CN207896087U - Intelligent power module and electrical equipment - Google Patents
Intelligent power module and electrical equipment Download PDFInfo
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- CN207896087U CN207896087U CN201820094598.9U CN201820094598U CN207896087U CN 207896087 U CN207896087 U CN 207896087U CN 201820094598 U CN201820094598 U CN 201820094598U CN 207896087 U CN207896087 U CN 207896087U
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- power device
- bridge arm
- driving chip
- base plate
- installation base
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- 238000009434 installation Methods 0.000 claims abstract description 49
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- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 230000003071 parasitic effect Effects 0.000 abstract description 13
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 abstract 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical group [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910002601 GaN Inorganic materials 0.000 description 5
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 241000272168 Laridae Species 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
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- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
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Abstract
The utility model discloses a kind of intelligent power module and electrical equipment, the intelligent power module include：Installation base plate；Multiple power devices, are set on installation base plate；And multiple driving chips, it is set on installation base plate, multiple driving chips connect one to one with multiple power devices, and the position of each driving chip and its power device being connected with each other is close to each other.So that between multiple power devices, each power device is all correspondingly arranged on a driving chip, and the controlled end of each power device is connect with the control terminal of corresponding driving chip.The utility model solve driving chip and power device it is apart from each other when, the drive signal generation signal interference that parasitic inductance that binding line and bonding wire introduce export driving chip, the problem of causing intelligent power can not work normally.
Description
Technical field
The utility model is related to electronic circuit technology field, more particularly to a kind of intelligent power module and electrical equipment.
Background technology
Intelligent power module is generally made of metal substrate, gate driving integrated chip and power device, gate driving collection
Pass through bonding line, the Metal Substrate grid between gate driving integrated chip and metal substrate at six drive outputs of chip
Bonding line between the grid of pole driver circuit and metal substrate and power device connects with the grid of corresponding power device
It connects, six power device work is driven by one piece of gate driving integrated chip.
But since the area of each power device is larger, and calorific value when power device work is also larger, therefore in group
When filling intelligent power module, often require that the spacing between above-mentioned each power device is big, and due to above-mentioned gate driving collection
Area at the area specific power device of chip is much smaller so that the Metal Substrate of gate driving integrated chip to each power device
Gate plate driver circuit is long, generates a large amount of parasitic inductance, these parasitic inductances will generate signal interference, and lead to intelligent work(
The reliability of rate module reduces.
Utility model content
The main purpose of the utility model is a kind of intelligent power module of proposition and electrical equipment, it is intended to solve driving chip
When apart from each other with power device, the parasitic inductance that binding line and bonding wire introduce generates letter to the drive signal that driving chip exports
Number interference, the problem of causing intelligent power can not work normally.
To achieve the above object, the utility model proposes a kind of intelligent power module, the intelligent power module includes：
Installation base plate；
Multiple power devices are set on the installation base plate；And
Multiple driving chips, are set on the installation base plate, multiple driving chips and multiple power
Device connects one to one, and the position of each driving chip and its power device being connected with each other is close to each other.
Preferably, multiple driving chips and multiple power devices the installation base plate upper edge first direction extremely
It organizes less in a row.
Preferably, multiple driving chips and multiple power devices first party described in the installation base plate upper edge
It is two rows of to composition, and respectively first row and second row, multiple power devices are arranged in the first row；Multiple drives
Dynamic chip is arranged in second row；Position is corresponding in said first direction with power device for the driving chip being connected with each other.
Preferably, multiple driving chips and multiple power devices first party described in the installation base plate upper edge
It is two rows of to composition, and respectively first row and second row, multiple power devices and multiple driving chips are arranged alternately
In the first row and second row, the driving chip of interconnection is corresponding in the upper position with power device.
Preferably, the installation base plate includes the first installing zone, the second installing zone, third installing zone and the 4th installing zone；
The power device includes upper bridge arm power device and lower bridge arm power device；The driving chip includes driving the upper bridge arm
The upper bridge arm driving chip of power device and the lower bridge arm driving chip for driving the lower bridge arm driving element；The upper bridge arm work(
The setting of rate device is arranged in first installing zone, the lower bridge arm driving chip in second installing zone, the upper bridge arm
Driving chip is set to the third installing zone, and the lower bridge arm power device is set to the 4th installing zone；
Alternatively, the upper bridge arm power device setting, in first installing zone, the upper bridge arm driving chip setting exists
Second installing zone, the lower bridge arm driving chip are set to the third installing zone, and the lower bridge arm power device is set to institute
State the 4th installing zone.
Preferably, the installation base plate includes low heat-conducting substrate and low thermal resistance substrate, and multiple power device settings exist
On the low thermal resistance substrate；Multiple driving chips are arranged on the low heat-conducting substrate.
Preferably, the low heat-conducting substrate is glass-fiber-plate；The low thermal resistance substrate is metal substrate.
Preferably, the power device is gallium nitride power device.
Preferably, the intelligent power module further includes multiple pins, and the installation base plate has opposite both sides, multiple
The pin is divided into the both sides of the installation base plate.
Also a kind of electrical equipment of the utility model, including intelligent power module as described above；The intelligent power module
Including：Installation base plate；Multiple power devices are set on the installation base plate；And multiple power devices, it is set to institute
It states on installation base plate, multiple driving chips connect one to one with multiple power devices, and the driving being connected with each other
The position of chip and power device is close to each other.
The present embodiment is by being arranged multiple power devices so that between multiple power devices, each power device is all right
It should be provided with a driving chip, and the controlled end of each power device is connect with the control terminal of corresponding driving chip, to
Realize that each driving chip drives the power device being respectively correspondingly connected with, and the position for the driving chip and power device being connected with each other
It is close to each other, to ensure power device generate heat do not interfere with driving chip it is normal while, shorten driving chip drive
Dynamic chip connects the space length of the binding line and wired circuit sandwich circuit of respective power device controlled end, and then reduces by binding
The parasitic inductance that line and bonding wire introduce.It is defeated to driving chip that the utility model solves the parasitic inductance that binding line and bonding wire introduce
The drive signal that goes out generates signal interference, the problem of causing intelligent power can not work normally.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of the utility model intelligent power module first embodiment；
Fig. 2 is the structural schematic diagram of the utility model intelligent power module second embodiment；
Fig. 3 is the structural schematic diagram of the utility model intelligent power module 3rd embodiment；
Fig. 4 is the structural schematic diagram of the utility model intelligent power module fourth embodiment；
Fig. 5 is the structural schematic diagram of the 5th embodiment of the utility model intelligent power module；
Fig. 6 is the structural schematic diagram of the utility model intelligent power module sixth embodiment.
Drawing reference numeral explanation：
| Label | Title | Label | Title |
| 10 | Installation base plate | 50 | Binding line |
| 20 | Power device | 11 | Low thermal resistance substrate |
| 30 | Driving chip | 12 | Low heat-conducting substrate |
| 40 | Pin |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, shall fall within the protection scope of the present invention.
If it is to be appreciated that related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding,
Afterwards ...), then directionality instruction be only used for explain it is opposite between each component under a certain particular pose (as shown in the picture)
Position relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes correspondingly.
If, should " first ", " the in addition, relate to the description of " first ", " second " etc. in the utility model embodiment
Two " etc. description is used for description purposes only, and is not understood to indicate or imply its relative importance or is implicitly indicated meaning
The quantity of the technical characteristic shown." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one
A this feature.In addition, the technical solution between each embodiment can be combined with each other, but must be with ordinary skill
Personnel can be implemented as basis, will be understood that this technical side when the combination of technical solution appearance is conflicting or cannot achieve
The combination of case is not present, also not within the protection domain of the requires of the utility model.
The utility model proposes a kind of intelligent power module.
Referring to figs. 1 to Fig. 5, in one embodiment of the utility model, which includes：
Installation base plate 10；
Multiple power devices 20 are set on the installation base plate 10；And
Multiple driving chips 30 are set on the installation base plate 10, multiple driving chips 30 and multiple work(
Rate device 20 connects one to one, and the position for the power device 20 that each driving chip 30 is connected with each other with it is mutually leaned on
Closely.
In the present embodiment, installation base plate 10 is the carrier of driving chip 30 and power device 20, and installation base plate 10 is led by height
Hot material is made, and lead frame or circuit board may be used to realize, circuit board includes insulating heat-conductive substrate and formation
Circuit-wiring layer on the insulating heat-conductive substrate.The shape of installation base plate 10 can be according to driving chip 30 and power device
20 size determines, can be rectangular, but be not limited to rectangular.
The quantity of power device 20 can be one, or it is multiple, may include four institutes when being set as multiple
Power device 20 is stated, can also include six power devices 20, six power devices 20 form inverter circuit, to apply
In the electrical equipments such as inverter, frequency converter, refrigeration equipment, metallurgical machinery equipment, electric traction equipment, especially frequency conversion man
In electrical appliance.
Each power device 20 is all correspondingly arranged on a driving chip 30, the controlled end of each power device 20 with it is respectively corresponding
Driving chip 30 control terminal connection, with realize when intelligent power module work, driving chip 30 receive outside it is defeated
After the control signal entered, corresponding pwm signal is exported with 20 conduction and cut-off of driving power device, to output driving electric energy, with
The loaded work pieces such as driving motor.Driving chip 30 is used for when driving power device 20 is connected, and charging is provided to power device 20
Electric current ensures that the switch of power device 20 can quickly be led so that the grid voltage between source electrodes of power device 20 rise very rapidly up to desirable value
It is logical.And ensure that the grid voltage between source electrodes of power device 20 maintain to stablize during power device 20 is connected, so that power device 20
Reliable conducting.Between each power device 20 and corresponding driving chip 30 can by and installation base plate 10 on circuit cloth
Line layer and the connection of binding line 50 and welding material realize electrical connection.
It should be noted that the area of power device 20 is usually larger, and power consumption is larger when the work of power device 20, thus
Its calorific value is also larger, therefore when being packaged to intelligent power module, it is necessary to assure between each power device 20
Away from larger.In addition, in intelligent power module, normally only integrates one piece of driving chip 30 and drive 20 work of multiple power devices simultaneously
Make, and driving chip 30 is much smaller compared to the area of power device 20, in this way, driving chip 30 connects each power device 20
The binding line 50 and wiring sandwich circuit of grid can be very long, and the parasitic inductance introduced with bonding wire and binding line 50 also can be compared with
It is more, the problem of these parasitic inductances can bring switching loss, ring.Importantly, parasitic inductance can also be to driving chip 30
The drive signal of output generates signal interference, and intelligent power is caused to can not work normally.
In order to reduce driving chip 30 with each power device 20 through the circuit-wiring layer and binding line 50 on installation base plate 10
When realizing electrical connection, the parasitic inductance of introducing, the present embodiment is by being arranged multiple driving chips 30 so that multiple power devices
Between 20, each power device 20 is all correspondingly arranged on a driving chip 30, and the controlled end of each power device 20 with it is respectively corresponding
Driving chip 30 control terminal connection, to realize that each driving chip 30 drives the power device 20 being respectively correspondingly connected with, and
The driving chip 30 of interconnection and the position of power device 20 are close to each other, to ensure the heat of the generation of power device 20 not
Can influence driving chip 30 it is normal while, shorten 30 driving chip 30 of driving chip connect 20 controlled end of respective power device
The space length of binding line 50 and wired circuit sandwich circuit, and then reduce the parasitic inductance introduced by binding line 50 and bonding wire.This
When utility model solves driving chip 30 and power device 20 apart from each other, the parasitic inductance pair of binding line 50 and bonding wire introducing
The problem of drive signal of the output of driving chip 30 generates signal interference, intelligent power is caused to can not work normally.
