CN208029214U - A kind of support plate for solving small-sized Resistor-Capacitor Unit and setting up a monument - Google Patents
A kind of support plate for solving small-sized Resistor-Capacitor Unit and setting up a monument Download PDFInfo
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- CN208029214U CN208029214U CN201820385015.8U CN201820385015U CN208029214U CN 208029214 U CN208029214 U CN 208029214U CN 201820385015 U CN201820385015 U CN 201820385015U CN 208029214 U CN208029214 U CN 208029214U
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Abstract
The utility model is related to a kind of support plates for solving small-sized Resistor-Capacitor Unit and setting up a monument, which is characterized in that and the support plate includes support plate, small-sized Resistor-Capacitor Unit, wherein：The length of bonding pad of the small-sized Resistor-Capacitor Unit is 0.145mm, pad width 0.185mm on the support plate.The utility model changes pad design, reduce lever length, and tin material is pulled into power and becomes to capacitance-resistance broadside both sides, the small-sized capacitance resistance component patch of small-sized capacitance-resistance can be more directly efficiently solved to set up a monument problem, not only increase small-sized Resistor-Capacitor Unit is applied to power, and the design and manufacture product yield of support plate is improved, material cost loss is reduced, there is good application prospect；Further, it is also possible to enhance component and support plate contact area, path signal consistency is improved, and extend the product life cycle.
Description
Technical field
The utility model is related to capacitor-resistor unit element welding fields, and in particular to a kind of to solve what small-sized Resistor-Capacitor Unit was set up a monument
Support plate.
Background technology
In highly integrated, high density, internal element is intended to extra smallization, ultrathin for semicon industry developing trend, current to seal
Filling Resistor-Capacitor Unit welding class product selects Resistor-Capacitor Unit also smaller and smaller, increasingly lighter.
Semiconductor packages business small Resistor-Capacitor Unit use at present is more and more common, but capacitor-resistor unit pastes on support plate
During piece, as component size is smaller and smaller, weight is more and more lighter, and because support plate laminate layers number is less, it is low to cover amount of copper, composite wood
Deformation, support plate green oil windowing offset, patch caused by harmomegathus caused by expecting coefficient of thermal expansion difference or warpage, metal material thermal stress
Piece equipment precision deviation, tin cream reflux capacitance-resistance sink sideslip offset the problems such as cause patch capacitance-resistance to be biased to long side side, such as lever
The general both ends tining of principle, which pulls power imbalance, causes capacitance-resistance to be set up a monument problem.Leave pad in the one end that usually will appear surface mount elements
Surface, element is inclined or upright, and shape such as stone tablet is known as setting up a monument.
The main method for improving phenomenon of setting up a monument in the prior art is typically to be controlled during surface mounting technology patch
System：Replace furnace with mutiple temperature regions, control furnace temperature, change hot air reflux mode in stove, replace thermal conductivity and the good support plate of thickness evenness,
Replace the good tin cream etc. of uniformity.But these control methods have the following disadvantages：It is of high cost, generally require replace it is more advanced and
The expensive equipment of value can just make moderate progress；Control flow is complicated；Manpower and materials expend serious.
In view of this, the utility model is quasi- to propose a kind of support plate for solving small-sized Resistor-Capacitor Unit and setting up a monument, it can be more effectively
It solves the problems, such as that small-sized capacitance resistance component patch is set up a monument, to reduce encapsulating material cost allowance, improves finished product yield；In addition, also
Component and support plate contact area can be enhanced, improve path signal consistency, and extend product service life.
Utility model content
Too small, the problem of setting up a monument on support plate, the utility model for small-sized Resistor-Capacitor Unit such as 01005 volume and weight of solution
It is quasi- that a kind of support plate for solving small-sized Resistor-Capacitor Unit and setting up a monument is provided, change support plate pad size from problem source design end, makes tin material
Wetting climbs glue and becomes to the broadside both sides reduction capacitance-resistance both ends of Resistor-Capacitor Unit to pull power, reduces lever length, more directly effectively
Solve the problems, such as that small-sized capacitance resistance component patch is set up a monument.
The utility model provides a kind of support plate for solving small-sized Resistor-Capacitor Unit and setting up a monument, which is characterized in that the support plate includes
Support plate, small-sized Resistor-Capacitor Unit, wherein：
The length of bonding pad of the small-sized Resistor-Capacitor Unit is 0.145mm, pad width 0.185mm on the support plate.
Further, the small-sized Resistor-Capacitor Unit includes the one or more in miniature resistance or small-sized capacitance.
