CN207752985U - A kind of CSP carriers - Google Patents
A kind of CSP carriers Download PDFInfo
- Publication number
- CN207752985U CN207752985U CN201721761131.7U CN201721761131U CN207752985U CN 207752985 U CN207752985 U CN 207752985U CN 201721761131 U CN201721761131 U CN 201721761131U CN 207752985 U CN207752985 U CN 207752985U
- Authority
- CN
- China
- Prior art keywords
- csp
- carrier plate
- carriers
- rest area
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
A kind of CSP carriers, including glass carrier plate, the rest area for placing CSP chips is equipped on glass carrier plate, the rest area includes the square blocks that several are arranged in array, square blocks are equipped with light non-transmittable layers, surrounding on glass carrier plate and positioned at rest area is additionally provided with positioning tag slot and cutting tag slot, CSP chips are put on rest area, make the position alignment of CSP chips and rest area by positioning the positioning tag line of tag slot, then cutting process is carried out to CSP chips by cutting the position of tag line, when carrying out cutting operation to CSP chips, the light-illuminating of cutting equipment is on glass carrier plate, cut tag line, positioning tag line can carry out image identification, accomplish to be accurately positioned.
Description
Technical field
The utility model is related to a kind of CSP carriers.
Background technology
Wafer-level package, that is, CSP（chip scale package）, have it is small, light-weight and good electrical property etc. is excellent
Point becomes memory chip encapsulation technology of new generation, and flip-chip is due to electrical by the chip of wire bond and substrate connection
Down, have the advantages that specular removal, high reliability and be easily integrated, to be widely used in CSP encapsulation technologies.But
Special design is carried out to the cutting operation of CSP chips there is no special carrier at present.
Invention content
The technical problem to be solved by the present invention is to provide a kind of flatness, and high, the convenient CSP of cutting positioning operation is carried
Tool.
In order to solve the above-mentioned technical problem, the utility model includes glass carrier plate, is equipped with and places on glass carrier plate
The rest area of CSP chips, the rest area include the square blocks that several are arranged in array, and on glass carrier plate and are located at
The surrounding of rest area is additionally provided with positioning tag slot and cutting tag slot.
The surrounding on the glass carrier plate positioned at rest area is additionally provided with pad pasting as a further improvement of the utility model,
Marked area.
The cutting tag slot is several cutting marks disposed in parallel as a further improvement of the utility model,
Line is equipped with light non-transmittable layers, the position phase of adjacent two cuttings mark line position and square blocks two sides on cutting tag line
It is corresponding.
The positioning tag slot includes the L-type for being located at rest area corner location as a further improvement of the utility model,
Tag line is positioned, light non-transmittable layers are equipped on positioning tag line.
The pad pasting marked area includes the pad pasting being located near carrier plate quadrangle as a further improvement of the utility model,
Tag line is equipped with light non-transmittable layers on pad pasting tag line.
The light non-transmittable layers are layers of chrome as a further improvement of the utility model,.
There is interval between two neighboring square blocks as a further improvement of the utility model,.
The beneficial effects of the utility model：By in CSP arrangements of chips to rest area, pass through the impermeable light-seeking mark of rest area
Know and realize being accurately positioned for CSP chips and rest area, then realizes being accurately positioned to CSP of cutting blade by cutting tag line
It is cut, accomplishes to be accurately positioned.Because carrier plate is glass material, it can ensure the high-flatness requirement of carrier plate in this way,
The thickness deviation of carrier plate can also be made to control within ± 5um, marking line allowance control is in ± 1um, to make the essence of cutting
Accuracy higher.
Description of the drawings
It is next with reference to the accompanying drawings and detailed description that the utility model is described in more detail.
Fig. 1 is the structure chart of the utility model.
Fig. 2 is the arrangement view of the square blocks of the utility model.
