CN207916233U - Press-fit release film for flexible printed circuit board - Google Patents
Press-fit release film for flexible printed circuit board Download PDFInfo
- Publication number
- CN207916233U CN207916233U CN201721445978.4U CN201721445978U CN207916233U CN 207916233 U CN207916233 U CN 207916233U CN 201721445978 U CN201721445978 U CN 201721445978U CN 207916233 U CN207916233 U CN 207916233U
- Authority
- CN
- China
- Prior art keywords
- layer
- release film
- high temperature
- pressing
- temperature resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004743 Polypropylene Substances 0.000 claims abstract description 19
- 229920001155 polypropylene Polymers 0.000 claims abstract description 18
- -1 polypropylene Polymers 0.000 claims abstract description 17
- 229920000306 polymethylpentene Polymers 0.000 claims abstract description 14
- 239000011116 polymethylpentene Substances 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims description 58
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 26
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000007731 hot pressing Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000835 fiber Substances 0.000 abstract description 4
- 239000012528 membrane Substances 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical group CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000011176 pooling Methods 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- OKJADYKTJJGKDX-UHFFFAOYSA-N Butyl pentanoate Chemical compound CCCCOC(=O)CCCC OKJADYKTJJGKDX-UHFFFAOYSA-N 0.000 description 1
- LQLQDKBJAIILIQ-UHFFFAOYSA-N Dibutyl terephthalate Chemical compound CCCCOC(=O)C1=CC=C(C(=O)OCCCC)C=C1 LQLQDKBJAIILIQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a pressfitting is from type membrane for flexible printed circuit board contains a fibrous layer, a buffer layer and a first high temperature resistant from type layer. The fiber layer has a first surface and a second surface opposite to the first surface. The buffer layer is formed on the first surface of the fiber layer, wherein the buffer layer is formed by polypropylene and polymethylpentene. The first high temperature resistant release layer is formed on the buffer layer, wherein the first high temperature resistant release layer is formed by polypropylene and polymethylpentene. The utility model discloses the material price of pressfitting release film is lower, consequently can reduce flexible printed circuit board's manufacturing cost. Additionally, the utility model discloses the pressfitting after the pressfitting is from type membrane hot pressing is good from the type effect, and overflows the volume of gluing and accord with the specification, consequently can increase flexible printed circuit board's production efficiency.
Description
Technical field
The utility model is to be relevant to a kind of pressing release film, espespecially a kind of for producing in flexible printed wiring board technique
Pressing release film.
Background technology
In general, flexible printed wiring board is made after being processed to copper clad laminate.In manufacture soft printing electricity
When the plate of road, copper clad laminate first can carry out hot pressing fitting with pressing release film, further to be processed in subsequent technique.Later, it presses
Release film can be removed from copper clad laminate again.Existing pressing release film is by TPX materials or polybutyl terapthalate
(PBT) it is formed.However, the higher price of TPX materials, causes the manufacturing cost of flexible printed wiring board to increase；And it is poly- to benzene
The pressing condition that dibutyl carboxylic acid is applied to pressing release film has it to limit range, and can not be widely used.
Invention content
Being designed to provide for the utility model is a kind of for producing the pressing release film in flexible printed wiring board technique,
To solve problem of the prior art.
The utility model is used for the pressing release film of flexible printed wiring board, including：One fibrous layer has a first surface
And one second surface relative to the first surface；One buffer layer, is formed on the first surface of the fibrous layer, wherein the buffering
Layer is formed by polypropylene and polymethylpentene；And one first high temperature resistant release layer, it is formed on the buffer layer, wherein should
First high temperature resistant release layer is formed by polypropylene and polymethylpentene.
Wherein, the overall thickness of the pressing release film is between 90 microns and 200 microns.The first high temperature resistant release layer
Thickness be the 10% ~ 25% of the pressing release film overall thickness, the thickness of the fibrous layer and the buffer layer is that the pressing release film is total
The 90% ~ 75% of thickness.The thickness ratio of the fibrous layer and the buffer layer is between 1：9 and 3：Between 7.Additionally comprise one second high temperature resistant
Release layer is formed on the second surface of the fibrous layer.The overall thickness of the pressing release film be between 90 microns and 200 microns it
Between.The thickness of the first high temperature resistant release layer is the 10% ~ 25% of the pressing release film overall thickness, the fibrous layer and the buffer layer
Thickness is the 80% ~ 50% of the pressing release film overall thickness, and the thickness of the second high temperature resistant release layer is the pressing release film total thickness
The 10% ~ 25% of degree.The thickness ratio of the fibrous layer and the buffer layer is between 1：9 and 3：Between 7.The fibrous layer is art paper.It should
The mechanical direction tensile strength of fibrous layer is 7 ~ 10 kg/15mm.
Compared to the prior art, the material price of the utility model pressing release film is relatively low, therefore can reduce soft print
The manufacturing cost of printed circuit board.In addition, the release effect of pressing after the utility model pressing release film hot pressing is good, and glue overflow amount accords with
Specification is closed, therefore the production efficiency of flexible printed wiring board can be increased.
Description of the drawings
Fig. 1 is the schematic diagram of the pressing release film of the utility model first embodiment.
Fig. 2 is the schematic diagram of the pressing release film of the utility model second embodiment.
Fig. 3 is the schematic diagram of the manufacturing method of the utility model pressing release film.
100,200 pressing release film
110 fibrous layers
The first surface of 110a fibrous layers
The second surface of 110b fibrous layers
120 buffer layers
130 first high temperature resistant release layers
140 second high temperature resistant release layers
300 T-Die die heads.
Specific implementation mode
Referring to FIG. 1, Fig. 1 is the schematic diagram of the pressing release film 100 of the utility model first embodiment.Such as Fig. 1 institutes
Show, it includes a fibrous layer 110, a buffer layer 120 and one first high temperature resistant release layer that the utility model, which presses release film 100,
130.Fibrous layer 110 has an a first surface 110a and second surface 110b relative to first surface 110a.Fibrous layer 110
Can be art paper, but the utility model is not limited.In addition, the mechanical direction (MD) of the fibrous material of fibrous layer 110 is anti-
Zhang Qiangdu (Tensile Strength) is 7 ~ 10 kg/15mm (1354 method for measurement of CNS).Buffer layer 120 is formed at fibre
On the first surface 110a for tieing up layer 110.Buffer layer 120 is by polypropylene (poly-propene) and polymethylpentene (poly4-
Methylpentene it) is formed.Weight percent of the polypropylene in buffer layer 120 is the poly- methyl between 90% and 99%
Weight percent of the amylene in buffer layer 120 is between 10% and 1%.In other words, polypropylene is the master of buffer layer 120
Material, polymethylpentene are the auxiliary materials of buffer layer 120.First high temperature resistant release layer 130 is formed on buffer layer 120.The
One high temperature resistant release layer 130 is formed by polypropylene and polymethylpentene.Polypropylene is in the first high temperature resistant release layer 130
Weight percent is between 1% and 20%, and weight percent of the polymethylpentene in the first high temperature resistant release layer 130 is to be situated between
Between 99% and 80%.In other words, polymethylpentene is the main material of the first high temperature resistant release layer 130, and polypropylene is first
The auxiliary material of high temperature resistant release layer 130.
In addition, in buffer layer 120 and the first high temperature resistant release layer 130, polyacrylic density is between 0.9 g/cm3
Between 1.0g/cm3, polyacrylic melting point is between 160 DEG C and 180 DEG C.The density of polymethylpentene is between 0.8
Between g/cm3 and 0.9g/cm3, the melting point of polymethylpentene is between 230 DEG C and 240 DEG C, and polymethylpentene is for wavelength
The light penetration of 550nm is between 85% and 95%.
Furthermore the overall thickness for pressing release film 100 is between 90 microns and 200 microns.Wherein the first high temperature resistant from
The thickness of type layer 130 is press 100 overall thickness of release film 10% ~ 25%, and the thickness of fibrous layer 110 and buffer layer 120 is pressing
The 90% ~ 75% of 100 overall thickness of release film, and the thickness of fibrous layer 110 and buffer layer 120 ratio is between 1：9 and 3：Between 7.
The utility model press release film 100 can when manufacture flexible printed wiring board and copper clad laminate progress hot pressing patch
It closes.During copper clad laminate and pressing release film 100 carry out hot pressing fitting, the first high temperature resistant release layer 130 can fit in
Copper clad laminate presses release effect to be provided after hot pressing attaching process.And fibrous layer 110 and buffer layer 120 can be in hot pressing
Pooling feature is provided during fitting.
Referring to FIG. 2, Fig. 2 is the schematic diagram of the pressing release film 200 of the utility model second embodiment.Such as the 2nd figure institute
Show, the utility model press release film 200 include a fibrous layer 110, a buffer layer 120, one first high temperature resistant release layer 130 with
And one second high temperature resistant release layer 140.Fibrous layer 110, the buffer layer of the pressing release film 200 of the utility model second embodiment
120 and first high temperature resistant release layer 130 be the same as the utility model first embodiment pressing release film 100 fibrous layer
110, buffer layer 120 and the first high temperature resistant release layer 130, therefore be no longer illustrated.Second high temperature resistant release layer 140 is to be formed
In on the second surface 110b of fibrous layer 110.Second high temperature resistant release layer 140 is by polypropylene and polybutyl terapthalate
It is formed, weight percent of the polypropylene in the second high temperature resistant release layer 140 is the poly terephthalic acid between 1% and 5%
Weight percent of the dibutyl ester in the second high temperature resistant release layer 140 is between 99% and 95%.In other words, poly- terephthaldehyde
Dibutyl phthalate is the main material of the second high temperature resistant release layer 140, and polypropylene is the auxiliary material of the second high temperature resistant release layer 140.
Furthermore the overall thickness for pressing release film 200 is between 90 microns and 200 microns.Wherein the first high temperature resistant from
The thickness of type layer 130 is press 200 overall thickness of release film 10% ~ 25%, and the thickness of fibrous layer 110 and buffer layer 120 is pressing
The 80% ~ 50% of 200 overall thickness of release film, and the thickness of fibrous layer 110 and buffer layer 120 ratio is between 1：9 and 3：Between 7, the
The thickness of two high temperature resistant release layers 140 is press 200 overall thickness of release film 10% ~ 25%.
The utility model press release film 200 can also when manufacture flexible printed wiring board and copper clad laminate progress hot pressing
Fitting.During copper clad laminate and pressing release film 200 carry out hot pressing fitting, the first high temperature resistant release layer 130 can be bonded
In copper clad laminate, release effect is pressed to be provided after hot pressing attaching process.And fibrous layer 110 and buffer layer 120 can be in warm
Pooling feature is provided during overlaying conjunction.In addition, the second high temperature resistant release layer 140 can be to avoid fibrous layer 110 because of pyrocarbon
Change and is stained with and sticks in hot rolled sheet.In other words, the pressing release film 200 of the utility model second embodiment can be new compared with this practicality
The pressing release film 100 of type first embodiment bears higher temperature.
Referring to FIG. 3, simultaneously together with reference to figure 1 and Fig. 2.Fig. 3 is showing for the manufacturing method of the utility model pressing release film
It is intended to.As shown in figure 3, the utility model is to carry out lamination technique using T-Die die heads 300, respectively will in a manner of the double-deck signature altogether
After the material melting of buffer layer 120 and the first high temperature resistant release layer 130 altogether extrusion and lamination to fibrous layer 110 first surface
On 110a, and further across tempering and cooling in formation buffer layer 120 and the first high temperature resistant release layer on fibrous layer 110
130.It later, can be again by the material of the second high temperature resistant release layer 140 to further form the second high temperature resistant release layer 140
It is total in extrusion and lamination to the second surface 110b of fibrous layer 110 after melting, and further across tempering and cooling in fiber
The second high temperature resistant release layer 140 is formed on layer 110.
The actual product that the pressing release film 200 of the utility model second embodiment is produced through above-mentioned manufacturing method
In, it is 160 microns to press release film thickness, and the thickness of the first high temperature resistant release layer 130 is press release film overall thickness 15%,
The thickness of fibrous layer 110 and buffer layer 120 is press release film overall thickness 75%, and the thickness of the second high temperature resistant release layer 140 is
Press the 10% of release film overall thickness.The poly- methyl that the main material of first high temperature resistant release layer 130 is produced by Britain's ICI Company
Amylene (poly4-methylpentene), trade mark P4MP1,0.83 g/cm3 of density, fusing point are 240 DEG C；Auxiliary material is Japan
The polypropylene that Prime polymer companies produce, trade mark F707, density are 0.92 g/cm3, and fusing point is 180 DEG C.Main material
Material is respectively 95% and 5% in the weight percent of the first high temperature resistant release layer 130 with auxiliary material.The main material of buffer layer 120 is
The polypropylene that Borealis companies of European Austria produce, trade mark BD212CF, density are 0.93 g/cm3, fusing point 160
℃；The polymethylpentene (poly4-methylpentene) that auxiliary material is produced by Britain's ICI Company, trade mark P4MP1 are close
0.83 g/cm3 is spent, fusing point is 240 DEG C, and main material is respectively 90% and 10% in the weight percent of buffer layer 120 with auxiliary material.
Fibrous layer 110 is the single side art paper of the made 128gsm base weights of OJI PAPER.Buffer layer 120 and fibrous layer
110 thickness ratio is 3:22.The main material of second high temperature resistant release layer 140 is produced poly- by Polyplastics companies of Japan
Dibutyl terephthalate, the trade mark are DURANEX SF3000, and density is 1.3 g/cm3, and melting point is 260 DEG C.Auxiliary material is
The polypropylene that Japanese Prime polymer companies produce, trade mark S135, density are 0.9 g/cm3, and fusing point is 180 DEG C.It is main
Material is respectively 98% and 2% in the weight percent of the second high temperature resistant release layer 140 with auxiliary material.
Through actual test the utility model press release film second embodiment actual product, 185 DEG C of pressing-in temp,
Pressure 120kg/cm2 and pressing time be in the case of 100 seconds, and the second embodiment of the utility model pressing release film has excellent
Release effect is pressed, and glue overflow amount is 24 microns, met within 50 microns of excessive glue specification.
Compared to prior art, the material price that the utility model presses release film is relatively low, therefore can reduce soft print
The manufacturing cost of printed circuit board.In addition, the release effect of pressing after the utility model pressing release film hot pressing is good, and glue overflow amount accords with
Specification is closed, therefore the production efficiency of flexible printed wiring board can be increased.
Claims (10)
1. a kind of pressing release film for flexible printed wiring board, which is characterized in that include：
One fibrous layer has a first surface and a second surface relative to the first surface；
One buffer layer, is formed on the first surface of the fibrous layer, and wherein the buffer layer is by polypropylene and polymethylpentene institute
It is formed；And
One first high temperature resistant release layer, is formed on the buffer layer, and wherein the first high temperature resistant release layer is by polypropylene and to gather
Methylpentene is formed.
2. pressing release film as described in claim 1, which is characterized in that the overall thickness of the pressing release film is between 90 microns
And between 200 microns.
3. pressing release film as claimed in claim 2, which is characterized in that the thickness of the first high temperature resistant release layer is the pressing
The thickness of the 10% ~ 25% of release film overall thickness, the fibrous layer and the buffer layer is the 90% ~ 75% of the pressing release film overall thickness.
4. pressing release film as claimed in claim 3, which is characterized in that the thickness ratio of the fibrous layer and the buffer layer be between
1：9 and 3：Between 7.
5. pressing release film as described in claim 1, which is characterized in that additionally comprise one second high temperature resistant release layer, be formed in
On the second surface of the fibrous layer.
6. pressing release film as claimed in claim 5, which is characterized in that the overall thickness of the pressing release film is between 90 microns
And between 200 microns.
7. pressing release film as claimed in claim 6, which is characterized in that the thickness of the first high temperature resistant release layer is the pressing
The thickness of the 10% ~ 25% of release film overall thickness, the fibrous layer and the buffer layer is the 80% ~ 50% of the pressing release film overall thickness,
The thickness of the second high temperature resistant release layer is the 10% ~ 25% of the pressing release film overall thickness.
8. pressing release film as claimed in claim 7, which is characterized in that the thickness ratio of the fibrous layer and the buffer layer be between
1：9 and 3：Between 7.
9. pressing release film as described in claim 1, which is characterized in that the fibrous layer is art paper.
10. as described in claim 1 pressing release film, which is characterized in that the mechanical direction tensile strength of the fibrous layer be 7 ~
10 kg/15mm。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106214937 | 2017-10-11 | ||
| TW106214937U TWM555558U (en) | 2017-10-11 | 2017-10-11 | Lamination release film for flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207916233U true CN207916233U (en) | 2018-09-28 |
Family
ID=62014765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721445978.4U Active CN207916233U (en) | 2017-10-11 | 2017-11-02 | Press-fit release film for flexible printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207916233U (en) |
| TW (1) | TWM555558U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109536070A (en) * | 2018-12-10 | 2019-03-29 | 佛山市佳世达薄膜科技有限公司 | A kind of high temperature resistant non-silicon release film |
-
2017
- 2017-10-11 TW TW106214937U patent/TWM555558U/en not_active IP Right Cessation
- 2017-11-02 CN CN201721445978.4U patent/CN207916233U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109536070A (en) * | 2018-12-10 | 2019-03-29 | 佛山市佳世达薄膜科技有限公司 | A kind of high temperature resistant non-silicon release film |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM555558U (en) | 2018-02-11 |
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| GR01 | Patent grant |