CN207997369U - A kind of punch machine of SIM card card base of the batch punching with 4FF card slots - Google Patents

A kind of punch machine of SIM card card base of the batch punching with 4FF card slots Download PDF

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Publication number
CN207997369U
CN207997369U CN201820162278.2U CN201820162278U CN207997369U CN 207997369 U CN207997369 U CN 207997369U CN 201820162278 U CN201820162278 U CN 201820162278U CN 207997369 U CN207997369 U CN 207997369U
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China
Prior art keywords
card
die
base
sim card
slots
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CN201820162278.2U
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Chinese (zh)
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吴冰
周亮
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SHANGHAI CHINA CARD SMART CARD CO Ltd
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SHANGHAI CHINA CARD SMART CARD CO Ltd
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Abstract

The utility model is a kind of punch machine of SIM card card base of batch punching with 4FF card slots, and the punch machine includes rack, workbench, stepper motor, feed mechanism, punching mechanism, card receiving mechanism and circuit control system, it is characterised in that:The punching mechanism of the punch machine includes 4FF card slots die cutting die and SIM card card base die cutting die, and the 4FF card slots die cutting die and SIM card card base die cutting die, which are mounted on the workbench of same punch machine or are respectively arranged on the workbench of two punch machines according to the procedure of processing gradation priority of SIM card card base, to be matched.The utility model improves existing punch machine, the SIM card card base with 4FF card slots can be punched into batches on big Zhang Jicai, band glued membrane can be covered with simultaneously with full page, facilitate subsequent fixed SIM card chip, blanking process is all automatically performed by punch machine, and production efficiency and machining accuracy are greatly improved.

