CN207783238U - A kind of high stability ceramic substrate - Google Patents
A kind of high stability ceramic substrate Download PDFInfo
- Publication number
- CN207783238U CN207783238U CN201721719028.6U CN201721719028U CN207783238U CN 207783238 U CN207783238 U CN 207783238U CN 201721719028 U CN201721719028 U CN 201721719028U CN 207783238 U CN207783238 U CN 207783238U
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- copper sheet
- substrate
- sheet layer
- layer
- ceramic wafer
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Abstract
A kind of high stability ceramic substrate, belongs to electric substrate technical field.Including waterproof layer, ceramic wafer, buckle slot, fastening strip, copper sheet layer, groove, shrinkage pool, pyrometric cone protrusion, elastic projection, substrate, nano heat-insulating layer, in substrate upper end setting pyrometric cone protrusion, elastic projection is set in pyrometric cone protrusion, copper sheet layer is set on substrate, groove is arranged in lower end in copper sheet layer, shrinkage pool is set on groove, pyrometric cone protrusion matches with groove, elastic projection matches with shrinkage pool, in copper sheet layer upper end, fastening strip is set, ceramic wafer is set on copper sheet layer, buckle slot is set in ceramic wafer lower end, fastening strip is connected on buckle slot.It is matched with shrinkage pool by the elastic projection in pyrometric cone protrusion, fastening strip matches with buckle slot, and substrate can be made to be completely embedded with copper sheet layer, copper sheet layer and ceramic wafer, will not make circuit board that degumming phenomenon occur with substrate, reduces production cost.
Description
Technical field
The utility model belongs to electric substrate technical field, is related to a kind of high stability ceramic substrate.
Background technology
With the continuous development of science and technology, the processing technology of all trades and professions is also more and more ripe, the quality of converted products
Also it becomes better and better, the service life of product is also extending.
At this stage, in circuit board technology field, traditional circuit board is connected with substrate using glue, and there is no use it
Its mode is reinforced, and such circuit board in use for some time, usually will appear circuit board and occur to take off with lower substrate
Glue phenomenon, so that circuit board is scrapped.Economic cost is caused to increase, it can be seen that, such circuit board has not caught up with existing
The progress of science and technology, cannot be satisfied the market demand.
Utility model content
Purpose of the utility model is to solve the above problems and provide a kind of high stability ceramic substrates, can solve
State problem.
The technical scheme in the invention for solving the above technical problem is：
A kind of high stability ceramic substrate, including it is waterproof layer, ceramic wafer, buckle slot, fastening strip, copper sheet layer, groove, recessed
Hole, pyrometric cone protrusion, elastic projection, substrate, nano heat-insulating layer, in substrate upper end setting pyrometric cone protrusion, in pyrometric cone protrusion
Copper sheet layer is arranged in upper setting elastic projection on substrate, and groove is arranged in lower end in copper sheet layer, is arranged shrinkage pool on groove, and three
Pyramid protrusion matches with groove, and elastic projection matches with shrinkage pool, and fastening strip is arranged in copper sheet layer upper end, is set on copper sheet layer
Ceramic wafer is set, buckle slot is set in ceramic wafer lower end, fastening strip is connected on buckle slot.
Scheme is advanced optimized as this practicality, nano heat-insulating layer is set between the substrate and copper sheet layer.
As the scheme that advanced optimizes of this practicality, the nano heat-insulating layer is made of glass fiber material.
Scheme is advanced optimized as this practicality, waterproof layer, the waterproof layer are set in the ceramic wafer upper end
It is made of polyurethane material.
As the scheme that advanced optimizes of this practicality, the thickness of the ceramic wafer is 0.4-0.6mm.
The utility model has the beneficial effects that：
1, the utility model includes that waterproof layer, ceramic wafer, buckle slot, fastening strip, copper sheet layer, groove, shrinkage pool, pyrometric cone are convex
It rises, elastic projection, substrate, nano heat-insulating layer, in substrate upper end setting pyrometric cone protrusion, it is convex that elasticity is set in pyrometric cone protrusion
Copper sheet layer is arranged in block on substrate, and groove is arranged in lower end in copper sheet layer, is arranged shrinkage pool on groove, pyrometric cone protrusion with it is recessed
Slot matches, and elastic projection matches with shrinkage pool, and fastening strip is arranged in copper sheet layer upper end, ceramic wafer is arranged on copper sheet layer,
Buckle slot is arranged in ceramic wafer lower end, and fastening strip is connected on buckle slot.Pass through the elastic projection and shrinkage pool phase in pyrometric cone protrusion
It coincide, fastening strip matches with buckle slot, and substrate can be made to be completely embedded with copper sheet layer, copper sheet layer and ceramic wafer, will not make electricity
With substrate degumming phenomenon occurs for road plate, reduces production cost.
2, nano heat-insulating layer is arranged in the utility model between the substrate and copper sheet layer.It can by nano heat-insulating layer
The heat that copper sheet layer generates is reduced, ensures to firmly install between substrate and copper sheet layer, prolong the service life.
3, nano heat-insulating layer described in the utility model is made of glass fiber material.Can its extend use the longevity
Life reduces production cost.
4, waterproof layer is arranged in the ceramic wafer upper end in the utility model, and the waterproof layer is by polyurethane material system
At.It can prevent water from falling into ceramic wafer by waterproof layer, avoid generating destruction to substrate and copper sheet layer, extend it and use the longevity
Life.
5, the thickness of ceramic wafer described in the utility model is 0.4-0.6mm.Under the premise of the stability for ensureing to use,
The weight of circuit board can be reduced.
6, the utility model is simple in structure, is easy to make, is suitable for industrialized production.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
In figure：1, waterproof layer, 2, ceramic wafer, 3, buckle slot, 4, fastening strip, 5, copper sheet layer, 6, groove, 7, shrinkage pool, 8, three
Pyramid protrusion, 9, elastic projection, 10, substrate, 11, nano heat-insulating layer.
Specific implementation mode
The utility model is described in further detail with specific implementation mode below in conjunction with the accompanying drawings：
As shown in Figure 1, a kind of high stability ceramic substrate described in the utility model, including waterproof layer 1, ceramic wafer 2, card
Catching groove 3, fastening strip 4, copper sheet layer 5, groove 6, shrinkage pool 7, pyrometric cone protrusion 8, elastic projection 9, substrate 10, nano heat-insulating layer 11,
End setting pyrometric cone protrusion 8 on the substrate 10, is arranged elastic projection 9 in pyrometric cone protrusion 8, and copper sheet layer 5 is arranged on substrate,
Groove 6 is arranged in lower end in copper sheet layer 5, and shrinkage pool 7 is arranged on groove 6, and pyrometric cone protrusion 8 matches with groove 6, elastic projection
9 match with shrinkage pool 7, and fastening strip 4 is arranged in 5 upper end of copper sheet layer, ceramic wafer 2 is arranged on copper sheet layer 5, in 2 lower end of ceramic wafer
Buckle slot 3 is set, and fastening strip 4 is connected on buckle slot 3.It is matched with shrinkage pool 7 by the elastic projection 9 in pyrometric cone protrusion 8,
Fastening strip 4 matches with buckle slot, and substrate can be made to be completely embedded with copper sheet layer 5, copper sheet layer 5 and ceramic wafer 2, will not make circuit
With substrate degumming phenomenon occurs for plate, reduces production cost.Nano heat-insulating layer 11 is set between the substrate and copper sheet layer 5.
The heat of the generation of copper sheet layer 5 can be reduced by nano heat-insulating layer 11, ensured to firmly install between substrate and copper sheet layer 5, be extended
Service life.The nano heat-insulating layer 11 is made of glass fiber material.Can its prolong the service life, reduce production
Cost.Waterproof layer 1 is set in 2 upper end of ceramic wafer, the waterproof layer 1 is made of polyurethane material.By anti-
Water layer 1 can prevent water from falling into ceramic wafer 2, avoid generating destruction to substrate and copper sheet layer 5, extend its service life.It is described
Ceramic wafer 2 thickness be 0.4-0.6mm.Under the premise of the stability for ensureing to use, the weight of circuit board can be reduced.
It should be noted last that：Above example is only to illustrate and unrestricted the technical solution of the utility model, to the greatest extent
Pipe is described in detail the utility model with reference to above-described embodiment, it will be apparent to an ordinarily skilled person in the art that：Still
The utility model can be modified or replaced equivalently, without departing from any modification of the spirit and scope of the utility model
Or part is replaced, and should all be covered in the right of the utility model.
Claims (5)
1. a kind of high stability ceramic substrate, it is characterised in that：Including waterproof layer, ceramic wafer, buckle slot, fastening strip, copper sheet layer,
Groove, shrinkage pool, pyrometric cone protrusion, elastic projection, substrate, nano heat-insulating layer, in substrate upper end setting pyrometric cone protrusion, in triangle
Elastic projection is set in cone protrusion, copper sheet layer is set on substrate, groove is arranged in lower end in copper sheet layer, is arranged on groove recessed
Hole, pyrometric cone protrusion match with groove, and elastic projection matches with shrinkage pool, fastening strip are arranged in copper sheet layer upper end, in copper sheet
Ceramic wafer is set on layer, buckle slot is set in ceramic wafer lower end, fastening strip is connected on buckle slot.
2. a kind of high stability ceramic substrate according to claim 1, it is characterised in that：In the substrate and copper sheet layer
Between be arranged nano heat-insulating layer.
3. a kind of high stability ceramic substrate according to claim 2, it is characterised in that：The nano heat-insulating layer be by
Made of glass fiber material.
4. a kind of high stability ceramic substrate according to claim 1, it is characterised in that：It is set in the ceramic wafer upper end
Waterproof layer is set, the waterproof layer is made of polyurethane material.
5. a kind of high stability ceramic substrate according to claim 1, it is characterised in that：The thickness of the ceramic wafer is
0.4-0.6mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721719028.6U CN207783238U (en) | 2017-12-12 | 2017-12-12 | A kind of high stability ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721719028.6U CN207783238U (en) | 2017-12-12 | 2017-12-12 | A kind of high stability ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207783238U true CN207783238U (en) | 2018-08-28 |
Family
ID=63231067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721719028.6U Expired - Fee Related CN207783238U (en) | 2017-12-12 | 2017-12-12 | A kind of high stability ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207783238U (en) |
-
2017
- 2017-12-12 CN CN201721719028.6U patent/CN207783238U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 Termination date: 20181212 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |