CN207799287U - A kind of high colour gamut down straight aphototropism mode set of uniform in light emission - Google Patents
A kind of high colour gamut down straight aphototropism mode set of uniform in light emission Download PDFInfo
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- CN207799287U CN207799287U CN201820052349.3U CN201820052349U CN207799287U CN 207799287 U CN207799287 U CN 207799287U CN 201820052349 U CN201820052349 U CN 201820052349U CN 207799287 U CN207799287 U CN 207799287U
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Abstract
The utility model discloses a kind of high colour gamut down straight aphototropism mode set of uniform in light emission, which includes metal backing, PCB lamp board, diaphragm, liquid crystal display panel, and wherein PCB lamp board includes pcb board, flip-chip, transparent silicon glue-line, quantum dot film, water proof oxygen film;The metal backing includes bottom plate and side plate, and side plate is vertically connected on the periphery of bottom plate;The bottom plate is fixedly arranged above PCB lamp board;It is sequentially placed diaphragm, liquid crystal display panel above the side board edge;The PCB lamp board is that pcb board is fixedly arranged above flip-chip, and two neighboring flip-chip equally arranges;It is provided with transparent silicon glue-line above the flip-chip;The transparent silicon glue-line of flip-chip overcentre is set as lens arrangement;It is provided with quantum dot film above transparent silicon glue-line, water proof oxygen film is covered with above quantum dot film.The utility model has the characteristics that ultra-thin, local dimming, good heat dissipation, NTSC color gamut value is high, emitting brightness is uniform.
Description
Technical field
The utility model is related to a kind of high colour gamut down straight aphototropism mode set of uniform in light emission, especially it is a kind of have it is ultra-thin,
The high colour gamut down straight aphototropism mode set of local dimming, good heat dissipation, NTSC color gamut value height, the uniform uniform in light emission of emitting brightness.
Background technology
With being constantly progressive for TV tech, TV experienced development from black and white to color, from electron tube, transistor to
Flat panel Liquid Crystal TV of today.Liquid crystal itself can not shine, and need to use brightness constancy, uniform white light backlight, lead to
Signal voltage is crossed, the arrangement state of liquid crystal molecule is changed, reaches adjusting and penetrates the light intensity after liquid crystal, to produce on the screen
Picture material needed for raw.Liquid crystal display in existing market is largely backlight liquid crystal display, including liquid crystal display panel and
Backlight module, liquid crystal display panel and backlight module are oppositely arranged, and backlight module provides light source, so that liquid crystal display panel display figure
Picture.Wherein down straight aphototropism mode set is due to high briliancy, good light extraction visual angle, light utilization ratio height, simple structure etc.
Advantage and become the market mainstream, but since its structure is mainly made of aluminum substrate, LED lamp bead lens of arranging in pairs or groups again, need certain
Height can be only achieved the effect of uniform in light emission, can undoubtedly increase the thickness and weight of module, while can not accomplish local dimming,
To increase power consumption.
Quantum dot (Quantum Dot) be called it is nanocrystalline, be it is a kind of conduction band electron, valence band hole and exciton in three skies
Between the nanometer semiconductor structure that holds onto on direction, be usually made of II-VI group or iii-v element, grain size between 1~
Between 10nm, since electrons and holes are by quantum confinement, continuous band structure becomes the discrete energy levels knot with molecular characterization
Structure can emit fluorescence after being excited.Quantum dot fluorescence powder has wider absorption spectra and relatively narrow excitation spectrum, has more glimmering than tradition
Light powder, more excellent photoelectric properties, NTSC are up to 140%.By changing quantum dot particle size and chemical composition, hair can be made
It penetrates spectrum and covers entire visible light region.
Currently, down straight aphototropism mode set structure in mainstream market is mainly arranged in pairs or groups lens group by pcb board, LED lamp bead again
At, while certain height being needed to can be only achieved the effect of uniform in light emission, it can undoubtedly increase the thickness and weight of module, while nothing
Method accomplishes local dimming, to increase power consumption.In addition LED lamp bead backlight is mostly YAG powder or silicate, nitride fluorescent
Powder, KSF fluorescent powders, β-SiAlON, colour gamut is only capable of reaching 72%-95%, while the launching efficiency of fluorescent powder is low, improves colour gamut only
It can be realized by increasing dosage, far can not meet that today's society is lower to energy consumption, efficiency higher and high colour gamut are wanted
It asks.
Utility model content
The purpose of this utility model is to provide one kind having ultra-thin, local dimming, good heat dissipation, NTSC color gamut value height, goes out
The high colour gamut down straight aphototropism mode set of the uniform uniform in light emission of brightness.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of high colour gamut down straight aphototropism mode set of uniform in light emission, including metal backing, PCB lamp board, diaphragm, liquid crystal surface
Plate, wherein PCB lamp board include pcb board, flip-chip, transparent silicon glue-line, quantum dot film, water proof oxygen film;
The metal backing includes bottom plate and side plate, and side plate is vertically connected on the periphery of bottom plate;It is fixed above the bottom plate
There is PCB lamp board;It is sequentially placed diaphragm, liquid crystal display panel above the side board edge;
The PCB lamp board is that pcb board is fixedly arranged above flip-chip, and two neighboring flip-chip equally arranges;Institute
It states and is provided with transparent silicon glue-line above flip-chip;The transparent silicon glue-line of flip-chip overcentre is set as lens arrangement;Thoroughly
It is provided with quantum dot film above bright layer of silica gel, water proof oxygen film is covered with above quantum dot film;
The thickness of the lens arrangement is 0.1-3mm, the diameter 0.05-0.5mm of lens arrangement;
The backlight module includes several PCB lamp boards mutually spliced along linear direction, and two neighboring PCB lamp board passes through
Side wall mutually splices;
The size of the flip-chip is 0.1-0.6mm, and the distance between adjacent flip-chip chip is 0.1-5mm, upside-down mounting core
The dominant wavelength that piece sends out light is 440-470nm;
The thickness of the transparent silicon glue-line is 0.3-5mm;The thickness of the quantum dot film (24) is 0.05-1mm;
The lens arrangement is one kind in conical socket, buttferfly-type protrusion, arc convex.
The utility model provides a kind of high colour gamut down straight aphototropism mode set of uniform in light emission, have ultra-thin, local dimming,
Good heat dissipation, the feature that NTSC color gamut value is high, emitting brightness is uniform.Flip-chip size is smaller, after quantum dot film of arranging in pairs or groups, Neng Gouda
It is 100-140% to color gamut value, realizes high colour gamut backlight display;Upside-down mounting core is directly wrapped up by transparent silicon glue-line in PCB lamp board
Piece, this method make PCB lamp board have outstanding heat-sinking capability, while reducing backlight mould instead of tradition, lens and supporting structure
The thickness of group, realizes ultra-thin display;The multiple PCB lamp boards mutually spliced form arbitrary dimension by mutual connecting method
Backlight module, and by driving circuit independent control, realize the function of backlight module inner region light modulation, promote the dynamic of picture
Contrast;Lens arrangement on the transparent silicon glue-line is diffused the light right over flip-chip, and top originally is stronger
Light be distributed to around, reach the uniform effect of water proof oxygen film upper surface emitting brightness.
Description of the drawings
In order to facilitate the understanding of those skilled in the art, the utility model will be further described below with reference to the accompanying drawings.
Fig. 1 is a kind of partial cross section's structural representation of the high colour gamut down straight aphototropism mode set of uniform in light emission of the utility model
Figure;
Fig. 2 is a kind of buttferfly-type protrusion lens arrangement of the high colour gamut down straight aphototropism mode set of uniform in light emission of the utility model
Partial cross section's structural schematic diagram;
Fig. 3 is a kind of arc convex lens arrangement office of the high colour gamut down straight aphototropism mode set of uniform in light emission of the utility model
Portion's cross section structure schematic diagram.
Specific implementation mode
The purpose of this utility model can be achieved through the following technical solutions:
A kind of high colour gamut down straight aphototropism mode set of uniform in light emission, referring to Fig. 1-3, including metal backing 1, PCB lamp board 2,
Diaphragm 3, liquid crystal display panel 4, wherein PCB lamp board 2 include pcb board 21, flip-chip 22, transparent silicon glue-line 23, quantum dot film 24, every
Water oxygen film 25;
The metal backing 1 includes bottom plate 11 and side plate 12, and side plate 12 is vertically connected on the periphery of bottom plate 11;The bottom plate
11 are fixedly arranged above PCB lamp board 2;It is sequentially placed diaphragm 3, liquid crystal display panel 4 above 12 edge of the side plate;
The PCB lamp board 2 is that pcb board 21 is fixedly arranged above flip-chip 22, and flip-chip 22 equally arranges;It is described
22 top of flip-chip is provided with transparent silicon glue-line 23;The transparent silicon glue-line 23 of 22 overcentre of flip-chip is set as lens knot
Structure;23 top of transparent silicon glue-line is provided with quantum dot film 24, and 24 top of quantum dot film is covered with water proof oxygen film 25;
The thickness of the lens arrangement is 0.1-3mm, the diameter 0.05-0.5mm of lens arrangement;The lens arrangement side wall
It is provided with arc convex;
The backlight module includes several PCB lamp boards 2 mutually spliced along linear direction, and two neighboring PCB lamp board 2 is logical
It crosses side wall mutually to splice, by the electric current and voltage of every PCB lamp board of driving circuit independent control 2, realizes the area of backlight module
Domain dims;
The size of the flip-chip 22 is 0.1-0.6mm, and the distance between adjacent flip-chip chip 22 is 0.1-5mm,
The dominant wavelength that cartridge chip 22 sends out light is 440-470nm;
The thickness of the transparent silicon glue-line 23 is 0.3-5mm, and the material of transparent silicon glue-line 23 is epoxy resin, organosilicon
One kind in glue class, polyurethanes;The thickness of the quantum dot film 24 is 0.05-1mm;
The quantum dot film 24 is mixed by quantum dot fluorescence powder and glue, and the material of quantum dot fluorescence powder is by first group
Divide one or more compositions in material, second component material, the third component material;The quantum dot fluorescence powder structure is nucleocapsid
Or Doped nanocrystal;
The first component material is that periodic table of chemical element II-VI group or iii-v element form compound;The second
Component material is the ternary compound of the Ith main group of the periodic table of chemical element, the IVth main group and the element formation in the VIIth main group;Institute
It is full-inorganic perovskite to state the third component material, by BaS, AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、
CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、GaSe、InGaAs、MgS、MgSe、MgTe、PbSe、PbTe、Cd
(SxSe1-x)、BaTiO3、PbZrO3、CsPbCl3、CsPbBr3、CsPbI3At least one of material composition;
The lens arrangement is one kind in conical socket, buttferfly-type protrusion, arc convex;
Contain YAG powder, silicate, nitride phosphor, KSF fluorescent powders or β-S iA l ON in the quantum dot film 24;
Contain the concentration of one or both of diffusant or dumb light agent, diffusant or dumb light agent in the quantum dot film 24
For 1-10%wt.
A kind of production method of the high colour gamut down straight aphototropism mode set of uniform in light emission, includes the following steps:
Step 1: the pad locations on the pcb board 21 are coated with tin cream, flip-chip 22 is placed into pcb board 21
On pad;Pcb board 21 is put into reflow ovens, the baking through 240-280 DEG C of 3-15min;Flip-chip 22 is set to be welded on pcb board 21
On;
Step 2: installing silica gel molding die above above-mentioned pcb board 21, silica gel is poured into the lower die of lens die,
By upper mould cover in lower die, and film is closed, removes extra silica gel;Pcb board 21 and mold are put into togerther in oven, through 120-180
Solidification bakings in DEG C of 1-5 hours, after cooling, take out pcb board 21, remove mold, form transparent silicon glue-line 23;
Step 3: quantum dot glue and water proof oxygen glue are poured into flat plate mold respectively, flat plate mold is put into vacuum
Drying box removes the bubble in quantum dispensing water and water proof oxygen glue, while making quantum dot glue and water proof oxygen through 30-60min
Glue flows even in flat plate mold;Quantum dot glue will be filled to be put into oven, dried respectively through solidification in 100-170 DEG C of 1-5 hours
It is roasting, after cooling, flat plate mold is removed, forms quantum dot film 24;The mold for filling water proof oxygen glue is put into oven, is passed through respectively
60-170 DEG C of solidification baking in 1-5 hours, after cooling, removes flat plate mold, forms water proof oxygen film 25;
Step 4: be sequentially placed above transparent silicon glue-line 23 to quantum dot film 24 obtained above and water proof oxygen film 25,
Complete the making of PCB lamp board 2;
Step 5: PCB lamp board 2 is sticked together by side wall, the bottom plate 11 of metal backing 1 is fixed on by viscose glue
On, diaphragm 3, liquid crystal display panel 4 are placed on 12 top of side plate, complete the assembling of backlight module.
The principles of the present invention:
22 size of the flip-chip is smaller, and after collocation quantum dot film 24, it is 100-140% that can reach color gamut value, real
Existing high colour gamut backlight display;Flip-chip 22, this method substitution are directly wrapped up by transparent silicon glue-line 23 in the PCB lamp board 2
Tradition, lens and supporting structure make PCB lamp board 2 have outstanding heat-sinking capability, while reducing the thickness of backlight module, real
Existing ultra-thin display;The multiple PCB lamp boards 2 mutually spliced form the backlight mould of arbitrary dimension by mutual connecting method
Group, and by driving circuit independent control, realize the function of backlight module inner region light modulation, promote the dynamic contrast of picture;
Lens arrangement on the transparent silicon glue-line 23 is diffused the light right over flip-chip, will divide the stronger light in top originally
Around being scattered to, reach the uniform effect of water proof oxygen film upper surface emitting brightness.
