CN207978185U - Titanium or titanium alloy circuit board folder - Google Patents
Titanium or titanium alloy circuit board folder Download PDFInfo
- Publication number
- CN207978185U CN207978185U CN201820507746.5U CN201820507746U CN207978185U CN 207978185 U CN207978185 U CN 207978185U CN 201820507746 U CN201820507746 U CN 201820507746U CN 207978185 U CN207978185 U CN 207978185U
- Authority
- CN
- China
- Prior art keywords
- clamp
- titanium
- circuit board
- articulated section
- elastic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010936 titanium Substances 0.000 title claims abstract description 51
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910001069 Ti alloy Inorganic materials 0.000 title claims abstract description 37
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 46
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- GFNGCDBZVSLSFT-UHFFFAOYSA-N titanium vanadium Chemical compound [Ti].[V] GFNGCDBZVSLSFT-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 8
- 238000009713 electroplating Methods 0.000 abstract description 5
- 239000002253 acid Substances 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000006641 stabilisation Effects 0.000 abstract 1
- 238000011105 stabilization Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052729 chemical element Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 silver White transition metal Chemical class 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
A kind of titanium of the utility model offer or titanium alloy circuit board folder.Titanium or titanium alloy circuit board folder provided by the utility model includes elastic component, pass through the elastic component interval opposite the first noumenon and the second ontology, the first noumenon includes the interconnecting piece for connecting hanger, the first articulated section for installing elastic component and the first clamp for clamping circuit board, the interconnecting piece, first articulated section and the first clamp extend to form successively, second ontology includes the pressure portion opposite with the interconnecting piece interval, the second articulated section for installing elastic component and the second clamp for clamping circuit board, the pressure portion, second articulated section and the second clamp extend to form successively；First clamp and second clamp are that titanium is made.Titanium has good resistance to corrosion；Due to the chemical property of its stabilization, good high temperature resistant, low temperature resistant, anti-strong acid, anti-highly basic, therefore, while chemical property is stablized during above structure circuit board electroplating, and it is durable, it will not damage.
Description
Technical field
The utility model is related to circuit board processing technique fields more particularly to a kind of titanium or titanium alloy circuit board to press from both sides.
Background technology
Flexible PCB is that have height reliability, excellent song to be a kind of made of base material using polyimides or mylar
Flexible printed circuit, such circuit was not only flexible, folds, winding, but also can arbitrarily be moved in three dimensions and flexible, thermal diffusivity
It is good, lightweight, miniaturization, slimming are realized, the industries such as computer, communication, space flight and household electrical appliances are therefore widely used in.
Most important step is exactly to be electroplated to flexible PCB in the production process, needs base material being fixed on folder before plating
On tool, places into electrolytic cell after being powered and be electroplated.
In the prior art, the plate folder of flexible titanium or titanium alloy circuit board folder mostly uses the metal materials such as aluminium, copper, in circuit board
In electrolytic cell electroplating process, the conductive contact of the metal materials such as aluminium, copper directly leaks in a cell cruelly so that conductive contact table
Face is corroded.To influence reusing for electroplating clamp, the cost produced during board production is increased.
Therefore, it is necessary to provide a kind of new titanium or titanium alloy circuit board folder solves above-mentioned technical problem.
Utility model content
The utility model provides a kind of titanium or titanium alloy circuit board folder of solution above-mentioned technical problem.
In order to solve the above technical problems, titanium provided by the utility model or titanium alloy circuit board folder include elastic component, pass through
The elastic component interval opposite the first noumenon and the second ontology, the first noumenon include for connect the interconnecting piece of hanger,
The first articulated section for installing elastic component and the first clamp for clamping circuit board, the interconnecting piece, the first articulated section and
First clamp extends to form successively, and second ontology includes the pressure portion opposite with the interconnecting piece interval, for installing bullet
Second articulated section of property part and the second clamp for clamping circuit board, the pressure portion, the second articulated section and the second clamp according to
It is secondary to extend to form；First clamp and second clamp are that titanium or titanium alloy are made.
Preferably, first clamp and the opposing end surface of the side of second clamp far from the elastic component are in wave
Unrestrained face.
Preferably, first clamp further includes being set to the limit protrusion for closing on the wavy surface.
Preferably, the side of second clamp far from the elastic component further includes towards the first clamp wavy surface
Bending structure, the second clamp wavy surface are set to the end of the bending structure.
Preferably, the end of first clamp and the side of second clamp far from the elastic component includes taper
Protrusion, the side that the tapered protrusion is directed away from the elastic component extend.
Preferably, first clamp and first articulated section by card slot set on first clamp and are set to institute
Snapping connection for the first articulated section is stated, the interconnecting piece and first articulated section are spirally connected.
Preferably, second clamp and second articulated section by card slot set on second clamp and are set to institute
Snapping connection for the second articulated section is stated, the pressure portion and second articulated section are spirally connected.
Preferably, first articulated section and the interconnecting piece are that titanium is made.
Preferably, the pressure portion and second articulated section are that titanium is made.
Preferably, the titanium alloy is six aluminium of titanium, four vanadium.
Compared with the relevant technologies, titanium or titanium alloy circuit board clamp provided by the utility model has the advantages that：
It includes elastic component that titanium or titanium alloy circuit board provided by the utility model, which presss from both sides, opposite by the elastic component interval
The first noumenon and the second ontology, the first noumenon include for connecting the interconnecting piece of hanger, first for installing elastic component
Articulated section and the first clamp for clamping circuit board, the interconnecting piece, the first articulated section and the first clamp extend to form successively,
Second ontology includes the pressure portion opposite with the interconnecting piece interval, the second articulated section for installing elastic component and is used for
Second clamp of clamping circuit board, the pressure portion, the second articulated section and the second clamp extend to form successively；First clamp
It is that titanium is made with second clamp.Titanium is a kind of chemical element, and chemical symbol Ti, atomic number 22 is a kind of silver
White transition metal, it is characterized in that it is light-weight, intensity is high, tool metallic luster, also have good resistance to corrosion；Since it is steady
Fixed chemical property, good high temperature resistant, low temperature resistant, anti-strong acid, anti-highly basic and high intensity, low-density are " too by good reputation
Empty metal.Therefore, while chemical property is stablized during above structure circuit board electroplating, and it is durable, it will not damage.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram for preferred embodiment that titanium provided by the utility model or titanium alloy circuit board press from both sides.
Specific implementation mode
The utility model is described in further detail with embodiment below in conjunction with the accompanying drawings.
Fig. 1 is please referred to, is a kind of preferred embodiment that titanium provided by the utility model or titanium alloy circuit board press from both sides
Structural profile illustration.The titanium or titanium alloy circuit board folder 100 are spaced opposite including elastic component 3, by the elastic component 3
The first noumenon 1 and the second ontology 2.
In the present embodiment, the elastic component 3 is spring, and the first noumenon 1 and the second ontology 2 pass through the elastic component
The elastic force of 3 connections and the elastic component 3 drives 1 and second ontology 2 of the first noumenon.
The first noumenon 1 include for connecting the interconnecting piece 11 of hanger, the first articulated section 12 for installing elastic component 3
And the first clamp 13 for clamping circuit board, the interconnecting piece 11, the first articulated section 12 and the first clamp 13 extend shape successively
At.
Second ontology 2 include be spaced opposite pressure portion 21 with the interconnecting piece 11, for installing elastic component 3
Two articulated sections 22 and the second clamp 23 for clamping circuit board, the pressure portion 21, the second articulated section 22 and the second clamp 23
It extends to form successively；First clamp 13 and second clamp 23 are that titanium or titanium alloy are made.
In the present embodiment, first clamp 13 and second clamp 23 are that six aluminium of titanium, four vanadium is made.
The opposing end surface of 23 side far from the elastic component 3 of first clamp 13 and second clamp is in wave
Face, respectively the first clamp wavy surface 10 and the second clamp wavy surface 20.
First clamp 13 further includes being set to the limit protrusion 131 for closing on the wavy surface 10.
Second clamp, 23 side far from the elastic component 3 further includes towards the curved of the first clamp wavy surface 10
Folded structure 231, the second clamp wavy surface 20 are set to the end of the bending structure 231.
The end of 23 side far from the elastic component 3 of first clamp 13 and second clamp includes that taper is convex
30 are played, the side that the tapered protrusion 30 is directed away from the elastic component 3 extends.
The setting of the tapered protrusion 30, it is remaining on the titanium or titanium alloy circuit board folder 100 after the completion of being electroplated
Electroplate liquid can flow downward rapidly, and by the own structural characteristics of the tapered protrusion 30, and electroplate liquid can be along described
The drop leaching downwards of tapered protrusion 30, prevents drippage in circuit board surface, is damaged to circuit board.
First clamp 13 and first articulated section 12 are by card slot 130 set on first clamp 13 and are set to
The buckle 120 of first articulated section 12 connects, and the interconnecting piece 11 and first articulated section 12 are spirally connected.
Second clamp 23 and second articulated section 22 are by card slot 230 set on second clamp 23 and are set to
The buckle 220 of second articulated section 22 connects, and the pressure portion 21 and second articulated section 22 are spirally connected.
First articulated section 12 and the interconnecting piece 11 are that titanium is made.
The pressure portion 11 and second articulated section 22 are that titanium is made.
The interconnecting piece 11, first articulated section 12 and first clamp 13 are the package assembly being detachably connected；
The pressure portion 21, second articulated section 22 and second clamp 23 are the package assembly being detachably connected；When plating, institute
State the first clamp wavy surface 10 and the second clamp wavy surface 20 be with circuit board contacts face, need to be electrically connected, wave structure
Frictional force can effectively be increased, keep clamping plate more firm, due to the first clamp wavy surface 10 and the second clamp wavy surface 20
Directly sudden and violent leakage is in electroplate liquid, and the two is corroded most soon, therefore in the present embodiment, first clamp 13 and second clamp
23 be that titanium is made；It, can be by will be described when first clamp 13 and second clamp 23 are corroded damage
First clamp 13 and second clamp 23 and first articulated section 12 and second articulated section 22 are dismantled and are replaced, and avoid
Replacement entire titanium or titanium alloy circuit board folder, while improving work efficiency, have saved cost.
Preferably, first articulated section 12 and the interconnecting piece 11 are that titanium is made；The pressure portion 11 and institute
It is that titanium is made to state the second articulated section 22.Above-described embodiment, which can more extend the titanium or titanium alloy circuit board folder 100, to be made
Use the period.
Compared with the relevant technologies, titanium or titanium alloy circuit board clamp provided by the utility model has the advantages that：
It includes elastic component that titanium or titanium alloy circuit board provided by the utility model, which presss from both sides, opposite by the elastic component interval
The first noumenon and the second ontology, the first noumenon include for connecting the interconnecting piece of hanger, first for installing elastic component
Articulated section and the first clamp for clamping circuit board, the interconnecting piece, the first articulated section and the first clamp extend to form successively,
Second ontology includes the pressure portion opposite with the interconnecting piece interval, the second articulated section for installing elastic component and is used for
Second clamp of clamping circuit board, the pressure portion, the second articulated section and the second clamp extend to form successively；First clamp
It is that titanium is made with second clamp.Titanium is a kind of chemical element, and chemical symbol Ti, atomic number 22 is a kind of silver
White transition metal, it is characterized in that it is light-weight, intensity is high, tool metallic luster, also have good resistance to corrosion；Since it is steady
Fixed chemical property, good high temperature resistant, low temperature resistant, anti-strong acid, anti-highly basic and high intensity, low-density are " too by good reputation
Empty metal.Therefore, while chemical property is stablized during above structure circuit board electroplating, and it is durable, it will not damage.
The above description is only the embodiments of the present invention, and it does not limit the scope of the patent of the present invention, every
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in
Other relevant technical fields, are equally included in the patent within the scope of the utility model.
Claims (10)
1. a kind of titanium or titanium alloy circuit board folder, which is characterized in that including elastic component, by the elastic component interval it is opposite the
One ontology and the second ontology, the first noumenon include the first hinge for connecting the interconnecting piece of hanger, for installing elastic component
Socket part and the first clamp for clamping circuit board, the interconnecting piece, the first articulated section and the first clamp extend to form successively, institute
State pressure portion, the second articulated section for installing elastic component that the second ontology includes opposite with the interconnecting piece interval and for pressing from both sides
Gu the second clamp of circuit board, the pressure portion, the second articulated section and the second clamp extend to form successively；First clamp and
Second clamp is that titanium or titanium alloy are made.
2. titanium according to claim 1 or titanium alloy circuit board folder, which is characterized in that first clamp and described second
The opposing end surface of side of the clamp far from the elastic component is in wavy surface.
3. titanium according to claim 2 or titanium alloy circuit board folder, which is characterized in that first clamp further includes being set to
Close on the limit protrusion of the wavy surface.
4. titanium according to claim 3 or titanium alloy circuit board folder, which is characterized in that second clamp is far from the bullet
Property part side further include towards the bending structure of the first clamp wavy surface, the second clamp wavy surface be set to it is described curved
The end of folded structure.
5. titanium according to claim 1 or titanium alloy circuit board folder, which is characterized in that first clamp and described second
The end of side of the clamp far from the elastic component includes tapered protrusion, and the tapered protrusion is directed away from the elastic component
Side extends.
6. titanium according to claim 1 or titanium alloy circuit board folder, which is characterized in that first clamp and described first
Articulated section is by the card slot set on first clamp and snapping connection set on first articulated section, the interconnecting piece and institute
The first articulated section is stated to be spirally connected.
7. titanium according to claim 1 or titanium alloy circuit board folder, which is characterized in that second clamp and described second
Articulated section is by the card slot set on second clamp and snapping connection set on second articulated section, the pressure portion and institute
The second articulated section is stated to be spirally connected.
8. titanium according to claim 6 or titanium alloy circuit board folder, which is characterized in that first articulated section and the company
Socket part is that titanium is made.
9. titanium according to claim 7 or titanium alloy circuit board folder, which is characterized in that the pressure portion and second hinge
Socket part is that titanium is made.
10. titanium according to claim 1 or titanium alloy circuit board folder, which is characterized in that the titanium alloy is six aluminium four of titanium
Vanadium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820507746.5U CN207978185U (en) | 2018-04-10 | 2018-04-10 | Titanium or titanium alloy circuit board folder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820507746.5U CN207978185U (en) | 2018-04-10 | 2018-04-10 | Titanium or titanium alloy circuit board folder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207978185U true CN207978185U (en) | 2018-10-16 |
Family
ID=63764088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820507746.5U Active CN207978185U (en) | 2018-04-10 | 2018-04-10 | Titanium or titanium alloy circuit board folder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207978185U (en) |
-
2018
- 2018-04-10 CN CN201820507746.5U patent/CN207978185U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6741865B2 (en) | Rectangular impact resistant leaf spring type connector | |
| CN101668382B (en) | Flexible printed circuit board and terminal | |
| CN207338642U (en) | A kind of antenna thimble | |
| CN207978185U (en) | Titanium or titanium alloy circuit board folder | |
| CN207069106U (en) | A kind of circuit board connects special welding terminal | |
| CN217363615U (en) | Radiator for intelligent terminal | |
| CN215732107U (en) | Copper bar connecting piece with novel voltage sampling points and voltage sampling connecting structure | |
| CN208087774U (en) | Titanium or titanium alloy circuit board electroplating fixture | |
| CN205811024U (en) | TM mould dielectric filter | |
| CN101657069A (en) | Surface processing method for printed circuit board and corresponding printed circuit board | |
| CN201515058U (en) | Shrapnel contact slot | |
| CN103361706B (en) | Circuit board electroplating fixture | |
| CN207038726U (en) | A kind of mobile terminal | |
| CN215444639U (en) | Compressing self-locking structure and electronic device | |
| CN205491441U (en) | ceramic substrate circuit board | |
| CN209805877U (en) | Steel sheet device for pressing BTB (Board to Board) by mobile phone | |
| CN220306541U (en) | PCB contact type connection structure | |
| CN221010167U (en) | Terminal equipment | |
| CN208899009U (en) | A kind of small area parcel plating benefit tin device | |
| CN215732109U (en) | Voltage sampling point suitable for aluminum battery connecting piece | |
| CN109193289A (en) | A kind of copper bar bindiny mechanism | |
| CN219799552U (en) | Testing clamp for annular device | |
| CN206461178U (en) | A kind of USB Type C connectors and electronic apparatus fixing structure | |
| CN204039538U (en) | The composite electroplated hanger of a kind of flex circuit application | |
| CN201663222U (en) | Antenna connector and mobile communication terminal used by antenna connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Titanium or titanium alloy circuit plate holder Effective date of registration: 20190808 Granted publication date: 20181016 Pledgee: Baoji Weibin rural commercial bank Limited by Share Ltd, Pledgor: Baoji Xinnuo New Metal Co., Ltd. Registration number: Y2019610000003 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200318 Granted publication date: 20181016 Pledgee: Baoji Weibin rural commercial bank Limited by Share Ltd, Pledgor: BAOJI XINNUO NEW METAL MATERIALS Co.,Ltd. Registration number: Y2019610000003 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Titanium or titanium alloy circuit plate holder Effective date of registration: 20200326 Granted publication date: 20181016 Pledgee: Baoji Weibin rural commercial bank Limited by Share Ltd, Pledgor: BAOJI XINNUO NEW METAL MATERIALS Co.,Ltd. Registration number: Y2020980001073 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210323 Granted publication date: 20181016 Pledgee: Baoji Weibin rural commercial bank Limited by Share Ltd. Pledgor: BAOJI XINNUO NEW METAL MATERIALS Co.,Ltd. Registration number: Y2020980001073 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Titanium or titanium alloy circuit board clip Effective date of registration: 20210324 Granted publication date: 20181016 Pledgee: Baoji Weibin rural commercial bank Limited by Share Ltd. Pledgor: BAOJI XINNUO NEW METAL MATERIALS Co.,Ltd. Registration number: Y2021980002009 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210326 Granted publication date: 20181016 Pledgee: Baoji Weibin rural commercial bank Limited by Share Ltd. Pledgor: BAOJI XINNUO NEW METAL MATERIALS Co.,Ltd. Registration number: Y2021980002009 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Titanium or titanium alloy circuit board clip Effective date of registration: 20210329 Granted publication date: 20181016 Pledgee: Baoji Weibin rural commercial bank Limited by Share Ltd. Pledgor: BAOJI XINNUO NEW METAL MATERIALS Co.,Ltd. Registration number: Y2021980002208 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220329 Granted publication date: 20181016 Pledgee: Baoji Weibin rural commercial bank Limited by Share Ltd. Pledgor: Baoji Xinnuo New Metal Material Co.,Ltd. Registration number: Y2021980002208 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |