CN207781545U - 一种塑封芯片浸泡槽 - Google Patents
一种塑封芯片浸泡槽 Download PDFInfo
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- CN207781545U CN207781545U CN201721860343.0U CN201721860343U CN207781545U CN 207781545 U CN207781545 U CN 207781545U CN 201721860343 U CN201721860343 U CN 201721860343U CN 207781545 U CN207781545 U CN 207781545U
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CN201721860343.0U CN207781545U (zh) | 2017-12-27 | 2017-12-27 | 一种塑封芯片浸泡槽 |
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CN201721860343.0U CN207781545U (zh) | 2017-12-27 | 2017-12-27 | 一种塑封芯片浸泡槽 |
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CN207781545U true CN207781545U (zh) | 2018-08-28 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Plastic envelope chip soaks groove Effective date of registration: 20190507 Granted publication date: 20180828 Pledgee: China Postal Savings Bank Limited by Share Ltd Suining Sui branch Pledgor: Sichuan Ming Tai Electronic Science and Technology Co., Ltd. Registration number: 2019510000053 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 629000 Dequan road Microelectronics Industrial Park, Suining economic and Technological Development Zone, Sichuan Province Patentee after: Sichuan Mingtai Microelectronics Technology Co.,Ltd. Address before: 629000 Dequan road Microelectronics Industrial Park, Suining economic and Technological Development Zone, Sichuan Province Patentee before: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD. |
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CP01 | Change in the name or title of a patent holder | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220328 Granted publication date: 20180828 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: 2019510000053 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |