CN207992915U - A kind of computer heat radiating device - Google Patents

Abstract

The utility model discloses a kind of computer heat radiating devices, including case lid, cabinet, endothermic tube and wind turbine, the top of the cabinet is hinged with case lid, and the top of case lid is equipped with alarm, the side of the cabinet is equipped with dust cover, the cabinet inside bottom end is equipped with water tank close to the side of dust cover, and the bottom end of water tank is uniformly fixed with semiconductor chilling plate, the bottom end of cabinet inside of the water tank far from dust cover side is equipped with micro pump, and the water inlet of micro pump is connected by the side of conduit and water tank.The utility model is by being equipped with endothermic tube, endothermic tube is connected by water pump and water tank, so that convenient for passing through the flowing of cooling water inside endothermic tube, the heat of cabinet inside is absorbed, the radiating efficiency of cabinet is greatly improved, device is by being equipped with semiconductor chilling plate so that convenient for cooling down to the cooling water inside water tank, to maintain the low-temperature condition of cooling water inside endothermic tube, be conducive to preferably radiate.

Description

computer cooling device

technical field

The utility model relates to the technical field of computer hardware equipment, in particular to a computer cooling device.

Background technique

With the continuous development of society, the use of computers has been greatly popularized. The current office, study and life are often inseparable from the use of computers. The emergence of computers has made people's work and life more simple and diverse. During use, heat dissipation performance is one of the most concerned factors for most users. Most of the existing heat dissipation methods use cooling fans to dissipate heat. However, due to the constraints of blade size and fan speed, the heat dissipation effect is not good. Use will cause dust to accumulate on the fan and heat sink, greatly affecting the heat dissipation efficiency, and may cause the hardware to burn out due to the inability to transmit the temperature in a timely and effective manner. There are certain hidden dangers in use.

Utility model content

The purpose of this utility model is to provide a computer cooling device to solve the problems raised in the above background technology.

In order to achieve the above object, the utility model provides the following technical solutions: a computer heat dissipation device, including a case cover, a case, a heat-absorbing pipe and a fan, the top of the case is hinged with a case cover, and an alarm is installed on the top of the case cover A dust cover is installed on one side of the chassis, a water tank is installed on the side close to the dust cover at the inner bottom of the chassis, and a semiconductor cooling chip is evenly fixed on the bottom of the water tank, and the water tank is one distance away from the dust cover. A micro-water pump is installed at the bottom of the case on the side, and the water inlet of the micro-pump is connected to one side of the water tank through a conduit. A fan is installed on the side close to the dust cover inside the case. Both sides of the case are A chute is provided, and a fixing frame is installed between the chute, sliders are installed at both ends of the fixing frame, and the slider and the chute are connected, and a heat-absorbing pipe is installed on the side of the fixing frame away from the fan , and the water inlet end of the heat-absorbing pipe is connected to the water outlet of the micro-water pump through the water inlet pipe, the water outlet end of the heat-absorbing pipe is connected to the top of the water tank through the water outlet pipe, and the chute is far away from the side wall of the chassis on the side of the fan There are noise-absorbing strips evenly installed on the top of the chassis, a single-chip microcomputer is installed on the top of one side of the chassis, and a temperature sensor is installed on the inner wall of the chassis below the single-chip microcomputer, and the output end of the temperature sensor is electrically connected to the input end of the single-chip microcomputer through a wire. , and the output end of the single chip microcomputer is electrically connected with the input end of the alarm through a wire.

Preferably, cooling holes are evenly provided on both sides of the chassis.

Preferably, activated carbon adsorption layers are provided on both sides inside the chassis.

Preferably, the heat absorption tubes are arranged in an S shape.

Preferably, a water injection port is provided at the top of one side of the water tank.

Compared with the prior art, the utility model has the beneficial effects that: the computer cooling device is equipped with a heat-absorbing pipe, and the heat-absorbing pipe is connected with the water tank through a water pump, so that the flow of cooling water inside the heat-absorbing pipe is convenient, and the inside of the chassis The heat is absorbed and removed, which greatly improves the heat dissipation efficiency of the chassis. The device is installed with a semiconductor cooling chip, which makes it easy to cool down the cooling water inside the water tank, so as to maintain the low temperature state of the cooling water inside the heat-absorbing pipe, which is conducive to better The device is installed with chute and slider, which makes it easy to install and disassemble the fixed frame, so as to facilitate the replacement of heat-absorbing pipes. The device is installed with a temperature sensor, and the temperature sensor is connected to the alarm through a single-chip microcomputer, making it easy to operate when inside the chassis. When the parts such as micro pumps and fans are damaged, an alarm can be issued when the temperature of the chassis is too high, so as to avoid the high temperature from burning the hardware inside the computer chassis, and at the same time remind the user to check and repair the chassis in time. At the same time, the device is equipped with a dust cover, which makes it play a good role in dust prevention, and avoids the accumulation of a large amount of dust on the fan to affect the heat dissipation efficiency.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is a partial schematic view of the internal structure of the utility model;

In the figure: 1-box cover; 2-single-chip microcomputer; 3-temperature sensor; 4-muffling bar; 5-chassis; 6-miniature water pump; 7-alarm; ; 11-dust cover; 12-outlet pipe; 13-inlet pipe; 14-water tank;

