CN207995231U - Camera encapsulating structure, circuit board package structure and electronic equipment - Google Patents

Abstract

The utility model discloses a kind of camera encapsulating structures, including encapsulating housing, camera eyeglass is installed on the encapsulating housing, package substrate and sensor devices are equipped in the encapsulating housing, the package substrate is electrically connected with the sensor devices, and the encapsulating housing includes side plate, and the side plate is equipped with several spaced positioning tenons, electroconductive elastic sheet is equipped between the adjacent positioning tenon, the electroconductive elastic sheet is electrically connected with the package substrate.The utility model no longer needs to use BTB connectors, can save the layout area of mainboard, improves installation integrated level, reduces BOM costs, and can reduce assembling difficulty, practicability and generalization are stronger.The invention also discloses the circuit board package structure using the camera encapsulating structure and the electronic equipments using the circuit board package structure.

Description

Camera encapsulating structure, circuit board package structure and electronic equipment

Technical field

The utility model is related to technical field of electronic equipment, are sealed more particularly to a kind of camera encapsulating structure, circuit board Assembling structure and electronic equipment.

Background technology

Electronic product especially moves consumer electronics product, such as mobile phone, intelligent wearable device etc., just towards small-sized Change, integrated direction is gradually developed.In electronic product, camera has been standard configuration, for especially corresponding to mobile phone, is taken the photograph As head is even more one of the principal element of purchase of attracting clients.

By taking mobile phone as an example, the camera installed in mobile phone is more and more, from rear camera to front camera and rear camera, then arrives The postposition of present mainstream is double to be taken the photograph, and front and back pair is taken the photograph, and subsequently more has the tendency that taking the photograph direction towards postposition three develops.

Camera is optical device, and the problem of due to image-forming range, camera device can not be made thinner.And it is present Mobile phone is to lightening development, it is desirable that complete machine is made thinner, and therefore, present handset structure all hollows out mainboard, to hold Set camera.Position due to housing camera on mainboard has carried out hollowing out processing, so camera can not be welded on mainboard, Camera is connected with mainboard to be generally attached using BTB (Board To Board, plate is to plate) connector mode.

This structure at least has the following disadvantages, first, the layout area of mainboard preciousness is occupied, due to a camera need A BTB connector is wanted, and BTB connectors belong to structure devices, size big will obtain for other electronic devices It is more；And when use pair is taken the photograph or three take the photograph, the area occupied is just more, more influences the layout of mainboard, sometimes, in order to image The layout of head, it has to sacrifice the function of part mobile phone.Second, increase BOM costs, FPC the and BTB connectors on camera are only Only play the role of signal transmission, and occupies the sizable a part of cost of camera scheme, when camera number increase is, Its increased cost becomes apparent.Third, mounting structure are complicated, and the problem of due to configuration aspects, camera BTB connectors can FPC homonymies or heteropleural can be located at camera body, in same Mobile phone, might have different combinations, this is resulted in It is extremely complex when complete machine assembles.

Utility model content

One purpose of the utility model is to propose a kind of camera encapsulating structure, solves the prior art and need to use Occupancy board area, increase BOM costs caused by BTB connectors, the problem of mounting structure complexity.

A kind of camera encapsulating structure, including encapsulating housing are equipped with camera eyeglass, the envelope on the encapsulating housing It fills and is equipped with package substrate and sensor devices in shell, the package substrate is electrically connected with the sensor devices, the encapsulating shell Body includes side plate, and the side plate is equipped with several spaced positioning tenons, is equipped with and leads between the adjacent positioning tenon Electric shrapnel, the electroconductive elastic sheet are electrically connected with the package substrate.

According to the utility model proposes camera encapsulating structure, sensor devices convert the figures of camera image lenses At electric signal, then by electric signal transmission to package substrate, and then can be by electric signal transmission to electronics by electroconductive elastic sheet In equipment on mainboard, there is no need to reuse the larger BTB connectors of volume, the layout area of mainboard can be saved, improves peace Integrated level is filled, reduces BOM costs, and assembling difficulty can be reduced, practicability and generalization are stronger.

In addition, according to camera encapsulating structure provided by the utility model, there can also be following additional technical characteristic：

Further, the encapsulating housing includes the bottom plate that top plate and the top plate are oppositely arranged, and the side plate is mounted on Between the top plate and the bottom plate.

Further, the top plate is equipped with hollow-out parts, and the camera eyeglass is mounted in the hollow-out parts.

Further, the package substrate is set on the bottom plate, and the sensor devices are set on the package substrate.

Further, the package substrate is electrically connected with the sensor devices by bonding line.

Further, the encapsulating housing is equipped with fool proof notch.

Further, the positioning tenon uses isolation material.

Further, the encapsulating housing uses isolation material.

Further, the camera eyeglass forms enclosed construction, institute with the top plate, the bottom plate and the side plate It is all vertical with the side plate respectively to state top plate, the bottom plate.

Further, wherein one end of the electroconductive elastic sheet is welded on the package substrate.

Further, the rectangular in cross-section of the encapsulating housing.

Further, it is equipped with positioning tenon on four side plates of the encapsulating housing, the positioning tenon is in the side It is uniformly distributed on plate.

Further, the hollow-out parts are located at the centre position of the top plate, and the camera eyeglass is located at the hollow out The centre position in portion.

Further, the camera eyeglass is arranged with the sensor devices face.

Another purpose of the utility model is to propose a kind of circuit board package structure comprising circuit board mainboard and Above-mentioned camera encapsulating structure, the circuit board mainboard are equipped with cavern part, and the circuit board mainboard is equipped with positioning card The accommodating place of bamboo shoot, the accommodating place of the positioning tenon is equal with the positioning quantity of tenon, and is correspondingly arranged, the adjacent positioning It is equipped with edges of boards pad between tenon is accommodating, the encapsulating housing is located in the cavern part, and the positioning tenon is caught in correspondence The positioning tenon it is accommodating in, the bottom plate is fixed on a limiting device, the electroconductive elastic sheet and the corresponding edges of boards Pad is electrically connected.The circuit board package structure no longer needs to use BTB connectors, can save the layout area of mainboard, reduces BOM costs, and mounting structure is simple, assembling difficulty is low.

In addition, according to circuit board package structure provided by the utility model, there can also be following additional technical characteristic：

Further, the circuit board package structure further includes camera head protecting eyeglass, and the camera head protecting eyeglass is set In on camera eyeglass.

Further, the size of the camera head protecting eyeglass is more than the size of the top plate.

Further, the camera head protecting eyeglass and the limiting device are located at the opposite of the circuit board mainboard Both sides.

Further, the side of the edges of boards pad is parallel with the side plate of camera encapsulating structure, the conduction bullet A side contacts for piece and the edges of boards pad, so that the electroconductive elastic sheet electrically connects with the corresponding edges of boards pad It connects.

Another purpose of the utility model is proposition a kind of electronic equipment, and it includes above-mentioned circuit board package knots Structure can save the layout area of mainboard using the electronic equipment of the circuit board package structure, reduce BOM costs, and install knot Structure is simple, and assembling difficulty is low.

The additional aspect and advantage of the utility model will be set forth in part in the description, partly will be from following description In become apparent, or recognized by the practice of the utility model.

Description of the drawings

The above-mentioned and/or additional aspect and advantage combination following accompanying drawings of the utility model in the description of embodiment to that will become It obtains obviously and is readily appreciated that, wherein：

Fig. 1 is the overlooking structure diagram of the camera encapsulating structure of the utility model first embodiment；

Fig. 2 is the side structure schematic view of the camera encapsulating structure of the utility model first embodiment；

Fig. 3 is the overlooking structure diagram of the circuit board package structure of the utility model second embodiment；

Fig. 4 is the schematic cross-sectional view of the circuit board package structure of the utility model second embodiment.

