CN207896402U - A kind of spininess glassy metal envelope connector soldering mold - Google Patents

A kind of spininess glassy metal envelope connector soldering mold Download PDF

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Publication number
CN207896402U
CN207896402U CN201820282115.8U CN201820282115U CN207896402U CN 207896402 U CN207896402 U CN 207896402U CN 201820282115 U CN201820282115 U CN 201820282115U CN 207896402 U CN207896402 U CN 207896402U
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CN
China
Prior art keywords
soldering
pedestal
upper mold
boss
mold
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Active
Application number
CN201820282115.8U
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Chinese (zh)
Inventor
郑浩楠
吕宏飞
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Xian Seal Electronic Material Technology Co Ltd
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Xian Seal Electronic Material Technology Co Ltd
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Priority to CN201820282115.8U priority Critical patent/CN207896402U/en
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Abstract

The utility model discloses a kind of spininess glassy metals to seal connector soldering mold,Including firm banking and upper mold,Upper mold leads to structure in being,Upper mold lower end sets soldering circle for blocking,Firm banking is equipped with boss,Boss upper end is equipped with multiple location holes,When sealing-in,Wait for sealing-in base sleeve on boss,Stem on substrate is inserted into the location hole of boss,Upper mold is placed in sealing-in pedestal,It is placed in soldering in high temperature furnace simultaneously,The soldering of completing substrate and pedestal,Realize that pedestal to be packaged and substrate with stem realize positioning using the pedestal with location hole,Then it is set in pedestal to be packaged by upper mold,Soldering is arranged in upper mold,Substrate and pedestal sealing-in mouth closed area are realized using upper mold,Then soldering is made to melt at high temperature,Form complete weld seam,The utility model is simple and reliable for structure,It is easy to operate,It disclosure satisfy that soldering is high-quality,Appearance consistency is good,Production efficiency is high,Soldering yield rate is set to greatly improve.

Description

A kind of spininess glassy metal envelope connector soldering mold
Technical field
The utility model belongs to multi-pin connector field, is specifically related to a kind of spininess glassy metal envelope connector soldering Mold.
Background technology
Increase as the rapid growth in the markets such as consumer electronics, automotive electronics, communicating terminal, China have become global link device The long most fast and maximum market of capacity, current country's low and middle-end connector are mainly in a manner of to the lower plastic packaging of performance requirement It is main, it is increasingly wider due to connector use scope, the performance requirement of connector is also improved therewith, in inclement condition, high temperature Deng under conditions of, traditional plastic packaging connector cannot be satisfied requirement, and for glass sealing connector with its excellent performance, high is reliable Property by more and more extensive use in military fields such as space flight, aviations.It is mainly made of contact pin, substrate, pedestal three parts, Contact pin carries out sealing-in with substrate by glass, and substrate is welded with pedestal by low lead or lead-free welding material, traditional craft Soldering requires operator high, phenomena such as it is uneven weld seam easily occur, solder skip, poor appearance and workpiece easy to pollute, and efficiency it is low, Yield rate is poor, leads to prodigious loss.
Utility model content
The purpose of this utility model is to provide a kind of spininess glassy metals to seal connector soldering mold, existing to overcome The deficiency of technology.
In order to achieve the above objectives, the utility model adopts the following technical solution:
A kind of spininess glassy metal envelope connector soldering mold, including firm banking and upper mold, upper mold lead to structure in being, Upper mold lower end sets soldering circle for blocking, and firm banking is equipped with boss, and boss upper end is equipped with multiple location holes, when sealing-in, waits sealing Base sleeve is connect on boss, the stem on substrate is inserted into the location hole of boss, and upper mold is placed in sealing-in pedestal, while being placed in height The soldering of soldering in warm stove, completing substrate and pedestal.
Further, firm banking is connected through a screw thread with boss.
Further, boss is equipped with the positioning pin for stem positioning, and positioning pin is fixed in location hole, on positioning pin Equipped with core pole hole.
Further, location hole internal diameter is identical as positioning pin outer diameter size, and positioning pin internal diameter is identical as stem outer diameter.
Further, boss outer diameter is identical as sealing-in pedestal internal diameter is waited for.
Further, upper mold outer diameter and the sum of 2 times of tin solder diameters are identical as pedestal internal diameter.
Further, the middle through-hole diameter of upper mold is identical as the maximum excircle dimension of stem distribution on substrate.
Compared with prior art, the utility model has technique effect beneficial below:
A kind of spininess glassy metal of the utility model seals connector soldering mold, including firm banking and upper mold, upper mold Leading to structure in, upper mold lower end sets soldering circle for blocking, and firm banking is equipped with boss, and boss upper end is equipped with multiple location holes, When sealing-in, sealing-in base sleeve is waited on boss, and the stem on substrate is inserted into the location hole of boss, and upper mold is placed in sealing-in pedestal It is interior, while it being placed in soldering in high temperature furnace, the soldering of completing substrate and pedestal realizes base to be packaged using the pedestal with location hole Seat and substrate with stem realize positioning, are then set in pedestal to be packaged by upper mold, soldering is arranged in upper mold, profit Substrate and pedestal sealing-in mouth closed area are realized with upper mold, then so that soldering is melted at high temperature, are formed complete weld seam, this practicality New structure is simple and reliable, easy to operate, disclosure satisfy that soldering is high-quality, and appearance consistency is good, and production efficiency is high, make soldering at Product rate greatly improves.
Further, firm banking is connected through a screw thread with boss, is convenient for the replacement of the corresponding boss of different stem quantity.
Further, upper mold outer diameter and the sum of 2 times of tin solder diameters are identical as pedestal internal diameter, can make to carry solder The upper mold of circle just into figure pedestal, makes the weld metal zone between upper mold and pedestal stablize.
Description of the drawings
Fig. 1 is the utility model encapsulating structure schematic diagram.
Wherein, 1, firm banking;2, boss;3, location hole;4, positioning pin;5, core pole hole;6, upper mold;8, pedestal;9, base Plate;10, stem.
Specific implementation mode
The utility model is described in further detail below in conjunction with the accompanying drawings:
As shown in Figure 1, a kind of spininess glassy metal seals connector soldering mold, including firm banking 1 and upper mold 6, Gu Determine pedestal 1 and be equipped with boss 2,2 upper end of boss is equipped with multiple location holes 3, when sealing-in, waits for that sealing-in pedestal 8 is sleeved on boss 2, base Stem 10 on plate 9 is inserted into the location hole 3 of boss 2, and upper mold 6 leads to structure in being, upper mold 6 is placed in sealing-in pedestal 8, upper mold 6 Lower end sets soldering circle for blocking, while being placed in soldering in high temperature furnace, the soldering of completing substrate 9 and pedestal 8.
Firm banking 1 is connected through a screw thread with boss 2, convenient for the replacement of the boss 2 of different model through-hole, keeps pedestal not Become;
Boss 2 is equipped with the positioning pin 4 positioned for stem 10, and positioning pin 4 is fixed in location hole 3, is set on positioning pin 4 There is core pole hole 5;Convenient for substrate 9 and the location and installation for waiting for sealing-in pedestal 8;
2 outer diameter of boss is identical as 8 internal diameter of sealing-in pedestal is waited for, blind hole internal diameter is identical as positioning pin outer diameter size, in positioning pin Diameter is identical as stem outer diameter;
6 outer diameter of upper mold and the sum of 2 times of tin solder diameters are identical as pedestal internal diameter;
The middle through-hole diameter of upper mold 6 is identical as the maximum excircle dimension of stem distribution on substrate.
It is described further below in conjunction with the accompanying drawings to the structural principle of the utility model and using step:
Positioning pin 4 is put into the location hole 3 on boss 2, ensures that positioning pin 4 is put into position, for use boss 2 is fixed on bottom On seat 1, the good substrate 9 of sealing-in is placed on boss 2, ensures that stem 10 is put into the core pole hole 5 of positioning pin 4 and ensures determining for substrate Position, pedestal 8 is placed on the boss 2 for fixing substrate 9, ensures that base bottom contacts pedestal 1, by soldering snare at 6 bottom of upper mold Portion, and upper mold 6 is put on pedestal 8, ensure all stems 10 in the middle through-hole of upper mold 6,6 bottom of upper mold and 9 surface of substrate Then the workpiece installed is put into Muffle furnace and completes welding by contact.

Claims (7)

1. a kind of spininess glassy metal seals connector soldering mold, which is characterized in that including firm banking (1) and upper mold (6), Upper mold (6) leads to structure in being, upper mold (6) lower end sets soldering circle for blocking, and firm banking (1) is equipped with boss (2), boss (2) Upper end is equipped with multiple location holes (3), when sealing-in, waits for that sealing-in pedestal (8) is sleeved on boss (2), and the stem (10) on substrate (9) is inserted In the location hole (3) for entering boss (2), upper mold (6) is placed in sealing-in pedestal (8), while being placed in soldering in high temperature furnace, completing substrate (9) with the soldering of pedestal (8).
2. a kind of spininess glassy metal according to claim 1 seals connector soldering mold, which is characterized in that fixed bottom Seat (1) is connected through a screw thread with boss (2).
3. a kind of spininess glassy metal according to claim 1 seals connector soldering mold, which is characterized in that boss (2) it is equipped with the positioning pin (4) for stem (10) positioning, positioning pin (4) is fixed in location hole (3), and positioning pin is set on (4) There is core pole hole (5).
4. a kind of spininess glassy metal according to claim 3 seals connector soldering mold, which is characterized in that location hole (3) internal diameter is identical as positioning pin (4) outer diameter size, and positioning pin internal diameter is identical as stem outer diameter.
5. a kind of spininess glassy metal according to claim 1 seals connector soldering mold, which is characterized in that boss (2) outer diameter is identical as sealing-in pedestal (8) internal diameter is waited for.
6. a kind of spininess glassy metal according to claim 1 seals connector soldering mold, which is characterized in that upper mold (6) outer diameter and the sum of 2 times of tin solder diameters are identical as pedestal internal diameter.
7. a kind of spininess glassy metal according to claim 1 seals connector soldering mold, which is characterized in that upper mold (6) middle through-hole diameter is identical as the maximum excircle dimension of stem distribution on substrate (9).
CN201820282115.8U 2018-02-28 2018-02-28 A kind of spininess glassy metal envelope connector soldering mold Active CN207896402U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820282115.8U CN207896402U (en) 2018-02-28 2018-02-28 A kind of spininess glassy metal envelope connector soldering mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820282115.8U CN207896402U (en) 2018-02-28 2018-02-28 A kind of spininess glassy metal envelope connector soldering mold

Publications (1)

Publication Number Publication Date
CN207896402U true CN207896402U (en) 2018-09-21

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Application Number Title Priority Date Filing Date
CN201820282115.8U Active CN207896402U (en) 2018-02-28 2018-02-28 A kind of spininess glassy metal envelope connector soldering mold

Country Status (1)

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CN (1) CN207896402U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109510049A (en) * 2018-12-21 2019-03-22 西安赛尔电子材料科技有限公司 A kind of mold and its process for sealing with glass-to-metal seal coaxial radio-frequency connector
CN109586138A (en) * 2018-12-19 2019-04-05 西安赛尔电子材料科技有限公司 A kind of multi-pin connector glass sintering mold
CN109586138B (en) * 2018-12-19 2024-06-04 西安赛尔电子材料科技有限公司 Glass sintering die for multi-pin connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109586138A (en) * 2018-12-19 2019-04-05 西安赛尔电子材料科技有限公司 A kind of multi-pin connector glass sintering mold
CN109586138B (en) * 2018-12-19 2024-06-04 西安赛尔电子材料科技有限公司 Glass sintering die for multi-pin connector
CN109510049A (en) * 2018-12-21 2019-03-22 西安赛尔电子材料科技有限公司 A kind of mold and its process for sealing with glass-to-metal seal coaxial radio-frequency connector

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