CN207947252U - A kind of temperature control equipment of bonder for production of electronic components - Google Patents
A kind of temperature control equipment of bonder for production of electronic components Download PDFInfo
- Publication number
- CN207947252U CN207947252U CN201820447227.4U CN201820447227U CN207947252U CN 207947252 U CN207947252 U CN 207947252U CN 201820447227 U CN201820447227 U CN 201820447227U CN 207947252 U CN207947252 U CN 207947252U
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- Prior art keywords
- fixed
- water
- water tank
- bonder
- pipe
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Abstract
The utility model discloses a kind of temperature control equipments of the bonder for production of electronic components, are related to bonder technical field.Including board and cabinet, heat sink is fixed with inside board, cabinet inner chamber bottom surface is fixed with sliding table and transmission mechanism, transmission mechanism one side is fixed with adhesive dispensing device, heat sink includes copper pipe radiator, the first water tank and the second water tank, first water tank, one surface is fixed with a water pump, and the water inlet of water pump is connected to by pipeline with the fixation of the water inlet of copper pipe radiator.The utility model is detected when the temperature is excessively high by temperature sensor, temperature sensor sends out signal to control device, control device control heat sink cools down, when temperature is too low, control device controls air blower and water pump is out of service, and solving the problems, such as that the existing bonder cooling-down effect for production of electronic components is bad causes temperature to be unable to control in OK range.
Description
Technical field
The utility model belongs to bonder technical field, more particularly to a kind of bonder for production of electronic components
Temperature control equipment.
Background technology
Bonder is mainly used for the lead tank bracket pressing plate of various spun gold device for ultrasonic welding and various chip attachment are set
Standby various suction nozzles, thimble, Glue dripping head, porcelain nozzle, cleansing pin, motor, carbon brush, encoder, driving belt, automation equipment it is various
Spare and accessory parts, instrument and instrument etc..
Traditional dropping glue of die bonder device is heated up when heating up using heating pole, reaches temperature perseverance using heat sink cooling
Fixed working condition, however the cooling-down effect of existing bonder heat sink is bad, at work between it is long after will appear temperature
Higher situation is spent, to need power-off to be protected, the working efficiency of bonder is reduced, cannot be satisfied the use of user
Effect.
Utility model content
The purpose of this utility model is to provide a kind of temperature control equipments of the bonder for production of electronic components, lead to
Excess temperature sensor detects when the temperature is excessively high, and temperature sensor sends out signal to control device, and control device controls heat sink
Cool down, when temperature is too low, control device controls air blower and water pump is out of service, solves existing for electronic component
The bonder cooling-down effect of production is bad to cause temperature to be unable to control the OK range the problem of.
In order to solve the above technical problems, the utility model is achieved through the following technical solutions:
The utility model is a kind of temperature control equipment of bonder for production of electronic components, including board and machine
Case is fixed with heat sink inside the board, and the cabinet inner chamber bottom surface is fixed with sliding table and transmission mechanism, described
Transmission mechanism one side is fixed with adhesive dispensing device;
The heat sink includes copper pipe radiator, the first water tank and the second water tank, and one surface of the first water tank is fixed
There are a water pump, the water inlet of the water pump to be connected to the fixation of the water inlet of copper pipe radiator by pipeline, the water outlet of the water pump
Mouth is fixed with one surface of the first water tank and is connected to, and the water outlet of the copper pipe radiator is fixed by pipeline and one surface of the second water tank
Connection, another surface of the second water tank are fixed with one surface of the first water tank by connecting tube and are connected to;
Second water tank, one surface and one surface of the first water tank, which are run through, a water-supply-pipe, is set inside second water tank
There are a heat-dissipating pipe, the heat-dissipating pipe both ends to be respectively positioned on outside the second water tank, described heat-dissipating pipe one end is fixed and is communicated with an air blower;
The adhesive dispensing device includes shell, and one surface of the shell is fixed with a sebific duct, and the enclosure interior is equipped with a heating
Bar, the heating rod outer surface are socketed with sleeve, and described sleeve pipe inner surface offers a thread groove, in the thread groove
Portion be equipped with the matched screw thread endothermic tube of thread groove, the shell week, side was through having two appendixs, two appendixs
One end is respectively positioned on inside pipe casing;
Screw thread endothermic tube both ends are connected to the fixation of two water-supply-pipes respectively by pipeline, two appendix one end difference
It is connected to the fixation of the air inlet of heat-dissipating pipe one end and air blower by pipeline;
One surface of the adhesive dispensing device is fixed with a control device, and the shell inner surface is fixed with a temperature sensor, institute
It states one surface of cabinet and is fixed with an audible-visual annunciator;
The control device includes processor and control unit, and the audible-visual annunciator and temperature sensor are filled with control
Set connection.