Specific implementation mode

To keep the purpose of this utility model, feature and advantage more obvious and easy to understand, below in conjunction with the accompanying drawings to this practicality Novel specific implementation mode is described in detail.Several embodiments of the utility model are given in attached drawing.But this practicality It is novel to realize in many different forms, however it is not limited to embodiment described herein.On the contrary, providing these implementations The purpose of example is to keep the disclosure to the utility model more thorough and comprehensive.

It should be noted that when element is referred to as " being fixedly arranged on " another element, it can be directly on another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ", " right side ", "upper", "lower" and similar statement for illustrative purposes only, do not indicate or imply the indicated device or member Part must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.

In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can Can also be electrical connection to be mechanical connection；It can be directly connected, can also indirectly connected through an intermediary, Ke Yishi Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood as the case may be Concrete meaning in the present invention.Term " and or " used herein includes one or more relevant Listed Items Any and all combinations.

It please refers to Fig.1 and Fig. 2, the camera encapsulating structure that the first embodiment of the utility model proposes, including encapsulating shell Body is equipped with camera eyeglass 20 on the encapsulating housing, package substrate 30 and sensor devices 40 is equipped in the encapsulating housing, The package substrate 30 is electrically connected with the sensor devices 40, and the side of the encapsulating housing is spaced equipped with several Tenon 50 is positioned, electroconductive elastic sheet 60, the electroconductive elastic sheet 60 and the encapsulation base are equipped between the adjacent positioning tenon 50 Plate 30 is electrically connected.

Specifically, the encapsulating housing includes top plate 11, the bottom plate being oppositely arranged with the top plate 11 12 and is mounted on Side plate 13 between the top plate 11 and the bottom plate 12.In the present embodiment, the side of the encapsulating housing is above-mentioned side plate 13, the rectangular in cross-section of the encapsulating housing.

The top plate 11 is equipped with hollow-out parts 111, and the hollow-out parts 11 are equipped with camera eyeglass 20.Specifically in this implementation In example, the hollow-out parts 111 are located at the centre position of the top plate 11, and the camera eyeglass 20 is located at the hollow-out parts 111 Centre position.

The bottom plate 12 is equipped with package substrate 30, and the package substrate 30 is equipped with sensor devices 40, sensor devices 40 Can be specifically CCD sensor devices, and the camera eyeglass 20 is arranged with 40 face of the sensor devices, it is better to ensure Obtain image.

And in the present embodiment, the camera eyeglass 20 and 13 shape of the top plate 11, the bottom plate 12 and the side plate Ensure quality of taking pictures at enclosed construction preferably to protect sensor devices 40.

The package substrate 30 is electrically connected with the sensor devices 40.Specifically, the package substrate 30 and the sense Optical device 40 with bonding line 70 by can be electrically connected.It should be understood that the package substrate 30 is same with the sensor devices 40 The mode of other electric connections may be used in sample, is not limited herein.

The side plate 13 is equipped with several spaced positioning tenons 50, specifically, four of the encapsulating housing Positioning tenon 50 is equipped on side plate 13, and the positioning tenon 50 is uniformly distributed on the side plate 13.On each side plate 13 Several positioning tenons 50 be arranged in parallel, positioning tenon 50 have certain length and width, positioning tenon 50 be, for example, grow Curved portion can be arranged in cube structure, the one end of positioning tenon 50 far from side plate 13.Position tenon 50 be used for encapsulating housing into The limit of row horizontal direction.

Between the adjacent positioning tenon 50 be equipped with electroconductive elastic sheet 60, specifically, the adjacent positioning tenon 50 it Between there are the gaps of one fixed width, for accommodating electroconductive elastic sheet 60, electroconductive elastic sheet 60 is for example, by using copper sheet.

The electroconductive elastic sheet 60 is electrically connected with the package substrate 30.Specifically, can be by electroconductive elastic sheet 60 wherein One end is welded on the package substrate 30, to realize the electric connection of the two.Electroconductive elastic sheet 60 transmits work(for realizing signal Can, specifically, the figure of image lenses is converted into electric signal by sensor devices 40, by bonding line 70 by electric signal transmission to sealing It fills on substrate 30, package substrate 30 is again by electric signal transmission to electroconductive elastic sheet 60, and electroconductive elastic sheet 60 is further by electric signal transmission Onto the mainboard of host.Wherein, electroconductive elastic sheet 60 can specifically include shrapnel main part 61 and respectively with the shrapnel main part The shrapnel flange 62 of 61 both ends connection, wherein shrapnel flange 62 Yu package substrate 30 welding of one end, the shrapnel of the other end turn over Side 62 is fixed on top plate 11.

