CN207908077U - Conductive film and film resistor strain pressure transducer - Google Patents
Conductive film and film resistor strain pressure transducer Download PDFInfo
- Publication number
- CN207908077U CN207908077U CN201820240366.XU CN201820240366U CN207908077U CN 207908077 U CN207908077 U CN 207908077U CN 201820240366 U CN201820240366 U CN 201820240366U CN 207908077 U CN207908077 U CN 207908077U
- Authority
- CN
- China
- Prior art keywords
- metal layer
- conductive film
- particle
- pressure transducer
- hard conating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 claims abstract description 79
- 229910052751 metal Inorganic materials 0.000 claims abstract description 79
- 239000002245 particle Substances 0.000 claims abstract description 47
- 239000000463 material Substances 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 241000209094 Oryza Species 0.000 claims 2
- 235000007164 Oryza sativa Nutrition 0.000 claims 2
- 235000009566 rice Nutrition 0.000 claims 2
- 150000002500 ions Chemical class 0.000 abstract description 27
- 238000006479 redox reaction Methods 0.000 abstract description 8
- 150000001450 anions Chemical class 0.000 abstract description 5
- 150000001768 cations Chemical class 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 description 11
- 230000007797 corrosion Effects 0.000 description 11
- 230000035945 sensitivity Effects 0.000 description 11
- 230000002401 inhibitory effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000002788 crimping Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229920006222 acrylic ester polymer Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The utility model is related to a kind of film resistor strain pressure transducer and conductive films.Strain resistor in above-mentioned film resistor strain pressure transducer is etched by conductive film to be formed.Wherein, conductive film includes base material, hard conating and metal layer, and includes the multiple particles formed by ion capturing agent in hard conating.Particle can adsorb free anion and cation.Therefore, by adding particle, the amount of ions dissociated in hard conating and metal layer can be efficiently reduced.Further, redox reaction has occurred in the principles of chemistry that metal layer corrodes, and by reducing the content of free ion, the generation of redox reaction can be effectively inhibited.Therefore, metal layer can be effectively prevented and the metallic circuit formed by metal layer is corroded in the environment of high temperature and humidity, so that the reliability of above-mentioned film resistor strain pressure transducer and conductive film is effectively promoted.
Description
Technical field
The utility model is related to pressure sensitivity technology field, more particularly to a kind of conductive film and film resistor strain-type pressure pass
Sensor.
Background technology
Pressure sensor (Pressure Transducer) is to experience pressure signal, and can be incited somebody to action according to certain rule
Pressure signal is converted into the device or device of the electric signal of available output.With the rapid development of modern science and technology, for pressure
The performance indicator of sensor, extreme operating environments constantly propose new demand, this results in film resistor strain-type pressure sensing
Device comes into being.
Film resistor strain pressure transducer generally comprises substrate and is attached to substrate surface, and by conductive metal film
Strain resistor made of etching.Currently, the conductive metal film for forming above-mentioned strain resistor generally comprises base material, and it is formed in
The metal layer of base material both sides.Moreover, using when need to be etched metal layer, to form strain resistor.
However, metal layer is easy to be corroded in the environment of high temperature and humidity, and etch the metal wire of obtained strain resistor
Road narrower width, generally micron order.Therefore, the metallic circuit of strain resistor is easy to be broken because of corrosiveness, so as to cause
Strain resistor loss of function, reliability are poor.
Utility model content
Based on this, it is necessary to for the problem that existing film resistor strain pressure transducer reliability is poor, provide one
Kind can promote the conductive film and film resistor strain pressure transducer of reliability.
A kind of conductive film, including：
Base material, including the first surface and second surface that are oppositely arranged；
Two hard conatings, are attached respectively to the first surface and second surface；And
Two metal layers are attached respectively to described two hard conatings backwards to the surface of the base material；
Wherein, include the multiple particles formed by ion capturing agent in described two hard conatings.
Free anion and cation can be adsorbed by multiple particles that ion capturing agent is formed.Therefore, pass through addition
Particle can efficiently reduce the amount of ions dissociated in hard conating and metal layer.Further, the chemistry that metal layer corrodes
Redox reaction has occurred in principle, and by reducing the content of free ion, redox reaction can be effectively inhibited
Generation.Therefore, metal layer can be effectively prevented to be corroded in the environment of high temperature and humidity, so that above-mentioned conductive film
Reliability is effectively promoted.
