CN207897238U - Electronic equipment - Google Patents

Electronic equipment Download PDF

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Publication number
CN207897238U
CN207897238U CN201820346215.2U CN201820346215U CN207897238U CN 207897238 U CN207897238 U CN 207897238U CN 201820346215 U CN201820346215 U CN 201820346215U CN 207897238 U CN207897238 U CN 207897238U
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China
Prior art keywords
shell
electronic equipment
buckle
buckle structure
equipment according
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Application number
CN201820346215.2U
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Chinese (zh)
Inventor
宋学敏
李竹新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Xiaomi Mobile Software Co Ltd
Original Assignee
Beijing Xiaomi Mobile Software Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Beijing Xiaomi Mobile Software Co Ltd filed Critical Beijing Xiaomi Mobile Software Co Ltd
Priority to CN201820346215.2U priority Critical patent/CN207897238U/en
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Publication of CN207897238U publication Critical patent/CN207897238U/en
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Abstract

The disclosure is directed to a kind of electronic equipment, the electronic equipment may include first shell, second shell and the buckle structure for being connected to the second shell, the buckle structure is clamped with the first shell, and adhesive linkage is equipped between at least part surface being oppositely arranged in the buckle structure and the first shell.On the one hand the disclosure can make the second shell keep coordinating with first shell always, ensure that gap between the two is consistently less than maximum allowable gap by acting on the dual pulling force in second shell;On the other hand it can reinforce the cooperation intensity between first shell and second shell, extend the service life of electronic equipment.

