CN207936577U - A kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case - Google Patents
A kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case Download PDFInfo
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- CN207936577U CN207936577U CN201820357126.8U CN201820357126U CN207936577U CN 207936577 U CN207936577 U CN 207936577U CN 201820357126 U CN201820357126 U CN 201820357126U CN 207936577 U CN207936577 U CN 207936577U
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- cold
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- semiconductor refrigerating
- lamination
- heat exchanging
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Abstract
The utility model discloses a kind of heat exchanging type semiconductor refrigerating plants of cold-accumulating insulated case, including thermal-insulating body, several corrugation mounting blocks are evenly arranged on the inner wall of thermal-insulating body left and right ends, being horizontally disposed in corrugation mounting blocks has hollow cold-storage fagging, it is provided with several air-through holes on hollow cold-storage fagging, and hollow cold-storage fagging is internally provided with cold-storage oxidant layer, thermal-insulating body inner cavity lower end is provided with plug socket, homogeneous vertical is provided with several installation jacks on plug socket, it is provided with semiconductor refrigerating lamination in installation jack, the lower end of semiconductor refrigerating lamination is provided with heat exchanging refrigerating device；Heat exchanging refrigerating device includes the heat exchange condenser pipe of evaporation fan and double-layer structure, the condenser pipe that exchanges heat is L-shaped, heat exchange condenser pipe lower end is vertically arranged with drain pipeline, the air outlet of evaporation fan is connect with drain lower end of duct, it is simple in structure, easy to operate, it can realize efficient, effect of freezing comprehensively, ensure the deepfreeze environment inside cold-accumulating insulated case.
Description
Technical field
The utility model is related to cold-accumulating insulated case technical field, specially a kind of heat exchanging type semiconductor system of cold-accumulating insulated case
Device for cooling.
Background technology
In the intermediate links of cold chain, referred to as Refrigerated Transport when providing low-temperature receiver using mechanical refrigeration equipment, and rely on and follow
Ring, which fills when cold phase change cold accumulating agent provides low-temperature receiver, is then known as cold insulation transport；Similarly, in storage link also reliable mechanical low-temperature receiver
Mechanical cold storage system box relies on point of the cold insulation storage of cold-storage material low-temperature receiver, it is clear that after cold insulation transport is housed in primary " filling cold " with cold insulation,
Numerous cold insulation skills has been disclosed to extend cold insulation storage and cold insulation haulage time in the low temperature that can only maintain finite time at present
Art scheme, technical way are to provide high performance cold-storage material and thermal-insulating body, still, this to use cold-storage material system
Cold cold-accumulating insulated case, during promoting the use of, there are still some problems, for example, being freezed by cold-storage material, it is fixed to need
Phase carries out the replacement of cold-storage material, this just brings certain trouble to user, moreover, a large amount of uses of cold-storage material, also increase
Use cost；Only freezed by cold-storage material, refrigeration effect is poor, once cold-storage material fails, can cause temperature inside cold-accumulating insulated case
The raising of degree.
Invention content
In order to overcome the shortcomings of that prior art, the utility model provide a kind of heat exchanging type semiconductor of cold-accumulating insulated case
Refrigerating plant, it is simple in structure, easy to operate, it can realize efficient, effect of freezing comprehensively, ensure the low temperature inside cold-accumulating insulated case
Cold storage environment, and can effectively solve the problem that the problem of background technology proposes.
Technical solution adopted by the utility model to solve its technical problems is：
A kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case, including thermal-insulating body, described thermal-insulating body or so two
Several corrugation mounting blocks are evenly arranged on the inner wall of end, being horizontally disposed in the corrugation mounting blocks has hollow cold-storage fagging, described
It is provided with several air-through holes on hollow cold-storage fagging, and hollow cold-storage fagging is internally provided with cold-storage oxidant layer, incubator
Intracoelomic cavity lower end is provided with plug socket, and homogeneous vertical is provided with several installation jacks on the plug socket, in the installation jack
It is provided with semiconductor refrigerating lamination, the cold end of the semiconductor refrigerating lamination is upper, and hot junction is under, and semiconductor refrigerating lamination
Lower end is provided with heat exchanging refrigerating device；
The heat exchanging refrigerating device includes the heat exchange condenser pipe of evaporation fan and double-layer structure, and the heat exchange condenser pipe is in
" L " shape, and the top for the condenser pipe that exchanges heat is connect with the lower end of semiconductor refrigerating lamination, the right end and evaporation fan of the condenser pipe that exchanges heat
Air inlet connection, heat exchange condenser pipe lower end is vertically arranged with drain pipeline, air outlet and the drain pipeline of the evaporation fan
Lower end connects.
Further, aluminum heat conducting plate, and the heat conduction are provided between the semiconductor refrigerating lamination and heat exchange condenser pipe
Several heat conduction hole is provided on aluminium sheet.
Further, the semiconductor refrigerating lamination is made of the superposition of two semiconductor chilling plates, and described is partly led
Body cooling piece includes two ceramic wafers, and several water conservancy diversion metal strips are evenly arranged between two ceramic wafers.
Further, the thermal-insulating body is layered structure, and thermal-insulating body includes that outer layer thermal insulation board and internal layer vacuum are exhausted
Hot plate, the internal layer vacuum heat-insulating plate are arranged in the inside of outer layer thermal insulation board, and the outer layer thermal insulation board and internal layer vacuum insulation
Polyurethane foam layer is provided between plate.
Further, several linking protrusions, outer layer are both provided in the upper and lower ends face of the polyurethane foam layer
The position that thermal insulation board lower end and the upper end of internal layer vacuum heat-insulating plate correspond to linking protrusion is both provided with linking groove, and the linking is convex
Setting is played in linking groove.
Compared with prior art, the utility model has the beneficial effects that：
The utility model only passes through cold-storage material reality by the setting of semiconductor refrigerating lamination compared to more traditional cold-accumulating insulated case
For existing refrigeration effect, the refrigeration effect inside cold-accumulating insulated case is greatly strengthened, meanwhile, reduce the use of cold-storage material；It is logical
The setting of setting heat exchanging refrigerating device is crossed, the heat that semiconductor refrigerating lamination heating end generates can quickly exchange heat, freezed,
It is in deepfreeze environment to be effectively ensured inside the cold-accumulating insulated case, moreover, evaporation fan in heat exchanging refrigerating device
Setting accelerates cold-accumulating insulated case inner air circulation speed, to realizing that efficient, comprehensive refrigeration has certain effect.
Description of the drawings
Fig. 1 is the whole vertical section structure schematic diagram of the utility model；
Fig. 2 is the thermal-insulating body cross section structure schematic diagram of the utility model；
Fig. 3 is the semiconductor chilling plate structural schematic diagram of the utility model.
Figure label：
1- thermal-insulating bodies；2- corrugation mounting blocks；The hollow cold-storage faggings of 3-；4- air-through holes；5- cold-storage oxidant layer；6- sockets
Seat；7- installs jack；8- semiconductor refrigerating laminations；9- heat exchanging refrigerating devices；10- aluminum heat conducting plates；11- heats conduct hole；12- half
Conductor cooling piece；13- ceramic wafers；14- water conservancy diversion metal strips；15- linking protrusions；16- is connected groove；
101- outer layer thermal insulation boards；102- internal layer vacuum heat-insulating plates；103- polyurethane foam layers；
901- evaporation fans；902- heat exchange condenser pipes；903- drain pipelines.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
As shown in Figure 1, the utility model provides a kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case, including protect
Incubator body 1 is evenly arranged with several corrugation mounting blocks 2, the corrugation mounting blocks 2 on 1 left and right ends inner wall of the thermal-insulating body
Interior be horizontally disposed with has hollow cold-storage fagging 3, and several air-through holes 4, air-through holes are provided on the hollow cold-storage fagging 3
4 setting so that the air circulation flow inside thermal-insulating body 1 ensure that 1 inner air of thermal-insulating body circulates, and hollow storage
Cold fagging 3 is internally provided with cold-storage oxidant layer 5, the setting of cold-storage oxidant layer 5, plays the role of refrigeration, cold-storage material be it is a kind of by
It is organic or (and) translucent (or opaque) of inorganic compound composition, sticky colloidal mixture, can at low temperature absorb simultaneously
A large amount of colds are stored, and a large amount of colds can be released when temperature is higher, the long period keeps itself and surrounding a small range
Low temperature environment.
1 inner cavity lower end of thermal-insulating body is provided with plug socket 6, and homogeneous vertical is provided with several installations and inserts on the plug socket 6
Hole 7 is provided with semiconductor refrigerating lamination 8 in the installation jack 7, by the setting of semiconductor refrigerating lamination 8, realizes directly
The effect of refrigeration, the cold end of the semiconductor refrigerating lamination 8 is upper, and hot junction is under, and the lower end setting of semiconductor refrigerating lamination 8
Have heat exchanging refrigerating device 9, by the setting of heat exchanging refrigerating device 9, it can be achieved that exchange between hot-fluid and cold flow, can quickly by
The heat that 8 heating end of semiconductor refrigerating lamination generates quickly absorbs, and can ensure that 1 inside of thermal-insulating body is in low temperature ring
Border.
The heat exchanging refrigerating device 9 includes the heat exchange condenser pipe 902 of evaporation fan 901 and double-layer structure, and the heat exchange is cold
Solidifying pipe 902 is L-shaped, and the top for the condenser pipe 902 that exchanges heat is connect with the lower end of semiconductor refrigerating lamination 8, and exchange heat condenser pipe 902
Right end connect with the air inlet of evaporation fan 901, heat exchange condenser pipe 902 lower end is vertically arranged with drain pipeline 903, the steaming
The air outlet of hair wind turbine 901 is connect with 903 lower end of drain pipeline.
The operation principle of heat exchanging refrigerating device 9 is as follows：
Under the action of evaporation fan 901 so that the thermal current that 8 heating end of semiconductor refrigerating lamination generates is cold by exchanging heat
Solidifying pipe 902 realizes that condensation, the aqueous solution for condensing generation are flowed downward out by drain pipeline 903 under the effect of gravity, at this point, steaming
The evaporation that the wind that hair wind turbine 901 is blown out accelerates condensation aqueous solution may make according to evaporation endothermic principle inside thermal-insulating body 1
Temperature reduces.
It further illustrates, when needing chilled goods, places items on hollow cold-storage fagging 3, at this point,
The article can not only absorb the cold of cold-storage oxidant layer 5 in hollow cold-storage fagging 3, can also absorb and be dissipated by semiconductor refrigerating lamination 8
The cold being dealt into 1 inner air of thermal-insulating body so that the temperature of article quickly reduces, and ensures in thermal-insulating body 1
Portion is in cryopreservation environment.
It is provided with aluminum heat conducting plate 10, and the aluminum heat conducting plate between the semiconductor refrigerating lamination 8 and heat exchange condenser pipe 902
Several heat conduction hole 11 is provided on 10, the setting of aluminum heat conducting plate 10 plays the role of conducting heat, may make semiconductor
The heat that refrigeration 8 heating end of lamination generates quickly is absorbed on aluminum heat conducting plate 10, is then realized and is made by heat exchanging refrigerating device 9 again
Cold effect, improves refrigerating efficiency；Heat conducts the setting in hole 11, realizes air circulation.
As shown in figures 1 and 3, the semiconductor refrigerating lamination 8 is made of two superpositions of semiconductor chilling plate 12, is folded
Add the semiconductor refrigerating lamination 8 of composition, for the conventional semiconductors that compare cooling piece, refrigeration effect more preferably, and the semiconductor
Cooling piece 12 includes two ceramic wafers 13, and several water conservancy diversion metal strips 14 are evenly arranged between two ceramic wafers 13, ceramics
13 surrounding of plate is all made of epoxy resin and is bonded.
As depicted in figs. 1 and 2, the thermal-insulating body 1 is layered structure, and thermal-insulating body 1 includes 101 He of outer layer thermal insulation board
Internal layer vacuum heat-insulating plate 102, the internal layer vacuum heat-insulating plate 102 is arranged in the inside of outer layer thermal insulation board 101, and the outer layer is protected
Polyurethane foam layer 103 is provided between warm plate 101 and internal layer vacuum heat-insulating plate 102, thermal insulation board is with polystyrene tree
Fat adds other supplementary materials and poly- inclusion for raw material, mixes injecting catalyst simultaneously by heating, then extrusion molding extrusion molding
And the rigid foam plate manufactured, there is good heat insulation effect；Vacuum heat-insulating plate is one kind in vacuum thermal insulating material, is
It is combined by filling core material and vacuum protection surface layer, it can be effectively prevented from heat transmission caused by cross-ventilation, therefore heat conduction
Coefficient can be greatly lowered, and be less than 0.003w/m2.k, and any ODS materials are not contained, there is environmental protection and energy-efficient spy
Property；Polyurethane foam plastics is that have splendid elasticity and guarantor made of isocyanates and the aggregated foaming of hydroxy compounds
Temp effect.
As shown in Fig. 2, being both provided with several linking protrusions in the upper and lower ends face of the polyurethane foam layer 103
15, the position of the upper end correspondence linking raised 15 of 101 lower end of outer layer thermal insulation board and internal layer vacuum heat-insulating plate 102 is both provided with linking
Groove 16, in linking groove 16, the setting of linking protrusion 15 and linking groove 16 may make poly- for 15 setting of linking protrusion
Ground is connected between urethane foam layer 103 and outer layer thermal insulation board 101, between internal layer vacuum heat-insulating plate 102 more closely.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing in the equivalent requirements of the claims will be fallen
All changes in justice and range are embraced therein.Any reference numeral in claim should not be considered as limitation
Involved claim.
Claims (5)
1. a kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case, it is characterised in that：Including thermal-insulating body (1), the guarantor
Several corrugation mounting blocks (2) are evenly arranged on the inner wall of incubator body (1) left and right ends, the interior level of the corrugation mounting blocks (2) is set
It is equipped with hollow cold-storage fagging (3), several air-through holes (4) are provided on the hollow cold-storage fagging (3), and hollow cold-storage supports
Plate (3) is internally provided with cold-storage oxidant layer (5), and thermal-insulating body (1) inner cavity lower end is provided with plug socket (6), the plug socket (6)
Upper homogeneous vertical is provided with several installation jacks (7), and semiconductor refrigerating lamination (8) is provided in the installation jack (7), described
The cold end of semiconductor refrigerating lamination (8) is upper, and hot junction is under, and the lower end of semiconductor refrigerating lamination (8) is provided with heat exchange refrigeration
Device (9)；
The heat exchanging refrigerating device (9) includes the heat exchange condenser pipe (902) of evaporation fan (901) and double-layer structure, the heat exchange
Condenser pipe (902) is L-shaped, and the top for the condenser pipe (902) that exchanges heat is connect with the lower end of semiconductor refrigerating lamination (8), is exchanged heat
The right end of condenser pipe (902) is connect with the air inlet of evaporation fan (901), and heat exchange condenser pipe (902) lower end, which is vertically arranged with, leads
The air outlet in liquid pipe road (903), the evaporation fan (901) is connect with drain pipeline (903) lower end.
2. a kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case according to claim 1, it is characterised in that：It is described
It is provided with aluminum heat conducting plate (10) between semiconductor refrigerating lamination (8) and heat exchange condenser pipe (902), and on the aluminum heat conducting plate (10)
It is provided with several heat conduction hole (11).
3. a kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case according to claim 1, it is characterised in that：It is described
Semiconductor refrigerating lamination (8) is made of two semiconductor chilling plate (12) superpositions, and the semiconductor chilling plate (12) wraps
Two ceramic wafers (13) are included, several water conservancy diversion metal strips (14) are evenly arranged between two ceramic wafers (13).
4. a kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case according to claim 1, it is characterised in that：It is described
Thermal-insulating body (1) is layered structure, and thermal-insulating body (1) includes outer layer thermal insulation board (101) and internal layer vacuum heat-insulating plate (102),
The internal layer vacuum heat-insulating plate (102) setting is in the inside of outer layer thermal insulation board (101), and the outer layer thermal insulation board (101) and interior
It is provided with polyurethane foam layer (103) between layer vacuum heat-insulating plate (102).
5. a kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case according to claim 4, it is characterised in that：It is described
It is raised (15) that several linkings are both provided in the upper and lower ends face of polyurethane foam layer (103), under outer layer thermal insulation board (101)
The position of end linking corresponding with the upper end of internal layer vacuum heat-insulating plate (102) raised (15) is both provided with linking groove (16), described
Linking raised (15) setting is in linking groove (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820357126.8U CN207936577U (en) | 2018-03-16 | 2018-03-16 | A kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820357126.8U CN207936577U (en) | 2018-03-16 | 2018-03-16 | A kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207936577U true CN207936577U (en) | 2018-10-02 |
Family
ID=63655420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820357126.8U Active CN207936577U (en) | 2018-03-16 | 2018-03-16 | A kind of heat exchanging type semiconductor refrigerating plant of cold-accumulating insulated case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207936577U (en) |
-
2018
- 2018-03-16 CN CN201820357126.8U patent/CN207936577U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 065201 No.39, Tianshan international business base, Yanjiao Development Zone, Sanhe City, Langfang City, Hebei Province Patentee after: CIMC fresh cold chain technology Hebei Co.,Ltd. Address before: 065201 No.39, Tianshan international business base, Sanhe Yanjiao Development Zone, Langfang City, Hebei Province Patentee before: SANHE JINGXIN XIANGNENG INSULATION MATERIAL Co.,Ltd. |
|
| CP03 | Change of name, title or address |