The multiple particle forms multiple protruding portion and flat on the surface of the hard conating in one of the embodiments,
Portion, layer on surface of metal position corresponding with the protruding portion are formed with protrusion.
On the one hand, the presence of protruding portion can increase the contact area between hard conating and metal layer, so as to increase metal
The adhesive force of layer.Also, inhibiting effect of the particle to dissociated ion can be promoted after contact area increase, therefore the corrosion resistance of metal layer
Further promoted.
On the other hand, the conductive film of strip is being manufactured using roll-to-roll process (roll to roll process)
When, since the surface of metal layer forms multiple protrusions.Therefore, when crimping conductive membrane, multiple protrusions can make two neighboring
Point contact is formed between metal layer, to prevent its stick to each other, crimping.
Between particle weight accounting in the hard conating is 0.01% to 5% in one of the embodiments,.
If the weight accounting of particle is too low, particle is limited to the inhibiting effect of dissociated ion, can not be obviously improved gold
Belong to the corrosion resistance of layer.And if the weight accounting of particle be more than 5% when, hard coating surface can be caused aperture or a large amount of gas occur
Body discharges, and influences the quality of conductive film.
The particle size range of the particle is between 0.1 micron and 2 microns in one of the embodiments,.
Specifically, in one timing of weight accounting of particle, the smaller then relative surface area of grain size of particle is bigger, therefore to free
The inhibiting effect of ion is more preferable.But prepare the particle cost higher that grain size is less than micron.Therefore, cost and more in order to balance
Good reliability, therefore the grain size of particle is set as between 0.1 micron to 2 microns.
Between the thickness range of the hard conating is 0.5 micron to 2 microns in one of the embodiments,.
If hard coat layer thickness is less than 0.5 micron, it can not be formed with the surface of base material and effectively be adhered to, and can not be to base material
It plays a protective role.And if the thickness of hard conating be higher than 2 microns, the internal stress in hard conating can be caused excessive, so be easy
Conductive film is caused to be cracked in blanking process.Moreover, the excessive thickness for also resulting in conductive film of the thickness of hard conating
It is excessive, do not meet the lightening demand of electronic product.
The metal layer is corronil film in one of the embodiments,.
Corronil is alloy material obtained from addition metallic nickel in fine copper.Wherein, corronil intensity, corrosion resistance,
Hardness is higher, therefore is conducive to prevent metal layer from damaging, and promotes the reliability of conductive film.Moreover, corronil can reduce resistance
Rate temperature coefficient, therefore the resistance value variation with temperature unobvious of metal layer.That is, etching to obtain by above-mentioned conductive film
Strain resistor resistivity variation with temperature it is smaller.Therefore, film resistor strain pressure transducer can be effectively reduced
Interference when sensing pressure caused by temperature change.
Between the weight accounting of copper is 50% to 95% in the metal layer in one of the embodiments,.
Specifically, when the weight ratio of copper is too low, the electric conductivity of metal layer can be deteriorated, and when the weight ratio of copper
When excessively high, then alloy material corrosion resistance, characteristic with high hardness can not be embodied.And the weight accounting of copper is 50% to 95%
Between when, metal layer can preferably take into account electric conductivity and corrosion resistance, the advantage of high rigidity.
The thickness of the metal layer is 50 nanometers to 300 nanometers in one of the embodiments,.
Specifically, the thickness of metal layer determines the thickness of the metallic circuit for the strain resistor that etching obtains, and electrostrictive strain
The pressure-dependent sensitivity of resistance value of resistance is also related with the thickness of metallic circuit.If the thickness of metallic circuit is excessive, can
Cause strain resistor more blunt to the sensing of pressure.Meanwhile if the thickness of metal layer is too small, after being etched into metallic circuit
It is easily broken off, fails so as to cause strain resistor.And when the thickness of metal layer is set as 50 nanometers to 300 nanometers, then it can be simultaneous
Care for reliability and the sensitivity of film resistor strain pressure transducer.
A kind of film resistor strain pressure transducer, including：
Substrate；And
It is attached to the strain resistor of the substrate surface, the strain resistor is described in any one of above preferred embodiment
Conductive film etch to be formed；
Wherein, the metal layer is etched into the metallic circuit of preset shape.
