CN207772410U - A kind of anti-fold film adhering jig - Google Patents
A kind of anti-fold film adhering jig Download PDFInfo
- Publication number
- CN207772410U CN207772410U CN201820048325.0U CN201820048325U CN207772410U CN 207772410 U CN207772410 U CN 207772410U CN 201820048325 U CN201820048325 U CN 201820048325U CN 207772410 U CN207772410 U CN 207772410U
- Authority
- CN
- China
- Prior art keywords
- thermal conducting
- conducting sleeve
- colloidal silica
- film adhering
- adhering jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of anti-fold film adhering jig, including：Colloidal silica, the upper surface of the colloidal silica are suitable for being bonded the circumferential film for curved surface；Multiple thermal conducting sleeves, multiple thermal conducting sleeves are arranged at least a pair of bottom edge edge being mutually parallel of the lower surface of the colloidal silica, two ends on the bottom edge are respectively set there are one the thermal conducting sleeve, through hole there are one being opened up on the side wall of the thermal conducting sleeve, the thermal conducting sleeve and the bottom edge are parallel to each other；Multiple heat generating cores, the heat generating core are fixed in the through hole, and the heat generating core is suitable for generating heat.Such anti-fold film adhering jig, is easy to implement the fitting of the film of four curved surfaces, avoids the occurrence of fold, improves quality, reduces cost.
Description
Technical field
The utility model is related to film adhering jigs, and in particular to a kind of anti-fold film adhering jig.
Background technology
Film adhering jig in the prior art has been carried out the fitting of bi-curved film.
But when being bonded the film of four curved surfaces, since it is desired that realizing four applications of a surface, it will appear in curved face part
Considerable fold, it is of high cost so as to cause high rejection rate, waste more situations.
It is necessary therefore, it is possible to provide a kind of anti-fold film adhering jig.
Utility model content
The technical problems to be solved in the utility model is：In order to solve in the prior art be bonded four curved surfaces film when
It waits, the problem of fold easily occurs in curved face part.The utility model provides a kind of anti-fold film adhering jig to solve above-mentioned ask
Topic.
Technical solution adopted by the utility model to solve its technical problems is：A kind of anti-fold film adhering jig：Including：
Colloidal silica, the upper surface of the colloidal silica are suitable for being bonded the circumferential film for curved surface；
Multiple thermal conducting sleeves, multiple thermal conducting sleeves are arranged in at least a pair of mutually flat of the lower surface of the colloidal silica
Capable bottom edge edge, two ends on the bottom edge are respectively set that there are one the thermal conducting sleeve, the sides of the thermal conducting sleeve
Through hole there are one being opened up on wall, the thermal conducting sleeve and the bottom edge are parallel to each other；
Multiple heat generating cores, the heat generating core are fixed in the through hole, and the heat generating core, which is suitable for being powered, generates heat.
Preferably, being provided with multiple recesses on the lower surface of the colloidal silica, the thermal conducting sleeve is arranged described recessed
In mouthful, there is gap between the upper surface of the thermal conducting sleeve and the bottom face of the recess.
Preferably, the upper surface of the thermal conducting sleeve is provided with multiple heat transmission fins, the upper end of the heat transmission fin
Close to the bottom face of the recess.
Preferably, the heat transmission fin, along the longitudinal direction of the thermal conducting sleeve or cross direction profiles, the heat transmission fin is solid
Be scheduled on the thermal conducting sleeve close to the corner of the colloidal silica one end.
Preferably, being opened up on a thermal conducting sleeve there are one mounting hole, temperature biography is fixed in the mounting hole
Sensor.
Preferably, having led first surface, the first surface on a top margin on the upper surface of the thermal conducting sleeve
It is parallel with the long side curved surface of the colloidal silica.
Preferably, further include pedestal,
Multiple thermal conducting sleeves are fixed on the circumferential direction of the upper surface of the pedestal；
Bayonet there are two being opened up on the upper surface of the pedestal；Card key that there are two the lower surface fixations of the colloidal silica, one
A card key corresponds to a bayonet, and the card key is fixed in the bayonet.
Preferably, further including thermal insulation board, a thermal insulation board corresponds to a thermal conducting sleeve, and the thermal insulation board is fixed on
The bottom of the thermal conducting sleeve, the thermal insulation board are fixed on the base.
