CN207736759U - The fan-free cooling device of 3D printer and 3D printer - Google Patents
The fan-free cooling device of 3D printer and 3D printer Download PDFInfo
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- CN207736759U CN207736759U CN201820016799.7U CN201820016799U CN207736759U CN 207736759 U CN207736759 U CN 207736759U CN 201820016799 U CN201820016799 U CN 201820016799U CN 207736759 U CN207736759 U CN 207736759U
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- printer
- evaporation cavity
- fan
- cooling device
- free cooling
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Abstract
The utility model is related to 3D printing equipment technical fields, and in particular to the fan-free cooling device of 3D printer and 3D printer, including evaporation cavity, siphunculus, condensation chamber, semiconductor chilling plate and radiating sleeve；The utility model provides the fan-free cooling device of 3D printer and 3D printer, utilize the principle of heat pipe, in trunnion lower end, evaporation cavity is set, it is absorbed heat and is evaporated using low-boiling working fluid, and pinnacled condensation chamber condenses using self-radiating and semiconductor chilling plate effect and flows back to evaporation cavity and realizes circulating heat conduction again, it is without friction when work, the stabilization of nozzle position is effectively ensured；Evaporation cavity heat conduction is also utilized simultaneously, the heat of a trunnion part is conducted to nozzle, is ensured temperature at nozzle, is avoided nozzle blockage.
Description
Technical field
The utility model is related to 3D printing equipment technical fields, and in particular to the fan-free cooling device of 3D printer and 3D are beaten
Print machine.
Background technology
3D printing is one kind of rapid shaping technique, it be one kind based on digital model file, with powdered gold
Belong to or the adhesive materials such as plastics, constructs the technology of object by layer-by-layer printing.Equipped with metal, pottery in 3D printer
Porcelain, plastics, sand etc. different " printed material " are raw material true, after printer is connect with computer, pass through computer control
System can from level to level stack up " printed material ", and the blueprint on computer is finally become in kind.
3D printer needs that printed material is first heated into molten state when being printed, and is then squeezed out from nozzle, one layer
Layer heap is folded, and is carried out at the same time cooling processing, realizes solidifying and setting.Fan is mostly used greatly in the prior art to radiate, it is this from
The type of cooling for blowing formula not only results in that inhomogeneous cooling is even, and nozzle can be made to generate larger vibration, makes discharge point three-dimensional position
It sets unstable.
Utility model content
(1) the technical issues of solving
The utility model aim is to overcome the shortcomings of the prior art, and provides 3D printer fan-free cooling device
And 3D printer.
(2) technical solution
The fan-free cooling device of 3D printer, including evaporation cavity, siphunculus, condensation chamber, semiconductor chilling plate and radiating sleeve；Institute
State evaporation cavity, condensation chamber is loop configuration, boring；The evaporation cavity is arranged outside the trunnion hypomere of 3D printer nozzle
Side；It is provided with low-boiling point liquid in the evaporation cavity；The condensation chamber being disposed over is connected by siphunculus at the top of the evaporation cavity；
It is close to the cold end of semiconductor chilling plate on the outside of the condensation chamber；The hot junction of the semiconductor chilling plate is connect with radiating sleeve；It is described
It is also evenly arranged with radiating fin on the outside of radiating sleeve.
Preferably, further include muff, heat transfer jacket and heat conductive rod, muff is linked on the nozzle of 3D printer nozzle,
Muff is linked in the heat transfer jacket of evaporation cavity outer wall by heat conductive rod connection.
Preferably, it is provided with slope surface at the top of the evaporation cavity.
Preferably, the condensation chamber bottom is also equipped with slope surface.
Preferably, the siphunculus connects trunnion by strut.
Preferably, the vertical length of the radiating sleeve is more than the vertical length of semiconductor chilling plate.
Preferably, the evaporation cavity, siphunculus, in condensation chamber be negative pressure.
It is any to be provided with the claims at the nozzle of the printer body for 3D printer, including printer body
The fan-free cooling device of 3D printer.
(3) advantageous effect
The utility model provides the fan-free cooling device of 3D printer and 3D printer, using the principle of heat pipe, in larynx
Evaporation cavity is arranged in pipe lower end, is absorbed heat and is evaporated using low-boiling working fluid, and pinnacled condensation chamber using self-radiating and
Semiconductor chilling plate effect condenses and flows back to evaporation cavity again realizes that circulating heat conduction, when work are without friction, and nozzle position is effectively ensured
The stabilization set；Evaporation cavity heat conduction is also utilized simultaneously, the heat of a trunnion part is conducted to nozzle, ensures temperature at nozzle,
Avoid nozzle blockage.
Description of the drawings
In order to illustrate more clearly of the technical solution of the utility model embodiment, make required for being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the utility model protection
Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the structure chart of one embodiment of cooling device in the utility model；
Fig. 2 is the structure chart of another embodiment of cooling device in the utility model.
In attached drawing, parts list represented by the reference numerals are as follows：
1- trunnions, 2- nozzles, 3- evaporation cavities, 4- siphunculus, 5- condensation chambers, 6- struts, 7- semiconductor chilling plates, 8- heat dissipations
Set, 9- radiating fins, 10- muffs, 11- heat transfer jackets, 12- heat conductive rods.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
The all other embodiment obtained, shall fall within the protection scope of the present invention.
Referring to attached drawing, the fan-free cooling device of 3D printer, including evaporation cavity 3, siphunculus 4, condensation chamber 5, semiconductor refrigerating
Piece and radiating sleeve；Evaporation cavity 3, condensation chamber 5 are loop configuration, boring；The larynx in 3D printer nozzle is arranged in evaporation cavity 3
On the outside of 1 hypomere of pipe；It is filled with low-boiling point liquid in evaporation cavity 3；3 top of evaporation cavity is disposed over cold by the connection of siphunculus 4
Solidifying chamber 5；It is close to the cold end of semiconductor chilling plate 7 in 5 outside of condensation chamber；The hot junction of semiconductor chilling plate 7 is connect with radiating sleeve 8；It dissipates
8 outside of hot jacket is also uniformly machined with radiating fin 9.
Wherein, 3 top of evaporation cavity is machined with slope surface, and 5 bottom of condensation chamber is also machined with slope surface, carries out water conservancy diversion.
Wherein, siphunculus 4 connects trunnion 1 by strut 6, realizes support.
Wherein, the vertical length of radiating sleeve 7 is more than the vertical length of semiconductor chilling plate 8.
Wherein, it is negative pressure in evaporation cavity 3, siphunculus 4, condensation chamber 5.
Further include muff 10, heat transfer jacket 11 and heat conductive rod 12 in another embodiment, muff 10 is linked in 3D and beats
On the nozzle 2 of print machine nozzle, muff 10 connects the heat transfer jacket 11 for being linked in 3 outer wall of evaporation cavity by heat conductive rod 12.
Specifically, low-boiling working fluid heat absorption evaporation in evaporation cavity 3, and pinnacled condensation chamber 5 is dissipated using itself
Heat and the effect of semiconductor chilling plate 7 condense and flow back to evaporation cavity 3 again realizes that circulating heat conduction, when work are without friction, is effectively ensured
The stabilization of nozzle position；Heat transfer jacket 11 absorbs the heat of part evaporation cavity 3 simultaneously, and heat is conducted to guarantor by heat conductive rod 12
Temperature set 10, ensures temperature at nozzle 2, and nozzle 2 is avoided to block.
It is fan-free to be provided with above-mentioned 3D printer at the nozzle of printer body for 3D printer, including printer body
Cooling device.
The preferred embodiment in the utility model disclosed above is only intended to help to illustrate the utility model.Preferred embodiment is simultaneously
There is no the details that detailed descriptionthe is all, does not limit the specific implementation mode that the utility model is only yet.Obviously, according to this specification
Content, can make many modifications and variations.These embodiments are chosen and specifically described to this specification, be in order to preferably explain
The principles of the present invention and practical application, to enable skilled artisan to be best understood by and utilize this practicality
It is novel.The utility model is limited only by the claims and their full scope and equivalents.
Claims (8)
- The fan-free cooling device of 1.3D printers, it is characterised in that：Including evaporation cavity, siphunculus, condensation chamber, semiconductor chilling plate and Radiating sleeve；The evaporation cavity, condensation chamber are loop configuration, boring；The evaporation cavity is arranged in 3D printer nozzle On the outside of trunnion hypomere；It is provided with low-boiling point liquid in the evaporation cavity；It is arranged upper by siphunculus connection at the top of the evaporation cavity The condensation chamber of side；It is close to the cold end of semiconductor chilling plate on the outside of the condensation chamber；The hot junction of the semiconductor chilling plate and heat dissipation Set connection；It is also evenly arranged with radiating fin on the outside of the radiating sleeve.
- 2. the fan-free cooling device of 3D printer according to claim 1, it is characterised in that：Further include muff, heat transfer Set and heat conductive rod, muff are linked on the nozzle of 3D printer nozzle, and muff is linked in evaporation cavity by heat conductive rod connection The heat transfer jacket of outer wall.
- 3. the fan-free cooling device of 3D printer according to claim 1 or 2, it is characterised in that：At the top of the evaporation cavity It is provided with slope surface.
- 4. the fan-free cooling device of 3D printer according to claim 1 or 2, it is characterised in that：The condensation chamber bottom It is also equipped with slope surface.
- 5. the fan-free cooling device of 3D printer according to claim 1 or 2, it is characterised in that：The siphunculus passes through branch Bar connects trunnion.
- 6. the fan-free cooling device of 3D printer according to claim 1 or 2, it is characterised in that：The radiating sleeve erects Straight length is more than the vertical length of semiconductor chilling plate.
- 7. the fan-free cooling device of 3D printer according to claim 1 or 2, it is characterised in that：The evaporation cavity leads to It is negative pressure in pipe, condensation chamber.
- 8.3D printers, including printer body, it is characterised in that：It is provided with aforesaid right at the nozzle of the printer body It is required that the fan-free cooling device of any 3D printer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820016799.7U CN207736759U (en) | 2018-01-05 | 2018-01-05 | The fan-free cooling device of 3D printer and 3D printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820016799.7U CN207736759U (en) | 2018-01-05 | 2018-01-05 | The fan-free cooling device of 3D printer and 3D printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207736759U true CN207736759U (en) | 2018-08-17 |
Family
ID=63122393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820016799.7U Active CN207736759U (en) | 2018-01-05 | 2018-01-05 | The fan-free cooling device of 3D printer and 3D printer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207736759U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110027214A (en) * | 2019-05-24 | 2019-07-19 | 杭州捷诺飞生物科技股份有限公司 | 3D printing spray head |
| CN110039770A (en) * | 2019-05-24 | 2019-07-23 | 杭州捷诺飞生物科技股份有限公司 | Ejecting device and photocuring 3D printer |
| WO2021055494A1 (en) * | 2019-09-19 | 2021-03-25 | Northrop Grumman Innovation Systems, Inc. | Apparatus for additively manufacturing an article, related tools, and related methods |
| CN110027214B (en) * | 2019-05-24 | 2024-04-30 | 杭州捷诺飞生物科技股份有限公司 | 3D prints shower nozzle |
-
2018
- 2018-01-05 CN CN201820016799.7U patent/CN207736759U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110027214A (en) * | 2019-05-24 | 2019-07-19 | 杭州捷诺飞生物科技股份有限公司 | 3D printing spray head |
| CN110039770A (en) * | 2019-05-24 | 2019-07-23 | 杭州捷诺飞生物科技股份有限公司 | Ejecting device and photocuring 3D printer |
| CN110039770B (en) * | 2019-05-24 | 2024-04-05 | 杭州捷诺飞生物科技股份有限公司 | Shower nozzle device and photocuring 3D printer |
| CN110027214B (en) * | 2019-05-24 | 2024-04-30 | 杭州捷诺飞生物科技股份有限公司 | 3D prints shower nozzle |
| WO2021055494A1 (en) * | 2019-09-19 | 2021-03-25 | Northrop Grumman Innovation Systems, Inc. | Apparatus for additively manufacturing an article, related tools, and related methods |
| US11376788B2 (en) | 2019-09-19 | 2022-07-05 | Northrop Grumman Systems Corporation | Apparatus for additively manufacturing an article and related tools |
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