CN207911007U

CN207911007U - Mems microphone

Info

Publication number: CN207911007U
Application number: CN201820171803.7U
Authority: CN
Inventors: 柏杨; 张睿
Original assignee: AAC Acoustic Technologies Shenzhen Co Ltd
Current assignee: AAC Technologies Holdings Shenzhen Co Ltd
Priority date: 2018-01-31
Filing date: 2018-01-31
Publication date: 2018-09-25
Anticipated expiration: 2028-01-31

Abstract

The utility model provides a kind of MEMS microphone, it include the capacitor system of substrate and setting with back of the body chamber on the substrate, the capacitor system includes backboard and the vibrating diaphragm opposite with the backboard, the backboard is arranged with the vibrating diaphragm interval, the side of the direction backboard of the side or the vibrating diaphragm of the direction vibrating diaphragm of the backboard is equipped with multiple for preventing from gluing the insulation protrusion sticked in the backboard when the diaphragm oscillations, the insulation protrusion includes and the backboard or the fixed fixing end of the vibrating diaphragm and the contact jaw opposite with the fixing end, the center portion of the contact jaw is compared with its peripheral part closer to the fixing end.Compared with the relevant technologies, the MEMS microphone better reliability of the utility model.

Description

MEMS microphone

【Technical field】

The utility model is related to electroacoustic conversion art more particularly to a kind of MEMS Mikes applied to mobile electronic device Wind.

【Background technology】

Mobile communication technology has been rapidly developed in recent years, and consumer uses mobile communication equipment more and more, Such as portable phone, portable phone, personal digital assistant or the dedicated communications network that can surf the Internet communicated other set Standby, wherein microphone is then wherein one of the ost important components, especially MEMS microphone.

MEMS (Micro-Electro-Mechanical System, MEMS) microphone be it is a kind of utilize microcomputer The electric energy that tool processing technology is made changes sound device, has the characteristics that small, good frequency response, noise are low.With electronics Compact, the lightening development of equipment, MEMS microphone are applied to more and more widely in these equipment.

The MEMS microphone of the relevant technologies includes vibrating diaphragm and the backboard that is arranged with the vibrating diaphragm relative spacing, and in order to prevent two Person bonds, and the MEMS microphones of the relevant technologies is provided with several between the vibrating diaphragm and the backboard on the backboard A anti-sticking protrusion is reduced the adhered area of the vibrating diaphragm and the backboard by the anti-sticking protrusion, reduces adhesion strength, avoid gluing Even phenomenon.

However, due to the limitation of process conditions or cost, the anti-sticking raised appearance and size of itself is difficult to accomplish very little, The vibrating diaphragm and the contact area of the anti-sticking protrusion are not reduced to negligible degree, cause between the two Viscous viscous force is still larger.When the screen resilience of vibrating diaphragm is still less than viscous viscous force, the vibrating diaphragm can still have viscous be adhered in described The risk of backboard causes the MEMS microphone to fail, reduces the reliability of the MEMS microphone.Therefore, it is necessary to carry For a kind of new MEMS microphone to solve drawbacks described above.

【Utility model content】

The purpose of the utility model is to overcome above-mentioned technical problems, provide a kind of MEMS microphone of good reliability.

To achieve the goals above, the utility model technology provides a kind of MEMS microphone, includes the base with back of the body chamber Bottom and setting capacitor system on the substrate, the capacitor system include backboard and opposite with the backboard shake Film, the backboard and the vibrating diaphragm interval are arranged, the side of the direction vibrating diaphragm of the backboard or the vibrating diaphragm towards institute The side for stating backboard is equipped with multiple insulation protrusions that is used to prevent to glue when the diaphragm oscillations and stick in the backboard, and the insulation is convex It rises and includes and the backboard or the fixed fixing end of the vibrating diaphragm and the contact jaw opposite with the fixing end, the contact jaw Center portion compared with its peripheral part closer to the fixing end.

Preferably, the contact jaw of the insulation protrusion is equipped with to the fixing end through the through-hole extended.

Preferably, the contact jaw of the insulation protrusion is equipped with the groove to the fixed concave end.

Preferably, the insulation protrusion is equally distributed in the backboard or the vibrating diaphragm.

Preferably, the insulation protrusion is cylindric or flat column.

Preferably, the MEMS microphone further includes being fixed on the support element of the substrate, the backboard and the vibrating diaphragm The substrate is fixed on by the support element relative spacing respectively.

Compared with the relevant technologies, the MEMS microphone provided by the utility model structure raised by changing insulation makes it Close to the contact jaw center portion compared with its peripheral part closer to the fixing end so that the vibrating diaphragm with it is described insulate it is convex Contact area between rising reduces, and to further reduced the viscous viscous force of the vibrating diaphragm and the insulation protrusion, effectively avoids The vibrating diaphragm generates viscous glutinous phenomenon with the backboard, and then improves the reliability of the MEMS microphone.

【Description of the drawings】

It is required in being described below to embodiment in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Attached drawing to be used is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the utility model Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings Other attached drawings are obtained, wherein：

Fig. 1 is the overall structure diagram of MEMS microphone provided by the utility model；

Fig. 2 is one structural schematic diagram of embodiment of the insulation protrusion of MEMS microphone provided by the utility model；

Fig. 3 is two structural schematic diagram of embodiment of the insulation protrusion of MEMS microphone provided by the utility model.

【Specific implementation mode】

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work The all other embodiment obtained, shall fall within the protection scope of the present invention.

Embodiment one：

Referring to Fig. 1, for the overall structure diagram of MEMS microphone provided by the utility model.The MEMS microphone 100 include with the substrate 10 for carrying on the back chamber 11, the support element 20 for being set in the substrate 10 and being fixedly connected with the substrate 10 And it is arranged in the capacitor system 30 of the support element 20, the capacitor system 30 is exhausted by the support element 20 and the substrate 10 Edge is fixed.

The substrate 10 is made of semi-conducting material, such as is made of polysilicon doping or monocrystalline silicon doping conductive material, The substrate 10 includes back of the body chamber 11, upper surface 12 and the lower surface 13 opposite with the upper surface 12.

The back of the body chamber 11 is arranged through the upper surface 12 and the lower surface 13.

Specifically, the back of the body chamber 11 can be formed by bulk-micromachining or etching.

The support element 20 is fixed on the upper surface 12 of the substrate 10, and the support element 20 is insulating materials.

The capacitor system 30 includes backboard 31, the vibrating diaphragm 32 with the backboard 31 with respect to parallel interval setting and is set to Multiple insulation protrusion of the backboard 31 relative to 32 side of the vibrating diaphragm or the vibrating diaphragm 32 relative to 31 side of the backboard 33。

The opposite side of the backboard 31 and the vibrating diaphragm 32 is equipped with conductor layer (not shown), and the backboard 31 and described Vibrating diaphragm 32 is formed by the support element 20 and is fixed, and the backboard 31 forms capacitance structure with the setting of the interval of the vibrating diaphragm 32.

It is viscous when the insulation protrusion 33 is for preventing the vibrating diaphragm 32 from vibrating to stick in the backboard 31, it avoids because of the vibrating diaphragm 32 with the backboard 31 it is viscous glutinous after so that the MEMS microphone 100 is failed.

Fig. 2 is please referred to, one structure of embodiment for the insulation protrusion of MEMS microphone provided by the utility model is shown It is intended to.Insulation protrusion 33 include and 32 fixed fixing end 331 of the backboard 31 or the vibrating diaphragm, with the fixing end 331 opposite contact jaws 332 and from the contact jaw 332 to 331 perforative through-hole 333 of the fixing end.When the vibrating diaphragm 32 Under the action of sound wave to the backboard 31 close to when, prevent the vibrating diaphragm 32 from continuing to the back of the body by insulation protrusion 33 Plate 31 is close, and because the contact jaw 332 and the contact area of the vibrating diaphragm 32 or the backboard 31 are small, the backboard 31 and institute State generate between vibrating diaphragm 32 be adhered power less than the screen resilience of of the vibrating diaphragm 32 itself so that the vibrating diaphragm 32 realizes rebound, from And it is effectively prevented the bonding of the vibrating diaphragm 32 and the backboard 31.