Preferably, offering multiple positioning ports on the pedestal, a positioning port corresponds to a thermal insulation board,
The thermal insulation board is fixed in the positioning port, and the depth of the positioning port is equal with the thickness of the thermal insulation board.
Preferably, offering arc-shaped depression portion, the bottom of the arc-shaped depression portion respectively in the opposite plane of two card keys
Face is higher than the bottom surface of the card key；
The arc surface being bonded to each other with the arc-shaped depression portion is led in the upper end of the side wall of the bayonet, and it is recessed that lower end offers card
Portion.
The utility model has the beneficial effects that such anti-fold film adhering jig, by colloidal silica, well for being bonded
Film coordinates heat generating core by thermal conducting sleeve, transfers heat to the bottom side portion of colloidal silica；Again and, because of thermal conducting sleeve and bottom
Side is parallel to each other, to play the uniform effect of heat conduction well.
Description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is a kind of structural schematic diagram of the optimum embodiment of anti-fold film adhering jig of the utility model.
Fig. 2 is the structural schematic diagram of the end face of the utility model colloidal silica.
Fig. 3 is the structural schematic diagram at the back of the utility model colloidal silica.
Fig. 4 is the structural schematic diagram of the optimum embodiment of the utility model thermal conducting sleeve.
Fig. 5 is the structural schematic diagram of the optimum embodiment for the thermal conducting sleeve that the utility model has mounting hole.
Fig. 6 is the structural schematic diagram of the optimum embodiment of the utility model pedestal.
1, colloidal silica in figure, 2, thermal conducting sleeve, 3, heat generating core, 4, temperature sensor, 5, pedestal, 6, thermal insulation board, 1-1, length
Side curved surface, 1-2, corner, 1-3, recess, 1-4, card key, 1-4-1, arc-shaped depression portion, 1-5, bottom edge, 2-1, through hole, 2-2, heat conduction
Fin, 2-3, first surface, 2-4, mounting hole, 5-1, bayonet, 5-2, positioning port, 5-1-1, arc surface, 5-1-2, card recess portion.
Specific implementation mode
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and should not be understood as to the utility model
Limitation.On the contrary, the embodiments of the present invention include falling into owning within the scope of the spirit and intension of attached claims
Variation, modification and equivalent.
In the description of the present invention, it should be understood that term "center", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " axis
To ", " radial direction ", the orientation or positional relationship of the instructions such as " circumferential direction " be to be based on the orientation or positional relationship shown in the drawings, be only for
Convenient for the description present invention and simplify description, specific side must be had by not indicating or implying the indicated device or element
Position, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply relatively important
Property.In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " connected " " connects
Connect " it shall be understood in a broad sense, for example, it may be being fixedly connected, it may be a detachable connection, or be integrally connected；It can be machine
Tool connects, and can also be electrical connection；It can be directly connected, it can also be indirectly connected through an intermediary.For this field
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.In addition, in this reality
With in novel description, unless otherwise indicated, the meaning of " plurality " is two or more.
Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes
It is one or more for realizing specific logical function or process the step of executable instruction code module, segment or portion
Point, and the range of preferred embodiments of the present invention includes other realization, wherein can not press shown or discuss
Sequence, include according to involved function by it is basic simultaneously in the way of or in the opposite order, to execute function, this should be by this
The embodiment person of ordinary skill in the field of utility model is understood.
As shown in Fig. 1 ~ 6, the utility model provides a kind of anti-fold film adhering jig, including：
Colloidal silica 1, the upper surface of colloidal silica 1 are suitable for being bonded the circumferential film for curved surface；
Multiple thermal conducting sleeves 2, multiple thermal conducting sleeves 2 are arranged what at least a pair in the lower surface of colloidal silica 1 was mutually parallel
The bottom edge edges 1-5, two ends of bottom edge 1-5 are respectively set there are one thermal conducting sleeve 2, on the side wall of thermal conducting sleeve 2
Through hole 2-1 there are one opening up, thermal conducting sleeve 2 and bottom edge 1-5 are parallel to each other；
Multiple heat generating cores 3, heat generating core 3 are fixed in through hole 2-1, and heat generating core 3 is suitable for generating heat.
Such anti-fold film adhering jig is used for attaching film, by leading well by the circumferential curved surface of colloidal silica 1
Thermal sleeve 2 coordinates heat generating core 3, transfers heat to the bottom edge portions 1-5 of colloidal silica 1；Again and, because of thermal conducting sleeve 2 and bottom edge 1-5
It is parallel to each other, to play the uniform effect of heat conduction well.The generation of heat, heat generating core 3 are realized by heating power core 3
Similar to heating resistor.
Multiple recess 1-3 are provided on the lower surface of colloidal silica 1, thermal conducting sleeve 2 is arranged in recess 1-3, thermal conducting sleeve 2
Upper surface and the bottom face of recess 1-3 between have gap.By the presence in gap, prevents heat conduction transition and damage colloidal silica
1。
The upper surface of thermal conducting sleeve 2 is provided with multiple heat transmission fin 2-2, and the upper end of heat transmission fin 2-2 is close to recess 1-3
Bottom face.By the setting of heat transmission fin 2-2, first, colloidal silica 1 can be rapidly transferred heat to；Likewise, working as
When pressing film, if there is no heat transmission fin 2-2, it is easy to so that glass is directly generated with the surface of thermal conducting sleeve 2 indirect
Hard contact, to broken glass, and be arranged after heat transmission fin 2-2, form a transition, to avoid to a certain extent
The breakage of glass.
For heat transmission fin 2-2 along the longitudinal direction of thermal conducting sleeve 2 or cross direction profiles, heat transmission fin 2-2 is fixed on the patch of thermal conducting sleeve 2
One end of the corner 1-2 of nearly colloidal silica 1.
It is fixed with temperature sensor 4 in mounting hole 2-4 there are one being opened up on one thermal conducting sleeve 2, mounting hole 2-4.Temperature
Sensor 4 is used for monitoring temperature, realizes temperature control effect.
First surface 2-3, first surface 2-3 and colloidal silica 1 have been led on a top margin on the upper surface of thermal conducting sleeve 2
Long side curved surface 1-1 is parallel.Ensure that the first surface 2-3 of thermal conducting sleeve 2 is capable of the curved surface of preferable attaching film, to ensure to press
Close effect.
Such film adhering jig further includes pedestal 5,
Multiple thermal conducting sleeves 2 are fixed on the circumferential direction of the upper surface of pedestal 5；
Bayonet 5-1 there are two being opened up on the upper surface of pedestal 5；The lower surface of colloidal silica 1 is fixed there are two card key 1-4, and one
A card key 1-4 corresponds to a bayonet 5-1, and card key 1-4 is fixed in bayonet 5-1.
Such film adhering jig further includes thermal insulation board 6, and a thermal insulation board 6 corresponds to a thermal conducting sleeve 2, and thermal insulation board 6 is fixed on
The bottom of thermal conducting sleeve 2, thermal insulation board 6 are fixed on pedestal 5.Thermal insulation board 6 uses heat-barrier material, can be very good protection bottom in this way
Seat 5, while scattering and disappearing for heat can also be prevented well.
Multiple positioning port 5-2 are offered on pedestal 5, a positioning port 5-2 corresponds to a thermal insulation board 6, and thermal insulation board 6 is fixed on
In positioning port 5-2, the depth of positioning port 5-2 is equal with the thickness of thermal insulation board 6.
Arc-shaped depression portion 1-4-1 is offered in plane opposite two card key 1-4 respectively, the bottom surface of arc-shaped depression portion 1-4-1 is high
In the bottom surface of card key 1-4；
The arc surface 5-1-1 being bonded to each other with arc-shaped depression portion 1-4-1 is led in the upper end of the side wall of bayonet 5-1, and lower end opens up
There is card recess portion 5-1-2.Such design can be such that colloidal silica 1 is buckled in well on pedestal 5, without will produce the shifting in level
Position.The setting of card recess portion 5-1-2 is the bottom end to the part between the bottom surface of card key that arc surface 5-1-1 is set for card, to make
Colloidal silica 1 catches on bayonet 5-1, increases entire firmness.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of the term
It states and may not refer to the same embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be
It can be combined in any suitable manner in any one or more embodiments or example.
