CN207884760U - A kind of image collecting device and image capturing system - Google Patents

Abstract

A kind of image collecting device and image capturing system provided by the utility model, wherein described device include：Device body and setting are in intrinsic first mainboard of described device, the second mainboard, the first power panel, second source plate and the first pinboard；First mainboard is electrically connected with the first power panel and the first pinboard respectively；Second mainboard is electrically connected with second source plate and the first pinboard respectively.Image collecting device provided by the utility model can the image of independent acquisition dual camera or dual image sensor chip simultaneously, and can image quality detection be carried out to the first mainboard and the image of the collected dual camera of the second mainboard or dual image sensor chip simultaneously；When ensure that stability when Image Acquisition, and ensure that dual camera or dual image sensor chip while independent progress Image Acquisition, it can be also carried out at the same time image quality detection, that is, improve the quality, performance and efficiency of Image Acquisition.

Description

A kind of image collecting device and image capturing system

Technical field

The utility model is related to technical field of image processing, are adopted more particularly, to a kind of image collecting device and image Collecting system.

Background technology

In recent years, smart mobile phone rapid rising needs the development for carrying out differentiation to be in homogeneous more serious today The necessary way of mobile phone brand, and camera is even more the most important thing, the especially appearance of dual camera, is quickly become each high-end product The watching focus of board can be done this is because dual camera can bring more possibility apart from relevant application, background blurring, background Replacement, background special efficacy, measurement distance, can also do optical zoom, can also do half-light effect enhancing, can also 3D shooting and 3D modeling etc..Therefore, dual camera has driven the differentiation of relevant configuration resource.

After camera is changed to two by one, not simple numbers pile up arrives technical threshold promotion Certain height.Existing Dual-camera handset includes：Ontology is provided with wireless transport module in ontology, is used for mobile phone and camera shooting Data transmission between head；Ontology is externally provided with protection shell, and protection shell is equipped with dual camera, and the camera includes first Camera module and second camera module, first camera module include camera lens, imaging sensor and substrate.

But how to ensure that two cameras keep stablizing and keeping preferable quality effect in Image Acquisition is urgently It solves the problems, such as, and the production of dual camera to need synchronous progress image data acquiring in automation equipment, how to keep away Exempt from data and interfere with each other that the influence to image quality is caused also to be very important.

Utility model content

For the above technical issues, a kind of image collecting device of the utility model offer and image capturing system.

In a first aspect, the utility model provides a kind of image collecting device, including：Device body and setting are in described device Intrinsic first mainboard, the second mainboard, the first power panel, second source plate and the first pinboard；First mainboard and institute The electrical connection of the first power panel is stated, so that first mainboard acquires the first camera or the first figure being connected with first mainboard As the image of sensor chip；First mainboard is electrically connected with first pinboard, so that first mainboard will acquire Image transmitting to be connected with first pinboard external equipment progress image quality detection；Second mainboard with it is described Second source plate is electrically connected, so that second mainboard acquires the second camera or the second image being connected with second mainboard The image of sensor chip；Second mainboard is electrically connected with first pinboard, so that second mainboard is by acquisition Image transmitting to the external equipment carries out image quality detection.

Wherein, the image collecting device further includes：Second pinboard and third pinboard, second pinboard It is electrically connected with first mainboard, and second pinboard is electrically connected with the first camera or the first image sensor chip； The third pinboard is electrically connected with second mainboard, and the third pinboard and second camera or the second image sensing Device chip is electrically connected.

Wherein, the image collecting device further includes：First opens short board and second opens short board, and described first opens Short board is electrically connected with first mainboard, for detect the open circuit of the first camera or the first image sensor chip circuit with Short-circuit condition；Described second opens short board is electrically connected with second mainboard, for detecting second camera or the second image sense Survey the open circuit and short-circuit condition of device chip circuit.

Wherein, first mainboard by arrange needle arrange mother stock not with first power panel, first pinboard, described Second pinboard and described first open short board electrical connection；Second mainboard by arrange needle arrange mother stock not with the second source Plate, first pinboard, the third pinboard and described second open short board electrical connection.

Wherein, first mainboard include the first Sensor interface circuits unit being sequentially connected, the first FPGA module and First FX3 modules；The first Sensor interface circuits unit and second pinboard, first power panel and described the One, which opens short board, is connected；The first FX3 modules open short board and first switching with first power panel, described first Plate is connected.

Wherein, second mainboard include the 2nd Sensor interface circuits unit being sequentially connected, the second FPGA module and 2nd FX3 modules；The 2nd Sensor interface circuits unit and the third pinboard, the second source plate and described the Two, which open short board, is connected；The 2nd FX3 modules open short board and first switching with the second source plate, described second Plate is connected.

Wherein, the first Sensor interface circuit units are MIPI circuits or DVP circuits；Alternatively, described first Sensor interface circuit units are MIPI circuits and DVP circuits；The 2nd Sensor interface circuit units be MIPI circuits or DVP circuits；Alternatively, the 2nd Sensor interface circuit units are MIPI circuits and DVP circuits.

Wherein, the image collecting device further includes：The first radiator on first mainboard is set, it is described First radiator is used to radiate for first FPGA module；And the second radiator on second mainboard, institute are set State the second radiator for for second FPGA module heat dissipation.