Referring to figs. 1 to Fig. 6, in a preferred embodiment, multiple power devices 20 and multiple driving chips 30 are in institute
State 10 upper edge first direction A of installation base plate at least organize it is in a row.
In the present embodiment, first direction A can be horizontal direction or vertical direction, multiple power devices 20 and multiple
Driving chip 30 can be organized in a row in 10 upper edge first direction A of the installation base plate, can also form two rows, or composition four
Row with the quantity of power device 20 is six (Q1~Q6), corresponding in the present embodiment to better illustrate the present embodiment
The quantity of driving chip 30 be six (U1~U2) for illustrate.
Referring in particular to Fig. 1, when power device 20 and driving element form one in 10 upper edge first direction A of the installation base plate
When row, six groups of power devices of concrete composition-driving chip Q1-U1, Q2-U2, Q3-U3, Q4-U4, Q5-U5, Q6-U6.Driving
Component, wherein be divided into three upper bridge arm driving elements and three lower bridge arm driving elements between power device Q1~Q6, to intelligence
When energy power module is packaged, each upper bridge arm power device 20 and lower bridge arm power device 20 are along first direction A compositions one
The sequence of row is adjustable, is not limited herein.
Referring in particular to Fig. 2, when multiple power devices 20 and multiple driving chips 30 are in 10 upper edge of the installation base plate
When the first direction A compositions two rows, respectively first row H1 and second row H2, multiple power devices 20 are arranged described
First row H1；Multiple driving chips 30 are arranged in second row H2；The multiple driving chips 30 and power being connected with each other
The position on the first direction A of device 20 corresponds to.
In the present embodiment, power device Q1~Q6 settings are arranged in first row H1, driving chip U1~U6 in second row H2,
Wherein, power device Q1, Q3, Q5 can be upper bridge arm power device 20, and power device Q2, Q4, Q6 are lower bridge arm power device
20, corresponding, driving chip U1, U3, U5 could be provided as bridge arm driving chip 30, and driving chip U2, U4, U6 are set as down
Bridge arm driving chip 30.Alternatively, power device Q1, Q2, Q3 could be provided as bridge arm power device 20, power device Q4, Q5,
Q6 is set as lower bridge arm power device 20, corresponding, and driving chip U1, U2, U3 could be provided as bridge arm driving chip 30, drives
Dynamic chip U4, U5, U6 are set as lower bridge arm driving chip 30.Certainly, in other embodiments, power device 20 is corresponded to respective
Driving chip 30 between sequence can also be other forms, be not limited herein.
Referring in particular to Fig. 3, when multiple power devices 20 and multiple driving chips 30 are in 10 upper edge of the installation base plate
When first direction A forms four rows, and respectively first row H1, second row H2, third arrange H3 and the 4th row H4, in an embodiment
In, upper bridge arm power device Q1, Q2, Q3 of power device 20 can be arranged in first row H1, corresponding, upper bridge arm driving chip
U1, U2, U3 setting arrange H3, corresponding, lower bridge arm in second row H2, lower bridge arm power device Q4, Q5, Q6 setting setting in third
Driving chip U4, U5, U6 setting in the 4th row H4 or bridge arm power device Q4, Q5, Q6 setting setting in the 4th row H4, it is right
It answers, lower bridge arm driving chip U4, U5, U6 setting arrange H3 in third.Certainly in other embodiments, the setting of power device 20 exists
When first row H1 and third row H3, the position of upper bridge arm power device 20 and lower bridge arm power device 20 is arbitrarily adjustable, correspondingly,
The driving chip 30 for being correspondingly arranged at second row H2 and the 4th row H4 also adjusts therewith.
It is understood that in above-described embodiment, the controlled end and driving chip of the power device 20 of each drive component
30 control terminals are connected by binding line 50, and position is close to each other, and space length is appropriate, in the heat for ensureing that power device 20 generates
While amount does not interfere with driving chip 30 and the normal work of power device 20, it is possible to reduce introduced by binding line 50 and bonding wire
Parasitic inductance.