Further, the size of the small-sized Resistor-Capacitor Unit is：Long 0.4mm, wide 0.2mm, high 0.2mm.
Further, the support plate includes support plate, PCB, material be metallic plate, copper-clad plate one kind.
The utility model achieves following advantageous effect：
The support plate provided by the utility model for solving small-sized Resistor-Capacitor Unit and setting up a monument, changes pad design, reduces lever length,
And tin material is pulled into power and becomes to capacitance-resistance broadside both sides, it can more directly efficiently solve the small-sized capacitance resistance component patch of small-sized capacitance-resistance
Piece is set up a monument problem, not only increases the power that is applied to of small-sized Resistor-Capacitor Unit, and the design and manufacture product for improving support plate is good
Rate reduces material cost loss, there is good application prospect；Further, it is also possible to enhance component and support plate contact area, carry
High via signal conformance, and extend the product life cycle.
Description of the drawings
Fig. 1 is the process flow diagram of the utility model.
Fig. 2 is the schematic diagram of the small-sized Resistor-Capacitor Unit pad of unresolved problem of setting up a monument.
Fig. 3 is the schematic diagram of the small-sized Resistor-Capacitor Unit pad of the utility model.
Fig. 4 is the long side side schematic view of the small-sized Resistor-Capacitor Unit encapsulation of the utility model.
Fig. 5 is the long side diagrammatic cross-section of the small-sized Resistor-Capacitor Unit encapsulation of unresolved problem of setting up a monument.
Fig. 6 is the long side diagrammatic cross-section of the small-sized Resistor-Capacitor Unit encapsulation of the utility model.
Fig. 7 is the broadside side schematic view of the small-sized Resistor-Capacitor Unit encapsulation of unresolved problem of setting up a monument.
Fig. 8 is the broadside side schematic view of the small-sized Resistor-Capacitor Unit encapsulation of the utility model.
Specific implementation mode
Below in conjunction with drawings and examples, specific embodiment of the present utility model is described in more details, with
Just those skilled in the art can be better understood when the embodiment of the utility model and its each by content disclosed in this specification
The advantages of a aspect.However, specific embodiments described below and embodiment are for illustrative purposes only, rather than to this practicality
Novel limitation.The utility model can be implemented or be applied by other different specific embodiments, each in this specification
Item details may be based on different viewpoints and application, carry out various modifications and changes under the design for not departing from the utility model.Separately
Outside, the attached drawing of the utility model is only simple schematically illustrate, not according to the description of actual size, is stated in advance.Implementation below
The relevant technologies content of the utility model will be explained in further detail in mode, but disclosure of that is not to limit this practicality
Novel protection domain.
A kind of support plate for solving small-sized Resistor-Capacitor Unit and setting up a monument, the support plate include support plate, small-sized Resistor-Capacitor Unit, wherein：Institute
The length of bonding pad for stating the small-sized Resistor-Capacitor Unit on support plate is 0.145mm, pad width 0.185mm.
The small-sized Resistor-Capacitor Unit includes the one or more in small-sized capacitance-resistance resistance or small-sized capacitance-resistance capacitance.It is described
The length, width and height of the element of small-sized Resistor-Capacitor Unit should be：Long 0.4mm, wide 0.2mm, high 0.2mm.The support plate includes support plate, circuit
Plate PCB, material be metallic plate, copper-clad plate one kind.
As shown in Figure 1, Fig. 1 is the process flow diagram of the utility model.
Step S1, small-sized Resistor-Capacitor Unit length dimensional measurement, for example, 01005 patch Resistor-Capacitor Unit, long 0.4mm is wide
0.2mm, high 0.2mm.Patch Resistor-Capacitor Unit 01005 is English unit, changes the patch Resistor-Capacitor Unit that metric system is 0402 into.
According to capacitance-resistance material structure it is found that only element both ends end pole metal is combined to form weld seam with tin material, in raw material
And under the certain state of technique, capillary effect and molten tin material are climbed glue degree of wetting characteristic and will be remained unchanged, and have support plate pad ruler only
Very little structure dominates molten tin material and climbs glue distribution.
This technique is adapted to the new opplication of small-sized Resistor-Capacitor Unit, is also applied for having applied the old of small-sized Resistor-Capacitor Unit
Support plate on small-sized Resistor-Capacitor Unit pad transformation.
If it is the transformation of the pad of the small-sized Resistor-Capacitor Unit of old support plate, it is necessary to first measure support plate Resistor-Capacitor Unit pad green oil
The old design size of windowing；Fig. 2 is the schematic diagram of the small-sized Resistor-Capacitor Unit pad of unresolved problem of setting up a monument.As shown in Fig. 2, traditional
Unilateral pad window size is usually 0.175mm*0.175mm, can be according to S2 steps, by the old support plate with the design size
It modifies design.
Step S2 sets the new window size of support plate pad.
Fig. 3 is the schematic diagram of the small-sized Resistor-Capacitor Unit pad of the utility model, as shown in figure 3, setting support plate pad accordingly
New window size makes support plate according to pad fenestration, and the new window size of support plate pad that sets is support plate length of bonding pad
For 0.145mm, pad width 0.185mm.
The utility model one embodiment, sets the new window size of support plate pad, and support plate length of bonding pad is 0.145mm, weldering
Disk width is 0.185mm, and support plate is made according to pad fenestration.
There is the problem of setting up a monument in another embodiment of the utility model, old support plate, and pad modification is carried out to old support plate,
Raw footage 0.175mm in support plate pad size is changed to 0.145mm, width 0.175mm in former pad size is changed to
0.185mm makes support plate according to pad fenestration.
In embodiment, increase support plate pad width, tending to both sides conducive to tin material climbs glue, reduces support plate length of bonding pad, is conducive to
Reducing capillary effect causes tin material to tend to Resistor-Capacitor Unit both ends, and purpose is all to reduce lever length.
Step S3 makes support plate according to pad fenestration.
The pad of miniaturized component on the support plate, process of surface treatment include mainly that support plate surface deposits anti-oxidation OSP, change
NiPdAu, three kinds of electronickelling gold are learned, difference is mainly cost selection, and bond pad surface capillary effect activity and special designing are empty
Between the aspect of utilization rate three.
Because of bonding line operational characteristic, the processing of support plate bond pad surface is usually chemical NiPdAu or electronickelling gold；In packaging industry
There is also bonding line class upside-down mounting product is not needed, support plate capacitance-resistance pad deposits anti-oxidation OSP using surface and electronickelling gold is handled
Form.The anti-oxidation OSP of deposition of cheaper is usually selected in the processing of PCB bond pad surfaces.
OSP is less than chemical NiPdAu less than electronickelling gold in cost, mainly depends on material cost and manufacture craft.Technique system
PCB mounts making technology after no support plate class wrapper bonding wire and reprocessing in journey, disposably flows back after usually mounting Resistor-Capacitor Unit
It is soldered into a whole set of attachment, is not in that OSP shifts to an earlier date volatilization problems at this time.
In pad capillary effect activity, chemical NiPdAu is equal to electronickelling gold and is higher than OSP, mainly depends on pad oxygen
Change ability, support plate base material circuit copper easily lose capillary effect activity by oxidation, and capacitor-resistor unit attachment plus upside-down mounting class product do not push away
OSP techniques are recommended, capacitance-resistance mounts rear bearing plate surface OSP because scaling powder and heating environment gradually volatilize, then carried when wafer upside-down mounting
Plate corresponds to pad metal copper exposure after wafer pad OSP volatilizees and is aoxidized, and metal copper and tin material wetting weldability is good, but oxygen
Change copper or cuprous oxide and solder wettability is very poor, support plate pad can be made, which to lose capillary effect, leads to problem of faulty soldering.
In space availability ratio, OSP is higher than chemical NiPdAu and nickel-gold electroplating process design, and depending primarily on prevents capillary
Effect opens a window diffusion into the surface in pad, and it is green that chemical NiPdAu and electronickelling gold need to correspond to the addition of support plate pad surrounding in wafer upside-down mounting
Oil barrier, prevents wafer tin material because capillary effect is spread out in bond pad surface, and tin material is made to be detached from upside-down mounting wafer.OSP techniques because
Gradually volatilization and tin material synchronize wetting welding during scaling powder and Reflow Soldering are antipyretic, and whole process speed is relatively fast, PCB welderings
The exposure of rosette copper metal is not easy to be aoxidized.
The utility model one embodiment avoids rosin joint, support plate pad table for the capillary effect activity that pad has had
Surface treatment is using chemical NiPdAu treatment process.
Another embodiment of the utility model, in order to save cost and improve space availability ratio, the processing of PCB bond pad surfaces is adopted
With the anti-oxidation OSP treatment process of deposition.
Step S4 makes paste solder printing web plate according to pad windowing, and web plate window size is protected with support plate pad window size
It holds consistent.
Step S5 paste solder printings, Printing screen align support plate windowing, print solder paste.