Wherein, first pinboard includes 3.0 interfaces of the first USB, 3.0 interfaces of the 2nd USB, power interface and power supply Switch；First USB, 3.0 interfaces are connected with the first FX3 modules, so that the first FX3 modules pass through described first 3.0 interfaces of USB are connected with the external equipment；2nd USB, 3.0 interfaces are connected with the 2nd FX3 modules, so that institute The 2nd FX3 modules are stated by 3.0 interfaces of the 2nd USB to be connected with the external equipment；The power switch and described first Power panel and the second source plate are connected, and the power interface is connected with the power switch and external power supply.

Wherein, described device ontology includes upper cover and lower cover, and the upper cover is fixed by screw with the lower cover；On described The top plate of lid is set there are two first through hole and two the second through-holes, the position of the first through hole respectively with second pinboard It is corresponding with the position of third pinboard, the position of second through-hole position pair with the first radiator and the second radiator respectively It answers；The side plate of the upper cover is set there are two third through-hole and two fourth holes, the position of the third through-hole respectively with it is described The position of first USB, 3.0 interfaces and 3.0 interfaces of the 2nd USB corresponds to, the position of the fourth hole respectively with the electricity The position of source interface and the power switch corresponds to；At least one fifth hole is covered under described, so that image collecting device It is mechanically connected with external component, and so that described image harvester is passed through the fifth hole and be aerated heat dissipation.

Wherein, the material of described device ontology is aluminium alloy, kirsite, magnesium alloy or engineering plastics；Described device ontology Made by machining, it is made by being molded into or is made by 3D printing, and the surface of described device ontology carried out black Change is handled.

Wherein, the machine of described device ontology crosses bottom and is equipped with multiple feets, and the feet uses rubber material；And the pad Foot is fastened by screw or glue with the lower cover.

Second aspect, the utility model provide a kind of image capturing system, including：External equipment, electrical connection device and Above-mentioned image collecting device；Dual camera or dual image sensor chip are fixed on the electrical connection device, the electricity Property attachment device is electrically connected with described image harvester, and described image harvester is electrically connected with the external equipment；Wherein, The external equipment includes image measurement module.

Wherein, the electrical connection device arranges parent phase company with described image harvester by arranging needle, and row's needle is arranged Row's needle in mother is mounted on the electrical connection device, and mother row during row's needle row is female is mounted on described image harvester On.

Wherein, described image harvester is connected with the external equipment by 3.0 data lines of USB, the USB 3.0 The USB plug of data line one end is connected with the USB socket on the external equipment, the USB of the 3.0 data line other ends of the USB Plug is connected with the USB socket on described image harvester.

Wherein, the dual camera is the camera with model or different model；Alternatively, the dual image sensor chip For the image sensor chip of same model or different model.

A kind of image collecting device and image capturing system provided by the utility model, by the way that the first mainboard and first is electric Source plate be electrically connected, the second mainboard is electrically connected with second source plate, and the first mainboard and the second mainboard with the first pinboard Electrical connection so that the image collecting device can simultaneously it is independent acquisition dual camera or dual image sensor chip image, And can image be carried out to the first mainboard and the image of the collected dual camera of the second mainboard or dual image sensor chip simultaneously Quality Detection is avoided because interfering with each other the influence generated to image quality between data, steady when ensure that Image Acquisition It is qualitative, and ensure that dual camera or dual image sensor chip simultaneously independent progress Image Acquisition when, can also be carried out at the same time Image quality detects, that is, improves the quality, performance and efficiency of Image Acquisition.

Description of the drawings

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts, Other drawings may also be obtained based on these drawings.

Fig. 1 is the structural schematic diagram for the image collecting device that the utility model embodiment provides；

Fig. 2 is the structure diagram for the image collecting device that another embodiment of the utility model provides；

Fig. 3 is the structural schematic diagram for the image collecting device that another embodiment of the utility model provides；

Fig. 4 is the structure diagram for the image capturing system that the utility model embodiment provides；

Wherein, 1- image collecting devices；2- external equipments；3- dual cameras or dual image sensor chip 3；4- electrically connects Connection device 4；The first mainboards of 10A-；The second mainboards of 10B-；The first power panels of 20A-；20B- second source plates；30A- first opens short Road plate；30B- second opens short board；The first pinboards of 40-；The second pinboards of 50A-；50B- third pinboards；60A- first dissipates Hot device；The second radiators of 60B-；70- device bodies；The second through-holes of 71A/71B-；72A/72B- first through hole；51A/51B/ It is female that 11A- arranges needle row；The first USB 3..0 interfaces of 41A-；3.0 interfaces of the 2nd USB of 41B-；42- power switches；43- power supplys connect Mouthful；The first FX3 modules of 100A-；The 2nd FX3 modules of 100B-；200A-the first FPGA modules；The second FPGA modules of 200B-； The first Sensor circuit interface units of 300A-；The 2nd Sensor circuit interface units of 300B-.

Specific implementation mode

It is new below in conjunction with this practicality to keep the purpose, technical scheme and advantage of the utility model embodiment clearer Attached drawing in type embodiment, is explicitly described the technical scheme in the embodiment of the utility model, it is clear that described reality It is the utility model a part of the embodiment to apply example, instead of all the embodiments.Based on the embodiments of the present invention, ability It is new to belong to this practicality for the every other embodiment that domain those of ordinary skill is obtained without making creative work The range of type protection.

Fig. 1 is the structural schematic diagram for the image collecting device that the utility model embodiment provides, as shown in Figure 1, the image Harvester includes：Device body 70 and the first mainboard 10A being arranged in described device ontology 70, the second mainboard 10B, first Power panel 20A, second source plate 20B and the first pinboard 40；The first mainboard 10A is electrically connected with the first power panel 20A It connects, so that the first mainboard 10A acquisitions and the first mainboard 10A the first cameras being connected or the first image sensor core The image of piece；The first mainboard 10A is electrically connected with first pinboard 40, so that the first mainboard 10A is by acquisition Image transmitting to the external equipment 2 being connected with first pinboard 40 carries out image quality detection；The second mainboard 10B with The second source plate 20B electrical connections, so that the second mainboard 10B acquires second to be connected with the second mainboard 10B and takes the photograph As head or the image of the second image sensor chip；The second mainboard 10B is electrically connected with first pinboard 40, so that institute It states the second mainboard 10B and the image transmitting of acquisition to the external equipment 2 is subjected to image quality detection.

Specifically, the first mainboard 10A is electrically connected with the first power panel 20A, is then powered for the first mainboard 10A, into And the first mainboard 10A is made to can be used for Image Acquisition and data processing etc..And by the first camera or the first image sensing Device chip 3 is connected with the first mainboard 10A, then the first mainboard 10A is allow to acquire the first camera or the first image sensor The image of chip.First mainboard 10A is connected with the first pinboard 40, and the first pinboard 40 connects external equipment 2, then first Mainboard 10A can carry out data communication with external equipment 2, for example, external equipment 2 is computer installation.Then external equipment 2 can be right First camera of the first mainboard 10A acquisitions or the image of the first image sensor chip carry out image quality detection, that is, detect Whether image reaches testing standard.

Second mainboard 10B is electrically connected with second source plate 20B, then is powered for the second mainboard 10B, so that the Two mainboard 10B can be used for Image Acquisition and data processing etc..And by second camera or the second image sensor chip 3 with Second mainboard 10B is connected, then the second mainboard 10B is allow to acquire the figure of second camera or the second image sensor chip 3 Picture.Second mainboard 10B is connected with the first pinboard 40, and the first pinboard 40 connects external equipment 2, then the second mainboard 10B Data communication can be carried out with external equipment 2, for example, external equipment 2 is computer installation.Then external equipment 2 can be led to second The second camera of plate 10B acquisitions or the image of the second image sensor chip carry out image quality detection, i.e. detection image is It is no to reach testing standard.

In the utility model embodiment, by the way that the first mainboard is electrically connected with the first power panel, by the second mainboard with Second source plate is electrically connected, and the first mainboard and the second mainboard are electrically connected with the first pinboard so that the image collector Set can simultaneously it is independent acquisition dual camera or dual image sensor chip image, and can simultaneously to the first mainboard and second The image of the collected dual camera of mainboard or dual image sensor chip carries out image quality detection, avoids because between data The stability for interfering with each other the influence generated to image quality, ensure that when Image Acquisition, and ensure that dual camera or double When image sensor chip while independent progress Image Acquisition, it can be also carried out at the same time image quality detection, that is, improve image Quality, performance and the efficiency of acquisition.

On the basis of the above embodiments, the image collecting device further includes：Second pinboard 50A and third turn Fishplate bar 50B, the second pinboard 50A are electrically connected with the first mainboard 10A, and the second pinboard 50A takes the photograph with first As head or the first image sensor chip are electrically connected；The third pinboard 50B is electrically connected with the second mainboard 10B, and institute Third pinboard 50B is stated to be electrically connected with second camera or the second image sensor chip.

Specifically, by connecting the second pinboard 50A on the first mainboard 10A, the interface position of the first mainboard 10A can be extended It sets, so that the first mainboard 10A can be more conveniently electrically connected with the first camera or the first image sensor chip.And by Third pinboard 50B is connected on second mainboard 10B, can extend the interface position of the second mainboard 10B, so that the second mainboard 10B can More conveniently it is electrically connected with second camera or the second image sensor chip.

On the basis of the various embodiments described above, the image collecting device further includes：First opens short board 30A and Two open short board 30B, and described first opens short board 30A is electrically connected with the first mainboard 10A, for detect the first camera or The open circuit and short-circuit condition of first image sensor chip circuit；Described second opens short board 30B and the second mainboard 10B electricity Connection, open circuit and short-circuit condition for detecting second camera or the second image sensor chip circuit.

Wherein, open-short circuit (also known as OPEN/SHORT tests, O/S tests), is mainly used for testing electronic device Connection, as its name suggests, open-short circuit are exactly test open circuit and short circuit, are exactly specifically to test an electronic device to answer Whether the place of the connection connects, if it is exactly to open a way not connect, if it is exactly short that the place that should not be connected, which is connected to, Road.

Specifically, the first mainboard 10A is opened short board 30A with first to be electrically connected, then this first is opened short board 30A and can also lead to It crosses the second pinboard 50A to be electrically connected with the first camera or the first image sensor chip, so that this first opens short board 30A can be used for detecting the open circuit and short-circuit condition of the first camera or the first image sensor chip circuit, so that first takes the photograph As the circuit of head or the first image sensor chip connect it is intact, improve the reliability of whole image harvester.And it will Second mainboard 10B opens short board 30B with second and is electrically connected, then this second open short board 30B can also be by third pinboard 50B It is electrically connected with second camera or the second image sensor chip, so that this second is opened short board 30B and can be used for detecting The open circuit and short-circuit condition of second camera or the second image sensor chip circuit, so that second camera or the second image sense The circuit connection for surveying device chip is intact, improves the reliability of whole image harvester.

On the basis of the various embodiments described above, the first mainboard 10A by arrange needle arrange mother stock not with first power supply Plate 20A, first pinboard 40, the second pinboard 50A and described first open short board 30A electrical connections；Described second Mainboard 10B by arrange needle arrange mother stock not with the second source plate 20B, first pinboard 40, the third pinboard 50B And described second open short board 30B electrical connection.

Wherein, row's needle is one kind of connector, English name：pin header.This connector be widely used in electronics, In pcb circuit boards in electric appliance, instrument, effect is blocked in circuit between place or isolated obstructed circuit, and bridge is played The function of beam shoulders the task of electric current or signal transmission.It is usually matched with row mother, constitutes plate and plate is connected；Or with electricity Sub- Wiring harness terminal matches, and constitutes plate and is connected to line；Also plate can be independently used for connect with plate.Row mother is one kind of connector, English name：female header；It is a kind of general connector part being widely used in electronics, electric appliance, instrument, it is main to rise To the effect of electric current or signal transmission.It is usually matched with row's needle, constitutes plate and plate is connected.

Specifically, by the first mainboard 10A, by arranging, needle mother row connect with the first power panel 20A, the first mainboard 10A passes through row Needle mother row connect with the first pinboard 40, the first mainboard 10A is connect by arranging needle row mother 11A with the second pinboard 50A, Yi Ji One mainboard 10A opens short board 30A with first by row needle mother row and connect, then, can be more convenient when needing to change circuit structure The the first power panel 20A, the first pinboard 40, the second pinboard 50A and first that arrange on needle mother row are opened short board 30A and carried out It replaces, improves the flexibility of 1 circuit of image collecting device.And in the first power panel 20A, 40, second turns of the first pinboard When fishplate bar 50A, first open short board 30A damage, will can more conveniently arrange the first power panel 20A on needle mother row, first turn Fishplate bar 40, the second pinboard 50A and first open short board 30A and are replaced, and improve the reliable of 1 circuit of image collecting device Property.

Second mainboard 10B is connect by row needle mother row with second source plate 20B, the second mainboard 10B is by arranging needle mother row It is connect with the first pinboard 40, the second mainboard 10B is connect with third pinboard 50B by row needle mother row and the second mainboard 10B Short board 30B is opened with second to connect, then when needing to change circuit structure, can more conveniently arrange row's needle by row needle mother row Second source plate 20B, the first pinboard 40, third pinboard 50B and second on mother open short board 30B and replace, and improve The flexibility of 1 circuit of image collecting device.And second source plate 20B, the first pinboard 40, third pinboard 50B, Second when opening short board 30B damage, will can more conveniently arrange second source plate 20B on needle mother row, the first pinboard 40, the Three pinboard 50B and second open short board 30B and are replaced, and improve the reliability of 1 circuit of image collecting device.

On the basis of the various embodiments described above, in conjunction with Fig. 2, the first mainboard 10A includes first be sequentially connected Sensor interface circuit units 300A, the first FPGA module 200A and the first FX3 modules 100A；The first Sensor interfaces electricity Road unit 300A opens short board 30A with the second pinboard 50A, the first power panel 20A and described first and is connected；It is described First FX3 modules 100A opens short board 30A with the first power panel 20A, described first and first pinboard 40 is connected.

Specifically, the first mainboard 10A includes the first Sensor interface circuit units 300A, the first FPGA moulds being sequentially connected Block 200A and the first FX3 module 100A, and the first Sensor interface circuit unit 300A are electrically connected with the second pinboard 50A, then First Sensor interface circuit units 300A can pass through the second pinboard 50A and the first camera or the first image sensor chip Electrical connection.First FPGA module 200A is a kind of field programmable gate array, for acquiring the first camera or the first image sense Survey the image of device chip, and processing correlation computations.First FX3 modules 100A is a kind of peripheral hardware control of high speed data transfer Device, and the first FX3 modules 100A is electrically connected with the first pinboard 40, then the first FX3 modules 100A is for adopting the first mainboard 10A The image transmitting of collection provides power supply supply to external equipment 2.

On the basis of the various embodiments described above, in conjunction with Fig. 2, the second mainboard 10B includes second be sequentially connected Sensor interface circuit units 300B, the second FPGA module 200B and the 2nd FX3 modules 100B；The 2nd Sensor interfaces electricity Road unit 300B opens short board 30B with the third pinboard 50B, the second source plate 20B and described second and is connected；It is described 2nd FX3 modules 100B opens short board 30B with the second source plate 20B, described second and first pinboard 40 is connected.

Specifically, the second mainboard 10B includes the 2nd Sensor interface circuit units 300B, the 2nd FPGA moulds being sequentially connected Block 200B and the 2nd FX3 module 100B, and the 2nd Sensor interface circuit unit 300B are electrically connected with third pinboard 50B, then 2nd Sensor interface circuit units 300B can pass through third pinboard 50B and second camera or the second image sensor chip Electrical connection.Second FPGA module 200B is a kind of field programmable gate array, for acquiring second camera or the second image sense The image of device chip is surveyed, and handles correlation computations.2nd FX3 modules 100B is a kind of peripheral control unit of high speed data transfer, And the 2nd FX3 modules 100B be electrically connected with the first pinboard 40, then the 2nd FX3 modules 100B is used for the second mainboard 10B acquisition Image transmitting to external equipment 2, while provide power supply supply.

On the basis of the various embodiments described above, the first Sensor interface circuit units 300A is MIPI circuits or DVP Circuit；Alternatively, the first Sensor interface circuit units 300A is MIPI circuits and DVP circuits；2nd Sensor connects Mouth circuit unit 300B is MIPI circuits or DVP circuits；Alternatively, the 2nd Sensor interface circuit units 300B is MIPI electricity Road and DVP circuits.

Specifically, when the first Sensor interface circuit units 300A be MIPI circuits when, can with MIPI classes camera or Image sensor chip is electrically connected；When the first Sensor interface circuit units 300A is DVP circuits, can be imaged with DVP classes Head or the electrical connection of image sensor chip；Alternatively, when the first Sensor interface circuit units 300A is MIPI circuits and DVP circuits When, can respectively with MIPI classes and DVP classes camera or or image sensor chip be electrically connected so that image collecting device MIPI classes or DVP classes camera or image sensor chip can be tested；Or so that image collecting device can be tested respectively MIPI classes and DVP classes camera or image sensor chip, and then improve the adaptability of image collecting device.

It, can be with MIPI classes camera or image sensing when the 2nd Sensor interface circuit units 300B is MIPI circuits Device chip is electrically connected；It, can be with DVP classes camera or image when the 2nd Sensor interface circuit units 300B is DVP circuits Sensor chip is electrically connected；Alternatively, when the 2nd Sensor interface circuit units 300B is MIPI circuits and DVP circuits, it can be with Respectively with MIPI classes and DVP classes camera or or image sensor chip be electrically connected so that image collecting device can be surveyed Try MIPI classes or DVP classes camera or image sensor chip；Or so that image collecting device can test MIPI classes respectively With DVP classes camera or image sensor chip, and then the adaptability of image collecting device is improved.

On the basis of the various embodiments described above, in conjunction with Fig. 1, the image collecting device further includes：Setting is described the The first radiator 60A, the first radiator 60A on one mainboard 10A for the first FPGA module 200A for radiating；With And the second radiator 60B, the second radiator 60B being arranged on the second mainboard 10B is for being the 2nd FPGA Module 200B heat dissipations.

Specifically, since the first FPGA module 200A is used to acquire the figure of the first camera or the first image sensor chip Picture, and handle correlation computations, then the first FPGA module 200A needs to carry out a large amount of, quick operation, then the first FPGA module 200A will produce certain heat, by the way that the first radiator 60A is arranged on the first mainboard 10A, then can by this first dissipate Hot device 60A is that the first FPGA module 200A radiates, and then reduces the temperature of the first FPGA module 200A so that the first FPGA Module 200A will not influence its efficiency because a large amount of, quick operation is carried out for a long time, and then improve image collecting device 1 Image Acquisition efficiency and relevant treatment efficiency.

And since the second FPGA module 200B is used to acquire the figure of second camera or the second image sensor chip Picture, and handle correlation computations, then the second FPGA module 200B needs to carry out a large amount of, quick operation, then the second FPGA module 200B will produce certain heat, by the way that the second radiator 60B is arranged on the second mainboard 10B, then can by this second dissipate Hot device 60B is that the second FPGA module 200B radiates, and then reduces the temperature of the second FPGA module 200B so that the 2nd FPGA Module 200B will not influence its efficiency because a large amount of, quick operation is carried out for a long time, and then improve image collecting device 1 Image Acquisition efficiency and relevant treatment efficiency.

On the basis of the various embodiments described above, in conjunction with Fig. 1, first pinboard 40 includes 3.0 interfaces of the first USB 41A, 3.0 interface 41B of the 2nd USB, power interface 43 and power switch 42；First USB, 3.0 interface 41A and described the One FX3 modules 100A is connected, so that the first FX3 modules 100A passes through 3.0 interface 41A of the first USB and the outside Equipment 2 is connected；2nd USB, 3.0 interface 41B are connected with the 2nd FX3 modules 100B, so that the 2nd FX3 modules 100B is connected by 3.0 interface 41B of the 2nd USB with the external equipment 2；The power switch 42 and first electricity The source plate 20A and second source plate 20B is connected, and the power interface 43 is connected with the power switch 42 and external power supply.

Specifically, 3.0 interface 41A of the first USB, 3.0 interface 41B of the 2nd USB, power supply are set on the first pinboard 40 Interface 43 and power switch 42, then the first FX3 modules 100A can be electrically connected with external equipment 2 by 3.0 interface 41A of the first USB It connects, then the first USB3.0 interfaces 41A can be used for data transmission and power supply power supply, i.e., the first FX3 modules 100A can be by this The image data of first mainboard 10A acquisitions is transmitted to external equipment 2 by 3.0 interface 41A of the first USB, so that in external equipment 2 The image of the first mainboard of image measurement module pair 10A acquisition carry out image quality detection.