Referring to figs. 1 to Fig. 6, in a preferred embodiment, multiple power devices 20 and multiple driving chips 30 are in institute
It is two rows of to state first direction A compositions described in 10 upper edge of installation base plate, and respectively first row H1 and second row H2, multiple power
Device 20 and multiple driving chips 30 are disposed alternately in the first row H1 and second row H2, multiple institutes of interconnection
Stating driving chip 30, the position on the first direction A is corresponding with power device 20.
Referring in particular to Fig. 4, in the present embodiment, power device Q1~Q6 and driving chip U1~U6 are disposed alternately at first
H1 and second row H2 is arranged, can be specifically power device Q1, driving chip U2, power device Q3, driving chip U4, power device
Driving chip U1, part Q5, driving chip U6 settings power device Q2, driving chip U3, power device Q4, are driven in first row H1
Dynamic chip U5, power device Q6 are arranged in second row H2.Wherein, power device Q1, Q3, Q5 and power device Q2, Q4, Q6 can
To be upper bridge arm power device 20 and lower bridge arm power device 20, corresponding, driving chip U1, U3, U5 and driving core respectively
Piece U2, U4, U6 are respectively upper bridge arm driving chip 30, lower bridge arm driving chip 30.Certainly, power device Q1, Q3, Q5 and power
Device Q2, Q4, Q6 and driving chip U1, U3, U5 and driving chip U2, U4, U6 type can also be arbitrarily arranged, herein not
It is limited.
Referring to figs. 1 to Fig. 6, in a preferred embodiment, the installation base plate 10 includes the first installing zone B1, the second installation
Area B2, third installing zone B3 and the 4th installing zone B4；The power device 20 includes upper bridge arm power device 20 and lower bridge arm work(
Rate device 20；The driving chip 30 includes upper bridge arm driving chip 30 and the driving institute for driving the upper bridge arm power device 20
State the lower bridge arm driving chip 30 of lower bridge arm driving element 20；The upper bridge arm power device 20 is arranged in first installing zone
B1, the lower bridge arm power drive chip 30 are arranged in the second installing zone B2, and the upper bridge arm driving chip 30 is set to
The third installing zone B3, the lower bridge arm power device 20 are set to the 4th installing zone B4；
Alternatively, the upper bridge arm power device 20 is arranged in the first installing zone B1, the upper bridge arm driving chip 30
Setting is set to the third installing zone B3, the lower bridge arm power in the second installing zone B2, the underarm driving chip 30
Device 20 is set to the 4th installing zone B4.
Referring in particular to Fig. 5, in the present embodiment, upper bridge arm power device Q1, Q2, Q3 are arranged in the first installing zone B1, lower bridge
Arm power drive device Q4, Q5, Q6 setting are in the 4th installing zone B4, and upper bridge arm driving chip U1, U2, U3 setting is in the second installation
Area B2 or third installing zone B3, when upper bridge arm driving chip U1, U2, U3 are arranged in the second installing zone B2, lower bridge arm at this time
Driving chip U4, U5, U6 are arranged in third installing zone B3.When upper bridge arm driving chip U1, U2, U3 are arranged in third installing zone B3
When, then lower bridge arm driving chip U4, U5, U6 is arranged in the second installing zone B2.It is understood that power device 20 and driving core
The area of piece 30 is different, and the area of the area specific power device 30 of driving chip 30 is much smaller, therefore, installation base plate
10 shape changes according to shape determined by the size of driving chip 30 and power device 20, can be rectangular but unlimited
In rectangular.
Referring to figs. 1 to Fig. 6, in a preferred embodiment, the installation base plate 10 includes low heat-conducting substrate 12 and low thermal resistance
Substrate 11, multiple power devices 20 are arranged on the low thermal resistance substrate 11；Multiple driving chips 30 are arranged in institute
It states on low heat-conducting substrate 12.
It should be noted that for GaN, SiC constant power device 20, itself have relative to Si power devices 20 more
High working junction temperature, but since its driving chip 30 is mostly the work that Si structures make its GaN, SiC intelligent power module by Si
Make temperature limiting so that the ideal working temperature of driving chip 30 will be less than the operating temperature of power device 20.Intelligent power mould
When block works, the fever of power device 20 is than more serious, in order to accelerate to radiate, mostly uses aluminum metal-matrix plate greatly to radiate,
But due to the high heat conduction of aluminum metal substrate base material act on, power component generate heat can by installation base plate 10 to driving core
Piece 30 conducts so that power component nearly reaches identical temperature with driving chip 30 so that driving chip 30 is operated in high temperature
Environment and control phenomena such as signal is disorderly, intelligent power module may be burnt when serious, or even burn entire electric-controlled plate and draw
Play fire.
Referring in particular to Fig. 6, to solve the above-mentioned problems, power device 20 is arranged in low thermal resistance substrate 11 the present embodiment
On, driving chip 30 is arranged on the low heat-conducting substrate 12, since 12 thermal conductivity of low heat-conducting substrate is relatively low, this just completely cuts off
Power device 20 is conducted heat to by substrate on driving chip 30.
Wherein, the low heat-conducting substrate 12 can be the preferable material institute of the heat insulation such as cardboard, half glass-fiber-plate, glass-fiber-plate
Manufactured substrate, the present embodiment are preferably glass-fiber-plate；Aluminium oxide may be used in 11 low thermal resistance substrate 11 of the low thermal resistance substrate
(Al2O3) or the metal substrate of aluminium nitride (AlN) material, the present embodiment preferably use aluminium nitride (AlN) metal substrate.
Referring to figs. 1 to Fig. 6, in a preferred embodiment, the power device 20 is gallium nitride power device 20.
In the case of same conducting resistance, gallium nitride (GaN) power device 20, (high electronics moves especially GaN HEMT
Shifting rate transistor) Terminal Capacitance it is relatively low, and without the reverse recovery loss caused by body diode, switch damage can be reduced
Consumption.And the switching speed of gallium nitride (GaN) power device 20 is faster than silicon MOSFET, therefore overall switch performance be better than silicon
Higher switching frequency may be implemented in MOSFET, thus while keeping reasonable switching loss, hoisting power density and transient state
Performance.
Referring to figs. 1 to Fig. 6, in a preferred embodiment, the intelligent power module further includes multiple pins 40, the peace
Filling substrate 10, there are opposite both sides, multiple pins 40 to be divided into the both sides of the installation base plate 10.
In the present embodiment, the pin 40 may be used that gull is wing or direct plugging-in, pin 40 are welded on low heat conductive insulating
On substrate, the corresponding pad locations of circuit-wiring layer, and realized with power device 20, driving chip 30 by metal wire and electrically connected
It connects.The present embodiment sets up pin 40 in the both sides of installation base plate 10 separately, relative to the mode that pin 40 is drawn from unilateral side, is conducive to
The wiring of peripheral circuit plate and layout.
The utility model also proposes that a kind of electrical equipment, the electrical equipment include intelligent power module as described above.
The detailed construction of the intelligent power module can refer to above-described embodiment, and details are not described herein again；It is understood that due in this reality
With above-mentioned intelligent power module has been used in novel electric appliance equipment, therefore, the embodiment of the utility model electrical equipment includes upper
Whole technical solutions of intelligent power module whole embodiments are stated, and the technique effect reached is also identical, herein no longer
It repeats.
In the present embodiment, which can be inverter, frequency converter, refrigeration equipment, metallurgical machinery equipment, electric power
One kind in pulling equipment.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention,
Under every utility model in the utility model is conceived, equivalent structure made based on the specification and figures of the utility model
Transformation, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of intelligent power module, which is characterized in that the intelligent power module includes：
Installation base plate；
Multiple power devices are set on the installation base plate；And
Multiple driving chips are set on the installation base plate, and multiple driving chips and multiple power devices are one by one
It is correspondingly connected with, the position of each driving chip and its power device being connected with each other is close to each other.