The width of the metallic circuit is less than or equal to 50 microns in one of the embodiments,.
Specifically, the pressure-dependent sensitivity of the resistance value of strain resistor is then related with the width of metallic circuit.Width
Bigger, then sensitivity is lower.If the width of metallic circuit is more than 50 microns, strain resistor can be caused to compare the sensing of pressure
It is blunt.Therefore, the width of metallic circuit 50 microns or less are set as to be conducive to promote film resistor strain pressure transducer
The sensitivity of Pressure identification and precision.
Above-mentioned film resistor strain pressure transducer can be adsorbed free by multiple particles that ion capturing agent is formed
Anion and cation.Therefore, by adding particle, the amount of ions dissociated in hard conating and metal layer can be efficiently reduced.
Further, redox reaction has occurred in the principles of chemistry that metal layer corrodes, and by reducing free ion
Content can effectively inhibit the generation of redox reaction.Therefore, can be effectively prevented metallic circuit high temperature and humidity environment
In be corroded so that the reliability of above-mentioned film resistor strain pressure transducer is effectively promoted.
Description of the drawings
Fig. 1 is the structural schematic diagram of film resistor strain pressure transducer in the utility model preferred embodiment；
Fig. 2 is the structural schematic diagram of conductive film in the utility model preferred embodiment.
Specific implementation mode
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms
It realizes, however it is not limited to embodiment described herein.Make to the utility model on the contrary, purpose of providing these embodiments is
The understanding of disclosure is more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with the technology for belonging to the utility model
The normally understood meaning of technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more relevant Listed Items.
The utility model provides a kind of film resistor strain pressure transducer and conductive film.
It please refers to Fig.1 and Fig. 2, the film resistor strain pressure transducer 10 in the utility model preferred embodiment includes
Strain resistor 11 and substrate 12.Wherein, strain resistor 11 is attached to the surface of substrate 12.Moreover, strain resistor 11 is by conductive thin
The etching of film 100 is formed.
Specifically, substrate 12, which can be surface, the inorganic material such as metal or quartz, the mica of insulating layer.Pressure acts on
When strain resistor 11, the resistance change of strain resistor 11, so as to cause the variation of electric signal.Electric signal is analyzed, just
Pressure value can be obtained.
Referring to Fig. 2, the conductive film 100 in the utility model preferred embodiment includes base material 110, hard conating
120 and metal layer 130.
Base material 110 includes the first surface (upper surface shown in Fig. 2) being oppositely arranged and second surface (following table shown in Fig. 2
Face).Base material 110 mainly plays a part of to carry hard conating 120 and metal layer 130.Base material 110 can be by amorphism thin polymer film
It is formed, can also be formed by crystalline polymer film.Specifically, base material 110 can be polyethylene terephthalate
(PET), makrolon (PC), polycyclic alkene (COP) film etc..
Hard conating 120 is two, and two hard conatings 120 are attached respectively to first surface and second surface.Moreover, metal
Layer 130 is two, and two metal layers 130 are attached respectively to surface of two hard conatings 120 backwards to base material 110.Due to base material
110 with the material difference of metal layer 130, therefore cementability between the two is poor.And by the way that hard conating 120 is arranged, on the one hand may be used
Transitional function is played to enhance the adhesive force of metal layer 130；On the other hand the surface of base material 110 can be formed and is protected.
Hard conating 120 includes binder resin.The binder resin includes such as solidification based on ultraviolet light, electron ray
Property resin combination.Hardening resin composition preferably comprises glycidyl acrylate based polymer and carries out addition with acrylic acid
Polymer obtained from reaction.Alternatively, hardening resin composition preferably comprises polyfunctional acrylic ester polymer (Ji Wusi
Alcohol, dipentaerythritol etc.).Hardening resin composition also includes polymerization initiator.Wherein, the thickness of hard conating 120 is generally 0
To between 5 microns,
Specifically in the present embodiment, the thickness of hard conating 120 is 0.5 micron to 2 microns.
If 120 thickness of hard conating is less than 0.5 micron, it can not be formed with the surface of base material 110 and effectively be adhered to, and can not
It plays a protective role to base material 110.And if the thickness of hard conating 120 is higher than 2 microns, can lead to the planted agent in hard conating 120
Power is excessive, and then is easy that conductive film 100 is caused to be cracked in blanking process.Moreover, the thickness of hard conating 120 is excessive also
The thickness of conductive film 100 can be caused excessive, do not meet the lightening demand of electronic product.
Metal layer 130 is for conduction.In film resistor strain pressure transducer 10, metal layer 130 is etched into pre-
If the metallic circuit (not shown) of shape.Metallic circuit constitutes the current-carrying part of strain resistor 11, and work(is realized for strain resistor 11
The core component of energy.
In the present embodiment, the width of metallic circuit is less than or equal to 50 microns.
Specifically, the pressure-dependent sensitivity of the resistance value of strain resistor 11 is then related with the width of metallic circuit.It is wide
Degree is bigger, then sensitivity is lower.If the width of metallic circuit is more than 50 microns, sensing of the strain resistor 11 to pressure can be caused
It is more blunt.Therefore, the width of metallic circuit 50 microns or less are set as to be conducive to promote film resistor strain-type pressure biography
The sensitivity of 10 Pressure identification of sensor and precision.
In addition, metal layer 120 is generally formed by copper alloy, there is good electric conductivity.Specifically in the present embodiment, metal
Layer 120 is corronil film.
Corronil is alloy material obtained from addition metallic nickel in fine copper.Wherein, corronil intensity, corrosion resistance,
Hardness is higher, therefore is conducive to prevent metal layer 120 from damaging, and promotes the reliability of conductive film 100.Moreover, corronil can drop
Low-resistivity temperature coefficient, therefore the resistance value variation with temperature unobvious of metal layer 130.That is, strain resistor 11
Resistivity variation with temperature is smaller.Therefore, when can be effectively reduced the sensing pressure of film resistor strain pressure transducer 10
Interference caused by temperature change.
In the metal layer 130 that corronil or other kinds of copper alloy are formed, the weight accounting of copper is generally
Between 5% to 95%.Further, in the present embodiment, in metal layer 130 copper weight accounting be 50% to 95% it
Between.
Specifically, when the weight ratio of copper is too low, the electric conductivity of metal layer 130 can be deteriorated, and when the weight of copper
Amount than it is excessively high when, then can not embody alloy material corrosion resistance, characteristic with high hardness.And the weight accounting of copper be 50% to
When between 95%, metal layer 130 can preferably take into account electric conductivity and corrosion resistance, the advantage of high rigidity.
In the present embodiment, the thickness of metal layer 130 is 50 nanometers to 300 nanometers.
Specifically, the thickness of metal layer 130 determines the thickness of the metallic circuit of strain resistor 11, and strain resistor 11
The pressure-dependent sensitivity of resistance value is also related with the thickness of metallic circuit.If the thickness of metallic circuit is excessive, can cause
Strain resistor 11 is more blunt to the sensing of pressure.Meanwhile if the thickness of metal layer 130 is too small, being etched into metallic circuit
After be easily broken off, so as to cause strain resistor 11 fail.And when the thickness of metal layer 130 is set as 50 nanometers to 300 nanometers,
Reliability and the sensitivity of film resistor strain pressure transducer 10 can then be taken into account.
In addition, conductive film 100 further includes the particle 140 formed by ion capturing agent.Include in two hard conatings 120
There are multiple particles 140.Wherein, ion capturing agent can be single substance, such as East Asia Synesis CompanyMay be used also
Think the mixture of common metal ion capturing agent and anion catching agent.
The effect of ion capturing agent is to capture ion, to inhibit the quantity of dissociated ion.Therefore, after adding particle 140,
The amount of ions dissociated in hard conating 120 and metal layer 130 can be efficiently reduced.Further, metal layer 140 corrodes
Redox reaction has occurred in the principles of chemistry, and by reducing the content of free ion, redox can be effectively inhibited
The generation of reaction.Therefore, metal layer can be effectively prevented to be corroded.Even if in the environment of high temperature and humidity, metal layer 140 it is resistance to
Corrosion is also effectively promoted, therefore the reliability of above-mentioned conductive film 100 is improved.
In the present embodiment, multiple particles 140 form multiple protruding portion (figure do not mark) and flat on the surface of hard conating 120
Portion's (figure is not marked), 130 surface of metal layer position corresponding with protruding portion is formed with protrusion 150.