Further, the opposite side of board week side is respectively and fixedly provided with an extraction fan, and one surface of the board is equipped with one
Dust-proof air ventilation plate.
Further, first water tank and one surface of the second water tank are equipped with water blockoff pipe, and water blockoff pipe one end is equipped with
Sealing-plug, the sealing-plug are located at outside board.
Further, described sleeve pipe is a hollow cylindrical structure, and the internal diameter of described sleeve pipe is more than the outer diameter of heating pole, poor
Away between 1mm-1.3mm.
Further, it is provided with check valve in the connecting tube, the cross section of heat-dissipating pipe character form structure for it.
Further, one surface of the board is rectangular is uniformly fixed with several feets, and the cabinet one side is fixed
There is a display screen.
The utility model has the advantages that:The utility model detects the temperature inside adhesive dispensing device by temperature sensor
Degree, when the temperature is excessively high, temperature sensor send out signal to control device, and control device controls water pump operation, and water pump drives the
Water inside one water tank is discharged to copper pipe radiator internal heat dissipating and is discharged to the second water tank, and the water of the second water tank is discharged to screw thread endothermic tube
The temperature of absorbed inside heating pole carries out water-cooled process, and water-cooled process is later when temperature sensor detects temperature or excessively high
When, control device controls air blower operation, and air blower is by injecting the cold air inside heat-dissipating pipe, inside pipe casing to inside pipe casing
Air heat absorption after row to form air circulation to absorbing heat through subcooled water inside heat-dissipating pipe and efficiently radiated, can carry out quick
Cooling, when the temperature is too low, control device control air blower and water pump it is out of service, can by temperature control in suitable model
It encloses, improves the working efficiency of bonder, meet the using effect of user.
Certainly, any product for implementing the utility model does not necessarily require achieving all the advantages described above at the same time.
Description of the drawings
In order to illustrate more clearly of the technical solution of the utility model embodiment, make required for being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the utility model,
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Other attached drawings.
Fig. 1 is a kind of structural representation of the temperature control equipment of bonder for production of electronic components of the utility model
Figure;
Fig. 2 is the structural schematic diagram of heat sink;
Fig. 3 is the structural schematic diagram of the second water tank;
Fig. 4 is the structural schematic diagram of adhesive dispensing device;
Fig. 5 is that adhesive dispensing device removes the structural schematic diagram after decannulation;
Fig. 6 is the structural schematic diagram of casing;
In attached drawing, parts list represented by the reference numerals are as follows:
1- boards, 2- cabinets, 3- heat sinks, 4- sliding tables, 5- transmission mechanisms, 6- adhesive dispensing devices, 7- control devices,
101- extraction fans, 102- dust-proof air ventilation plates, 103- feets, 104- display screens, 201- audible-visual annunciators, 301- copper pipe radiators,
The first water tanks of 302-, the second water tanks of 303-, 304- water pumps, 305- connecting tubes, 306- water-supply-pipes, 307- heat-dissipating pipes, 308- water blockoffs
Pipe, 309- sealing-plugs, 310- air blowers, 601- shells, 602- point sebific ducts, 603- heating poles, 604- casings, 605- thread grooves
Road, 606- screw thread endothermic tubes, 607- appendixs.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
The all other embodiment obtained, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be understood that term " trepanning ", "upper", "lower", " thickness ", "top",
" in ", " length ", "inner", indicating positions or the position relationship such as " surrounding ", be merely for convenience of description the utility model and simplification
Description, does not indicate or imply the indicated component or element must have a particular orientation, with specific azimuth configuration and behaviour
Make, therefore should not be understood as limiting the present invention.
It please refers to Fig.1 shown in -6, the utility model is a kind of temperature control dress of bonder for production of electronic components
It sets, including board 1 and cabinet 2, heat sink 3 is fixed with inside board 1,2 inner chamber bottom surface of cabinet is fixed with 4 He of sliding table
Transmission mechanism 5,5 one side of transmission mechanism are fixed with adhesive dispensing device 6;
Heat sink 3 includes copper pipe radiator 301, the first water tank 302 and the second water tank 303,302 1 surface of the first water tank
It is fixed with a water pump 304, the water inlet of water pump 304 is connected to by pipeline with the fixation of the water inlet of copper pipe radiator 301, water pump
304 water outlet is fixed with 302 1 surface of the first water tank and is connected to, and the water outlet of copper pipe radiator 301 passes through pipeline and the second water
Connection is fixed on 303 1 surface of case, and 303 another surface of the second water tank is fixed by connecting tube 305 and 302 1 surface of the first water tank to be connected
It is logical;
Second water tank, 303 1 surface and 302 1 surface of the first water tank, which are run through, a water-supply-pipe 306, in the second water tank 303
Portion is equipped with a heat-dissipating pipe 307, and 307 both ends of heat-dissipating pipe are respectively positioned on outside the second water tank 303, and 307 one end of heat-dissipating pipe is fixed and is communicated with
One air blower 310;
Adhesive dispensing device 6 includes shell 601, and 601 1 surface of shell is fixed with a sebific duct 602, and shell 601 is internally provided with a heating
Bar 603,603 outer surface of heating pole are socketed with sleeve 604, and 604 inner surface of casing offers a thread groove 605, thread groove
Road 605 be internally provided with 605 matched screw thread endothermic tube 606 of thread groove, 601 weeks sides of shell are through there is two appendixs
607, two appendixs, 607 one end is respectively positioned on inside casing 604, and screw thread endothermic tube 606 and casing 604 are made of copper product;
606 both ends of screw thread endothermic tube are connected to the fixation of two water-supply-pipes 306 respectively by pipeline, two appendixs, 607 one end point
It is not connected to the fixation of the air inlet of 307 one end of heat-dissipating pipe and air blower 310 by pipeline;
6 one surface of adhesive dispensing device is fixed with a control device 7, and 601 inner surface of shell is fixed with a temperature sensor, and temperature passes
Sensor is DS18B20 model temperature sensors, and 2 one surface of cabinet is fixed with an audible-visual annunciator 201;
Control device 7 includes processor and control unit, audible-visual annunciator 201 and temperature sensor with control device 7
Connection.
Wherein, the opposite side of 1 week side of board is respectively and fixedly provided with an extraction fan 101, and 1 one surface of board is equipped with a dust-proof air ventilation
Plate 102 improves the air inside board 1 using the air inlet of 101 exhausting of extraction fan and dust-proof air ventilation plate 102 and flows, to machine
Platform 1 radiates.
Wherein, the first water tank 302 and 303 1 surface of the second water tank are equipped with water blockoff pipe 308, and 308 one end of water blockoff pipe is equipped with
Sealing-plug 309, sealing-plug 309 are located at outside board 1.
Wherein, casing 604 is a hollow cylindrical structure, and the internal diameter of casing 604 is more than the outer diameter of heating pole 603, gap
Between 1mm-1.3mm, the gap between casing 604 and heating pole 603 is flowed for air.
Wherein, check valve is provided in connecting tube 305, character form structure, check valve avoid for it for the cross section of heat-dissipating pipe 307
Water inside second water tank 303 flows into the first water tank 302, and heat-dissipating pipe 307 is copper pipe.
