CN207747249U - A kind of silicon chip cutting heat sink - Google Patents
A kind of silicon chip cutting heat sink Download PDFInfo
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- CN207747249U CN207747249U CN201721719413.0U CN201721719413U CN207747249U CN 207747249 U CN207747249 U CN 207747249U CN 201721719413 U CN201721719413 U CN 201721719413U CN 207747249 U CN207747249 U CN 207747249U
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- water
- water tank
- silicon chip
- pipe
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Abstract
The utility model discloses a kind of silicon chip cutting heat sinks, including bottom plate, the quadrangle of bottom plate is equipped with vertical upright bar, the vertical one end of upright bar far from bottom plate is equipped with top plate, circular groove is offered on bottom plate, Cutting platform is equipped with by pillar in circular groove, cutter device is installed above the lower section Cutting platform of top plate, the bottom of circular groove offers round hole slot, circular groove is connected with the first water pipe by round hole slot, the one end of first water pipe far from circular groove is equipped with the first water tank, the inside of first water tank is equipped with filter plate, and first water tank a side filter plate below be communicated with the second water pipe, the one end of second water pipe far from the first water tank is equipped with water pump, the side of water pump is connected with circulation pipe.The utility model in silicon chip cutting process, carries out quick spray cooling, and by blower device auxiliary temperature-reducing, quickly reduce temperature when silicon chip cutting by the second water tank, third water pipe, water dish, nozzle to silicon chip cutting.
Description
Technical field
The utility model is related to silicon chip cutting technique field more particularly to a kind of silicon chip cutting heat sinks.
Background technology
The development of science and technology constantly pushes the development of semiconductor.The technologies development such as automation and computer, makes silicon chip
It is usually the thin slice cut by silicon heavy stone used as an anchor or silico briquette that (integrated circuit), which has increasingly wider application market, existing silicon chip, directly
Diameter have 6 inches, 8 inches, 12 inches of equal-specifications be mainly used to produce integrated circuit, the chip made of silicon chip be it is famous " god
Operator " is mainly used in microelectronic industry, especially current booming electronics industry, demand bigger, high speed development
Electronics industry driven the development of silicon chip industry.In the cutting process of silicon chip, need to use cutter device.
Existing silicon wafer cutting device generally cuts silicon heavy stone used as an anchor using cutting line or cutting net when cutting silicon chip,
But it will produce a large amount of heat in silicon chip cutting process, if cooling not in time, not only result in the silicon for gluing glutinous cutting on silicon chip
Piece powder, and higher temperature can also be such that the service life of cutting line greatly shortens, we design a kind of novel silicon slice thus
Cutting is solved the above problems with heat sink.
Utility model content
Purpose of the utility model is to solve disadvantages existing in the prior art, and a kind of silicon chip cutting proposed is used
Heat sink.
To achieve the goals above, the utility model uses following technical solution：
The quadrangle of a kind of silicon chip cutting heat sink, including bottom plate, the bottom plate is equipped with vertical upright bar, described vertical
The one end of upright bar far from bottom plate is equipped with top plate, and circular groove is offered on the bottom plate, passes through pillar in the circular groove
Cutting platform is installed, cutter device, the bottom of the circular groove are installed above the lower section Cutting platform of the top plate
Round hole slot is offered, the circular groove is connected with the first water pipe by round hole slot, and first water pipe is far from round recessed
One end of slot is equipped with the first water tank, and the inside of first water tank is equipped with filter plate, and a side filter plate of first water tank
Lower section be communicated with the second water pipe, the described one end of second water pipe far from the first water tank is equipped with water pump, the side of the water pump
It is connected with circulation pipe, and the one end of circulation pipe far from water pump is connected with the second water tank, second water tank is mounted on the upper of top plate
Side, a side-lower of second water tank are communicated with third water pipe, and the described one end of third water pipe far from the second water tank is equipped with
Water dish, and it is equidistant on the water dish be uniformly provided with water outlet, be mounted on nozzle on water outlet, the top plate it is upper
Side of the side far from the second water tank is equipped with blower device.
Preferably, the blower device is made of bellows, rotary electric machine and blower fan, and rotary electric machine, blower fan are pacified
Mounted in the inside of bellows, and blower fan is mounted on the output shaft of rotary electric machine.
Preferably, the lower section room of the bellows is communicated with blast pipe, and the one end of the blast pipe far from bellows opens up
There are air outlet, the air outlet to be arranged above the side of Cutting platform.
Preferably, the water dish is tiltedly mounted on the lower section of third water pipe, and the rounded array arrangement of water outlet exists
The lower section of water dish, and the water spraying direction of the nozzle on the water dish is towards Cutting platform.
Preferably, first water pipe, the second water pipe, be mounted on solenoid electric valve on third water pipe.
Compared with prior art, the utility model has the beneficial effects that：In the utility model, pass through the second water tank, third
Water pipe, water dish, nozzle carry out quick spray cooling in silicon chip cutting process, to silicon chip cutting, and the water after cooling flows to
It in circular groove below cutting bed, is flowed in the first water tank by the first water pipe in circular groove, by water pump, the second water
The effect of pipe, circulation pipe, makes water circulate between the first water tank and the second water tank and flows, and then by spraying water constantly in silicon chip
Cutting process cools down, and the service life of silicon chip cutting diamond wire is improved, in addition, by blower device auxiliary temperature-reducing, not only
Temperature can be quickly reduced, and the moisture of the attachment on spray to cutter device and silicon chip can be dried up.
Description of the drawings
Fig. 1 be the utility model proposes a kind of silicon chip cutting heat sink structural schematic diagram；
Fig. 2 be the utility model proposes a kind of silicon chip cutting heat sink water dish structural schematic diagram.
In figure：1 bottom plate, 2 vertical upright bars, 3 bottom plates, 4 Cutting platforms, 5 cutter devices, 6 first water pipes, 7 first water tanks, 8
Filter plate, 9 second water pipes, 10 water pumps, 11 second water tanks, 12 third water pipes, 13 water dishes, 14 nozzles, 15 blower devices, 16 air blast
Pipe, 17 air outlets.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
Referring to Fig.1-2, the quadrangle of a kind of silicon chip cutting heat sink, including bottom plate 1, bottom plate 1 is equipped with vertical upright bar
2, the one end of vertical upright bar 2 far from bottom plate 1 is equipped with top plate 3, and circular groove is offered on bottom plate 1, passes through branch in circular groove
Column is equipped with Cutting platform 4, and the top of the lower section Cutting platform 4 of top plate 3 is equipped with cutter device 5, and the bottom of circular groove is opened
Equipped with round hole slot, circular groove is connected with the first water pipe 6, first one end of water pipe 6 far from circular groove by round hole slot
First water tank 7 is installed, the inside of the first water tank 7 is equipped with filter plate 8, and the lower section of a side filter plate 8 of the first water tank 7 is communicated with
Second water pipe 9, the one end of the second water pipe 9 far from the first water tank 7 are equipped with water pump 10, and the side of water pump 10 is connected with circulation pipe,
And the one end of circulation pipe far from water pump 10 is connected with the second water tank 11, the second water tank 11 is mounted on the top of top plate 3, the second water tank
11 side-lower is communicated with third water pipe 12, and the one end of third water pipe 12 far from the second water tank 11 is equipped with water dish 13, and
It is equidistant on water dish 13 to be uniformly provided with water outlet, nozzle 14 is mounted on water outlet, water dish 13 is tiltedly mounted on
The lower section of three water pipes 12, the rounded array arrangement of water outlet is in the lower section of water dish 13, and the spray of the nozzle 14 on water dish 13
Towards Cutting platform 4, the top of top plate 3 is equipped with blower device 15, blower device far from the side of the second water tank 11 in water direction
15 are made of bellows, rotary electric machine and blower fan, and rotary electric machine, blower fan are installed in the inside of bellows, and blower fan
On the output shaft of rotary electric machine, the lower section room of bellows is communicated with blast pipe 16, blast pipe 16 far from bellows one
End offers air outlet 17, and air outlet 17 is arranged above the side of Cutting platform 4, the first water pipe 6, the second water pipe 9, third water
It is mounted on solenoid electric valve on pipe 12.
Operation principle：When the utility model is used, passing through the second water tank 11, third water pipe 12, water dish 13, nozzle 14
In silicon chip cutting process, quick spray cooling is carried out to silicon chip cutting, the water after cooling flows to the circle of 4 lower section of Cutting platform
It in connected in star, is flowed in the first water tank 7 by the first water pipe 6 in circular groove, by water pump 10, the second water pipe 11, cycle
The effect of pipe makes water circulate between the first water tank 7 and the second water tank 11 and flows, and then is constantly cut in silicon chip by spraying water
Process cools down, and improves the service life of silicon chip cutting diamond wire, in addition, by 15 auxiliary temperature-reducing of blower device, it can not only
Temperature is quickly reduced, and the moisture of the attachment on spray to cutter device 5 and silicon chip can be dried up.
The preferable specific implementation mode of the above, only the utility model, but the scope of protection of the utility model is not
Be confined to this, any one skilled in the art within the technical scope disclosed by the utility model, according to this practicality
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (5)
1. a kind of silicon chip cutting heat sink, including bottom plate (1), which is characterized in that the quadrangle of the bottom plate (1) is equipped with perpendicular
Up-and-down rod (2), the one end of the vertical upright bar (2) far from bottom plate (1) are equipped with top plate (3), circle are offered on the bottom plate (1)
Connected in star is equipped with Cutting platform (4) in the circular groove by pillar, the lower section Cutting platform (4) of the top plate (3)
Top is equipped with cutter device (5), and the bottom of the circular groove offers round hole slot, and the circular groove passes through round hole
Slot is connected with the first water pipe (6), and the one end of first water pipe (6) far from circular groove is equipped with the first water tank (7), and described the
The inside of one water tank (7) is equipped with filter plate (8), and is communicated with the second water below a side filter plate (8) for first water tank (7)
It manages (9), the one end of second water pipe (9) far from the first water tank (7) is equipped with water pump (10), and the side of the water pump (10) connects
It is connected to circulation pipe, and the one end of circulation pipe far from water pump (10) is connected with the second water tank (11), the second water tank (11) installation
One side-lower of the top in top plate (3), second water tank (11) is communicated with third water pipe (12), the third water pipe (12)
Water dish (13) is installed far from one end of the second water tank (11), and equidistant on the water dish (13) is uniformly provided with water outlet
Mouthful, it is mounted on nozzle (14) on water outlet, the top of the top plate (3) is equipped with air blast far from the side of the second water tank (11)
Device (15).
2. a kind of silicon chip cutting heat sink according to claim 1, which is characterized in that the blower device (15) by
Bellows, rotary electric machine and blower fan are constituted, and rotary electric machine, blower fan are installed in the inside of bellows, and blower fan is installed
On the output shaft of rotary electric machine.
3. a kind of silicon chip cutting heat sink according to claim 2, which is characterized in that the lower section room of the bellows
It is communicated with blast pipe (16), the one end of the blast pipe (16) far from bellows offers air outlet (17), the air outlet
(17) it is arranged above the side of Cutting platform (4).
4. a kind of silicon chip cutting heat sink according to claim 1, which is characterized in that the water dish (13) tilts
Lower section mounted on third water pipe (12), the rounded array arrangement of water outlet is in the lower section of water dish (13), and the spray
The water spraying direction of nozzle (14) on water pond (13) is towards Cutting platform (4).
5. a kind of silicon chip cutting heat sink according to claim 1, which is characterized in that first water pipe (6),
Two water pipes (9), third water pipe are mounted on solenoid electric valve on (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721719413.0U CN207747249U (en) | 2017-12-12 | 2017-12-12 | A kind of silicon chip cutting heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721719413.0U CN207747249U (en) | 2017-12-12 | 2017-12-12 | A kind of silicon chip cutting heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207747249U true CN207747249U (en) | 2018-08-21 |
Family
ID=63147438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721719413.0U Expired - Fee Related CN207747249U (en) | 2017-12-12 | 2017-12-12 | A kind of silicon chip cutting heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207747249U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109291268A (en) * | 2018-11-08 | 2019-02-01 | 上海申和热磁电子有限公司 | A kind of three axis changes the slicer cutting method of two axis |
| CN109551243A (en) * | 2019-01-01 | 2019-04-02 | 谢吉芳 | Stainless sheet steel cutting means with means for correcting |
| CN112936624A (en) * | 2020-12-31 | 2021-06-11 | 六安优云通信技术有限公司 | Wafer slicing machine for manufacturing power supply chip and preparation process |
-
2017
- 2017-12-12 CN CN201721719413.0U patent/CN207747249U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109291268A (en) * | 2018-11-08 | 2019-02-01 | 上海申和热磁电子有限公司 | A kind of three axis changes the slicer cutting method of two axis |
| CN109551243A (en) * | 2019-01-01 | 2019-04-02 | 谢吉芳 | Stainless sheet steel cutting means with means for correcting |
| CN112936624A (en) * | 2020-12-31 | 2021-06-11 | 六安优云通信技术有限公司 | Wafer slicing machine for manufacturing power supply chip and preparation process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180821 Termination date: 20201212 |