Specifically, flat part is the region that hard conating 120 is not provided with particle 140, and particle 140 is in hard conating 120
The region at place can then form protruding portion.Since metal layer 130 is stacked in the surface of hard conating 120, therefore the surface of the two
Shape is identical.Therefore, multiple raised 150 can be formed in the region corresponding with protruding portion of metal layer 130.
On the one hand, the presence of protruding portion can increase the contact area between hard conating 120 and metal layer 130, so as to increase
Add the adhesive force of metal layer 130.Also, inhibiting effect of the particle 140 to dissociated ion can be promoted after contact area increase, thus it is golden
The corrosion resistance for belonging to layer 130 is further promoted.
On the other hand, the conductive film of strip is being manufactured using roll-to-roll process (roll to roll process)
When 100, since the surface of metal layer 130 forms multiple raised 150.Therefore, when crimping conductive membrane 100, multiple protrusions
150 can make to form point contact between two neighboring metal layer 130, to prevent its stick to each other, crimping.
In the present embodiment, between the weight accounting in hard conating 120 of particle 140 is 0.01% to 5%.
If the weight accounting of particle 140 is too low, particle 140 is limited to the inhibiting effect of dissociated ion, can not be significant
Promote the corrosion resistance of metal layer 130.And if the weight accounting of particle 140 be more than 5% when, 120 surface of hard conating can be caused to go out
Existing aperture or the release of a large amount of gas, influence the quality of conductive film 100.
In addition, when the particle 140 formed by ion capturing agent is limited by additive amount and lazy weight, can influence to lead at this time
The resist blocking and that function of conductive film 100, therefore can further include anti-block particulates (not shown) in hard conating 120, this is anti-
Adhesion particle forms protrusion on 120 surface of hard conating, and further forms protrusion on corresponding metal layer 130 so that is rolling up
When bent conductive membrane 100, protrusion can make to form point contact between two neighboring metal layer 130, to prevent its stick to each other,
Crimping.
In the present embodiment, between the particle size range of particle 140 is 0.1 micron to 2 microns.
Specifically, in one timing of weight accounting of particle 140, the smaller then relative surface area of grain size of particle 140 is bigger, therefore
It is more preferable to the inhibiting effect of dissociated ion.But prepare the 140 cost higher of particle that grain size is less than 0.1 micron.
Therefore, cost and better reliability in order to balance, thus the grain size of particle 140 be set as 0.1 micron to 2 microns it
Between.Further, the particle size range of particle 140 is preferably 0.1um~0.5um.
Above-mentioned film resistor strain pressure transducer 10 and conductive film 100, multiple formed by ion capturing agent
Grain 140 can adsorb free anion and cation.Therefore, by adding particle 140, hard conating 120 can be efficiently reduced
And the amount of ions dissociated in metal layer 130.Further, the principles of chemistry that metal layer 130 corrodes are aoxidized
Reduction reaction, and by reducing the content of free ion, the generation of redox reaction can be effectively inhibited.Therefore, can have
Effect metal layer 130 and the metallic circuit formed by metal layer 130 is prevented to be corroded in the environment of high temperature and humidity, so that
The reliability of film resistor strain pressure transducer 10 and conductive film 100 is effectively promoted.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of conductive film, which is characterized in that including：
Base material, including the first surface and second surface that are oppositely arranged；
Two hard conatings, are attached respectively to the first surface and second surface；And
Two metal layers are attached respectively to described two hard conatings backwards to the surface of the base material；
Wherein, include the multiple particles formed by ion capturing agent in described two hard conatings.
2. conductive film according to claim 1, which is characterized in that surface shape of the multiple particle in the hard conating
At multiple protruding portion and flat part, layer on surface of metal position corresponding with the protruding portion is formed with protrusion.
3. conductive film according to claim 1, which is characterized in that particle weight accounting in the hard conating is
Between 0.01% to 5%.
4. conductive film according to claim 1, which is characterized in that the particle size range of the particle is micro- with 2 for 0.1 micron
Between rice.
5. conductive film according to claim 1, which is characterized in that the thickness range of the hard conating is 0.5 micron to 2
Between micron.
6. conductive film according to claim 1, which is characterized in that the metal layer is corronil film.
7. conductive film according to claim 6, which is characterized in that the weight accounting of copper is in the metal layer
Between 50% to 95%.
8. conductive film according to claim 1, which is characterized in that the thickness of the metal layer is 50 nanometers to 300 and receives
Rice.
9. a kind of film resistor strain pressure transducer, which is characterized in that including：
Substrate；And
It is attached to the strain resistor of the substrate surface, the strain resistor is led by 1 to 8 any one of them of the claims
Conductive film etches to be formed；
Wherein, the metal layer is etched into the metallic circuit of preset shape.
10. film resistor strain pressure transducer according to claim 9, which is characterized in that the metallic circuit
Width is less than or equal to 50 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820240366.XU CN207908077U (en) | 2018-02-09 | 2018-02-09 | Conductive film and film resistor strain pressure transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820240366.XU CN207908077U (en) | 2018-02-09 | 2018-02-09 | Conductive film and film resistor strain pressure transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207908077U true CN207908077U (en) | 2018-09-25 |
Family
ID=63559883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820240366.XU Expired - Fee Related CN207908077U (en) | 2018-02-09 | 2018-02-09 | Conductive film and film resistor strain pressure transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207908077U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109381183A (en) * | 2018-10-09 | 2019-02-26 | 浙江大学昆山创新中心 | Have both pressure sensing degradable brain electrode array and preparation method thereof |
| CN114136503A (en) * | 2021-10-27 | 2022-03-04 | 贵州航天智慧农业有限公司 | Method for integrating pressure sensor and humidity sensor |
-
2018
- 2018-02-09 CN CN201820240366.XU patent/CN207908077U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109381183A (en) * | 2018-10-09 | 2019-02-26 | 浙江大学昆山创新中心 | Have both pressure sensing degradable brain electrode array and preparation method thereof |
| CN114136503A (en) * | 2021-10-27 | 2022-03-04 | 贵州航天智慧农业有限公司 | Method for integrating pressure sensor and humidity sensor |
| CN114136503B (en) * | 2021-10-27 | 2023-07-18 | 贵州航天智慧农业有限公司 | Method for integrating pressure sensor and humidity sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7931203B2 (en) | Non-contact type IC card | |
| CN207908077U (en) | Conductive film and film resistor strain pressure transducer | |
| JP2019208031A (en) | Reinforcement member for flexible printed wiring board and flexible printed wiring board with the same | |
| JP5918614B2 (en) | Conductive substrate, touch panel, and method of manufacturing conductive substrate | |
| KR20090073218A (en) | Connected structure and method for manufacture thereof | |
| KR102311989B1 (en) | electromagnetic shielding sheet | |
| JP2005277145A (en) | Adhesive sheet for shielding electromagnetic wave | |
| KR102048695B1 (en) | Anisotropic conductive film and bonded structure | |
| JP2014219963A (en) | Sheet for sensor sheet production, method for producing the same, sensor sheet for touchpad, and method for producing the same | |
| CN105474149A (en) | Touch sensor electrode integrated with polarizing plate | |
| CN107422904A (en) | Touch-screen and electronic equipment | |
| CN105103098B (en) | Contact panel, its preparation method and the silver-colored palladium neodymium alloy for contact panel | |
| KR102088165B1 (en) | Conductive bonding sheet for fpc and fpc | |
| CN110132464A (en) | Conductive film and film resistance strain type pressure sensor | |
| CN112210306B (en) | Ultrathin composite adhesive film with heat dissipation, conduction and shielding functions and preparation method thereof | |
| CN101060756B (en) | Wired circuit board | |
| CN107660279A (en) | Conducting structures and its manufacture method | |
| KR20060044416A (en) | Method for manufacturing probe needle, method for manufacturing probe card, and probe card | |
| WO2021065715A1 (en) | Touch sensor, electronic device, and method of manufacturing touch sensor | |
| TWI545478B (en) | Very fine metal wire manufacturing method and its structure | |
| CN201087845Y (en) | Wafer type electricity sensing component structure | |
| KR200380753Y1 (en) | Vertical Conductive Adhesive Tape | |
| CN214457737U (en) | Electromagnetic shielding type adhesive tape | |
| KR20210038571A (en) | Heater and heater attachment | |
| EP4383992A1 (en) | Thermoelectric conversion element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180925 |