CN207756639U - A kind of copper material thins molding leveling sideband mold - Google Patents

A kind of copper material thins molding leveling sideband mold Download PDF

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Publication number
CN207756639U
CN207756639U CN201820013182.XU CN201820013182U CN207756639U CN 207756639 U CN207756639 U CN 207756639U CN 201820013182 U CN201820013182 U CN 201820013182U CN 207756639 U CN207756639 U CN 207756639U
Authority
CN
China
Prior art keywords
mold insert
leveling
cavity plate
mold
discharging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820013182.XU
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Chinese (zh)
Inventor
韩鸿君
王绍春
王超军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hebei Chao Ya Precision Punching Electronics Co Ltd
Original Assignee
Hebei Chao Ya Precision Punching Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hebei Chao Ya Precision Punching Electronics Co Ltd filed Critical Hebei Chao Ya Precision Punching Electronics Co Ltd
Priority to CN201820013182.XU priority Critical patent/CN207756639U/en
Application granted granted Critical
Publication of CN207756639U publication Critical patent/CN207756639U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of copper materials to thin molding leveling sideband mold, including fixed part, pressing part and moving portion;The fixed part includes lower die holder, the lower bolster being located on lower die holder and the concave template being located on lower bolster;Cavity plate cushion block is placed in the endoporus of the concave template;Cavity plate leveling mold insert and cavity plate mold insert are placed on the cavity plate cushion block;The cavity plate leveling mold insert is located inside cavity plate mold insert;The pressing part includes discharging backboard and the stripper that is located on discharging backboard bottom surface;Discharging mold insert is equipped in the stripper;Leveling mold insert is equipped in the discharging mold insert;The moving portion includes upper die holder, the upper padding plate being located on upper die holder bottom surface and the upper solid plate being located on upper padding plate bottom surface.