In addition, in the present embodiment, the positioning tenon 50 uses isolation material, such as epoxy resin or plastics, in reality While the positioning of existing horizontal direction, moreover it is possible to play the isolation and insulation between each electroconductive elastic sheet 60.

And in the present embodiment, the encapsulating housing also uses isolation material, such as epoxy resin or plastics, avoids telecommunications Number interference.

Further, in order to promote efficiency and success rate when assembled, the encapsulating housing is equipped with fool proof notch 14, tool Body is to have carried out corner cut for one jiao in rectangle, to carry out fool proof, prevents signal contact fault caused by the installation of camera mistake.

According to the utility model proposes camera encapsulating structure, sensor devices convert the figures of camera image lenses At electric signal, then by electric signal transmission to package substrate, and then can be by electric signal transmission to electronics by electroconductive elastic sheet In equipment on mainboard, there is no need to reuse the larger BTB connectors of volume, the layout area of mainboard can be saved, improves peace Integrated level is filled, reduces BOM costs, and assembling difficulty can be reduced, practicability and generalization are stronger.

Please refer to Fig. 3 and Fig. 4, the circuit board package structure of the second embodiment proposition of the utility model, including circuit board Mainboard 200 and camera encapsulating structure, the camera encapsulating structure use the camera encapsulating structure in first embodiment, because This, which may refer to Fig. 1 and Fig. 2 comprising encapsulating housing, the encapsulating housing include top plate 11, with The bottom plate 12 that the top plate 11 is oppositely arranged and the side plate 13 between the top plate 11 and the bottom plate 12.This implementation In example, the rectangular in cross-section of the encapsulating housing.The circuit board mainboard 200 is equipped with cavern part 201, when assembling, the envelope Dress shell is located in the cavern part 201.

The top plate 11 is equipped with hollow-out parts 111, and the hollow-out parts 11 are equipped with camera eyeglass 20.The hollow-out parts 111 are located at the centre position of the top plate 11, and the camera eyeglass 20 is located at the centre position of the hollow-out parts 111.

The bottom plate 12 is equipped with package substrate 30, and the package substrate 30 is equipped with sensor devices 40, sensor devices 40 Specifically CCD sensor devices, and the camera eyeglass 20 is arranged with 40 face of the sensor devices, to ensure preferably to obtain Image.The camera eyeglass 20 forms enclosed construction with the top plate 11, the bottom plate 12 and the side plate 13, with more preferable Protection sensor devices 40, guarantee takes pictures quality.Specifically, the top plate 11, the bottom plate 12 can all respectively with the side Plate 13 is vertical.

The package substrate 30 is electrically connected with the sensor devices 40.Specifically, the package substrate 30 and the sense Optical device 40 with bonding line 70 by can be electrically connected.

The side plate 13 is equipped with several spaced positioning tenons 50, specifically, four of the encapsulating housing Positioning tenon 50 is equipped on side plate 13, and the positioning tenon 50 is uniformly distributed on the side plate 13.On each side plate 13 Several positioning tenons 50 be arranged in parallel, positioning tenon 50 have certain length and width, positioning tenon 50 be, for example, grow Curved portion can be arranged in cube structure, the one end of positioning tenon 50 far from side plate 13.Position tenon 50 be used for encapsulating housing into The limit of row horizontal direction.

Between the adjacent positioning tenon 50 be equipped with electroconductive elastic sheet 60, specifically, the adjacent positioning tenon 50 it Between there are the gaps of one fixed width, for accommodating electroconductive elastic sheet 60, electroconductive elastic sheet 60 is for example, by using copper sheet.