The utility model provides a kind of high colour gamut down straight aphototropism mode set of uniform in light emission, have ultra-thin, local dimming,
Good heat dissipation, the feature that NTSC color gamut value is high, emitting brightness is uniform.Flip-chip size is smaller, after quantum dot film of arranging in pairs or groups, Neng Gouda
It is 100-140% to color gamut value, realizes high colour gamut backlight display;Upside-down mounting core is directly wrapped up by transparent silicon glue-line in PCB lamp board
Piece, this method make PCB lamp board have outstanding heat-sinking capability, while reducing backlight mould instead of tradition, lens and supporting structure
The thickness of group, realizes ultra-thin display;The multiple PCB lamp boards mutually spliced form arbitrary dimension by mutual connecting method
Backlight module, and by driving circuit independent control, realize the function of backlight module inner region light modulation, promote the dynamic of picture
Contrast;Lens arrangement on the transparent silicon glue-line is diffused the light right over flip-chip, and top originally is stronger
Light be distributed to around, reach the uniform effect of water proof oxygen film upper surface emitting brightness.
Above content is only to the utility model structure example and explanation, the technology people of affiliated the art
Member makes various modifications or additions to the described embodiments or substitutes by a similar method, without departing from reality
With novel structure or beyond the scope defined by this claim, all should belong to the protection range of the utility model.
Claims (6)
1. a kind of high colour gamut down straight aphototropism mode set of uniform in light emission, including metal backing (1), PCB lamp board (2), diaphragm (3),
Liquid crystal display panel (4), which is characterized in that PCB lamp board (2) includes pcb board (21), flip-chip (22), transparent silicon glue-line (23), amount
Son point film (24), water proof oxygen film (25);
The metal backing (1) includes bottom plate (11) and side plate (12), and side plate (12) is vertically connected on the periphery of bottom plate (11);Institute
It states bottom plate (11) and is fixedly arranged above PCB lamp board (2);It is sequentially placed diaphragm (3), liquid crystal display panel above side plate (12) edge
(4);
The PCB lamp board (2) is that pcb board (21) is fixedly arranged above flip-chip (22), and flip-chip (22) equally arranges;
It is provided with transparent silicon glue-line (23) above the flip-chip (22);The transparent silicon of two neighboring flip-chip (22) overcentre
Glue-line (23) is set as lens arrangement;Quantum dot film (24), quantum dot film (24) top are provided with above transparent silicon glue-line (23)
It is covered with water proof oxygen film (25).
2. a kind of high colour gamut down straight aphototropism mode set of uniform in light emission according to claim 1, which is characterized in that described
The thickness of mirror structure is 0.1-3mm, the diameter 0.05-0.5mm of lens arrangement.
3. a kind of high colour gamut down straight aphototropism mode set of uniform in light emission according to claim 1, which is characterized in that the backlight
Module includes several PCB lamp boards (2) mutually spliced along linear direction, and two neighboring PCB lamp board (2) is mutual by side wall
Splicing.
4. a kind of high colour gamut down straight aphototropism mode set of uniform in light emission according to claim 1, which is characterized in that it is described fall
The size of cartridge chip (22) is 0.1-0.6mm, and the distance between adjacent flip-chip chip (22) is 0.1-5mm, flip-chip (22)
The dominant wavelength for sending out light is 440-470nm.
5. a kind of high colour gamut down straight aphototropism mode set of uniform in light emission according to claim 1, which is characterized in that described
The thickness of bright layer of silica gel (23) is 0.3-5mm;The thickness of the quantum dot film (24) is 0.05-1mm.
6. a kind of high colour gamut down straight aphototropism mode set of uniform in light emission according to claim 1, which is characterized in that described
Mirror structure is one kind in conical socket, buttferfly-type protrusion, arc convex.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108051952A (en) * | 2018-01-12 | 2018-05-18 | 安徽芯瑞达科技股份有限公司 | A kind of high colour gamut down straight aphototropism mode set of uniform in light emission and preparation method thereof |
CN114578615A (en) * | 2022-02-18 | 2022-06-03 | 惠州视维新技术有限公司 | Backlight module and display device |
-
2018
- 2018-01-12 CN CN201820052349.3U patent/CN207799287U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108051952A (en) * | 2018-01-12 | 2018-05-18 | 安徽芯瑞达科技股份有限公司 | A kind of high colour gamut down straight aphototropism mode set of uniform in light emission and preparation method thereof |
CN108051952B (en) * | 2018-01-12 | 2023-07-25 | 安徽芯瑞达科技股份有限公司 | High-color-gamut direct-type backlight module with uniform light emission and manufacturing method thereof |
CN114578615A (en) * | 2022-02-18 | 2022-06-03 | 惠州视维新技术有限公司 | Backlight module and display device |
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