2nd FX3 modules 100B can be electrically connected by 3.0 interface 41B of the 2nd USB with external equipment 2, then the 2nd USB 3.0 interface 41B can be used for data transmission and power supply power supply, i.e. the 2nd FX3 modules 100B can be connect by the 2nd USB 3.0 The image data of first mainboard 10A acquisitions is transmitted to external equipment 2 by mouth 41B, so that the image measurement module in external equipment 2 Image quality detection is carried out to the image of the first mainboard 10A acquisitions.

The break-make of power switch 42 controllable power interface 43 and external power supply, that is, control the first power panel 20A and second The connection or disconnection of power panel 20B and external power supply, when the first power panel 20A and second source plate 20B connects with external power supply Can be that whole image harvester 1 provides power supply, for example, providing the DC power supply of 12V2A for image collecting device 1 when logical.

In addition, the first reseting interface and the second reseting interface can be also set on the first pinboard 40, and first reset connects Mouth is connected by the first FX3 modules 100A with the first FPGA module 200A, i.e. the first pinboard 40 can be connect by first reset The power reset of the first FPGA module 200A of mouth control；And second reseting interface passes through the 2nd FX3 modules 100B and second FPGA module 200B is connected, i.e. the first pinboard 40 can control the power supply of the second FPGA module 200B by second reseting interface It resets.And the first power switch 42 on pinboard 40 can be key switch, microswitch, toggle switch or touch out It closes, the break-make for controlling external power supply and second source plate 20B.

On the basis of the various embodiments described above, in conjunction with Fig. 3, described device ontology 70 includes upper cover and lower cover, the upper cover It is fixed by screw with the lower cover；The top plate of the upper cover is set there are two first through hole 72A/72B and two the second through-holes The position of 71A/71B, the first through hole 72A/72B position with the second pinboard 50A and third pinboard 50B respectively Corresponding, the position of the second through-hole 71A/71B is corresponding with the position of the first radiator 60A and the second radiator 60B respectively；Institute The side plate for stating upper cover is set there are two third through-hole and two fourth holes, and the position of the third through-hole is respectively with described first The position of USB 3.0 interface 41A and 3.0 interface 41B of the 2nd USB corresponds to, the position of the fourth hole respectively with it is described The position of power interface 43 and the power switch 42 corresponds to；At least one fifth hole is covered under described, so that image is adopted Acquisition means 1 are mechanically connected with external component, and described image harvester 1 is made to be aerated by the fifth hole Heat dissipation.

Specifically, as shown in figure 3, device body 70 is fixed by screw by upper cover and lower cover, i.e. device body 70 For casing, and the upper cover of casing is made of top plate, side plate, front and rear panels, and top plate, side plate, front and rear panels pass through spiral shell Silk carries out affixed.And after foreboard is fastened by screw and top plate and lower cover, the first mainboard 10A and the second mainboard 10B can be limited One degree of freedom；And after back plate is fastened by screw and top plate and lower cover, the first mainboard 10A and second can be limited The one degree of freedom of mainboard 10B.

First through hole 72A/72B and two the second through-hole 71A/71B, first through hole 72A/ there are two being set on the top plate of upper cover The position of 72B is corresponding with the position of the second pinboard 50A and third pinboard 50B respectively, for example, first through hole 72A/72B Shape is in the same size with the second pinboard 50A's and third pinboard 50B, for exposing the second pinboard 50A and third switching Row on plate 50B is female.The position of second through-hole 71A/71B is corresponding with the position of the first radiator 60A and the second radiator 60B, For example, the second through-hole 71A/71B includes equally distributed multiple circular holes, for being the first radiator 60A and the second radiator 60B It is aerated heat dissipation.

And third through-hole and two fourth holes there are two being set on the side plate of upper cover, and the position of third through-hole point Not with the first USB 3.0 interface 41A and the 2nd USB 3.0 interface 41B position it is corresponding, for example, the shape of third through-hole and the One USB 3.0 interface 41A and the 2nd USB 3.0 interface 41B it is in the same size, it is exposed for interface.The position of fourth hole It is corresponding with the position of power interface 43 and power switch 42 respectively, for example, the shape of fourth hole and power switch 42 and power supply Interface 43 it is in the same size, for the exposed of interface and switch, while can be used for ventilation and heat.

Lower lid is equipped at least one fifth hole, then image collecting device 1 can pass through the fifth hole and external component It is mechanically connected, image collecting device 1 can also be aerated heat dissipation etc. by the fifth hole.

In addition, several through-holes can also be arranged on the foreboard of upper cover and/or back plate, using the through-hole be aerated heat dissipation or Screw etc. is installed.

Further, the material of device body 70 is aluminium alloy, kirsite, magnesium alloy or engineering plastics；Device body 70 Made by machining, it is made by being molded into or is made by 3D printing, and melanism is carried out to the surface of device body 70 Processing, so that the existing black treated layer in the surface of device body 70.And cross the multiple pads of bottom setting in the machine of device body 70 Foot, and feet uses rubber material；And feet is fastened by screw or glue with lower cover.