The circuit board mainboard 200 is equipped with the accommodating place 202 of positioning tenon, the accommodating place 202 of the positioning tenon and institute The quantity for stating positioning tenon 50 is equal, and is correspondingly arranged, the size phase of positioning the tenon accommodating size for locating 202 and positioning tenon 50 Cooperation, is equipped with edges of boards pad 203 between the accommodating place of the adjacent positioning tenon 202, and when assembling, the encapsulating housing is located at institute It states in cavern part 201, the positioning tenon 50 is caught in the corresponding positioning tenon and houses in place 202, camera encapsulating structure In encapsulating housing be fixed in the vertical direction on a limiting device 300, for example, in the application environment of mobile phone, limit dress Set 300 limiting devices that can be mounted on mobile phone center.The electroconductive elastic sheet 60 and 203 electricity of the corresponding edges of boards pad Property connection.

Wherein, in order to realize the electric connection of electroconductive elastic sheet 60 and corresponding edges of boards pad 203, edges of boards pad can be made 203 side is parallel with the side plate 13 of camera encapsulating structure, the institute of the electroconductive elastic sheet 60 and the edges of boards pad 203 A side contacts are stated, so that the electroconductive elastic sheet 60 is electrically connected with the corresponding edges of boards pad 203.

In order to ensure that the feasibility and product yield of process for manufacturing circuit board, the width of the edges of boards pad 203 are best Not less than 0.2mm, the spacing between adjacent edges of boards pad 203 is not less than 0.15mm.As a specific example, in order to ensure The stability of electric connection, edges of boards pad 203 can specifically include pad main part 2031 and respectively with the pad main part The pad flange 2032 of 2031 both ends connection, the pad main part 2031 and two pad flange 2032 can encase The marginal position of circuit board mainboard 200.It is contacted by pad main part 2031 and shrapnel main part 61, to realize electroconductive elastic sheet 60 With electrically conducting for edges of boards pad 203.Preferably, the pad main part 2031 is in the side of the edges of boards pad, described Pad main part 2031 is parallel with side plate 13.

The electroconductive elastic sheet 60 is electrically connected with the package substrate 30.Specifically, can be by electroconductive elastic sheet 60 wherein One end is welded on the package substrate 30, to realize the electric connection of the two.Electroconductive elastic sheet 60 transmits work(for realizing signal Can, specifically, the figure of image lenses is converted into electric signal by sensor devices 40, by bonding line 70 by electric signal transmission to sealing It fills on substrate 30, package substrate 30 is again by electric signal transmission to electroconductive elastic sheet 60, and electroconductive elastic sheet 60 is further by electric signal transmission To edges of boards pad 203, and then it is transferred on circuit board mainboard 200.

The positioning tenon 50 uses isolation material, such as epoxy resin or plastics, in the positioning for realizing horizontal direction While, moreover it is possible to play the isolation and insulation between each electroconductive elastic sheet 60.The encapsulating housing also uses isolation material, such as epoxy Resin or plastics etc. avoid the interference of electric signal.

In the present embodiment, the circuit board package structure further includes camera head protecting eyeglass 400, the camera head protecting mirror Piece 400 is set on camera eyeglass 20, and the size of the camera head protecting eyeglass 400 is more than the size of the top plate 11.Institute It states camera head protecting eyeglass 400 and the limiting device 300 is located at the opposite sides of the circuit board mainboard 200, pass through Camera head protecting eyeglass 400 and limiting device 300 are realized to the limit on camera encapsulating structure vertical direction, and position tenon Accommodating place 202 and the cooperation of positioning tenon 50 realize the limit in camera encapsulating structure horizontal direction.

The encapsulating housing be equipped with fool proof notch 14, specifically in rectangle one jiao carried out corner cut, correspondingly, the electricity In corresponding position there is fool proof to hollow out area 210 on road plate mainboard 200, fool proof hollows out area 210 and is matched with the shape of fool proof notch 14, To carry out fool proof, signal contact fault caused by the installation of camera mistake is prevented.