Specific implementation mode
Shown in Fig. 1 to Fig. 2, the utility model includes glass carrier plate, is equipped on glass carrier plate and places CSP chips
Rest area 1, the rest area 1 includes several square blocks 2 for being arranged in array, is had between two neighboring square blocks 2
Interval, square blocks 2 are equipped with light non-transmittable layers, and the surrounding on glass carrier plate and positioned at rest area 1 is additionally provided with positioning mark
Area and cutting tag slot and pad pasting marked area, the positioning tag slot include the L-type positioning mark for being located at 1 corner location of rest area
Line 3 is equipped with light non-transmittable layers on positioning tag line 3, and the cutting tag slot is several cutting tag lines 4 disposed in parallel,
Light non-transmittable layers, the position phase of adjacent two cuttings 4 position of tag line and 2 two sides of square blocks are equipped on cutting tag line 4
Corresponding, the light non-transmittable layers are layers of chrome.The pad pasting marked area includes the pad pasting tag line 5 being located near carrier plate quadrangle,
Pad pasting tag line 5 is equipped with light non-transmittable layers.
CSP chips are put on rest area 1, make CSP chips and rest area by positioning the positioning tag line 3 of tag slot
Then 1 position alignment carries out cutting process by cutting the position of tag line 4 to CSP chips, because light non-transmittable layers are chromium
Layer, when carrying out cutting operation to CSP chips, the light-illuminating of cutting equipment is cut on glass carrier plate on tag line 4
Layers of chrome can be carried out image identification, accomplish to be accurately positioned, be realized full-automatic cutting operation due to opaque.Because carrier plate is
Glass material can be ensured the high-flatness requirement of carrier plate by processing, can also make the thickness deviation of the carrier plate in this way
Control is within ± 5um, and marking line allowance control is in ± 1um, to make the precision higher of cutting.Because of adjacent two cuttings
4 position of tag line is corresponding with the position of 2 two sides of square blocks, in this way can be convenient by CSP chips by cutting tag line
Cut into the shape of square blocks.
Claims (7)
1. a kind of CSP carriers, it is characterised in that：Including glass carrier plate, it is equipped on glass carrier plate and places putting for CSP chips
Area is set, the rest area includes the square blocks that several are arranged in array, on glass carrier plate and positioned at the four of rest area
It is additionally provided with positioning tag slot and cutting tag slot week.
2. CSP carriers as described in claim 1, it is characterised in that：On the glass carrier plate also positioned at the surrounding of rest area
Equipped with pad pasting marked area.
3. CSP carriers as described in claim 1, it is characterised in that：The cutting tag slot is that several disposed in parallel are cut
Tag line is cut, light non-transmittable layers, adjacent two cuttings mark line position and square blocks two sides are equipped on cutting tag line
Position is corresponding.
4. CSP carriers as described in claim 1, it is characterised in that：The positioning tag slot includes being located at rest area quadrangle position
The L-type positioning tag line set, light non-transmittable layers are equipped on positioning tag line.
5. CSP carriers as described in claim 2, it is characterised in that：The pad pasting marked area is attached including being located at carrier plate quadrangle
Close pad pasting tag line is equipped with light non-transmittable layers on pad pasting tag line.
6. by the CSP carriers described in claim 4 or 5, it is characterised in that：The light non-transmittable layers are layers of chrome.
7. CSP carriers as described in claim 1, it is characterised in that：There is interval between two neighboring square blocks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721761131.7U CN207752985U (en) | 2017-12-17 | 2017-12-17 | A kind of CSP carriers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721761131.7U CN207752985U (en) | 2017-12-17 | 2017-12-17 | A kind of CSP carriers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207752985U true CN207752985U (en) | 2018-08-21 |
Family
ID=63147969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721761131.7U Expired - Fee Related CN207752985U (en) | 2017-12-17 | 2017-12-17 | A kind of CSP carriers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207752985U (en) |
-
2017
- 2017-12-17 CN CN201721761131.7U patent/CN207752985U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180821 Termination date: 20211217 |