The image collecting device that the various embodiments described above provide have compact-sized, small, compatible high, good reliability and Easy to operate advantage, and the device is not only applicable in handwork, also is adapted for automated machine operation；The image collecting device has There is unified interface, is conducive to camera module factory and is connected with the installation of other test equipments in automated production, go out figure effect It is good, while Image Acquisition while the image collecting device disclosure satisfy that dual camera or dual image sensor chip Related product It is detected with image quality.

Fig. 4 is the structure diagram for the image capturing system that the utility model embodiment provides, as shown in figure 4, the image is adopted Collecting system includes：External equipment 2, electrical connection device 4 and above-mentioned image collecting device 1；Dual camera or dual image sensing Device chip 3 is fixed on the electrical connection device 4, and the electrical connection device 4 is electrically connected with described image harvester 1, Described image harvester 1 is electrically connected with the external equipment 2；Wherein, the external equipment 2 includes image measurement module.

Specifically, by double cameras or double image sensor chip fixed placements on electrical connection device 4, and Electrical connection device 4 is electrically connected with image collecting device 1, then can acquire double camera shootings simultaneously by the image collecting device 1 The image of head or double image sensor chips, and image collecting device 1 can also carry out image product to the image collected simultaneously Quality detection.And be electrically connected image collecting device 1 with external equipment 2, for example, external equipment 2 is computer installation etc.；And Image measurement module is equipped in external equipment 2, then the image collected is transmitted to external equipment 2 by image collecting device 1, can be led to The image measurement module crossed in the external equipment 2 carries out image quality detection to image.

Further, electrical connection device 4 can be that row needle row is female with being electrically connected for image collecting device 1, wherein row's needle On electrical connection device 4, row is female to be mounted on image collecting device 1, i.e., the first camera on electrical connection device 4 Or first image sensor chip arrange mother 51A by arranging needle and be electrically connected with the second pinboard 50A, the on electrical connection device 4 Two cameras or the second image sensor chip are electrically connected by arranging needle row mother 51B with the second pinboard 50B.Image collecting device 1 can be connect with the electrical connection of external equipment 2 by 3.0 data lines of USB, for example, one of 3.0 data lines of USB is A types USB plug, other end are Type B USB plugs, and Type B USB socket is mounted on image collecting device 1, and A type USB sockets are mounted on outer In portion's equipment 2.

Image collecting device 1 can acquire the power supply status of dual image sensor chip or dual camera 3, electrical signals, Picture signal etc. can also read the related data of dual image sensor chip or dual camera 3, and real-time display is set in outside On standby 2.Further, image collecting device 1 can transmit data in dual image sensor chip or dual camera 3, and Relevant data are written in space in it.And dual camera or dual image sensor chip 3 can be with models, it can not also With model；Image collecting device 1 can be synchronous when to dual camera or dual image sensor chip 3 in image detection , it can also be asynchronous.And image collecting device 1 is when to dual camera or dual image sensor chip 3 in image detection, it can It is carried out at the same time calibration test with two images.

When carrying out image detection using the image capturing system, first, by two cameras or two image sensor cores Piece is put on the electrical connection device 4 being connected with image collecting device 1 simultaneously, and electrical connection is made to handle on-state.Secondly, it opens Image measurement module in dynamic external equipment 2, and parameter is carried out according to the model of dual image sensor chip or dual camera 3 and is set It sets and lights, the parameter setting of dual image sensor chip or dual camera 3 can be carried out before product is lighted by manual operations Setting can also be configured before product is lighted by operating and searching for automatically adaptation operation in advance.Then, it is surveyed by image Die trial block carries out image quality detection to dual image sensor chip or dual camera 3, with detect dual image sensor chip or Whether the image quality of dual camera 3 reaches testing standard.After detecting the actual state of image quality, then pass through burning work Corrected parameter is written in the recordable space that image sensor chip or camera are specified by tool makes it meet testing standard.

Finally it should be noted that：Above example is only to illustrate the technical solution of the utility model, rather than its limitations； Although the utility model is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that： It still can be with technical scheme described in the above embodiments is modified, or is carried out to which part technical characteristic etc. With replacement；And these modifications or replacements, various embodiments of the utility model technology that it does not separate the essence of the corresponding technical solution The spirit and scope of scheme.

Claims (16)

1. a kind of image collecting device, which is characterized in that including：Device body and setting are in intrinsic first master of described device Plate, the second mainboard, the first power panel, second source plate and the first pinboard；

First mainboard is electrically connected with first power panel, so that first mainboard acquisition is connected with first mainboard The first camera or the first image sensor chip image；

First mainboard is electrically connected with first pinboard so that first mainboard by the image transmitting of acquisition to institute It states the connected external equipment of the first pinboard and carries out image quality detection；

Second mainboard is electrically connected with the second source plate, so that second mainboard acquisition is connected with second mainboard Second camera or the second image sensor chip image；

Second mainboard is electrically connected with first pinboard so that second mainboard by the image transmitting of acquisition to described External equipment carries out image quality detection.

2. image collecting device according to claim 1, which is characterized in that further include：Second pinboard and third switching Plate, second pinboard are electrically connected with first mainboard, and second pinboard and the first camera or the first image Sensor chip is electrically connected；

The third pinboard is electrically connected with second mainboard, and the third pinboard and second camera or the second image Sensor chip is electrically connected.