The width of the edges of boards pad 203 is not less than 0.2mm, and the spacing between adjacent edges of boards pad 203 is not less than 0.15mm。

It should be pointed out that the present embodiment is assembled on a circuit board mainboard 200 to a camera encapsulating structure It illustrates, in the case of multiple camera encapsulating structures are assembled on the same circuit board mainboard 200, as long as on mainboard The multiple cavern parts 201 of setting, other assembling modes are identical.

According to the utility model proposes circuit board package structure, sensor devices convert the figures of camera image lenses At electric signal, then by electric signal transmission to package substrate, and then can be by electric signal transmission to circuit by electroconductive elastic sheet On edges of boards pad on plate mainboard, there is no need to reuse the larger BTB connectors of volume, the range of distribution of mainboard can be saved Product improves installation integrated level, reduces BOM costs, and can reduce assembling difficulty, practicability and generalization are stronger.

The 3rd embodiment of the utility model provides a kind of electronic equipment, which includes at least second embodiment Circuit board package structure.The electronic equipment can be mobile phone, tablet computer, portable computer, vehicle-mounted computer, desk-top calculating One of which in machine, intelligent TV set, intelligent wearable device, smart home device.

Since the electronic equipment has foregoing circuit plate encapsulating structure, there is no need to reuse the larger BTB connections of volume Device can save the layout area of mainboard, improve installation integrated level, reduce BOM costs, and can reduce assembling difficulty, Practicability and generalization are stronger.

Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term It states and may not refer to the same embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be It can be combined in any suitable manner in any one or more embodiments or example.

Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (10)

1. a kind of camera encapsulating structure, which is characterized in that including encapsulating housing, camera shooting head mirror is equipped on the encapsulating housing Piece, the encapsulating housing is interior to be equipped with package substrate and sensor devices, and the package substrate is electrically connected with the sensor devices, institute It includes side plate to state encapsulating housing, the side plate be equipped with several spaced positioning tenons, the adjacent positioning tenon it Between be equipped with electroconductive elastic sheet, the electroconductive elastic sheet and the package substrate are electrically connected.

2. camera encapsulating structure according to claim 1, which is characterized in that the encapsulating housing includes top plate and institute The bottom plate that top plate is oppositely arranged is stated, the side plate is mounted between the top plate and the bottom plate.

3. camera encapsulating structure according to claim 2, which is characterized in that the camera eyeglass and the top plate, The bottom plate and the side plate form enclosed construction, and the top plate, the bottom plate are all vertical with the side plate respectively.

4. camera encapsulating structure according to claim 1, which is characterized in that the package substrate and the sensor devices It is electrically connected by bonding line.

5. camera encapsulating structure according to claim 1, which is characterized in that the encapsulating housing is cut equipped with fool proof Mouthful.

6. camera encapsulating structure according to claim 1, which is characterized in that the rectangular in cross-section of the encapsulating housing.

7. camera encapsulating structure according to claim 6, which is characterized in that on four side plates of the encapsulating housing Equipped with positioning tenon, the positioning tenon is uniformly distributed on the side plate.

8. a kind of circuit board package structure, which is characterized in that including circuit board mainboard and claim 1 to 7 any one institute The camera encapsulating structure stated, the circuit board mainboard are equipped with cavern part, and the circuit board mainboard is equipped with positioning tenon Accommodating place, the accommodating place of the positioning tenon is equal with the positioning quantity of tenon, and is correspondingly arranged, the adjacent positioning card It is equipped with edges of boards pad between bamboo shoot are accommodating, the encapsulating housing is located in the cavern part, and the positioning tenon is caught in corresponding During the positioning tenon is accommodating, the bottom plate is fixed on a limiting device, and the electroconductive elastic sheet is welded with the corresponding edges of boards Disk is electrically connected.

9. circuit board package structure according to claim 8, which is characterized in that the side of the edges of boards pad is taken the photograph with described As the side plate of head encapsulating structure is parallel, a side contacts for the electroconductive elastic sheet and the edges of boards pad, so that described Electroconductive elastic sheet is electrically connected with the corresponding edges of boards pad.

10. a kind of electronic equipment, which is characterized in that including circuit board package structure according to any one of claims 8.