In present embodiment, the insulation protrusion 33 is equally distributed in the backboard 31 or the vibrating diaphragm 32.

Specifically, the insulation protrusion 33 is cylindric or flat column.Certainly, shape is not limited to this.

MEMS microphone be powered on state under, the backboard 31 and the vibrating diaphragm 32 can take opposite polarity electricity Lotus forms the capacitor system 30.When the vibrating diaphragm 32 generates vibration, the vibrating diaphragm 32 and the backboard under the action of sound wave The distance between 31 can change, and the capacitance of the capacitor system 30 is caused to change, to convert acoustic signals to Different electric signals realizes the corresponding function of microphone.

Embodiment two：

Referring to Fig. 3, two structural schematic diagram of embodiment of the insulation protrusion for MEMS microphone provided by the utility model. The structure of MEMS microphone provided in this embodiment and the MEMS microphone 100 that embodiment one provides are essentially identical, and difference exists In the structure of the insulation protrusion 33a.

The insulation protrusion 33a include and the backboard or the fixed fixing end 331a of the vibrating diaphragm, with the fixing end The contact jaw 332a opposite 331a and groove 333a being recessed from the contact jaw 332a to the fixing end 331a, the groove 333a is used to reduce the contact area of insulation the protrusion 33a and the vibrating diaphragm.

It should be noted that in the embodiments of the present invention one and embodiment two, by insulation protrusion point The through-hole 333 and the groove 333a are not set, and the purpose is to reduce the contact jaw and the vibrating diaphragm or the backboard Contact area, to reduce because what contact generated is adhered power.Therefore, other are by changing the contact jaw and the vibrating diaphragm or institute The similar structure for stating the contact area of backboard, both is within the protection scope of the present invention.

Compared with the relevant technologies, the MEMS microphone provided by the utility model structure raised by changing insulation makes it Close to described vibrating diaphragm one end marginal portion compared with center portion closer to the vibrating diaphragm so that the vibrating diaphragm is raised with the insulation Between contact area reduce, to further reduced the vibrating diaphragm with it is described insulation protrusion viscous viscous force, effectively prevent The vibrating diaphragm generates viscous glutinous phenomenon with the backboard, and then improves the reliability of the MEMS microphone.

Above-described is only the embodiment of the utility model, it should be noted here that for the ordinary skill of this field For personnel, without departing from the concept of the present invention, improvement can also be made, but these belong to this practicality Novel protection domain.

Claims

1. a kind of MEMS microphone includes the capacitor system of substrate and setting with back of the body chamber on the substrate, the electricity Appearance system includes backboard and the vibrating diaphragm opposite with the backboard, and the backboard is arranged with the vibrating diaphragm interval, the backboard The side of the direction backboard towards the side of the vibrating diaphragm or the vibrating diaphragm is equipped with multiple for preventing the diaphragm oscillations When the viscous insulation protrusion sticked in the backboard, which is characterized in that the insulation protrusion includes consolidating with the backboard or the vibrating diaphragm Fixed fixing end and the contact jaw opposite with the fixing end, the center portion of the contact jaw compared with its peripheral part closer to The fixing end.

2. MEMS microphone according to claim 1, which is characterized in that it is described insulation protrusion the contact jaw be equipped with to The fixing end is through the through-hole extended.

3. MEMS microphone according to claim 1, which is characterized in that it is described insulation protrusion the contact jaw be equipped with to The groove of the fixed concave end.

4. according to claim 1-3 any one of them MEMS microphones, which is characterized in that the raised equidistantly distributed of the insulation In the backboard or the vibrating diaphragm.

5. according to claim 1-3 any one of them MEMS microphones, which is characterized in that insulation protrusion be it is cylindric or Flat column.

6. according to claim 1-3 any one of them MEMS microphones, which is characterized in that the MEMS microphone further includes solid Due to the support element of the substrate, the backboard is fixed on the base by the support element relative spacing respectively with the vibrating diaphragm Bottom.