Description

A kind of punch machine of SIM card card base of the batch punching with 4FF card slots
Technical field
The utility model is related to a kind of automatic processing machine of SIM card, especially discloses a kind of batch punching and carry 4FF cards The punch machine of the SIM card card base of slot is applied to smart card manufacturing, realizes modularization, mass, automatically in SIM card 4FF card slots are set on card base, and conveniently subsequently SIM card chip is fixed in 4FF card slots, improve production efficiency.
Background technology
Widely used SIM card is that the NANO-SIM cutting ferrules of 4FF the cutting ferrule of 3FF and 2FF in the market, is integrated in one On the ID-I type cards for the standard of opening, need just to break lower corresponding cutting ferrule with that money.The mode of production is first to produce individual standard ID-I type card bases, then according to position as defined in ISO/IEC 7810 and scale chips slot on card base.It is carried on the back in SIM card chip SIM card chip is fixed in the chip slot of card base by hot melt adhesive in face paste by way of hot pressing.What this manufacturing process needed Equipment cost is high, whole gum, groove milling, encapsulation production line cost in 1,000,000 RMB or so, cost of labor is also comparable Height is not suitable for the economic development form of society now.
Occurs the SIM card chip of modular again at present, SIM card card base is the ID-I type card bases of standard, and this chip exists Fixed form on SIM card card base is:First produce individual standard ID-I type card bases(That is SIM card card base), then in single card The chip slot that 4FF is gone out on base pastes last layer band glued membrane at the card base back side, then SIM card chip is attached to the band glue in 4FF card slots On film.It is the SIM card card base 2 with 4FF card slots 1 shown in attached drawing 1 and attached drawing 2,2 back side of SIM card card base is covered with one layer of band glue Film 3 is used for subsequent fixed SIM card chip.Since 4FF card slots 1 are the step through-holes for penetrating SIM card card base 2, so with glued membrane 3 must be overlying on again on SIM card card base 2 after the punching for completing 4FF card slots 1, and the prior art is first to go out standard ID-1 types Card base, then 4FF card slots 1 are gone out on single card base, it is finally covered with band glued membrane 3 one by one using artificial.
The disadvantage of this manufacturing process is to need individual jet-bedding, individual manual adhesive tape glued membrane.Due to being individually to process, So position deviation of the 4FF card slots on card base is larger, cause after sticking SIM card chip, performance, artificial hand can be influenced Not only production efficiency is low for dynamic single card base covering band glued membrane, but also manually adhesive tape glued membrane mode accuracy is extremely unstable, Product qualified rate is low, is easy to cause waste of material, increases production cost.
Invention content
The purpose of this utility model is to solve the defect of the prior art, designs a kind of SIM of batch punching with 4FF card slots The punch machine of Ka Kaji, can be in big Zhang Jicai(The full page base material of 32 SIM card card bases can be cut)Upper batch is punched into 4FF The SIM card card base of card slot can be covered with band glued membrane simultaneously with full page, facilitate subsequent fixed SIM card chip, the punching of 4FF card slots and The blanking process of SIM card card base is all automatically performed by punch machine, and band glued membrane is then pasted by automatic mulch applicator automatically, completely Individual whole in the prior art manual fabrication procedures are avoided, production efficiency and machining accuracy are greatly improved.
The utility model is realized in this way:A kind of punch machine of SIM card card base of the batch punching with 4FF card slots, institute The punch machine stated includes rack, workbench, stepper motor, feed mechanism, punching mechanism, card receiving mechanism and circuit control system, It is characterized in that:The punching mechanism of the punch machine includes 4FF card slots die cutting die and SIM card card base die cutting die, described 4FF card slots die cutting die and SIM card card base die cutting die are to match, can be according to the procedure of processing gradation of SIM card card base It is successively mounted on the workbench of same punch machine and matches, can also be respectively arranged on the workbench of two punch machines It matches, adjusts the step pitch of punch machine, it is mutual by the 4FF card slots die cutting die and SIM card card base die cutting die Cooperation, is done directly the punching work that full page 32 opens the SIM card card base with 4FF card slots on the base material of SIM card card base.
The 4FF card slots die cutting die and SIM card card base die cutting die is matched by the upper die and lower die of rectangle to be combined into:
The lower die of the 4FF card slots die cutting die is equipped with 4 4FF card slot cavity plates of a row, in 4 4FF cards being arranged in a row A pair of vertically disposed location hole cavity plate is respectively set in geosynclinal concave mould both sides, in upper mold and the 4FF cards of the 4FF card slots die cutting die The 4FF card slots punch-pin and location hole punch-pin of identical quantity are equipped at the corresponding position of lower die of slot die cutting die;