It is enlightenment, through the above description, related work people with the above-mentioned desirable embodiment according to the utility model
Member can carry out various changes and amendments in the range of without departing from this item utility model technological thought completely.This item is real
It is not limited to the contents of the specification with novel technical scope, it is necessary to which its technology is determined according to right
Property range.
Claims (10)
1. a kind of anti-fold film adhering jig, it is characterised in that：Including：
Colloidal silica, the upper surface of the colloidal silica are suitable for being bonded the circumferential film for curved surface；
Multiple thermal conducting sleeves, multiple thermal conducting sleeves are arranged what at least a pair in the lower surface of the colloidal silica was mutually parallel
Bottom edge edge, two ends on the bottom edge are respectively set there are one the thermal conducting sleeve, on the side wall of the thermal conducting sleeve
Through hole there are one opening up, the thermal conducting sleeve and the bottom edge are parallel to each other；
Multiple heat generating cores, the heat generating core are fixed in the through hole, and the heat generating core is suitable for generating heat.
2. film adhering jig as described in claim 1, it is characterised in that：It is provided on the lower surface of the colloidal silica multiple recessed
Mouthful, the thermal conducting sleeve is arranged in the recess, has between the upper surface of the thermal conducting sleeve and the bottom face of the recess
There is gap.
3. film adhering jig as claimed in claim 2, it is characterised in that：The upper surface of the thermal conducting sleeve is provided with multiple heat conduction
Fin, the bottom face of the upper end of the heat transmission fin close to the recess.
4. film adhering jig as claimed in claim 3, it is characterised in that：The heat transmission fin along the longitudinal direction of the thermal conducting sleeve or
Person's cross direction profiles, the heat transmission fin are fixed on the thermal conducting sleeve close to the one end in the corner of the colloidal silica.
5. film adhering jig as described in claim 1, it is characterised in that：It is fixed there are one being opened up on one thermal conducting sleeve
Hole is fixed with temperature sensor in the mounting hole.
6. film adhering jig as described in claim 1, it is characterised in that：On a top margin on the upper surface of the thermal conducting sleeve
First surface is led, the first surface is parallel with the long side curved surface of the colloidal silica.
7. film adhering jig as described in claim 1, it is characterised in that：Further include pedestal,
Multiple thermal conducting sleeves are fixed on the circumferential direction of the upper surface of the pedestal；
Bayonet there are two being opened up on the upper surface of the pedestal；There are two card key, an institutes for the lower surface fixation of the colloidal silica
It states card key and corresponds to a bayonet, the card key is fixed in the bayonet.
8. film adhering jig as claimed in claim 7, it is characterised in that：Further include thermal insulation board, a thermal insulation board corresponds to an institute
Thermal conducting sleeve is stated, the thermal insulation board is fixed on the bottom of the thermal conducting sleeve, and the thermal insulation board is fixed on the base.
9. film adhering jig as claimed in claim 8, it is characterised in that：Multiple positioning ports, an institute are offered on the pedestal
It states positioning port and corresponds to a thermal insulation board, the thermal insulation board is fixed in the positioning port, the depth of the positioning port and institute
The thickness for stating thermal insulation board is equal.
10. film adhering jig as claimed in claim 7, it is characterised in that：
Arc-shaped depression portion is offered in the opposite plane of two card keys respectively, the bottom surface of the arc-shaped depression portion is higher than the card key
Bottom surface；
The arc surface being bonded to each other with the arc-shaped depression portion is led in the upper end of the side wall of the bayonet, and lower end offers card recess portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820048325.0U CN207772410U (en) | 2018-01-11 | 2018-01-11 | A kind of anti-fold film adhering jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820048325.0U CN207772410U (en) | 2018-01-11 | 2018-01-11 | A kind of anti-fold film adhering jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207772410U true CN207772410U (en) | 2018-08-28 |
Family
ID=63224157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820048325.0U Expired - Fee Related CN207772410U (en) | 2018-01-11 | 2018-01-11 | A kind of anti-fold film adhering jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207772410U (en) |
-
2018
- 2018-01-11 CN CN201820048325.0U patent/CN207772410U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 Termination date: 20210111 |