2. intelligent power module as described in claim 1, which is characterized in that multiple driving chips and multiple power
Device is at least organized in a row in the installation base plate upper edge first direction.
3. intelligent power module as claimed in claim 2, which is characterized in that multiple driving chips and multiple power
Device first direction composition described in the installation base plate upper edge is two rows of, and respectively first row and second row, multiple work(
Rate device is arranged in the first row；Multiple driving chips are arranged in second row；Be connected with each other the driving chip with
Position corresponds to power device in said first direction.
4. intelligent power module as claimed in claim 2, which is characterized in that multiple driving chips and multiple power
Device first direction composition described in the installation base plate upper edge is two rows of, and respectively first row and second row, multiple work(
Rate device and multiple driving chips are disposed alternately in the first row and second row, the driving chip of interconnection
Position is corresponding in said first direction with the power device.
5. intelligent power module as described in claim 1, which is characterized in that the installation base plate includes the first installing zone, the
Two installing zones, third installing zone and the 4th installing zone；The power device includes upper bridge arm power device and lower bridge arm power device
Part；The driving chip includes the upper bridge arm driving chip and the driving lower bridge arm power for driving the upper bridge arm power device
The lower bridge arm driving chip of device；In first installing zone, the lower bridge arm drives core for the upper bridge arm power device setting
Piece setting is set to the third installing zone, the lower bridge arm power device in second installing zone, the upper bridge arm driving chip
Part is set to the 4th installing zone；
Alternatively, the upper bridge arm power device setting is in first installing zone, the upper bridge arm driving chip is arranged described
Second installing zone, the lower bridge arm driving chip are set to the third installing zone, and the lower bridge arm power device is set to described the
Four installing zones.
6. intelligent power module as described in claim 1, which is characterized in that the installation base plate includes low heat-conducting substrate and low
Thermal resistance substrate, multiple power devices are arranged on the low thermal resistance substrate；Multiple driving chips are arranged described low
On heat-conducting substrate.
7. intelligent power module as claimed in claim 6, which is characterized in that the low heat-conducting substrate is glass-fiber-plate；It is described low
Thermal resistance substrate is metal substrate.
8. the intelligent power module as described in claim 1 to 7 any one, which is characterized in that the power device is nitridation
Gallium power device.
9. the intelligent power module as described in claim 1 to 7 any one, which is characterized in that the intelligent power module is also
Including multiple pins, there are the installation base plate opposite both sides, multiple pins to be divided into the both sides of the installation base plate.
10. a kind of electrical equipment, which is characterized in that include the intelligent power module as described in claim 1 to 9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820094598.9U CN207896087U (en) | 2018-01-18 | 2018-01-18 | Intelligent power module and electrical equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820094598.9U CN207896087U (en) | 2018-01-18 | 2018-01-18 | Intelligent power module and electrical equipment |
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| CN207896087U true CN207896087U (en) | 2018-09-21 |
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| CN201820094598.9U Expired - Fee Related CN207896087U (en) | 2018-01-18 | 2018-01-18 | Intelligent power module and electrical equipment |
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| Country | Link |
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| CN (1) | CN207896087U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109980955A (en) * | 2019-04-26 | 2019-07-05 | 广东美的制冷设备有限公司 | Intelligent power module and air conditioner |
| WO2023272528A1 (en) * | 2021-06-29 | 2023-01-05 | 西门子股份公司 | Power switch module and converter comprising power switch module |
-
2018
- 2018-01-18 CN CN201820094598.9U patent/CN207896087U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109980955A (en) * | 2019-04-26 | 2019-07-05 | 广东美的制冷设备有限公司 | Intelligent power module and air conditioner |
| WO2023272528A1 (en) * | 2021-06-29 | 2023-01-05 | 西门子股份公司 | Power switch module and converter comprising power switch module |
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Granted publication date: 20180921 |