Invention content
The technical problem to be solved by the present invention is to how be rapidly selected a kind of height of electronic and electrical equipment
Heat sink conception is imitated, a kind of simulation is provided and is radiated test device and system.
Technical solution adopted by the utility model to solve its technical problems is:A kind of simulation heat dissipation test device is provided,
Including babinet, the support component being fixed in babinet, be arranged in support component and can adjust up and down any position to
At least one heating circuit module and heating electric for being used for simulating different heat power consumptions is arranged in placement plate in a few placement plate
Road module is connected and provides the supply unit of electric energy, be connected the temperature for acquiring its real-time temperature data with heating circuit module
Harvester, the radiator for being detachably fixed and radiating to it with heating circuit module.
Preferably, the support component include be fixed on the first fixed seat at left and right sides of babinet, two it is setting up and down and
The horizontal slide rail being fixed in the first fixed seat and at least one longitudinal slide rail component;Longitudinal slide rail component includes two left sides
The longitudinal slide rail of right setting, two the first sliding parts for being set to longitudinal slide rail both ends, longitudinal slide rail component pass through the first sliding
Part horizontally slips in horizontal slide rail.
Preferably, the longitudinal slide rail component further includes that placement plate is slided up and down second in two longitudinal slide rails to slide
Moving part;Second sliding part includes the longitudinal hole circumferentially formed for the position of placement plate bottom surface closely longitudinal slide rail;First sliding
Part includes the intermediate single sliding block fixed plate for being equipped with a cross through hole, and single sliding block fixed plate is set in the transverse direction by cross through hole
On sliding rail.
Preferably, further include the fixed plate for being detachably secured to placement plate upper surface, be detachably secured to fixed plate upper table
Face is used to fix the heat source fixed plate of heating circuit module, and radiator is detachably secured to heating circuit module upper surface.
Preferably, the support component further includes that the placement for placement plate to be fixed in longitudinal slide rail is buckled, is used for
Longitudinal slide rail component is fixed on the buckle of the sliding rail in horizontal slide rail.
Preferably, the babinet include side frame, horizontal support comprising more equidistantly distributeds rear cover of box, be hinged on
The babinet protecgulum of side frame and the fixed component for static housing rear cover, babinet buckle, for the fixation bottom of static housing
Seat;Side frame is equipped with the first groove at left and right position corresponding with horizontal support;The width of first groove and the size of horizontal support
It is adapted, horizontal support is moved forward and backward along the first groove to adjust housing interior volume and be fixed on by fixed component specified
Position;Babinet buckle is that concave is used for static housing protecgulum and rear cover of box.
Preferably, the fixed component includes that the positioning screw seat of left plate and right plate centre position in side frame is arranged
With zigzag positioning screw, positioning screw seat is U-shaped and is open towards rear cover of box, the closed one end convex of positioning screw seat
Go out to form the first positioning spiro pit;Horizontal support includes the first horizontal support, the second horizontal support and third horizontal support;Second
The both ends of horizontal support and the first positioning spiro pit relative position are equipped with the second positioning threads coordinated with the first positioning spiro pit
Hole, positioning screw seat pass through the first positioning spiro pit and the second threaded hole that the second horizontal support is fixed.
Preferably, the right plate of the side frame and the babinet protecgulum realize the babinet protecgulum by hinge connection
Opening is turned over, the lock body for locking babinet protecgulum is provided on the left plate of the side frame.
Preferably, the top-side panel of the side frame is equipped with multiple first heat emission holes, the top-side panel of side frame radiates with multiple first
Hole corresponding position outer surface is equipped with the first sliding groove formed in the horizontal stripe of inverted L-shaped by two and two are relatively arranged on first
The first shutter in sliding slot for covering the first heat emission hole;The bottom side plate of side frame is equipped with the bottom of multiple second heat emission holes, side frame
Side plate and multiple second heat emission hole corresponding position outer surfaces be equipped with the second sliding slot formed in the horizontal stripe of inverted L-shaped by two and
Two are relatively arranged on the second shutter in second sliding slot for covering the second heat emission hole.
The utility model also provides a kind of simulation heat dissipation test system, including simulates heat dissipation test device as described above,
And it obtains the real time temperature data of simulation heat dissipation test device and carries out the data analysis set-up of heat dissipation comparative analysis to it.
The technical solution for implementing the utility model simulation heat dissipation test device and system, has the following advantages or technology is imitated
Fruit:The utility model simulation heat dissipation test device adjusts the hot merit of heating circuit module by adjusting the power of supply unit
Consumption, and then the calorific value of different electronic components can be simulated, for the heating circuit module, select the heat dissipation of different heat dissipation performances
Device is tested, and specific test includes the different location, the different heat power consumptions of heating circuit module, heat dissipation of heating circuit module
The different heat dissipation performances of device and the different-thickness of babinet etc. carry out every test, and by analyzing comprehensively, provide different electricity
The preferred heat sink conception of sub- electrical equipment, simple operation.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, what be will be described below is various
Embodiment will refer to corresponding attached drawing, these attached drawings constitute a part for embodiment, and which describe realize that this practicality is new
The various embodiments that type may use.It should be appreciated that other embodiments also can be used, or embodiment enumerated herein is carried out
Modification structurally and functionally, without departing from the scope of the utility model and essence.
As shown in Figs. 1-5, the utility model provides a kind of simulation heat dissipation test device embodiment, including babinet 10, fixation
Support component 20 in babinet 10 is arranged in support component 20 and can adjust at least one of any position up and down and puts
It sets plate 30, at least one heating circuit module 40 and heating circuit for simulating different heat power consumptions is set in placement plate 30
Module 40 is connected and provides the supply unit 50 of electric energy, is connected for acquiring its real-time temperature data with heating circuit module 40
Temperature collecting device 70, the radiator 80 for being detachably fixed and radiating to it with heating circuit module 40.Specifically, electric
Source device 50 adjusts its output power and is worked within the scope of different temperature with controlling heating circuit module 40, works in different
Heating circuit module 40 in temperature range selects the radiator 80 of different heat dissipation performances.Temperature collecting device 70 can be temperature
Sensor is spent, can also be lead-type temperature sensor.
The utility model simulation heat dissipation test device adjusts heating circuit module by adjusting the power of supply unit 50
40 heat power consumption, and then the calorific value of different electronic components can be simulated, for the heating circuit module 40, select different heat dissipations
The radiator of performance is tested, and specific test includes different location, the heating circuit module 40 of heating circuit module 40
Different-thickness of different heat power consumptions, the different heat dissipation performances of radiator 80 and babinet etc. carries out every test, and by complete
Surface analysis provides the preferred heat sink conception of different electronic and electrical equipments, simple operation.
In the present embodiment, behind the position and heat power consumption for adjusting heating circuit module 40, radiator 80 is installed,
Heat dissipation effect of the radiator 80 chosen for heating circuit module 40 is determined by the temperature that temperature collecting device 70 is shown.
Continue to replace the radiator 80 if the radiator 80 chosen does not obtain satisfied heat dissipation effect.Each heating electric
Road module 40 just represents a heat-generating electronic elements.Support component 20 adjusts the position of placement plate 30 to test position up and down
In any position in babinet 10 radiator 80 for heating circuit module 40 heat dissipation effect.
In the present embodiment, support component 20 includes being fixed in the first fixed seat 23, two of 10 left and right sides of babinet
Lower setting and the horizontal slide rail 21 and at least one longitudinal slide rail component 22 being fixed in the first fixed seat 23;This is longitudinally sliding
Rail assembly 22 includes the longitudinal slide rail 221 of two left and right settings, is set to two first sliding parts at 221 both ends of longitudinal slide rail
222, longitudinal slide rail component 22 is horizontally slipped by the first sliding part 222 and is fixed in horizontal slide rail 21.First fixed seat 23 is
With reeded inverted T-shaped, groove is used for placing horizontal slide rail 21.Longitudinal slide rail component 22 can be multiple, due to simulation electronic
The electronic component of multiple fevers in electrical equipment, it is preferred that the quantity of the longitudinal slide rail component 22 of the present embodiment is 3, that is, is existed
3 pieces of placement plates 30 can be placed in babinet 10, that is, can place 3 heating circuit modules 40.
More specifically, horizontal slide rail 21 is connected to by the first fixed seat 23 in rear cover of box 102, wherein one laterally sliding
Rail 21 is mounted on the top-side panel of closely babinet 10, in addition a bottom side plate for being mounted on closely babinet 10, two if designing in this way
Maximum separated by a distance between root horizontal slide rail 21, the length of longitudinal slide rail component 22 is also longer, what placement plate 30 slided up and down
Space is also bigger.Placement plate 30 is arranged in longitudinal slide rail 221.It is longitudinal since placement plate 30 is provided in longitudinal slide rail 221
Sliding rail 221 is moved left and right by the first sliding part 222, and then realizes the variation of 30 position of placement plate, due to longitudinal slide rail group
Part 22 can be moved in 21 or so any position of horizontal slide rail, and placement plate 30 can be in about 221 any position of longitudinal slide rail
Mobile, therefore, placement plate 30 can be in any position in babinet 10, and then can be to the fever of any position in babinet 10
Circuit module 40 carries out every test.
Specifically, longitudinal slide rail component 22 further includes slided up and down placement plate 30 in two longitudinal slide rails 221
Two sliding parts 223.Second sliding part 223 includes circumferentially being formed for the position of 30 bottom surface of placement plate closely longitudinal slide rail 221
Longitudinal hole 224.First sliding part 222 includes the intermediate single sliding block fixed plate 225 for being equipped with a cross through hole 226, single sliding block
Fixed plate 225 is set in by cross through hole 226 in horizontal slide rail 21.
In the present embodiment, simulation heat dissipation test device further includes being detachably secured to the fixed plate of 30 upper surface of placement plate
90, it is detachably secured to heat source fixed plate 91 of 90 upper surface of fixed plate for fixing heating circuit module 40, radiator 80
It is detachably secured to 40 upper surface of heating circuit module.Specifically, radiator 80 is fixed in fixed plate 90, and and heating electric
40 Contact of road module its radiate.More specifically, which can be cooling fin, radiator fan, painting
It is covered with the cooling fin etc. of thermal dispersant coatings, therefore not to repeat here.Preferably, the material of heat source fixed plate 91 is bakelite or steel plate.
In the present embodiment, placement plate 30, fixed plate 90, heat source fixed plate 91, be correspondingly provided on radiator 80
Multiple screw holes 302 for fixing heating circuit module 40, screw sequentially pass through placement plate 30, fixed plate 90, heat source fixed plate
91 and radiator 80 screw hole 302, and then reach fixed effect.It is of course also possible to use other fixed forms are consolidated
Fixed, therefore not to repeat here.
In the present embodiment, support component 20 further includes the placement for being fixed on placement plate 30 in longitudinal slide rail 221
Buckle 24, the sliding rail buckle 25 for being fixed on longitudinal slide rail component 22 in horizontal slide rail 21.Specifically, when placement plate 30 is logical
The second sliding part 223 is crossed after the movement of longitudinal slide rail 221, in order to consolidate the position of placement plate 30, in the both ends of placement plate 30 institute
221 position of longitudinal slide rail at place sets up dismountable place and buckles 24, when needing to move placement plate 30 again, will place first
Buckle 24 is removed, and mobile placement plate 30 buckles placement buckle 24 again.Likewise, when longitudinal slide rail 221 has reached designated position
Afterwards, it is arranged at the both ends of single sliding block fixed plate 225 and places buckle 24.It is equally dismountable to place buckle 24, that is, needs to move
When longitudinal slide rail component 221, buckle 24 will be placed and removed;When needing fixed, placement buckle 24 is clipped in single sliding block and is fixed
In the horizontal slide rail 21 at 225 both ends of plate.In the present embodiment, the shape for placing buckle 24 is C-shaped, and material is elastic material,
It is plastic material in the present embodiment.It is not limited to described in the present embodiment at this point, it should be noted that placing buckle 24
This is a kind of, as long as can shelf tool for fixing can all use.
In the present embodiment, after the babinet of horizontal support 13 of the babinet 10 including side frame 11, comprising more equidistantly distributeds
Lid 12, the babinet protecgulum 16 for being hinged on side frame 11 and for static housing rear cover 12 fixed component 60, be used for static housing
10 firm banking 19;Babinet 10 further includes dismountable babinet for consolidating babinet protecgulum 16 and rear cover of box 12 is concave
Buckle 18.The concave size of babinet buckle 18 is adapted with 10 thickness of babinet.Firm banking 19 includes the second buckle in ship type
191, third groove 192 is offered in the second 191 bottom centre positions of buckle, has been inserted perpendicularly into and third in third groove 192
The fixed plate 193 that 192 matching size of groove closes.
In the present embodiment, side frame 11 is equipped with the first groove 15 at left and right position corresponding with horizontal support 13;First is recessed
The width of slot 15 is adapted with the size of horizontal support 13, and horizontal support 13 is moved forward and backward along the first groove 15 to adjust babinet
10 inner spaces are simultaneously fixed on designated position by fixed component 60.Pass through the first setting of groove 15 and matching for horizontal support 13
The thickness of babinet 10 can be adjusted by closing, and allow for simulation heat dissipation test device in this way and can match different size of electronic apparatus setting
It is standby.
In the present embodiment, fixed component 60 includes the positioning being arranged in the left plate and right plate centre position of side frame 11
Screw bolt seat 61 and zigzag positioning screw 62, positioning screw seat 61 are U-shaped and are open towards rear cover of box 12, positioning screw seat 61
Closed one end outwardly protrudes to form the first positioning spiro pit 63;Horizontal support 13 includes that the first horizontal support 131, second is lateral
Holder 132 and third horizontal support 133;Second horizontal support 132 and the both ends of 63 relative position of the first positioning spiro pit are equipped with
With the second positioning spiro pit 64 of the first positioning spiro pit 63 cooperation, positioning screw seat 61 passes through the first positioning spiro pit 63 and the
Second horizontal support 132 is fixed to adjust the front and back position of rear cover of box 12 for two threaded holes 64.More specifically, when need
When adjusting the thickness of babinet 10, rear cover of box 12 is pushed along the first groove 15 with external force, before realizing rear cover of box 12
Mobile adjustment tank thickness afterwards.
In the present embodiment, the right plate of side frame 11 and babinet protecgulum 16 are connected by hinge 161, realize babinet protecgulum 16
The lock body 162 for turning over opening, being provided with for locking babinet protecgulum 16 on the left plate of side frame 11.Specifically, convenient for taking
Heating circuit module 40 is put, when opening babinet protecgulum 16, because babinet protecgulum 16 is that hinge is flexibly connected with right plate, babinet
Protecgulum 16 is need not completely to be taken off from babinet, is thus used just more convenient.It is set on the left plate of side frame 11
It is equipped with the lock body 162 for locking babinet protecgulum 16, the lid conjunction that babinet protecgulum 16 and left plate may be implemented is firm.
In order to reach the use environment same with electronic and electrical equipment, at least side of side frame 11 is equipped with multiple heat emission holes,
Quantity, size and the position of setting of heat emission hole can be determined according to practical electronic and electrical equipment to be tested.For example, I
Test a television set heat-generating electronic elements running temperature, top plate, left plate and the right plate of television set are equipped with scattered
Hot hole, then heat emission hole can also be arranged in the identical side of babinet in simulation heat dissipation test device.The setting of heat emission hole is also to be
The running environment of better simulation electronic electrical equipment internal heat generation electronic component.
In the present embodiment, the top-side panel of side frame 11 be equipped with multiple first heat emission holes 111, side frame 11 top-side panel with it is multiple
First heat emission hole, 111 corresponding position outer surface is equipped with the first sliding groove 175 and two formed in the horizontal stripe 174 of inverted L-shaped by two
It is a to be relatively arranged on the first shutter 171 moved in the first sliding groove 175 for covering the first heat emission hole 111;Side frame 11
It is same that bottom side plate is equipped with multiple second heat emission holes 112, the bottom side plate of side frame 11 and 112 corresponding position outer surface of multiple second heat emission holes
Sample is equipped with the second sliding slot 113 formed in the horizontal stripe 174 of inverted L-shaped by two and two are relatively arranged in second sliding slot 113
Move the second shutter 172 for covering the second heat emission hole 112;The end of first shutter 171 and the second shutter 172
Formation handle 173 protruding upward.
In the present embodiment, the setting of the first shutter 171 and the second shutter 172 is dissipated to preferably adjust first
The quantity of hot hole 111 and the second heat emission hole 112 being aerated.Specifically, for the different electronic and electrical equipment of size, respectively
The heat dissipation hole number being aerated being arranged is different, at this time, for better simulation test environment, so that it may to pass through first
The quantity of shutter 171 and the second shutter 172 adjustment the first heat emission hole 111 and the second heat emission hole 112, so it is more accurate
Electronic and electrical equipment to be tested is simulated, to obtain more targeted, more accurate test result.
The utility model adjusts the heat power consumption of heating circuit module by adjusting the power of supply unit, and then can be with mould
The calorific value for intending different electronic components, the specific test for the heating circuit module include different location, difference heat power consumption, no
Every test is carried out with heat dissipation performance and different-thickness etc., and preferred heat sink conception, simple operation are provided by analyzing comprehensively.
As shown in fig. 6, the utility model also provides a kind of heat dissipation test system embodiment, including simulation described above dissipates
Heat test device 100, and with the simulation heat dissipation test device be connected 100 obtain simulation radiate test devices 100 real-time temperature
Degrees of data and the data analysis set-up 200 that heat dissipation comparative analysis is carried out to it.Specifically, heating circuit module 40 is placed on mould
In quasi- heat dissipation test device 100, heating circuit module 40 is obtained in different radiators 80, difference by temperature collecting device 70
Position, different-thickness, different heat power consumption situation real time temperature data after be sent to data analysis set-up 200, data analysis dress
Comprehensive analyzing processing, which is carried out, after setting 200 reception test datas and provides analysis result being shown.
The utility model adjusts the heat power consumption of heating circuit module by adjusting the power of power-supply system, and then can be with mould
The calorific value for intending different electronic components, the specific test for the heating circuit module include different location, difference heat power consumption, no
Every test is carried out with heat dissipation performance and different-thickness etc., and preferred heat sink conception, simple operation are provided by analyzing comprehensively.
The above is only the preferred embodiment of the utility model only, and those skilled in the art know, is not departing from this
In the case of the spirit and scope of utility model, various changes or equivalent replacement can be carried out to these features and embodiment.Separately
Outside, it under the introduction of the utility model, can modify to these features and embodiment to adapt to particular situation and material
Without departing from the spirit and scope of the utility model.Therefore, the utility model is not by specific embodiment disclosed herein
It limits, the embodiment within the scope of fallen with claims hereof belongs to the scope of protection of the utility model.