Description

A kind of copper material thins molding leveling sideband mold
Technical field
The utility model is related to Stamping Die Technology field, more particularly to a kind of copper material thins molding leveling sideband mold.
Background technology
Protecgulum uses plastic material PP, since product wall is thin, the fraction defective in injection molding in traditional mobile phone speaker Too high, low output, if simple manually apply sticker vibrating diaphragm, disappears simultaneously as product protecgulum sticks with glue together with vibrating diaphragm Too many human and material resources are consumed, in order to improve production efficiency, protecgulum material have been changed to copper material, and use automatic assembly line instead Loud speaker is assembled, in order to coordinate transfer matic to assemble loud speaker, protecgulum is also required to form a complete production network with transfer matic, makes sideband form, Original plastic cement material will be kept by completing a series of processes, the copper protecgulums such as gluing, patch vibrating diaphragm, dress frame by automatic line traffic control Shape of product needs positive and negative to thin, and product front thins relatively deeply, and 0.4 thick material is thinned down to differ less than 0.1 with bottom surface, Product can be caused to thin bottom surface injustice in this way, product length direction becomes arch upwards, but needs to apply at product front edge Glue vibrating diaphragm, for planarity requirements within 0.03, otherwise gluing is uneven, causes vibrating diaphragm to fall off, the protecgulum of sideband connection structure Transfer matic gluing umber of defectives can be also caused to increase if flatness is bad, glue can also be wasted by not only wasting material.
Utility model content
The utility model is intended to provide a kind of copper material that can effectively correct product internal stress and thins molding leveling sideband mould Tool.
The utility model adopts the following technical solution:
A kind of copper material thins molding leveling sideband mold, including fixed part, pressing part and moving portion;
The fixed part includes lower die holder, the lower bolster being located on lower die holder and the concave template being located on lower bolster;It is described Cavity plate cushion block is placed in the endoporus of concave template;Cavity plate leveling mold insert and cavity plate mold insert are placed on the cavity plate cushion block;It is described Cavity plate leveling mold insert is located inside cavity plate mold insert;
The pressing part includes discharging backboard and the stripper that is located on discharging backboard bottom surface;It is equipped with and unloads in the stripper Expect mold insert;Leveling mold insert is equipped in the discharging mold insert;
The upper padding plate and be located at upper solid on upper padding plate bottom surface that the moving portion includes upper die holder, is located on upper die holder bottom surface Plate.
As further solution:The bottom surface of the stripper is generally aligned in the same plane interior with the bottom surface of discharging mold insert; Discharging mold insert is stretched out in the lower end of the leveling mold insert.
As further solution:The side of the cavity plate leveling mold insert is equipped with protrusion;The cavity plate mold insert Inner wall is equipped with groove;The protrusion is located in groove;The height of the protrusion is identical as the height of groove.
As further solution:The top surface of the cavity plate leveling mold insert is curved surface.
As further solution:The discharging mold insert is interference fitted with stripper.
As further solution:The leveling mold insert is interference fitted with discharging mold insert.
The good effect that the utility model generates is as follows:
The utility model uses split-type design, and low manufacture cost, maintenance maintenance is conveniently.Cavity plate cushion block is placed on concave template Interior, cavity plate leveling mold insert is placed on cavity plate cushion block, and cavity plate mold insert is sleeved on cavity plate cushion block, is tucked into concave template, by cavity plate Leveling mold insert is tightly pressed on cavity plate cushion block.Workpiece in punching course is that cavity plate flattens mold insert, when it is needed replacing When, remove cavity plate mold insert, it will be able to which convenient cavity plate of replacing flattens mold insert;Same leveling mold insert is to be threadedly coupled with discharging mold insert , when it wears, it can directly be replaced after backing out leveling mold insert, not only simplify replacement step, also a save more The time is changed, production efficiency is improved.
Plane is curved surface on the cavity plate leveling mold insert of the utility model, can will be in preceding working procedure during punching press The tablet being bent is straightened again, discharges the internal stress of tablet, ensures being normally carried out for next process.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model;
Wherein:1 upper die holder, 2 upper padding plates, solid plate, 4 discharging backboards, 5 strippers, 6 concave templates, 7 lower bolsters, 8 lower dies on 3 Seat, 9 leveling mold inserts, 10 discharging mold inserts, 11 cavity plates leveling mold insert, 12 cavity plate mold inserts, 13 cavity plate cushion blocks.
Specific implementation mode
The utility model is further described with reference to Fig. 1.
The utility model adopts the following technical solution:
A kind of copper material thins molding leveling sideband mold, including fixed part, pressing part and moving portion;
The fixed part includes lower die holder 8, the lower bolster 7 being located on lower die holder 8 and the concave template 6 being located on lower bolster 7; Cavity plate cushion block 13 is placed in the endoporus of the concave template 6;Cavity plate leveling mold insert 11 and recessed is placed on the cavity plate cushion block 13 Mould mold insert 12;The cavity plate leveling mold insert 11 is located inside cavity plate mold insert 12;
The pressing part includes discharging backboard 4 and the stripper 5 that is located on 4 bottom surface of discharging backboard;It is set in the stripper 5 There is discharging mold insert 10;Leveling mold insert 9 is equipped in the discharging mold insert 10;
The upper padding plate 2 and be located on 2 bottom surface of upper padding plate that the moving portion includes upper die holder 1, is located on 1 bottom surface of upper die holder Upper solid plate 3.
As further solution:The bottom surface of the stripper 5 and the bottom surface of discharging mold insert 10 are generally aligned in the same plane It is interior;Discharging mold insert 10 is stretched out in the lower end of the leveling mold insert 9.
As further solution:The side of the cavity plate leveling mold insert 11 is equipped with protrusion;The cavity plate mold insert 12 inner wall is equipped with groove;The protrusion is located in groove;The height of the protrusion is identical as the height of groove.
As further solution:The top surface of the cavity plate leveling mold insert 11 is curved surface.
As further solution:The discharging mold insert 10 is interference fitted with stripper 5.
As further solution:The leveling mold insert 9 is interference fitted with discharging mold insert 10.
The utility model is used for the production of mobile phone speaker protecgulum, and effect is to eliminate the planted agent of tablet in a upper procedure Power keeps its smooth.
The course of work of the utility model is further described with reference to punching course.
The tablet that punching press is completed in upper one of production process is transported to this procedure with material strip, and moving portion is downward first Mobile, stripper 5 contacts with concave template 6, material strip is fixed;Leveling mold insert 9 and cavity plate leveling mold insert 11 clamp tablet, prevent Its displacement.
Meanwhile moving portion is rapidly moving downward, pounds to pressing part, pressing part by after thrust by flatten mold insert 9 by its Pass to tablet, the entire upper surface of tablet by a downward pressure, cavity plate flatten mold insert 11 to tablet apply one to On pressure because cavity plate leveling mold insert 11 is intermediate high, surrounding is low, and the middle section of tablet is first under pressure, and around Diffusion.The bending direction of tablet flattens the radian of 11 upper surface of mold insert on the contrary, by the step with cavity plate, and tablet can be made flat It is whole.
After the completion of punching press, tablet is transferred to next process.
Upper solid plate 3 and discharging backboard 4 use split-type design, put when deforming, wearing, can in time into Row is replaced.Upper padding plate 2 mainly works as a buffer, and absorbs vibrations, protects upper die holder 1.Lower bolster 7 plays the role of and upper padding plate 2 Effect it is identical, mainly protect lower die holder 8.
Finally it should be noted that above example is only to illustrate the technical solution of the utility model, rather than its limitations, Although the utility model is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that, It can still modify to the technical solution recorded in previous embodiment, or be equal to which part technical characteristic It replaces, and these modifications or replacements, the utility model embodiment technical solution that it does not separate the essence of the corresponding technical solution Spirit and scope.