Description

Electronic equipment
Technical field
This disclosure relates to field of terminal technology more particularly to a kind of electronic equipment.
Background technology
Currently, the appearance member of electronic equipment generally includes backboard and front shell assemblies, can be with by the front shell assemblies and backboard Accommodation space is cooperatively formed, which can place battery plate, mainboard and other flexible circuit board etc., these battery plates, master It is connected with each other between plate and flexible circuit board to maintain the normal operation of electronic equipment.
Utility model content
The disclosure provides a kind of electronic equipment, to solve deficiency in the related technology.
In accordance with an embodiment of the present disclosure, a kind of electronic equipment is provided, including first shell, second shell and is connected to described The buckle structure of second shell, the buckle structure are clamped with the first shell, and the buckle structure and described Adhesive linkage is equipped between at least part surface being oppositely arranged on one shell.
Optionally, the first shell includes the first mating surface, and the second shell includes the second mating surface;
Wherein, the buckle structure and the first shell be clamped in place and it is mutually be bonded with the first shell when, institute The gap stated between the first mating surface and second mating surface is not more than maximum allowable gap.
Optionally, the buckle structure includes the clamping portion for buckling ontology and being connected with the buckle ontology;Wherein, described Adhesive linkage is adhered to the region that the clamping portion link position is different from the buckle ontology.
Optionally, the buckle ontology is along the setting of the edge of the second shell and the buckle ontology is in the electronics It is projected as closed figure on device thickness direction.
Optionally, the adhesive linkage is projected as closed figure on the electronic equipment thickness direction.
Optionally, the buckle structure is adhesively fixed with the second shell.
Optionally, the adhesive linkage includes the gum for being attached at the buckle structure.
Optionally, the adhesive linkage solidifies shape by the solidification glue being sprayed between the buckle structure and the first shell At.
Optionally, the first shell includes front shell assemblies, and the second shell includes backboard.
Optionally, the first shell includes backboard, and the second shell includes front shell assemblies.
The technical scheme provided by this disclosed embodiment can include the following benefits:
By above-described embodiment it is found that on the one hand the disclosure can be made by acting on the dual pulling force in second shell The second shell keeps coordinating with first shell always, ensures that gap between the two is consistently less than maximum allowable gap;It is another Aspect can reinforce the cooperation intensity between first shell and second shell, extend the service life of electronic equipment.
It should be understood that above general description and following detailed description is only exemplary and explanatory, not The disclosure can be limited.
Description of the drawings
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure Example, and together with specification for explaining the principles of this disclosure.
Fig. 1 is the structural schematic diagram according to a kind of electronic equipment shown in an exemplary embodiment.
Fig. 2 is the decomposition diagram according to a kind of electronic equipment shown in an exemplary embodiment.
Fig. 3 is the partial schematic diagram according to a kind of electronic equipment shown in an exemplary embodiment.
Fig. 4 is the decomposition diagram of a kind of buckle structure and adhesive linkage shown according to an exemplary embodiment.
Fig. 5 is the sectional view according to a kind of electronic equipment shown in an exemplary embodiment.
Fig. 6 is the sectional view of another electronic equipment shown according to an exemplary embodiment.
Specific implementation mode
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended The example of consistent device and method of some aspects be described in detail in claims, the application.
It is the purpose only merely for description specific embodiment in term used in this application, is not intended to be limiting the application. It is also intended to including majority in the application and "an" of singulative used in the attached claims, " described " and "the" Form, unless context clearly shows that other meanings.It is also understood that term "and/or" used herein refers to and wraps Containing one or more associated list items purposes, any or all may be combined.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the application A little information should not necessarily be limited by these terms.These terms are only used for same type of information being distinguished from each other out.For example, not departing from In the case of the application range, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as One information.Depending on context, word as used in this " if " can be construed to " ... when " or " when ... When " or " in response to determination ".
Fig. 1 is that structural schematic diagram, Fig. 2 of a kind of electronic equipment shown according to an exemplary embodiment are shown according to one Example property implements the decomposition diagram of a kind of electronic equipment exemplified.As shown in Figure 1 and Figure 2, which may include First shell 1, second shell 2 and the buckle structure 3 for being connected to the second shell 2, the buckle structure 3 can be with first shells 1 Between be equipped between at least part surface for being clamped, also, being oppositely arranged in the buckle structure 3 and first shell 1 it is viscous Layer 4 is connect, so as to provide the pulling force acted in second shell 2 respectively by the adhesive linkage 4 and buckle structure 3, passes through effect The second shell 2 on the one hand can be made to keep cooperation with first shell 1 always in the dual pulling force in second shell 2, ensured Gap between the two is consistently less than maximum allowable gap;On the other hand can reinforce between first shell 1 and second shell 2 Coordinate intensity, extends the service life of electronic equipment.
For example, as shown in figure 3, the first shell 1 may include the first mating surface 11, second shell 2 may include Second mating surface 21;So, after first shell 1 and second shell 2 are assembled by buckle structure 3 and adhesive linkage 4, first Shell 1 can provide pulling force F1 to second shell 2 by buckle structure 3, provide pulling force F2 to second shell 2 by adhesive linkage 4, To by the double action of pulling force F1 and pulling force F2, can as far as possible so that second shell 2 close to first shell 1 from And the second mating surface 21 can also be as far as possible close to the first mating surface 11, so that the first mating surface 11 and the second mating surface 21 Between gap be not more than maximum allowable gap, meet design standard.
In one embodiment, after second shell 2 is clamped by buckle structure 3 to first shell 1, in 1 He of first shell Solidification glue is sprayed between buckle structure 3, to form adhesive linkage 4 after solidification glue solidification;In another embodiment, the adhesive linkage 4 may include the gum or foamed glue being adhered on buckle structure 3, to be clamped in buckle structure 3 and first shell 1 During, it is bonding between synchronous realization buckle structure 3 and first shell 1, it avoids carrying out secondary operation, letter to electronic equipment Change operating process, it is cost-effective.
In above-mentioned each embodiment, as shown in figure 4, buckle structure 3 may include buckle ontology 31 and with the buckle sheet The connected clamping portion 32 of body 31, the clamping portion 32 are clamped with first shell 1, and adhesive linkage 4 can be adhered on buckle ontology 1 It is different from the region of 32 link position of clamping portion, also that is, adhesive linkage 4 occupied region and clamping portion 32 on buckle ontology 1 Occupied region is paved with the surface of entire buckle ontology on buckle ontology 1, increases drawing in a manner of by increasing bond area Power.
Wherein, which can be adhered to the marginal position of second shell 2, and in the thickness side of electronic equipment The upward buckle ontology 31 is projected as closed figure, also that is, buckle ontology 31, which can surround, forms one substantially and second shell The identical whole circle of body 2, clamping portion 32 can be uniformly adhered on the whole circle that buckle ontology 31 is formed, so that first shell It being capable of secure fit between 1 and second shell 2.Further, projected on the thickness direction of electronic equipment can also for adhesive linkage 4 For closed figure, and shape can be adapted with the shape of buckle ontology 31 substantially, to be further increased by the adhesive linkage 4 The aqueous energy of electronic equipment.
In above-mentioned each embodiment, electronic equipment 100 may include mobile phone, tablet computer, electronic reader etc., this public affairs It opens and is limited not to this.It is following by electronic equipment 100 be mobile phone for, to the specific knot of first shell 1 and second shell 2 Structure is described in detail.
In one embodiment, as shown in figure 5, it can be mobile phone that first shell 1, which can be the backboard of mobile phone, second shell 2, Front shell assemblies, the space of accommodating electronic component is assembled to form between the front shell assemblies and backboard.Wherein, the front shell assemblies 100 may include the screen module of mobile phone, and the globality of mobile phone can be improved using integrally formed backboard, and simplification is processed Journey.
In another embodiment, as shown in fig. 6, first shell 1 can be the front shell assemblies of mobile phone, second shell 2 can be with It is similar for the backboard of mobile phone, the space for being assembled to form accommodating electronic component of backboard and front shell assemblies can be passed through.Its In, the front shell assemblies can packet mobile phone center and components, the backboard such as screen assembly can be mobile phone battery cover, the battery cover Spiral-lock is conducive to removing and installing for mobile phone in front shell assemblies.
Those skilled in the art will readily occur to its of the disclosure after considering specification and putting into practice disclosure disclosed herein Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or Person's adaptive change follows the general principles of this disclosure and includes the undocumented common knowledge in the art of the disclosure Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.

Claims (10)

1. a kind of electronic equipment, which is characterized in that including first shell, second shell and the buckle for being connected to the second shell Structure, the buckle structure are clamped with the first shell, and are set relatively in the buckle structure and the first shell Adhesive linkage is equipped between at least part surface set.
2. electronic equipment according to claim 1, which is characterized in that the first shell includes the first mating surface, described Second shell includes the second mating surface;
Wherein, the buckle structure and the first shell be clamped in place and it is mutually be bonded with the first shell when, described the Gap between one mating surface and second mating surface is not more than maximum allowable gap.
3. electronic equipment according to claim 1, which is characterized in that the buckle structure include buckle ontology and with it is described Buckle the connected clamping portion of ontology;Wherein, the adhesive linkage, which is adhered on the buckle ontology, is different from the clamping portion connection The region of position.
4. electronic equipment according to claim 3, which is characterized in that the buckle ontology is along the edge of the second shell It is arranged and the buckle ontology is projected as closed figure on the electronic equipment thickness direction.
5. electronic equipment according to claim 3, which is characterized in that the adhesive linkage is in the electronic equipment thickness direction On be projected as closed figure.
6. electronic equipment according to claim 1, which is characterized in that the buckle structure is Nian Jie with the second shell solid It is fixed.
7. electronic equipment according to claim 1, which is characterized in that the adhesive linkage includes being attached at the buckle structure Gum.
8. electronic equipment according to claim 1, which is characterized in that the adhesive linkage by be sprayed at the buckle structure with Solidification glue between the first shell solidifies to be formed.
9. electronic equipment according to claim 1, which is characterized in that the first shell includes front shell assemblies, and described Two shells include backboard.
10. electronic equipment according to claim 1, which is characterized in that the first shell includes backboard, the second shell Body includes front shell assemblies.
CN201820346215.2U 2018-03-14 2018-03-14 Electronic equipment Active CN207897238U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820346215.2U CN207897238U (en) 2018-03-14 2018-03-14 Electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820346215.2U CN207897238U (en) 2018-03-14 2018-03-14 Electronic equipment

Publications (1)

Publication Number Publication Date
CN207897238U true CN207897238U (en) 2018-09-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820346215.2U Active CN207897238U (en) 2018-03-14 2018-03-14 Electronic equipment

Country Status (1)

Country Link
CN (1) CN207897238U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113556892A (en) * 2020-04-26 2021-10-26 北京小米移动软件有限公司 Housing and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113556892A (en) * 2020-04-26 2021-10-26 北京小米移动软件有限公司 Housing and electronic device

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