model are provided with attached drawing.These attached drawings are in the utility model discloses A part for appearance mainly to illustrate embodiment, and can coordinate the associated description of specification to explain that the running of embodiment is former Reason.Cooperation refers to these contents, and those of ordinary skill in the art will be understood that other possible embodiments and this practicality are new The advantages of type.Component in figure is not necessarily to scale, and similar component symbol is conventionally used to indicate similar component.
The utility model is further illustrated in conjunction with the drawings and specific embodiments.
Embodiment one
With reference to shown in Fig. 2, a kind of LED package provided in this embodiment, including:LED support, LED chip 20, metal connect Wiring 30 and packaging plastic (not shown), the LED support include substrate 11 and the positive electrode that is arranged at intervals in the substrate 11 12 and negative electrode 13, further include a fixing piece 40, the fixing piece 40 includes ceramic insulation portion 41 and is respectively arranged at the pottery First conductive part 42 and the second conductive part 43 at 41 both ends of porcelain insulating portion, the ceramic insulation portion 41 of the fixing piece 40 is set to just Between electrode 12 and negative electrode 13, and first conductive part 42 at 41 both ends of ceramic insulation portion and the second conductive part 43 are respectively by solid Brilliant glue (not shown) is fixed on positive electrode 12 and negative electrode 13;20 die bond of the LED chip is led to respectively on LED support It crosses metal contact wires 30 and is electrically connected the positive electrode 12 and negative electrode 13, the packaging plastic covers the LED chip 20 and metal Connecting line 30.
Specifically, in the present embodiment, for 20 die bond of the LED chip on positive electrode 12, the anode of the LED chip 20 is logical It crosses metal contact wires 30 to be electrically connected on the first conductive part 41, the cathode of the LED chip 20 is electrically connected by metal contact wires 30 It is connected on negative electrode 13, such encapsulating structure, has the characteristics that convenient welding, shortens 30 length of metal contact wires.In other realities It applies in example, if the LED chip die bond can be on negative electrode, the cathode of the LED chip is electrically connected to by metal contact wires On second conductive part, the anode of the LED chip is electrically connected to by metal contact wires on positive electrode.
Further, in the present embodiment, the first conductive part 42 and the second conductive part 43 of the fixing piece 40 are to be plated in The thickness of the silver coating of the end in ceramic insulation portion 41, the silver coating is preferably -60 microinch of 40 microinch, both can guarantee welding And conduction, and the material cost of coating can be saved to the full extent.
Further, in the present embodiment, the crystal-bonding adhesive is elargol, in other embodiments, can also use routine Tin cream substitutes, this is that those skilled in the art grasps already, and this will not be detailed here.
Further, the packaging plastic is transparent silica gel or fluorescent glue, this is that those skilled in the art can be according to tool The light extraction requirement of body is selected, and this will not be detailed here.
Embodiment two
With reference to shown in Fig. 3, LED package provided in this embodiment, structure is roughly the same with the structure of embodiment one, only Unlike one, in the present embodiment, the fixing piece 40 is equipped with two, and two fixing pieces 40 are arranged side by side in positive electrode 12 and bear Between electrode 13, structure is more stable.
In other embodiments, fixing piece 40 can also be arranged two or more, and multiple fixing pieces 40 are arranged side by side in positive electricity Between pole 12 and negative electrode 13, specific quantity, which is those skilled in the art, to be selected according to concrete structure, This will not be detailed here.
By technical solution provided by the utility model, it is fixedly connected with fixing piece between positive electrode and negative electrode, with The relative position of fixed positive electrode and negative electrode, the ceramic insulation portion deformation of fixing piece is small, can effectively prevent positive electrode and negative electricity Because expanding with heat and contract with cold so that the two relative position changes, therefore guarantee metal contact wires will not break substrate between pole It opens, connection structure is simple, and stability is good, and service life is long.Further, the first conductive part is arranged in the both ends in ceramic insulation portion It with the second conductive part, can be used for welding metal connecting line, have the characteristics that convenient welding, shorten metal contact wires length.
Although specifically showing and describing the utility model in conjunction with preferred embodiment, those skilled in the art answers This is understood, in the spirit and scope for not departing from the utility model defined by the appended claims, in form and details On the utility model can be made a variety of changes, be the scope of protection of the utility model.

Claims (8)

1. a kind of LED package, including:LED support, LED chip, metal contact wires and packaging plastic, the LED support include base Bottom and the positive electrode and negative electrode being arranged at intervals in the substrate, it is characterised in that:Further include an at least fixing piece, it is described solid Determine part to include ceramic insulation portion and be respectively arranged at first conductive part and the second conductive part at the ceramic insulation portion both ends, it is described The ceramic insulation portion of fixing piece is set between positive electrode and negative electrode, and first conductive part and second at ceramic insulation portion both ends Conductive part is fixed on by crystal-bonding adhesive on positive electrode and negative electrode respectively;The LED chip die bond is on LED support, and difference It is electrically connected the positive electrode and negative electrode by metal contact wires, the packaging plastic covers the LED chip and metal contact wires.
2. LED package according to claim 1, it is characterised in that:First conductive part of the fixing piece and second is led Electric portion is silver coating.
3. LED package according to claim 2, it is characterised in that:The thickness of the silver coating is that 40 microinch -60 are micro- Inch.
4. LED package according to claim 1, it is characterised in that:The fixing piece be equipped with it is multiple, multiple fixing pieces are simultaneously Row is set between positive electrode and negative electrode.
5. LED package according to claim 1, it is characterised in that:The LED chip die bond is on the positive electrode, described The anode of LED chip is electrically connected to by metal contact wires on the first conductive part, and the cathode of the LED chip is connected by metal Line is electrically connected on negative electrode.
6. LED package according to claim 1, it is characterised in that:The LED chip die bond is described on negative electrode The cathode of LED chip is electrically connected to by metal contact wires on the second conductive part, and the anode of the LED chip is connected by metal Line is electrically connected on positive electrode.
7. LED package according to claim 1, it is characterised in that:The crystal-bonding adhesive is elargol or tin cream.
8. LED package according to claim 1, it is characterised in that:The packaging plastic is transparent silica gel or fluorescent glue.
CN201820399784.3U 2018-03-23 2018-03-23 A kind of LED package Expired - Fee Related CN208045533U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820399784.3U CN208045533U (en) 2018-03-23 2018-03-23 A kind of LED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820399784.3U CN208045533U (en) 2018-03-23 2018-03-23 A kind of LED package

Publications (1)

Publication Number Publication Date
CN208045533U true CN208045533U (en) 2018-11-02

Family

ID=63948481

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820399784.3U Expired - Fee Related CN208045533U (en) 2018-03-23 2018-03-23 A kind of LED package

Country Status (1)

Country Link
CN (1) CN208045533U (en)

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Granted publication date: 20181102