Claims (6)

1. a kind of copper material thins molding leveling sideband mold, it is characterised in that:Including fixed part, pressing part and moving portion;
The fixed part includes lower die holder(8), be located at lower die holder(8)On lower bolster(7)Be located at lower bolster(7)On cavity plate Plate(6);The concave template(6)Endoporus in be placed with cavity plate cushion block(13);The cavity plate cushion block(13)On to be placed with cavity plate whole Flat mold insert(11)With cavity plate mold insert(12);The cavity plate flattens mold insert(11)Positioned at cavity plate mold insert(12)It is internal;
The pressing part includes discharging backboard(4)Be located at discharging backboard(4)Stripper on bottom surface(5);The stripper(5) It is interior to be equipped with discharging mold insert(10);The discharging mold insert(10)It is interior to be equipped with leveling mold insert(9);
The moving portion includes upper die holder(1), be located at upper die holder(1)Upper padding plate on bottom surface(2)Be located at upper padding plate(2)Bottom surface On upper solid plate(3).
2. a kind of copper material according to claim 1 thins molding leveling sideband mold, it is characterised in that:The stripper (5)Bottom surface and discharging mold insert(10)Bottom surface be generally aligned in the same plane in;The leveling mold insert(9)Lower end stretch out discharging mold insert (10).
3. a kind of copper material according to claim 1 thins molding leveling sideband mold, it is characterised in that:The cavity plate leveling Mold insert(11)Side be equipped with protrusion;The cavity plate mold insert(12)Inner wall be equipped with groove;The protrusion is located in groove; The height of the protrusion is identical as the height of groove.
4. a kind of copper material according to claim 3 thins molding leveling sideband mold, it is characterised in that:The cavity plate leveling Mold insert(11)Top surface be curved surface.
5. a kind of copper material according to claim 1 thins molding leveling sideband mold, it is characterised in that:The discharging mold insert (10)With stripper(5)Interference fit.
6. a kind of copper material according to claim 5 thins molding leveling sideband mold, it is characterised in that:The leveling mold insert (9)With discharging mold insert(10)Interference fit.
CN201820013182.XU 2018-01-04 2018-01-04 A kind of copper material thins molding leveling sideband mold Expired - Fee Related CN207756639U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820013182.XU CN207756639U (en) 2018-01-04 2018-01-04 A kind of copper material thins molding leveling sideband mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820013182.XU CN207756639U (en) 2018-01-04 2018-01-04 A kind of copper material thins molding leveling sideband mold

Publications (1)

Publication Number Publication Date
CN207756639U true CN207756639U (en) 2018-08-24

Family

ID=63183377

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820013182.XU Expired - Fee Related CN207756639U (en) 2018-01-04 2018-01-04 A kind of copper material thins molding leveling sideband mold

Country Status (1)

Country Link
CN (1) CN207756639U (en)

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180824

Termination date: 20220104