Fig. 4 is the long side side schematic view of the small-sized Resistor-Capacitor Unit encapsulation of the utility model.Fig. 5 is unresolved problem of setting up a monument
Small-sized Resistor-Capacitor Unit encapsulation long side diagrammatic cross-section.Fig. 6 is that the long side of the small-sized Resistor-Capacitor Unit encapsulation of the utility model is cutd open
Face schematic diagram.Fig. 7 is the broadside side schematic view of the small-sized Resistor-Capacitor Unit encapsulation of unresolved problem of setting up a monument.Fig. 8 is that this practicality is new
The broadside side schematic view of the small-sized Resistor-Capacitor Unit encapsulation of type.
According to Fig. 4-Fig. 8 as it can be seen that compared with old design, shortens capacitance-resistance both ends and correspond to support plate pad metal length, it can be with
Effectively reducing tin material capillary effect makes tin material become to going to flow to capacitance-resistance long side both ends；And widens capacitance-resistance broadside both ends and correspond to support plate weldering
Disk width makes tin material become to capacitance-resistance broadside both sides.This design alteration can make former tin material be gathered in capacitance-resistance long side both ends to become to going to climb
Glue effectively shortens lever length to broadside both sides.
Support plate is molded with web plate combination print solder paste, small-sized Resistor-Capacitor Unit is mounted on by step S6, Resistor-Capacitor Unit attachment
Support plate pad windowing surface.
Step S7, reflow soldering flow back resolidification, heating zone and heat preservation zone heating by tin cream liquefaction reflux, and cooling area is solid again
Chemical conversion type, reflow process connect the end pole metal and support plate pad of Resistor-Capacitor Unit, are allowed to mutual conduction and fixed Resistor-Capacitor Unit,
The mode of the Reflow Soldering heating includes hot wind or infrared heating.
Step S8 will confirm welding effect under the microscope after the completion of component mounter, examine whether there is or not the problem of setting up a monument, confirm nothing
After problem of setting up a monument, encapsulation follow-up process is completed.
It should be noted that each embodiment above by reference to described in attached drawing is only to illustrate the utility model rather than limit
The scope of the utility model processed, it will be understood by those of ordinary skill in the art that, in the spirit and model for not departing from the utility model
The modification to the utility model progress or equivalent replacement, should all cover within the scope of the utility model under the premise of enclosing.
In addition, signified outer unless the context, the word occurred in the singular includes plural form, and vice versa.In addition, except non-specifically
Illustrate, then all or part of of any embodiment is used in combination with all or part of of any other embodiment.
Claims (4)
1. a kind of support plate for solving small-sized Resistor-Capacitor Unit and setting up a monument, which is characterized in that the support plate includes support plate, small-sized capacitance-resistance member
Part, wherein：The length of bonding pad of the small-sized Resistor-Capacitor Unit is 0.145mm, pad width 0.185mm on the support plate.
2. the support plate according to claim 1 for solving small-sized Resistor-Capacitor Unit and setting up a monument, which is characterized in that the small-sized capacitance-resistance member
Part includes the one or more in miniature resistance or small-sized capacitance.
3. the support plate according to claim 2 for solving small-sized Resistor-Capacitor Unit and setting up a monument, which is characterized in that the small-sized capacitance-resistance member
The size of part is：Long 0.4mm, wide 0.2mm, high 0.2mm.
4. the support plate according to claim 1 for solving small-sized Resistor-Capacitor Unit and setting up a monument, which is characterized in that the support plate includes carrying
Plate, PCB, material be metallic plate, copper-clad plate one kind.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820385015.8U CN208029214U (en) | 2018-03-21 | 2018-03-21 | A kind of support plate for solving small-sized Resistor-Capacitor Unit and setting up a monument |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820385015.8U CN208029214U (en) | 2018-03-21 | 2018-03-21 | A kind of support plate for solving small-sized Resistor-Capacitor Unit and setting up a monument |
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| Publication Number | Publication Date |
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| CN208029214U true CN208029214U (en) | 2018-10-30 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289390A (en) * | 2018-03-21 | 2018-07-17 | 上海飞骧电子科技有限公司 | Solve support plate design, packaging method and support plate that small-sized Resistor-Capacitor Unit is set up a monument |
-
2018
- 2018-03-21 CN CN201820385015.8U patent/CN208029214U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289390A (en) * | 2018-03-21 | 2018-07-17 | 上海飞骧电子科技有限公司 | Solve support plate design, packaging method and support plate that small-sized Resistor-Capacitor Unit is set up a monument |
| WO2019179061A1 (en) * | 2018-03-21 | 2019-09-26 | 深圳飞骧科技有限公司 | Carrier board design and packaging method capable of solving tombstoning of small-sized resistor-capacitor unit, and carrier board |
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