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Please refer to Fig. 1-2, an embodiment provided by the utility model: a computer cooling device, including a case cover 1, a case 5, a heat-absorbing pipe 9 and a fan 10, the top of the case 5 is hinged with a case cover 1, and the case An alarm 7 is installed on the top of the cover 1, the type of the alarm 7 can be TGSG-01, the alarm 7 is connected to the mains power through wires, and both sides of the chassis 5 are evenly provided with cooling holes to facilitate the improvement of heat dissipation efficiency. Both sides of the 5 interior are provided with activated carbon adsorption layers, which play the role of absorbing impurities such as dust, and prevent dust from entering the interior of the chassis 5 through the cooling holes. A dust cover 11 is installed on one side of the chassis 5, and the bottom of the chassis 5 is close to the anti- One side of the dust cover 11 is equipped with a water tank 14, and the top of the water tank 14 side is provided with a water injection port, which is convenient for adding and replacing coolant. TEC1-12703T125, the semiconductor cooling chip 15 is connected to the mains by wires, and the water tank 14 is equipped with a micro-water pump 6 at the bottom of the cabinet 5 on the side away from the dust cover 11. The type of the micro-water pump 6 can be IS50-32-125 , the micro-water pump 6 is connected to the mains by wires, the water inlet of the micro-water pump 6 is connected to one side of the water tank 14 through a conduit, a fan 10 is installed on the side near the dust cover 11 inside the cabinet 5, and the two sides of the cabinet 5 are Both are provided with chute 16, between the chute 16 is installed a fixed frame 8, both ends of the fixed frame 8 are installed with sliders 17, the slider 17 and the chute 16 are connected, and the side of the fixed frame 8 away from the fan 10 is installed There are heat-absorbing pipes 9 arranged in an S shape, which is convenient for saving space and has a better heat-absorbing effect. The water outlet end is connected with the top of water tank 14 through water outlet pipe 12, and chute 16 is evenly equipped with muffler bar 4 on the side wall of the cabinet 5 on one side away from blower fan 10, and the top of cabinet 5 inner side is equipped with single-chip microcomputer 2, and this single-chip microcomputer The model 2 can be ZYWYKJ, and a temperature sensor 3 is installed on the inner wall of the chassis 5 below the microcontroller 2. The model of the temperature sensor 3 can be CWDZ11. The output end of the temperature sensor 3 is electrically connected to the input end of the microcontroller 2 through a wire. The output terminal of 2 is electrically connected with the input terminal of the alarm 7 through a wire.

Working principle: when in use, turn on the power supply. When the weather temperature is low, turn on the blower fan 10 to dissipate heat. The cooling water is introduced into the heat-absorbing pipe 9, and the cooling water flows in the heat-absorbing pipe 9, and at the same time absorbs the heat inside the chassis 5, and transports it back to the water tank 14 through the water outlet pipe 12, opens the semiconductor refrigeration sheet 15, and cools the inside of the water tank 14. The cooled cooling water is cooled, and the cooled cooling water continues to be conducted to the heat-absorbing pipe 9 through the micro-water pump 6. Such a circulation effect can effectively absorb the heat inside the chassis 5 and maintain the normal operating temperature of the computer hardware. When parts such as the micro-water pump 6 or the fan 10 are damaged, causing the internal temperature of the chassis 5 to be too high, the temperature sensor 3 receives the signal and transmits the signal to the alarm 7 through the single-chip microcomputer 2, and the alarm 7 sends an alarm to remind the user to stop using the computer , check and repair the chassis 5 in time to avoid damage to the hardware inside the chassis.

It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, no matter from all points of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, so it is intended to fall within the scope of the claims All changes within the meaning and range of equivalents of the required elements are included in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (5)

1. A computer cooling device, comprising a case cover (1), a case (5), a heat-absorbing pipe (9) and a fan (10), characterized in that: the top of the case (5) is hinged with a case cover (1 ), and an alarm (7) is installed on the top of the case cover (1), a dust cover (11) is installed on one side of the case (5), and the inner bottom of the case (5) is close to the dust cover ( A water tank (14) is installed on one side of the water tank (11), and the bottom end of the water tank (14) is evenly fixed with a semiconductor cooling chip (15), and the water tank (14) is far away from the chassis (5) on the side of the dust cover (11) A micro-water pump (6) is installed at the bottom of the interior, and the water inlet of the micro-water pump (6) is connected to one side of the water tank (14) through a conduit, and the interior of the chassis (5) is close to the side of the dust cover (11) A fan (10) is installed, both sides of the chassis (5) are provided with chute (16), and a fixed frame (8) is installed between the chute (16), the fixed frame (8) Sliders (17) are installed at both ends, and the sliders (17) are connected to the chute (16), and the side of the fixed frame (8) away from the fan (10) is installed with a heat-absorbing pipe (9), and The water inlet end of the heat-absorbing pipe (9) is connected to the water outlet of the micro-water pump (6) through the water inlet pipe (13), and the water outlet end of the heat-absorbing pipe (9) is connected to the water tank (14) through the water outlet pipe (12). The top is connected, and the side wall of the chassis (5) on the side of the chute (16) away from the fan (10) is evenly installed with a sound-absorbing strip (4), and the top of the interior side of the chassis (5) is installed with a single-chip microcomputer ( 2), and a temperature sensor (3) is installed on the inner wall of the chassis (5) below the single-chip microcomputer (2), and the output end of the temperature sensor (3) is electrically connected to the input end of the single-chip microcomputer (2) through a wire, And the output end of the single-chip microcomputer (2) is electrically connected with the input end of the alarm (7) through a wire. 2. The computer cooling device according to claim 1, characterized in that: cooling holes are uniformly arranged on both sides of the chassis (5). 3. The computer cooling device according to claim 1, characterized in that: activated carbon adsorption layers are arranged on both sides inside the chassis (5). 4. A computer cooling device according to claim 1, characterized in that: the heat-absorbing pipes (9) are arranged in an S shape. 5. The computer cooling device according to claim 1, characterized in that: a water injection port is provided at the top of one side of the water tank (14).