Wherein, 1 one surface of board is rectangular is uniformly fixed with several feets 103, and 2 one side of cabinet is fixed with a display
Screen 104.
One of the present embodiment has particular application as:When bonder is run, heating pole 603 heats adhesive dispensing device 602, temperature
The temperature inside sensor detection adhesive dispensing device 6 is spent, when the temperature is excessively high, temperature sensor sends out signal to control device 7, control
Device 7 controls water pump 304 and runs, and water pump 304 drives the water inside the first water tank 302 to be discharged to 301 internal heat dissipating of copper pipe radiator
And it is discharged to the second water tank 303, the water of the second water tank 303 is discharged to 606 absorbed inside heating pole of screw thread endothermic tube by water-supply-pipe 306
603 temperature, carry out water-cooled process, water-cooled process later when temperature sensor detect temperature or it is excessively high when, control device 7
It controls air blower 310 to run, air blower 310 is by the cold air inside casing 604 inside injection heat-dissipating pipe 307, casing 604
It absorbs heat through subcooled water inside row to heat-dissipating pipe 307 after internal air heat absorption and to form air circulation and efficiently radiated, work as temperature
When spending low, control device 7 controls air blower 310 and water pump 304 is out of service, can control temperature in suitable range.
When radiator 3 is run, the water extraction inside the first water tank 302 is discharged to copper pipe radiator 301 by the operation of water pump 304
Internal heat dissipating, the water finished that radiates are passed through in the second water tank 303, and the water inside the second water tank 303 is discharged to spiral shell by water-supply-pipe 306
Inside line endothermic tube 606, screw thread endothermic tube 606 will be discharged to the first water after the heat absorption on heating pole 603 by water-supply-pipe 607
Inside case 302, Water-cooling circulating is formed, while the water inside the second water tank 303 is discharged to by connecting tube 305 in the first water tank 302
The water cycle in portion, formation remains that the water temperature inside the second water tank 303 keeps low temperature, and air blower 310 will be inside heat-dissipating pipe 307
Cold air be drawn through pipeline and be discharged to inside casing 604, the gas inside casing 604 is by another appendix 607 and pipe
Road is recycled to inside heat-dissipating pipe 307, and the gas inside heat-dissipating pipe 307 is that normal temperature air forms air by the endothermic transition of cold water
Cycle carries out air-cooled processing to 604 inside of casing.
In the description of this specification, the description of reference term " one embodiment ", " example ", " specific example " etc. means
Particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained in at least one of the utility model
In embodiment or example.In the present specification, schematic expression of the above terms be not necessarily referring to identical embodiment or
Example.Moreover, particular features, structures, materials, or characteristics described can be in any one or more embodiments or example
In can be combined in any suitable manner.
The preferred embodiment in the utility model disclosed above is only intended to help to illustrate the utility model.Preferred embodiment is simultaneously
There is no the details that detailed descriptionthe is all, does not limit the specific implementation mode that the utility model is only described yet.Obviously, according to this theory
The content of bright book can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to preferably
The principles of the present invention and practical application are explained, to enable skilled artisan to be best understood by and utilize this
Utility model.The utility model is limited only by the claims and their full scope and equivalents.
Claims (6)
1. a kind of temperature control equipment of bonder for production of electronic components, including board(1)And cabinet(2), feature
It is:The board(1)Inside is fixed with heat sink(3), the cabinet(2)Inner chamber bottom surface is fixed with sliding table(4)
And transmission mechanism(5), the transmission mechanism(5)One side is fixed with adhesive dispensing device(6);
The heat sink(3)Including copper pipe radiator(301), the first water tank(302)With the second water tank(303), described first
Water tank(302)One surface is fixed with a water pump(304), the water pump(304)Water inlet pass through pipeline and copper pipe radiator
(301)Water inlet fix connection, the water pump(304)Water outlet and the first water tank(302)Connection is fixed on one surface, described
Copper pipe radiator(301)Water outlet pass through pipeline and the second water tank(303)Connection, second water tank are fixed in one surface
(303)Another surface passes through connecting tube(305)With the first water tank(302)Connection is fixed on one surface;
Second water tank(303)One surface and the first water tank(302)One surface, which is run through, a water-supply-pipe(306), described
Two water tanks(303)It is internally provided with a heat-dissipating pipe(307), the heat-dissipating pipe(307)Both ends are respectively positioned on the second water tank(303)Outside,
The heat-dissipating pipe(307)One end is fixed and is communicated with an air blower(310);
The adhesive dispensing device(6)Including shell(601), the shell(601)One surface is fixed with a sebific duct(602), the shell
(601)It is internally provided with a heating pole(603), the heating pole(603)Outer surface is socketed with sleeve(604), described sleeve pipe
(604)Inner surface offers a thread groove(605), the thread groove(605)It is internally provided with and thread groove(605)Match
The screw thread endothermic tube of conjunction(606), the shell(601)All sides, which are run through, two appendixs(607), two appendixs(607)
One end is respectively positioned on casing(604)It is internal;
The screw thread endothermic tube(606)Both ends by pipeline respectively with two water-supply-pipes(306)Fixed connection, two appendixs
(607)One end passes through pipeline and heat-dissipating pipe respectively(307)One end and air blower(310)Air inlet fix connection;
The adhesive dispensing device(6)One surface is fixed with a control device(7), the shell(601)Inner surface is fixed with temperature biography
Sensor, the cabinet(2)One surface is fixed with an audible-visual annunciator(201);
The control device(7)Including processor and control unit, the audible-visual annunciator(201)With temperature sensor with control
Device processed(7)Connection.
2. a kind of temperature control equipment of bonder for production of electronic components according to claim 1, feature exist
In the board(1)The opposite side of all sides is respectively and fixedly provided with an extraction fan(101), the board(1)It is dust-proof that one surface is equipped with one
Air permeable plate(102).
3. a kind of temperature control equipment of bonder for production of electronic components according to claim 1, feature exist
In first water tank(302)With the second water tank(303)One surface is equipped with water blockoff pipe(308), the water blockoff pipe(308)One
End is equipped with sealing-plug(309), the sealing-plug(309)Positioned at board(1)It is external.
4. a kind of temperature control equipment of bonder for production of electronic components according to claim 1, feature exist
In described sleeve pipe(604)For a hollow cylindrical structure, described sleeve pipe(604)Internal diameter be more than heating pole(603)Outer diameter,
Gap is between 1mm-1.3mm.
5. a kind of temperature control equipment of bonder for production of electronic components according to claim 1, feature exist
In the connecting tube(305)On be provided with check valve, the heat-dissipating pipe(307)Cross section character form structure for it.
6. a kind of temperature control equipment of bonder for production of electronic components according to claim 1, feature exist
In the board(1)One surface is rectangular to be uniformly fixed with several feets(103), the cabinet(2)One side is fixed with one
Display screen(104).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820447227.4U CN207947252U (en) | 2018-04-02 | 2018-04-02 | A kind of temperature control equipment of bonder for production of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820447227.4U CN207947252U (en) | 2018-04-02 | 2018-04-02 | A kind of temperature control equipment of bonder for production of electronic components |
Publications (1)
Publication Number | Publication Date |
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CN207947252U true CN207947252U (en) | 2018-10-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201820447227.4U Expired - Fee Related CN207947252U (en) | 2018-04-02 | 2018-04-02 | A kind of temperature control equipment of bonder for production of electronic components |
Country Status (1)
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CN (1) | CN207947252U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117727667A (en) * | 2024-02-08 | 2024-03-19 | 东莞触点智能装备有限公司 | Chip high-precision die bonder and hot pressing process thereof |
-
2018
- 2018-04-02 CN CN201820447227.4U patent/CN207947252U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117727667A (en) * | 2024-02-08 | 2024-03-19 | 东莞触点智能装备有限公司 | Chip high-precision die bonder and hot pressing process thereof |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181009 Termination date: 20200402 |
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CF01 | Termination of patent right due to non-payment of annual fee |