The lower die of the SIM card card base die cutting die is equipped with 4 SIM card card base cavity plates of a row, and the SIM card card base is recessed The installation position of mould is corresponding with the card slot cavity plate positions 4FF on the 4FF card slots die cutting die, and 4FF card slots is made to be punched into SIM card card base on be located at setting position, meanwhile, the lower die of SIM card card base die cutting die is additionally provided with 4 card basic modes tool positioning Hole, size and installation position are also corresponding with 4 location hole cavity plates being arranged on the 4FF card slots die cutting die, the SIM card The upper mold of card base die cutting die is correspondingly provided with 4 SIM card card base punch-pin of a row and 4 positioning columns, the diameter of the positioning column and Position cooperation corresponding with the card basic mode tool location hole.
The lower die and upper mold of the 4FF card slots die cutting die cooperate, and one-step punching goes out 4 4FF card slots of a row and 4 Location hole for ease of difference mold direction and determines position of the 4FF card slots on SIM card card base, the 4FF card slots die cutting die Upper mold on 4 location hole punch-pin being arranged be set as two pairs of location holes of different interval distance in the both sides of entire row 4FF card slots Punch-pin, correspondingly, 4 location hole cavity plate positions being arranged in 4FF cards difference die cutting die lower die also correspond therewith.Institute The location hole punch-pin stated is the gage punch of 4 5mm.
The positioning column end being arranged in the upper mold of the SIM card card base die cutting die is cone, is convenient for and SIM card card base Card basic mode tool location hole cooperation in the lower die of die cutting die.
The utility model has the beneficial effects that:The utility model is punched into 4FF card slots in batches by elder generation on big Zhang Jicai, Full page is covered with band glued membrane again, then corresponds to the ID-I type card bases for the standard that is punched into again, and the SIM card card base with 4FF card slots is made, Blanking process is realized all to be automatically performed on punch machine, can one-step punching go out 32 carry 4FF card slots SIM card card bases. Meanwhile band glued membrane can also be directly covered with automatic mulch applicator on the big Zhang Jicai for be punched 4FF card slots, facilitate subsequent fixed SIM card chip changes in the prior art manually to the mode of production of individual SIM card card base adhesive band glued membrane, improves production Efficiency.
Existing mode of production inefficiency, quality control can only rely on proficiency of workers, can not ensure product matter Amount and yield, production cost and rejection rate are high, adhesive tape glued membrane process yield be 1000/people/class, only this process it is artificial at Originally it is 0.3 yuan/.And the punch machine of the utility model is used, whole processes, which may be implemented, only needs 3 operators, per tour 100000 can be produced, cost of labor is only 0.009 yuan, and product quality is protected by mould and die accuracy and automation equipment Barrier has high stability.
Description of the drawings
Fig. 1 is the SIM card card based structures schematic diagram with 4FF card slots.
Fig. 2 is the side structure schematic view of Fig. 1.
Fig. 3 is the 4FF card slot die cutting die lower die structure schematic diagrames of the utility model.
Fig. 4 is the 4FF card slot die cutting die upper die structure schematic diagrames of the utility model.
Fig. 5 is the structural schematic diagram that embodiment 1 is punched into 4FF card slots and location hole on the base material of full page.
Fig. 6 is the SIM card card base die cutting die lower die structure schematic diagram of the utility model.
Fig. 7 is the SIM card card base die cutting die upper die structure schematic diagram of the utility model.
Fig. 8 is the positioning column schematic cross-section in the SIM card card base die cutting die upper mold of the utility model.
Fig. 9 is the location arrangements schematic diagram that embodiment 1 is punched the SIM card card base with 4FF card slots on the base material of full page.
In figure:1,4FF card slots;2, SIM card card base;3, band glued membrane;4,4FF card slots cavity plate;5, location hole cavity plate; 6,4FF card slots punch-pin;7, location hole punch-pin;8, location hole;9, SIM card card base cavity plate;10, card basic mode has location hole; 11, SIM card card base punch-pin;12, positioning column.
Specific implementation mode
The utility model is a kind of punch machine of SIM card card base of batch punching with 4FF card slots, to the complete of the prior art Automatic punch machine is improved, and 4FF card slots die cutting die and SIM card card base die cutting die are devised, and the cooperation of two molds makes With, the SIM card card base with 4FF card slots can be punched into batches on full page base material, and full page is covered with band glued membrane simultaneously, it is convenient Subsequent fixed SIM card chip, is all completed by mechanical automation.
The punch machine is full-automatic punch machine, including rack, workbench, stepper motor, feed mechanism, bicker Structure, card receiving mechanism and circuit control system.The punching mechanism of the punch machine include matching used 4FF card slots die cutting die and SIM card card base die cutting die can successively be mounted on the work of same punch machine by several times according to the procedure of processing of SIM card card base It is matched on platform, can also be respectively arranged on the workbench of two punch machines and match, adjust the step pitch of punch machine, It is cooperated by the 4FF card slots die cutting die and SIM card card base die cutting die, on the base material of SIM card card base directly Complete the punching work that full page 32 opens the SIM card card base with 4FF card slots.
With reference to the accompanying drawings 3 and attached drawing 4, the lower die and upper mold of the 4FF card slot die cutting dies of the utility model are rectangle, wherein The lower die of 4FF card slot die cutting dies is equipped with 4 4FF card slots cavity plates 4 of a row, and the upper mold of 4FF card slot die cutting dies is corresponding to be equipped with 4 A 4FF card slots punch-pin 6(That is 4 4FF card slot punches), while the rectangle two sides of the lower die of 4FF card slot die cutting dies are set respectively There are two location hole cavity plate 5, it is equipped with 4 altogether, and the upper mold rectangle two sides of corresponding 4FF card slot die cutting dies also position pair That answers is equipped with location hole punch-pin 7(That is 4 gage punch, 5mm), altogether be equipped with 4, the lower die of 4FF card slot die cutting dies and Upper mold cooperates, and 4 4FF card slots of a row and 4 location holes 8 can be gone out with one-step punching.For ease of difference mold direction and really Determine position of the 4FF card slots on SIM card card base, 4 location hole punch-pin 7 being arranged in the upper mold of the 4FF card slots die cutting die It is set as different spacing distances in the two sides of upper mold, 4 be arranged in the corresponding poor die cutting die lower die of the 4FF cards are fixed Cavity plate 5 position in position hole also corresponds.
With reference to the accompanying drawings 6 and attached drawing 7, the lower die and upper mold of the SIM card card base die cutting die of the utility model be also be square Shape, the wherein lower die of SIM card card base die cutting die are equipped with 4 SIM card card base cavity plates 9 of a row, and installation position is rushed with 4FF card slots 4 position of 4FF card slots cavity plate cut on mold corresponds to, and 4FF card slots can be made to be located at setting position on the SIM card card base being punched into It sets.Meanwhile the lower die of SIM card card base die cutting die is additionally provided with 4 card basic modes tool location holes 10, size and installation position also with 4 location hole cavity plates 5 on 4FF card slot die cutting dies correspond to.Likewise, the upper mold of SIM card card base die cutting die is correspondingly provided with The one SIM card card base of row 4 punch-pin 11, two sides are equipped with 4 positioning columns altogether, and the diameter of the positioning column and position are and SIM card Card basic mode in the lower die of card base die cutting die has 10 corresponding cooperation of location hole.
With reference to the accompanying drawings 8, for ease of coordinating with the card basic mode tool location hole 10 in the lower die of SIM card card base die cutting die, SIM 12 end of positioning column being arranged in the upper mold of Ka Kaji die cutting dies is cone.
Embodiment 1:
With reference to the accompanying drawings 5, use the 4FF card slot die cutting dies of the utility model, adjustment full-automatic on full-automatic punch machine The step pitch of punch machine can not cut full page base material, 8 rows 4 row totally 32 4FF card slots are directly punched on full page base material, together When be punched into 32 location holes, the corresponding two sides for being respectively in full page base material.Often arrange 4 4FF card slots both sides has a pair fixed respectively Position hole, and the positioning pitch of holes on both sides is different, to facilitate position when determining follow-up SIM card card base Punching Technology.
After completing this step, so that it may realize that full page base material is covered with band glued membrane on automatic mulch applicator, PET strip glue may be used Film is greater than 5N to the cohesive force of SIM card chip.
With reference to the accompanying drawings 9, use the SIM card card base die cutting die of the utility model on full-automatic punch machine, adjustment entirely from First 4 positioning columns 12 at left and right sides of mold are inserted into after the step pitch of dynamic punch machine and be punched 4FF card slots 1 and location hole 8 Full page base material on first row location hole 8 in, thus secure SIM card card base punch-pin 11(That is card base punch)With full page base The relative position of this corresponding row's 4FF card slot, ensure that the position of the 4FF card slots on SIM card card base that punching is got off on material Be positioned at setting position and position it is changeless, punching machining accuracy ensured completely by mold.Without artificial Intervene contraposition calibration.After the step pitch for setting full-automatic punch machine, you can 8 rows 4 are directly gone out on full page base material to be arranged, totally 32 SIM card card base can obtain 32 band 4FF card slots, and cover the good SIM card card base with glued membrane.
Due to the SIM card card base die cutting die using the utility model, the feeding sequence of full-automatic punch machine is:Feeding When, feed clamp clamps base material, the collet release base material of feed clamp behind setting position is sent to, by SIM card card base die cutting die Upper mold be inserted on base material the location hole 8 that has been punched by card base mould location column 12 come position when correcting conveying during decline The deviation set.Since the top of card base mould location column 12 is taper, height is higher by mold stripper, so waiting for base material position It sets by after correcting, mold stripper can just push down base material, and sweep away SIM card card by the pushing of the upper mold of SIM card card base die cutting die Base.
The design of the utility model allows position fixation of the 4FF card slots on SIM card card base to immobilize, and processes Process automation, high precision machining, can in process full page be covered with band glued membrane, it is entirely avoided in the prior art all Individual manual fabrication procedures, greatly improve production efficiency and machining accuracy.