3. image collecting device according to claim 2, which is characterized in that further include：First, which opens short board and second, opens Short board, described first opens short board is electrically connected with first mainboard, for detecting the first camera or the first image sensing The open circuit and short-circuit condition of device chip circuit；

Described second opens short board is electrically connected with second mainboard, for detecting second camera or the second image sensor core The open circuit and short-circuit condition of piece circuit.

4. image collecting device according to claim 3, which is characterized in that first mainboard is other by arranging needle row's mother stock Short board is opened with first power panel, first pinboard, second pinboard and described first to be electrically connected；

Second mainboard is transferred with the second source plate, first pinboard, the third by arranging needle row mother stock Plate and described second open short board electrical connection.

5. image collecting device according to claim 3, which is characterized in that first mainboard includes be sequentially connected One Sensor interface circuits unit, the first FPGA module and the first FX3 modules；

The first Sensor interface circuits unit opens short circuit with second pinboard, first power panel and described first Plate is connected；

The first FX3 modules open short board with first power panel, described first and first pinboard is connected.

6. image collecting device according to claim 5, which is characterized in that second mainboard includes be sequentially connected Two Sensor interface circuits units, the second FPGA module and the 2nd FX3 modules；

The 2nd Sensor interface circuits unit opens short circuit with the third pinboard, the second source plate and described second Plate is connected；

The 2nd FX3 modules open short board with the second source plate, described second and first pinboard is connected.

7. image collecting device according to claim 6, which is characterized in that the first Sensor interface circuit units are MIPI circuits or DVP circuits；Alternatively, the first Sensor interface circuit units are MIPI circuits and DVP circuits；

The 2nd Sensor interface circuit units are MIPI circuits or DVP circuits；Alternatively, the 2nd Sensor interface circuits Unit is MIPI circuits and DVP circuits.

8. image collecting device according to claim 6, which is characterized in that further include：It is arranged on first mainboard The first radiator, first radiator be used for for first FPGA module radiate；And

The second radiator on second mainboard is set, and second radiator is used to dissipate for second FPGA module Heat.

9. image collecting device according to claim 8, which is characterized in that first pinboard includes the first USB 3.0 interfaces, 3.0 interfaces of the 2nd USB, power interface and power switch；

First USB, 3.0 interfaces are connected with the first FX3 modules, so that the first FX3 modules pass through described first 3.0 interfaces of USB are connected with the external equipment；

2nd USB, 3.0 interfaces are connected with the 2nd FX3 modules, so that the 2nd FX3 modules pass through described second 3.0 interfaces of USB are connected with the external equipment；

The power switch is connected with first power panel and the second source plate, and the power interface is opened with the power supply It closes and external power supply is connected.

10. image collecting device according to claim 9, which is characterized in that described device ontology includes upper cover and lower cover, The upper cover is fixed by screw with the lower cover；

The top plate of the upper cover is set there are two first through hole and two the second through-holes, the position of the first through hole respectively with it is described The position of second pinboard and third pinboard corresponds to, and the position of second through-hole is radiated with the first radiator and second respectively The position of device corresponds to；

The side plate of the upper cover is set there are two third through-hole and two fourth holes, the position of the third through-hole respectively with it is described The position of first USB, 3.0 interfaces and 3.0 interfaces of the 2nd USB corresponds to, the position of the fourth hole respectively with the electricity The position of source interface and the power switch corresponds to；

At least one fifth hole is covered under described, so that image collecting device is mechanically connected with external component, and So that described image harvester is passed through the fifth hole and is aerated heat dissipation.

11. image collecting device according to claim 1, which is characterized in that the material of described device ontology be aluminium alloy, Kirsite, magnesium alloy or engineering plastics；

Described device ontology makes or is made by 3D printing and described device sheet made by machining, by being molded into The surface of body has black treated layer.

12. image collecting device according to claim 10, which is characterized in that the machine of described device ontology is crossed bottom and is equipped with Multiple feets, the feet use rubber material；And the feet is fastened by screw or glue with the lower cover.

13. a kind of image capturing system, which is characterized in that including：External equipment, electrical connection device and such as claim 1-12 Any one of them image collecting device；

Dual camera or dual image sensor chip are fixed on the electrical connection device, the electrical connection device with it is described Image collecting device is electrically connected, and described image harvester is electrically connected with the external equipment；

Wherein, the external equipment includes image measurement module.

14. image capturing system according to claim 13, which is characterized in that the electrical connection device and described image Harvester arranges parent phase company by arranging needle, and row's needle in row's needle mother row is mounted on the electrical connection device, described Mother row arranged in needle mother row is mounted on described image harvester.

15. the image capturing system according to claim 13 or 14, which is characterized in that described image harvester with it is described External equipment is connected by 3.0 data lines of USB, on the USB plug and the external equipment of the 3.0 data line one end the USB USB socket be connected, USB plug and the USB socket phase on described image harvester of the 3.0 data line other ends of the USB Even.

16. image capturing system according to claim 13, which is characterized in that the dual camera is with model or difference The camera of model；Alternatively, the dual image sensor chip is the image sensor chip with model or different model.