Claims (5)

1. a kind of punch machine of SIM card card base of the batch punching with 4FF card slots, the punch machine include rack, workbench, Stepper motor, feed mechanism, punching mechanism, card receiving mechanism and circuit control system, it is characterised in that:The punching of the punch machine Mechanism includes 4FF card slots die cutting die and SIM card card base die cutting die, the 4FF card slots die cutting die and SIM card Ka Jichong It is to match to cut mold, is successively mounted on the work of same punch machine by several times according to two mold of procedure of processing of SIM card card base Make on platform or be respectively arranged on the workbench of two punch machines to match, the 4FF card slots die cutting die and SIM card card Base die cutting die is matched by the upper die and lower die of rectangle to be combined into;
The lower die of the 4FF card slots die cutting die is equipped with 4 4FF card slot cavity plates of a row, recessed in 4 4FF card slots being arranged in a row A pair of vertically disposed location hole cavity plate is respectively set in mould both sides, is rushed in upper mold and the 4FF card slots of the 4FF card slots die cutting die Cut the 4FF card slots punch-pin and location hole punch-pin that identical quantity is equipped at the corresponding position of lower die of mold;
The lower die of the SIM card card base die cutting die is equipped with 4 SIM card card base cavity plates of a row, the SIM card card base cavity plate Installation position is corresponding with the card slot cavity plate positions 4FF on the 4FF card slots die cutting die, and makes 4FF card slots in the SIM being punched into It is located at setting position on Ka Kaji, meanwhile, the lower die of SIM card card base die cutting die is additionally provided with 4 card basic mode tool location holes, big Small and installation position is also corresponding with 4 location hole cavity plates being arranged on the 4FF card slots die cutting die, the SIM card Ka Jichong The upper mold for cutting mold is correspondingly provided with 4 SIM card card base punch-pin of a row and 4 positioning columns, the diameter of the positioning column and position are equal Cooperation corresponding with the card basic mode tool location hole.
2. according to a kind of punch machine of SIM card card base of batch punching with 4FF card slots described in claim 1, feature It is:The lower die and upper mold of the 4FF card slots die cutting die cooperate, and one-step punching goes out 4 4FF card slots of a row and 4 fixed Position hole for ease of difference mold direction and determines position of the 4FF card slots on SIM card card base, the 4FF card slots die cutting die Two pairs of location holes that 4 location hole punch-pin being arranged in upper mold are set as different interval distance in the both sides of entire row 4FF card slots are convex Mould, correspondingly, 4 location hole cavity plate positions being arranged in 4FF cards difference die cutting die lower die also correspond therewith.
3. according to a kind of punch machine of SIM card card base of batch punching with 4FF card slots described in claim 2, feature It is:The location hole punch-pin is the gage punch of 4 5mm.
4. according to a kind of punch machine of SIM card card base of batch punching with 4FF card slots described in claim 1, feature It is:The positioning column end being arranged in the upper mold of the SIM card card base die cutting die is cone, is convenient for and SIM card Ka Jichong Cut the card basic mode tool location hole cooperation in the lower die of mold.
5. according to a kind of punch machine of SIM card card base of batch punching with 4FF card slots described in claim 1, feature It is:The step pitch for adjusting punch machine is cooperated by the 4FF card slots die cutting die and SIM card card base die cutting die, The punching work that full page 32 opens the SIM card card base with 4FF card slots is done directly on the base material of SIM card card base.
CN201820162278.2U 2018-01-31 2018-01-31 A kind of punch machine of SIM card card base of the batch punching with 4FF card slots Active CN207997369U (en)

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CN201820162278.2U CN207997369U (en) 2018-01-31 2018-01-31 A kind of punch machine of SIM card card base of the batch punching with 4FF card slots

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Application Number Priority Date Filing Date Title
CN201820162278.2U CN207997369U (en) 2018-01-31 2018-01-31 A kind of punch machine of SIM card card base of the batch punching with 4FF card slots

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109531699A (en) * 2018-12-21 2019-03-29 精工伟达科技(深圳)有限公司 One kind one goes out two SIM card perforating press

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109531699A (en) * 2018-12-21 2019-03-29 精工伟达科技(深圳)有限公司 One kind one goes out two SIM card perforating press

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